D5018UK SEME-LAB | Alldatasheet
Document overview
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Technical content
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612. Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing orders. PD Power Dissipation BV DSS Drain – Source Breakdown Voltage * BV GSS Gate – Source Breakdown Voltage * ID(sat) Drain Current * Tstg Storage Temperature Tj Maximum Operating Junction Temperature 250W 125V ±20V –65 to 150°C 200°C MECHANICAL DATA A B G OI E (2 pls) F J Typ. K N Q M D C P H 13 24 8 675 GOLD METALLISED MULTI-PURPOSE SILICON DMOS RF FET 100W – 50V – 500MHz PUSH–PULL
FEATURES
SIMPLIFIED AMPLIFIER DESIGN SUITABLE FOR BROAD BAND APPLICATIONS L O W C rss SIMPLE BIAS CIRCUITS LOW NOISE HIGH GAIN – 10 dB MINIMUM DD PIN 1 SOURCE (COMMON) PIN 3 DRAIN 2 PIN 5 SOURCE (COMMON) PIN 7 GATE 1 PIN 2 DRAIN 1 PIN 4 SOURCE (COMMON) PIN 6 GATE 2 PIN 8 SOURCE (COMMON) ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
APPLICATIONS
HF/VHF/UHF COMMUNICATIONS from 1 MHz to 500 MHz METAL GATE RF SILICON FET TetraFET DIM mm Tol. Inches Tol. A 9.14 0.13 0.360 0.005 B 12.70 0.13 0.500 0.005 C4 5 ° 5° 45° 5° D 6.86 0.13 0.270 0.005 E 0.76 0.13 0.030 0.005 F 9.78 0.13 0.385 0.005 G 19.05 0.25 0.750 0.010 H 4.19 0.13 0.165 0.005 I 3.17 0.13 0.125 0.005 J 1.52R 0.13 0.060R 0.005 K 1.65R 0.13 0.065R 0.005 M 16.51 0.13 0.650 0.005 N 22.86 0.13 0.900 0.005 O 0.13 0.02 0.005 0.001 P 6.35 0.64 0.250 0.025 Q 10.77 0.13 0.424 0.005 * Per Side ROHS COMPLIANT
Parameter Test Conditions Min. Typ. Max. Unit D5018UK Document Number 3826 Issue 1 Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612. Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing orders. 125 2.4 20:1 180 VGS = 0 I D = 100mA VDS = 50V V GS = 0 VGS = 20V V DS = 0 ID = 10mA V DS = VGS VDS = 10V I D = 1.5A PO = 100W VDS = 50V I DQ = 0.6A f = 500MHz VDS = 50V V GS = –5V f = 1MHz VDS = 50V V GS = 0 f = 1MHz VDS = 50V V GS = 0 f = 1MHz V mA µA V S dB pF pF pF ELECTRICAL CHARACTERISTICS (Tcase = 25°C unless otherwise stated) Drain–SourceBV DSS Breakdown Voltage Zero Gate VoltageI DSS Drain Current IGSS Gate Leakage Current VGS(th) Gate Threshold Voltage * gfs Forward Transconductance * G PS Common Source Power Gain η Drain Efficiency VSWR Load Mismatch Tolerance C iss Input Capacitance C oss Output Capacitance C rss Reverse Transfer Capacitance HAZARDOUS MATERIAL WARNING The ceramic portion of the device between leads and metal flange is beryllium oxide. Beryllium oxide dust is highly toxic and care must be taken during handling and mounting to avoid damage to this area. THESE DEVICES MUST NEVER BE THROWN AWAY WITH GENERAL INDUSTRIAL OR DOMESTIC WASTE. R THj–case Thermal Resistance Junction – Case Max. 0.7°C / W THERMAL DATA * Pulse Test: Pulse Duration = 300 µs , Duty Cycle ≤2% TOTAL DEVICE PER SIDE PER SIDE