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D00FCFFJ-E2

Rohm

35V Withstand Voltage 1A LDO Regulators

Manufacturer: Rohm

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〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays TSZ02201-0G2G0A600040-1-2© 2016 ROHM Co., Ltd. All rights reserved. 16.May.2016 Rev.004TSZ22111 • 14 • 001 www.rohm.com Single-Output LDO Regulators 35V Withstand Voltage 1A LDO Regulators BDxxFC0 series

Description The BDxxFC0 series are low-saturation regulators. The series’ output voltages are Variable, 3.0V, 3.3V, 5.0V, 6.0V, are HTSOP-J8, TO252-3, and TO252-5. This series has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a thermal shutdown circuit that protects the IC from thermal damage due to overloading.
Key Specifications 1) Output current capability: 1A 3) High output voltage accuracy (Ta=25℃): ±1% 4) Low saturation with PDMOS output 5) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits 6) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading 7) Available Ceramic Capacitor to prevent oscillation 8) HTSOP-J8, TO252-3 and TO252-5 packages
Features ・Output Voltage: 1.0V to 15.0V ・Output Voltage Precision(Ta=25℃): ±1% ・Supply Voltage(VO≧3.0V): V O+1.0V to 26.5V ・Supply Voltage(VO＜3.0V): 4.0V to 26.5V ・Output Current: 1A ・Operating Temperature Range: -25 ℃≦Ta≦+85℃
Packages ( T y p ) ( T y p ) ( M a x ) HTSOP-J8 4.90mm x 6.00mm x 1.00mm TO252-3 6.50mm x 9.50mm x 2.50mm TO252-5 6.50mm x 9.50mm x 2.50mm
Ordering part number B D x x F C 0 W x x x - E 2 Part Number Output voltage 00: Variable 30: 3.0V 33: 3.3V 50: 5.0V 60: 6.0V 70: 7.0V 80: 8.0V 90: 9.0V J0: 10.0V J2: 12.0V J5: 15.0V Input Voltage F:35V Output Current C0:1.0A Shutdown Mode “W”: Included shutdown mode None: Without shutdown mode Package EFJ: HTSOP-J8 FP: TO252-3/5 Packaging and forming specification E2: Emboss tape reel

Pin Configuration/Pin Description 〈With Shutdown SW (HTSOP-J8)〉

Figure 4. Pin Configuration (With Shutdown SW)

1 Vo Output pin

3 GND GND pin

5 EN Enable pin

8 V CC Power supply pin

(Note 1) N.C. Pin can be open, because it is not connected to the IC. Figure 5. Pin Description (Without Shutdown SW)

1 Vcc Power Supply Pin

3 Vo Output Pin

(Note 1) N.C.Pin can be open since it is not connected inside of IC.

1 EN Enable Pin

2 Vcc Power Supply Pin

4 Vo Output Pin

(Note 1) N.C.Pin can be open since it is not connected inside of IC.

