CXP86212 SONY | Alldatasheet

Document overview

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Technical content

Features

  • A wide instruction set (213 instructions) which covers various types of data – 16-bit operation/multiplication and division/ Boolean bit operation instructions
  • Minimum instruction cycle 250ns at 16MHz operation 122µs at 32kHz operation
  • Incorporated ROM 12K bytes (CXP86212) 24K bytes (CXP86324) 40K bytes (CXP86440) 16K bytes (CXP86216) 32K bytes (CXP86332) 48K bytes (CXP86448) 60K bytes (CXP86460)
  • Incorporated RAM 352 bytes (CXP86212/86216) 704 bytes (CXP86324/86332) 1536 bytes (CXP86440/86448/86460) (Excludes VRAM for on-screen display and sprite RAM)
  • Peripheral functions – A/D converter 8-bit 6-channel successive approximation method (Conversion time of 3.25µs at 16MHz) – Serial interface 8-bit clock sync type, 1 channel – Timer 8-bit timer 8-bit timer/counter 19-bit time-base timer 32 kHz timer/counter – On-screen display (OSD) function 12
  • 16 dots, 128 character types (CXP86212/86216), 256 character types (CXP86324/86332), 384 character types (CXP86440/86448/86460) 15 character colors, 2 lines · 24 characters, frame background 8 colors/ half blanking, background on full screen 15 colors/ half blanking edging/ shadowing/ rounding for every line, background with shadow for every character (CXP86440/86448/86460), double scanning, sprite OSD (CXP86440/86448/86460), 12 · 16 dots, 1 screen, 8 colors for every dot – I 2C bus interface – PWM output 8 bits, 8 channels 14 bits, 1 channel – Remote control reception circuit 8-bit pulse measurement counter, 6-stage FIFO – HSYNC counter 2 channels – Watchdog timer
  • Interruption 13 factors, 13 vectors, multi-interruption possible
  • Standby mode Sleep
  • Package 64-pin plastic SDIP/QFP/LQFP
  • Piggyback/evaluator CXP86400 64-pin ceramic PQFP CXP86490 64-pin ceramic PSDIP (Supports custom font) Perchase of Sony's I2C components conveys a licence under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. Structure Silicon gate CMOS IC 64 pin SDIP (Plastic) 64 pin QFP (Plastic) 64 pin LQFP (Plastic)

– 2 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 A/D C O N VER TER 6C H FIFOR EM O C O N SER IAL IN TER FAC E U N IT 8BIT TIM ER 1 8BIT TIM ER / C O U N TER 0 O N SC R EEN D ISPLAY H SYN C C O U N TER 0 H SYN C C O U N TER 1 I2C BU S IN TER FAC E U N IT 8BIT PW M 14BIT PW M PR ESC ALER / TIM E BASE TIM ER W ATC H D O G TIM ER 32kH z TIM ER /C O U N TER R O M 12K/16K/24K/32K/ 40K/48K/60K BYTES R AM 352/704/1536 BYTES SPC 700 C PU C O R E C LO C K G EN ER ATO R /SYSTEM C O N TR O L INTERRUPT CONTROLLER PORT A PORT B PORT C PORT D PORT E PORT F PORT G PG 3 to PG 7 PWM PF0 to PF78 PE4 to PE63 PE2 to PE32 PE0 to PE12 PD 0 to PD 78 PC 6 to PC 72 PC 0 to PC 56 PB0 to PB78 PA0 to PA78 PWM0 to PWM7 ADJ SCL1 SCL0 SDA1 SDA0 H S1 H S0 VSYN C H SYN C YM YS I B G R EXLC XLC TO EC SC K SO SI R M C AN 0 to AN 5 6 INT0 INT1 INT2 TEX TX EXTAL XTAL RST MP VDD VSS Block Diagram

– 3 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 VSS VD D N C EXLC XLC PE4/YM PE5/YS PE6/I B G R PB0 PB1 PB2 PG 3 PG 4 PC 4 PC 5 PC 6/PW M 6 PC 7/PW M 7 PF0/PW M 0 PF1/PW M 1 PF2/PW M 2 PF3/PW M 3 PF4/SC L0 PF5/SC L1/PW M 4 PF6/SD A0 PF7/SD A1/PW M 5 PE0/TO /AD J PE1/PW M PE2/TEX/IN T0 PE3/TX H S0/PD 4 PC 3 PC 2 PC 1 PC 0 EC /PD 7 R M C /PD 6 H S1/PD 5 SI/PD 3 SO /PD 2 SC K/PD 1 IN T2/PD 0 H SYN C /PA7 VSYN C /PA6 R ST V SS PA0/AN 0 XTAL EXTAL PA5/AN 5 PA4/AN 4 PA3/AN 3 PA2/AN 2 PA1/AN 1 PB7 PB6 PB5 PB4 PB3 IN T1/PG 7 PG 6 PG 5 Pin Assignment(Top View) 64-pin SDIP Note) 1. NC (Pin 46) is left open. 2. Vss (Pins 16 and 48) are both connected to GND.

