DAN202C3 CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • Fast switching speed.
  • Ultra small surface mount package
  • High conductance
  • Pb-free package Equivalent Circuit Outline

Applications

  • For general purpose switching applications.

Ordering Information

Device Package Shipping Marking DAN202C3 SOT-523 (Pb-free) 3000 pcs / Tape & Reel N SOT-523 DAN202C3 Common cathode Anode 1：Anode Anode 2：Anode 3：Common cathode

CYStech Electronics Corp. Spec. No. : C303C3 Issued Date : 2010.11.02 Revised Date : Page No. : 2/6 DAN202C3 CYStek Product Specification Absolute Maximum Ratings @TA=25℃ Parameters Symbol Min Max Unit Repetitive peak reverse voltage VRRM - 110 V Continuous reverse voltage VR - 100 V Average Rectified Forward Current (single) IO - 150 mA Repetitive peak forward current IFM 300 mA Non-repetitive peak forward current @square wave, Tj=125℃ prior to surge t=1μs t=1ms t=1s IFSM 0.5 A A A Power Dissipation(Note 1) PD 150 mW Operating Junction Temperature Range Tj -55 +150 °C Storage Temperature Range Tstg -65 +150 °C Note 1: Device mounted on an FR-4 PCB. Electrical Characteristics @ Ta=25℃ unless otherwise specified Parameters Symbol Conditions Min Typ. Max Unit Reverse Breakdown V oltage VR(BR) IR=100μA 100 - - V Forward voltage VF IF=1mA IF=10mA IF=50mA IF=150mA - - 715 855 1.25 mV mV V V Reverse current IR VR=25V VR=100V - - 30 2.5 nA μA Diode capacitance Cd VR=0V , f=1MHz - - 2 pF Reverse recovery time trr when switched from IF=10mA to IR=10mA,RL=100Ω, measured at IR=1mA - - 4 ns Thermal Characteristics Symbol Parameter Conditions Value Unit Rth, j-a thermal resistance from junction to ambient Note 1 833 ℃/W Note 1: Device mounted on an FR-4 PCB.

CYStech Electronics Corp. Spec. No. : C303C3 Issued Date : 2010.11.02 Revised Date : Page No. : 3/6 DAN202C3 CYStek Product Specification Typical Characteristics Power Derating Curve 100 120 140 160 0 25 50 75 100 125 150 Ambient Temperature---T A(℃) Power Dissipation---PD(mW) Mounting on glass epoxy PCBs Forward Current vs Forward Voltage 0.1 100 Forward Voltage---V F(V) Forward Current---I F(mA) Ta= - 40℃ Ta= 25℃ Ta= 85℃ Reverse Leakage Current vs Reverse Voltage 0.001 0.01 0.1 100 0 1 02 03 04 05 0 Reverse Voltage---VR(V) Reverse Leakage Current---IR(μA) Ta= 125 ℃ Ta= 25℃ Ta= 150℃ Ta=55℃ Ta=85℃ Capacitance vs Reverse Voltage 0.52 0.56 0.6 0.64 0.68 00 . 2 0 . 4 0 . 6 Reverse Voltage---V R(V) Diode Capacitance ---C D(pF) 0 . 8 f=1MHz Ta=25℃

CYStech Electronics Corp. Spec. No. : C303C3 Issued Date : 2010.11.02 Revised Date : Page No. : 4/6 DAN202C3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C303C3 Issued Date : 2010.11.02 Revised Date : Page No. : 5/6 DAN202C3 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C303C3 Issued Date : 2010.11.02 Revised Date : Page No. : 6/6 DAN202C3 CYStek Product Specification SOT-523 Dimension (C Forming) *: Typical Inches N H F J A B C D E G I K L M O Style: Pin 1.Anode 2.Anode 3.Common Cathode 3-Lead SOT-523 Plastic Surface Mounted Package CYStek Package Code: C3 Marking: 3E_ _ : hFE Rank Code N Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.