Absolute Maximum Ratings (Ta= 25℃) Parameter Symbol Ratings Unit Supply Voltage *1 Vcc -0.3 to +35.0 V EN Voltage *2 VEN -0.3 to +35.0 V Operating Temperature Range Ta -25 to +85 ℃ Storage Temperature Range Tstg -55 to +150 ℃ Maximum Junction Temperature Tjmax 150 ℃ *1 Do not exceed Tjmax. *2 Power Supply (Vcc) and EN pin startup sequence does not matter provided they are operated within the power supply voltage range.
Operating Conditions (-25℃≦Ta≦+85℃) Parameter Symbol Min Max Unit Supply Voltage (VO≧3.0V) Vcc V O+1 26.5 V Supply Voltage (VO<3.0V) Vcc 4.0 26.5 V Startup Voltage (IO=0mA) Vcc - 3.8 V EN Voltage (with shutdown SW) V EN 0 26.5 V Output Current I O 0 1.0 A Output Voltage *3 (BD00FC0) VO 1.0 15.0 V *3 Please refer to Notes when using BD00FC0 at output voltage of 1.0V to 3.0V.
Electrical Characteristics Unless otherwise specified, Ta=25°C, Vcc=13.5V, IO=0mA, VEN=5.0V The resistor between FB and OUT =56.7kΩ, FB and GND =10kΩ (BD00FC0) Parameter Symbol Guaranteed Limit Unit Conditions Min Typ Max Circuit Current at shutdown mode I SD - 0 5 µA Circuit Current Icc - 0.5 2.5 mA Output Reference Voltage (BD00FC0) V FB 0.742 0.750 0.758 V I O =50mA Output Voltage (BD30/33/50FC0) VO V O×0.99 V O V O×1.01 V I O =200mA Output Voltage (BD60/70/80/90/J0/J2/J5FC0) VO V O×0.99 V O V O×1.01 V I O =500mA *4 Minimum dropout voltage ∆Vd - 0.4 0.7 V Vcc=4.0V IO =500mA *５ Minimum dropout voltage I O =500mA Line Regulation Reg.I - 20 80 mV Vcc=V O+1.0V→26.5V Load Regulation Reg.I O - V O×0.010 V O×0.020 V I O =5mA→1A *4 EN High Voltage (with shutdown SW) V EN(High) 2.0 - - V ACTIVE MODE EN Low Voltage (with shutdown SW) V EN(Low) - - 0.8 V OFF MODE EN Bias Current I EN - 25 50 μA *4 In case of J0, J2 and J5, Vcc=Vo+4.5V *5 In case of Vo ≧ 4.0V

Thermal Resistance Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p (Note 4) HTSOP-J8 Junction to Ambient θJA 206.4 45.2 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 21 13 °C/W TO252-5 / TO252-3 Junction to Ambient θJA 115.3 20.8 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 14 3 °C/W (Note 1)Based on JESD51-2A(Still-Air) (Note 2)The thermal characterization parameter to report the diff erence between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. Layer Number of Measurement Board Material Board Size Single FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70 μm (Note 4)Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Thermal Via (Note 5) Pitch Diameter Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2mm x 74.2mm 35 μm 74.2mm x 74.2mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers

Measurement setup for reference data ■BD00FC0 series（5.0V Output Setting） Measurement setup for Figure 12 Measurement setup for Figure 13 Measurement setup for Figure 14 Measurement setup for Figure 15 Measurement setup for Figure 16 Measurement setup for Figure 17 Measurement setup for Figure 18 Measurement setup for Figure 19 Measurement setup for Figure 20 Measurement setup for Figure 21 Measurement setup for Figure 22 Measurement setup for Figure 23 Vcc EN GND FB Vo 1µF 1µF 56.7kΩ 10kΩ 13.5V IFEEDBACK_R

I/O equivalent circuit
Output Voltage Configuration Method (BD00FC0) Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 77. Please be aware that the offset, due to the current that flows from the FB terminal, becomes large when resistors with large values are used. Resistance values ranging from R2=5kΩ to 10kΩ is recommended. V OUT setting equation is, V OUT≒VFB×(R1+R2)/R2 Thoroughly check the constant se ttings on the application because circuit current increases depending on connected resistor. Resistance value of R 2 is from 5kΩ to 10kΩ. Determine R 1 by adjusting with R2. Figure 77. Vcc Terminal EN Terminal Vo Terminal BD30/33/50/60/70/80/90/J0/J2/J5FC0(W) R 1 (kΩ) (Typ) R2 (kΩ) (Typ) R3 (kΩ) (Typ) BD30FC0(W) 30.3 BD33FC0(W) 34 BD50FC0(W) 56.6 BD60FC0(W) 83.5 BD50FC0(W) 61.7 BD80C0A(W) 5 48.3 20 BD90C0A(W) 55 BDJ0C0A(W) 5 61.7

15 BDJ2C0A(W) 75

BDJ5C0A(W) 4 76.1 BD00FC0W Vo Terminal FB Terminal Figure 76. IC FB pin VO VFB≒0 . 75 V (TYP ) Vcc IC Vcc Vo Vcc Vo 15kΩ (Typ) EN 200kΩ 200kΩ 1kΩ F B

