DI4005SH CYSTEKEC | Alldatasheet

Document overview

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Technical content

Features

  • High current capability
  • Low power loss, high efficiency
  • Ultra high-speed switching
  • Low profile surface mounted package in order to minimize board space
  • Pb-free package Mechanical data
  • Case : Molded plastic, JEDEC SOD-123.
  • Epoxy : UL94-V0 rated flame retardant
  • Terminals : Plated terminals, solderable per MIL-STD-202 method 208
  • Polarity : Indicated by cathode band
  • Mounting position : Any
  • Weight : approx. 0.04 gram Symbol Outline DI4005SH 2 (Anode) SOD-123

CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 2/6 DI4005SH CYStek Product Specification Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Conditions Symbol Min Typ Max Units Repetitive peak reverse voltage VRRM 500 V RMS voltage VRMS 350 V Continuous reverse voltage VR 500 V Forward rectified current Single phase half wave, 60Hz @TJ=25°C IF(AV) 1 A Forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) IFSM 10 A Thermal resistance Junction to Ambient RθJA 250 °C/W Storage temperature range Tstg -55 150 °C Operating junction temperature range Tj -55 150 °C Characteristics (TA=25°C, unless otherwise noted) Characteristic Symbol Condition Min. Typ Max. Unit VR IR=100μA 500 - - V VF 1 IF=100mA - - 0.9 Forward V oltage VF 2 IF=1A - - 1.25 V IR VR=500V - - 100 nA Reverse Leakage Current IR VR=500V , TA=125°C - - 10 μA Junction Capacitance CJ VR=1V , f=1MHz - 5 - pF

Ordering Information

(Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel

CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 3/6 DI4005SH CYStek Product Specification Typical Characteristics Power Derating Curve 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125 150 175 200 Ambient Temperature---T A(℃) Power Dissipation(W) Forward Current vs Forward Voltage 100 1000 10000 Forward Voltage---V F(V) Instantaneous Forward Current---IF(mA) Pulse width=300μs, 1% Duty cycle 125℃ -40°C 25°C 75°C Reverse Leakage Current vs Reverse Voltage 0.01 0.1 100 1000 0 100 200 300 400 500 Reverse Voltage---V R(V) Reverse Leakage Current---I R(nA) Tj=75℃ Tj=25℃ Tj=125℃ Tj=-40°C Tj=0°C Junction Capacitance vs Reverse Voltage 0.1 1 10 100 Reverse Voltage---V R(V) Junction Capacitance---C J(pF) Tj=25℃, f=1.0MHz Recommended Soldering Footprint

CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 4/6 DI4005SH CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 5/6 DI4005SH CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C210SH Issued Date : 2012.09.13 Revised Date : Page No. : 6/6 DI4005SH CYStek Product Specification SOD-123 Dimension Marking: 2-Lead SOD-123 Plastic Surface Mounted Package CYStek Package Code: SH Style: Pin 1.Cathode 2.Anode C 0.041 0.049 1.050 1.250 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.