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Kontaktbereich vergoldetMating Area gold plating Anschlussbereich verzinnt 4-6 µmTerminal Area 4-6 µm tin plating Koplanarität der Anschlüsse ≤ 0,1 mm Coplanarity Area of Termination ≤ Anforderungsstufe 1Performance Level 1 0,1 mm 330 Verpackt in GurtverpackungTape on Reel Packaging Verpackungseinheit: 250 StückPackaging unit: 250 pcs Leiterplatten-Layout Vorschlag für SMT PCB-Layout Proposal for SMT 1,6 0,3 13,31 ±0,03 1,2 1,27 -0,031,1 7,6 2,2 7 x 1,27 = 0,8 8,89 2,21 ±0,03 5,5 Ansaughaubehood ±0,03 9,85 12,91 -0,031,5 4,85 4±0,1 13,31 5,6 BA 8-23 - hohe Bauhöhetype 8-23 - High Profile prior notice. contact one of the ERNI companies Date 17.07.2013d Index SMCQ Male SMC-Q 16-SMD-type8-23 Messerl. SMC-Q 16-SMD-BA8-23 254414 3:1Information: Tolerances Scale All Dimensions in mm Class I Subject to modification without Designation www.ERNI.com before using. Drawing will not be updated. All rights reserved. Only for Information. To ensure that this is the latest version of this drawing, please Copyright by ERNI GmbH Proprietary notice pursuant to ISO 16016 to be observed. a1a8 7 x 1,27 = 8,89 1,27 12,11 7,2 3,25 11,11 15,24 1,8 1,27 4,2 -0,05 10,70,75