Operational Notes 1. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values ar e expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits, and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics. 3. GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics. 4. Ground wiring pattern When using both small-signal and lar ge-current GND traces, the two ground tr aces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also, ensure that the GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pi ns and the power supply or GND pins (caused by poor soldering or foreign objects) may result in damage to the IC. 6. Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 7. Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the ev aluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Power Dissipation Pd Using the unit in excess of the rated power dissipation ma y cause deterioration in electrical characteristics including reduced current capability due to the rise of chip temperature. The mentioned power dissipation in the absolute maximum rating of this specification, at HTSOP-J8 andTO252-3/5 package when 114.3mm×76.2mm×1.6mm glass epoxy board is mounted, is the value of when there is no heat dissipation boar d. And in case this exceeds, take the measures like enlarge the size of board; make copper foil area for heat dissipation big; and use dissipation board and do not exceed the power dissipation. 9. Thermal consideration Use a thermal design that allows for a suffic ient margin in light of the Pd in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc) Tjmax : Maximum junction temperature=150(℃) , Ta : Peripheral temperature(℃) , θja : Thermal resistance of package-ambience(℃/W), Pd : Package Power dissipation (W), Pc : Power consumption (W), Vcc : Input Voltage, VO : Output Voltage, IO : Load, Icc : Circut Current Package Power dissipation : Pd (W) = (Tjmax-Ta) / θja Power consumption : Pc (W) = (Vcc-V O)×IO+Vcc×Icc 10. Vcc pin the capacitance according to the line between the power smoot hing circuit and the Vcc pin. Se lection of the capacitance also depends on the application. Verify the application and a llow for sufficient margins in the design. It is recommended to use a capacitor with excellent voltage and temperature characteristics. Electrolytic capacitor Ceramic capacitor, Low ESR capacitor IC

BDxxFC0 series DatasheetDatasheet TSZ02201-0G2G0A600040-1-2© 2016 ROHM Co., Ltd. All rights reserved. 16.May.2016 Rev.004 www.rohm.com TSZ22111・15・001 11. Output pin In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a capacitor with a capacitance of more than 1 μF(3.0V≦VO≦15.0V). Electrolytic, tantalum and ceramic capacitors can be used. When selecting the capacitor, ensure that the capacitanc e of more than 1 μF(3.0V≦VO≦15.0V) or more than 4.7μF(1.0V≦VO<3.0V) is maintained at the intended applied voltage and temperature range. Due to changes in temperature, the capacitance c an fluctuate possibly resulting in oscillation. Fo r selection of the capacitor, refer to the Cout_ESR vs I OUT data. The stable operation ran ge given in the reference data is based on the standalone IC and resistive load. For actual applications , the stable operating range is influenc ed by the PCB impedance, input supply impedance, and load impedance. Therefore, verification of the final operating environment is needed. When selecting a ceramic type capacitor, we recommend using X5R, X7R, or better, with excellent temperature and DC-biasing characteristics and high voltage tolerance. Also, in case of rapidly changing input voltage and load curr ent, select the capacitance in accordance with verifying that the actual application meets the required specification. Operation Note 11 Measurement circuit (BD00FC0W) 0.001 0.01 0.1 100 0 200 400 600 800 1000 Io(mA) Cout_ESR(Ω） Unstable operating region Stable operating region Cin vs Cout 3.0V ≤ Vo ≤ 15.0V (Reference data) Cout_ESR vs Io 3.0V ≤ Vo ≤ 15.0V (Reference data) 4.0V ≤ Vcc ≤ 26.5V 3.0V ≤ VO ≤ 15.0V -25℃ ≤ Ta ≤ +85℃ 5kΩ ≤ R2 ≤ 10kΩ (BD00FC0W) Cin=2.2µF ≤ Cin ≤ 100µF 1µF ≤ Cout ≤ 100µF 4.0V ≤ Vcc ≤ 26.5V 3.0V ≤ VO ≤ 15.0V -25℃ ≤ Ta ≤ +85℃ 0A ≤ IO ≤ 1A 5kΩ ≤ R2 ≤ 10kΩ (BD00FC0W) 100 11 0 1 0 0 Cout(µF) Cin（µF） Stable operating region 6.0V≤Vcc≤26.5V 5.0V≤VO≤15.0V -25℃≤Ta≤+85℃ 0A≤IO≤1A 5kΩ≤R2≤10kΩ (BD00FC0W) 100 11 0 1 0 0 Cout（µF） Cin（µF） Stable operating region 2.2 Unstable operating region IO(mA) 0.001 0.01 0.1 100 0 200 400 600 800 1000 Io(mA) Cout_ESR(Ω） Stable operating region Unstable operating region 0.5 4.0V ≤ Vcc ≤ 26.5V 1.0V ≤ Vo < 1.5V -25°C ≤ Ta ≤ +85°C 5kΩ ≤ R1 ≤ 10kΩ (BD00FC0W) 2.2µF ≤ Cin ≤ 100µF 4.7µF ≤ Cout ≤ 100µF 4.0V ≤ Vcc ≤ 26.5V 1.0V ≤ Vo < 3.0V -25°C ≤ Ta ≤ +85°C 0A ≤ Io ≤ 1A 5kΩ≤ R1 ≤ 10kΩ (BD00FC0W) 4.0V ≤ Vcc ≤ 26.5V 1.5V ≤ Vo < 3.0V -25°C ≤ Ta ≤ +85°C 5kΩ ≤ R1 ≤ 10kΩ (BD00FC0W) 2.2µF ≤ Cin ≤ 100µF 4.7µF ≤ Cout ≤ 100µF Stable operating region 100 11 0 1 0 0 Cout（µF） Cin（µF） Stable operating region Unstable operating region 2.2 4.7 0.001 0.01 0.1 100 0 200 400 600 800 1000 Io(mA) Cout_ESR(Ω） Stable operating region Unstable operating region Cout_ESR vs Io 1.0V ≤ Vo < 3.0V (Reference data) Cin vs Cout 1.0V ≤ Vo < 3.0V (Reference data) Vcc EN GND FB Vo VEN (5.0V) Cin (1µF or higher) Cout (1µF or higher) ESR (0.001Ω or higher) Io (Rout) (5k to 10kΩ) VCC (4.0V to 26.5V)

