DS1963S_V01 DALLAS | Alldatasheet
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4401 South Beltwood Parkway
Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com ph: 972-371-3726 fax: 972-371-6016 mbl: 214-435-6610
Conclusion: DS1963S The following qualification successfully meets the quality and reliability standards required of all Dallas Semiconductor products and processes: Module Description: A description of this Module can be found in the product data sheet. You can find the product data sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.* Reliability Derating: A module device consists of one or more IC's in a single, upward integrated, package. This package is assembled to include batteries, crystals, and other piece parts that make up the configuration of the Module. Because of either the complexity of the package or the included piece parts, standard high temperature reliability testing is not possible. Therefore, in order to determine the reliability of module products, the reliability of each of the piece parts is individually determined, then summed to determine the reliability of the integrated module product. If there are "n" significant components in the module then: Fr (module) = Failure rate of module Fr(n) = Failure rate of the nth component Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate is related to MTTF by: MTTF = 1/Fr NOTE: MTTF is frequently used interchangeably with MTBF. The calculated failure rate for this module/assembly is: The parameters used to calculate the module failure rate are as follows: Cf: 60% Ea: 0.7 B: 0 Tu: 25 Vu: 5.5°C Volts In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. The current status of the reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.* Module Device: Quantity: MTTF (Yrs): FITs: 5.620404DS2421 1 620404Totals:
The reliability data follows. A the start of this data is the module assembly information. This is a description of the module. The next section is the detailed reliability data for each stress found in the qualification / monitor. If there are additional processes or assemblies used as part of this report, a description of each will follow which includes the respective reliability data for that process/ assembly. The reliability data section includes the latest data available. * Some proprietary products may be excepted from this requirement. Assembly Site: Dallas Body Size: 0 Pin Count: 2 Package Type: iButton F50 w/Bump Lead Frame: Printed Crt Brd; FR4 Assembly Information: Lead Finsh: Mold Compound: FP4323, Dexter Hysol Die Attach: Underfill FP4527, Dexter Hysol Bond Wire / Size: Al / 1.25 mil Moisture Sensitivity (JEDEC J-STD20A) Flammability: UL 94-V0 99399939 toDate Code Range: Qualification Vehicle: DS1963S MECHANICAL LIFE DESCRIPTION READPOINTCONDITION QUANTITY FAILSDATE CODE 30200G, 1/2 SINE, 6 MS 50 0MECHANICAL SHOCK CYS9939 910g or 0.06", 5Hz-2KHz, X Y Z axis 50 0VIBRATION, VARIABLE F HRS9939 0Total: STORAGE LIFE DESCRIPTION READPOINTCONDITION QUANTITY FAILSDATE CODE
114425 C 22 0STORAGE LIFE HRS9939
100085 C 77 0STORAGE LIFE HRS9939
0Total: TEMPERATURE CYCLE DESCRIPTION READPOINTCONDITION QUANTITY FAILSDATE CODE 1000-40 TO 85C 77 3TEMP CYCLE CYS9939 3Total: UNBIASED MOISTURE RESISTANCE DESCRIPTION READPOINTCONDITION QUANTITY FAILSDATE CODE 95985 C/85% R.H. 77 0MOISTURE SOAK HRS9939 0Total: