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Anforderungsstufe 1Performance Level 1 Kontaktbereich vergoldetMating Area gold plating Anschlussbereich verzinnt 4-6 µmTerminal Area 4-6 µm tin plating Koplanarität der Anschlüsse ≤ 0,1 mm Coplanarity Area of Termination ≤ 0,1 mm 330 Verpackungseinheit: 500 Stück Verpackt in GurtverpackungTape on Reel PackagingPackaging unit: 500 pcs 2,6 max. Abspulrichtung - Reel off Direction Class prior notice. contact one of the ERNI companies Date 20.03.2013f Index MSPEED Female 90° 50 c. BM SMD EMV Federl. 90° 50p. BM SMD EMV 284310 5:1Information: Tolerances Scale www.ERNI.com before using. in mm I All Dimensions Drawing will not be updated. Subject to modification without DesignationAll rights reserved. Only for Information. To ensure that this is the latest version of this drawing, please Copyright by ERNI GmbH Proprietary notice pursuant to ISO 16016 to be observed. Board edge 1.) Leiterplattenkante MicroSpeed application note. Leiterplatten-Layout Vorschlag / PCB-Layout Proposal please consider Drill tool Für weitere Layout Details bitte Applikations Schrift MicroSpeed beachten.For further layout details 1.) Durchmesser des Bohrers / 1.) 0,5 0,75 3 2,5 ±0,03 0,7 0,7 8 x 3 = 24 1 26 ±0,03 1,5 0,25 0,25 0,25 0,25 25,83 24 x 1 = 24 0,36 0,86 0,085 26,8 0,5 0,9 ±0,03 1,725 2,85 8,8 4,9 0,7 5,1 5,25 0,6 3 6,1 a 1 a25 b 1 b25 0,5 x 0,8 24 x 1 = 24 0,6 25,3 1,5 27,4 1,5