BDxxFC0 series DatasheetDatasheet TSZ02201-0G2G0A600040-1-2© 2016 ROHM Co., Ltd. All rights reserved. 16.May.2016 Rev.004 www.rohm.com TSZ22111・15・001 Operation Note 11 Measurement circuit (BD00FC0W) 12. EN pin Do not make the voltage level of the chip’s enable pin at floating level or in between V EN(High) and VEN(Low). Otherwise, the output voltage would be unstable or indefinite. 13. For a steep change of the Vcc voltage Because MOSFET for output Transistor is used when an input voltage change is ve ry steep, it may evoke large current. When selecting the value of external circuit constants, pl ease make sure that the operat ion on the actual application takes these conditions into account. 14. For infinitesimal fluctuat ions of output voltage. For applications that have infinitesimal fluc tuations of the output voltage caused by some factors (e.g. disturbance noise, input voltage fluctuations, load fluctuat ions, etc.), please take enough measures to avoid some influence (e.g. insert a filter, etc.). 15. Over current protection circuit (OCP) The IC incorporates an integrated over-cu rrent protection circuit that operates in accordance with the rated output capacity. This circuit serves to protect the IC from damage wh en the load becomes shorted. It is also designed to limit output current (without latching) in the ev ent of a large and instantaneous current flow from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications charac terized by the continuous or transitive operation of the protection circuits. 16. Thermal Shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off, completely, in the event of thermal overload. It is not designed to pr otect the IC from damage or guarantee its operation. IC’s should not be used after this function has activated, or in applications where the operation of this circuit is assumed. 0.001 0.01 0.1 100 0 200 400 600 800 1000 Io(mA) Cout_ESR(Ω） Unstable operating region Stable operating region 4.0V ≤ Vcc ≤ 26.5V 1.0V ≤ Vo < 3.0V (Cout and Ceramic capacitor 10µF is connected in parallel.) -25°C ≤ Ta ≤ +85°C 5kΩ ≤ R1 ≤ 10kΩ (BD00FC0W) 2.2µF ≤ Cin ≤ 100µF 1µF ≤ Cout ≤ 100µF 4.0V ≤ Vcc ≤ 26.5V 1.0V ≤ Vo < 3.0V (Cout and Ceramic capacitor 10µF is connected in parallel.) -25°C ≤ Ta ≤ +85°C 0A ≤ Io ≤ 1A 5kΩ≤ R1 ≤ 10kΩ (BD00FC0W) Cout_ESR vs Io 1.0V ≤ Vo < 3.0V Cout and Ceramic capacitor 10µF is connected in parallel. (Reference data) Cin vs Cout 1.0V ≤ Vo < 3.0V Cout and Ceramic capacitor 10µF is connected in parallel. (Reference data) Vcc EN GND FB Vo Cin (1µF or higher) VEN (5.0V) VCC (4.0V to 26.5V) (5k to 10kΩ) Output load Io(Rout) Cout (1µF or higher) ESR (0.001Ω or higher) 10µF 100 11 0 1 0 0 Cout（µF） Cin（µF） Stable operating region 2.2 Unstable operating region

BDxxFC0 series DatasheetDatasheet TSZ02201-0G2G0A600040-1-2© 2016 ROHM Co., Ltd. All rights reserved. 16.May.2016 Rev.004 www.rohm.com TSZ22111・15・001 17. In some applications, the Vcc and the Vo potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. For example, the accumulated charge in the output pin capacitor flow backward from the Vo to the Vcc when the Vcc shorts to the GND. Use a capacitor with a capacitance with less than 1000 μF for reducing the damage. We also recommend using reverse polarity diodes in series between the Vcc and the GND or a bypass diode between the Vo and the Vcc. 18. Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors. For example (refer to the Figure below): ○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode ○When GND > Pin B, the PN junction operates as a parasitic transistor Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. Accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Example of monolithic IC structure

Physical Dimension Tape and Reel InformationS Package Name HTSOP-J8 ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs Direction of feed Reel 1pin

Marking Diagram Output Voltage[V] Part Number Marking 3.3 33FC0 5.0 50FC0 Output Voltage[V] Part Number Marking Variable 00FC0W 3.0 30FC0W 3.3 33FC0W 5.0 50FC0W 6.0 60FC0W 7.0 70FC0W 8.0 80FC0W 9.0 90FC0W

10.0 J0FC0W

12.0 J2FC0W

15.0 J5FC0W

Voltage[V] Part Number Marking Variable 00FC0W 3.0 30FC0W 3.3 33FC0W 5.0 50FC0W 6.0 60FC0W 7.0 70FC0W 8.0 80FC0W 9.0 90FC0W HTSOP-J8 (TOP VIEW) xxFC0W Part Number Marking LOT Number 1PIN MARK TO252-3 TO252-3 (TOP VIEW) Part Number Marking LOT Number TO252-5 TO252-5 (TOP VIEW) Part Number Marking LOT Number HTSOP-J8 1PIN 1PIN

Revision History Date Revision Changes 27.Aug.2013 001 New Release 20.Oct. 2015 002 Add BDxxFC0FP and BDxxFC0WFP Change pin name OUT -> Vo 02.Dec. 2015 003 P2 Lineup modified 16.May. 2016 004 The document control number:TSZ02201-0GAG0A600040-1-2 -> TSZ02201-0G2G0A600040-1-2 P8 Power dissipation deleted P8 notes added in electrical characteristics P9 Copper Pattern area modified Misentry modified in Whole page

Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability ( such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail -safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions . If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no -clean type fluxes, cleanin g residue of flux is recommended); or Washing our Products by using water or water -soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on -board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady -state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation d epending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under devian t condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface -mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface -mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e .g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information an d data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatso ever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Minimum Package Quantity 2000 Packing Type Taping Constitution Materials List inquiry RoHS Yes BD50FC0FP - Web Page

Product Information

D00FCFFJ-E2 specifications and overview.

Summary

35V Withstand Voltage 1A LDO Regulators

Description

35V Withstand Voltage 1A LDO Regulators

Source title D00FCFFJ-E2 Datasheet(PDF) - Rohm

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