– 4 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 VSS VD D N C EXLC XLC PE4/YM PE5/YS PE6/I B G PE1/PW M PE2/TEX/IN T0 PE3/TX PF3/PW M 3 PF4/SC L0 PF5/SC L1/PW M 4 PF6/SD A0 PF7/SD A1/PW M 5 PE0/TO /AD J PF2/PW M PF1/PW M PF0/PW M PC7/PW M PC6/PW M PC5 PC4 PC3 PC2 PC1 PC0 PD7/EC PD6/RM C 5253545556575859606364 6162 R PB0 PB1 PB2 PG3 PG4 PG5 PG6 INT1/PG7 PB3 PB4 PB5 PB6 31 3220 21 22 23 24 25 26 27 28 29 30 H S0/PD 4 H S1/PD 5 SI/PD 3 SO /PD 2 SC K/PD 1 IN T2/PD 0 H SYN C /PA7 VSYN C /PA6 R ST VSS PA0/AN 0 XTAL EXTAL PA5/AN 5 PA4/AN 4 PA3/AN 3 PA2/AN 2 PA1/AN 1 PB7 Pin Assignment(Top View) 64-pin QFP Note) 1. NC (Pin 40) is left open. 2. Vss (Pins 10 and 42) are both connected to GND.

– 5 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 PE2/TEX/IN T0 PE3/TX VSS VD D N C EXLC XLC PE4/YM PE5/YS PE6/I PF7/SD A1/PW M 5 PE0/TO /AD J PE1/PW M PF4/SC L0 PF5/SC L1/PW M 4 PF6/SD A0 PF0/PW M PC7/PW M PC6/PW M PC5 PC4 PC3 PC2 PC1 PC0 PD7/EC PD6/RM C PD5/HS1 PD4/HS0 5253545556575859606364 6162 BGR PB0 PB1 PB2 PG3 PG4 PG5 PG6 INT1/PG7 PB3 PB4 31 3220 21 22 23 24 25 26 27 28 29 30 SO /PD 2 SI/PD 3 SC K/PD 1 IN T2/PD 0 H SYN C /PA7 VSYN C /PA6 R ST VSS XTAL EXTAL PA5/AN 5 PA4/AN 4 PA3/AN 3 PA2/AN 2 PA1/AN 1 PA0/AN 0 17 18 19 495051 PF1/PW M PF2/PW M PF3/PW M PB5 PB6 PB7 Pin Assignment(Top View) 64-pin LQFP Note) 1. NC (Pin 38) is left open. 2. Vss (Pins 8 and 40) are both connected to GND.

– 6 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 (Port A) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins) (Port B) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins) (Port C) Lower 6 bits are I/O ports; I/O can be set in a unit of single bits. Upper 2 bits are output port and large current (12mA) N-channel open drain output. Upper 2 bits are medium drive voltage (12V); lower 6 bits are 5V drive. (8 pins) (Port D) 8-bit I/O port. I/O can be set in a unit of single bits. Can drive 12mA synk current. (8 pins) (Port E) Bits 0 and 1 are I/O port; I/O can be set in a unit of single. Bits 2 and 3 are input port. Bits 4, 5 and 6 are output port. (7 pins) Pin Description Symbol PA0/AN0 to PA5/AN5 PA6/VSYNC PA7/HSYNC PB0 to PB7 PC0 to PC5 PC6/PWM6 to PC7/PWM7 PD0/INT2 PD1/SCK PD2/SO PD3/SI PD4/HS0 PD5/HS1 PD6/RMC PD7/EC PE0/TO/ADJ PE1/PWM PE2/TEX/INT0 PE3/TX PE4/YM PE5/YS PE6/I B G R I/O/ Analog input I/O/Input I/O/Input I/O I/O Output/Output I/O/Input I/O/I/O I/O/Output I/O/Input I/O/Input I/O/Input I/O/Input I/O/Input I/O/Output/ Output I/O/Output Input/Input/ Input Input/Output Output/Output Output/Output Output/Output Output Output Output I/O Description Analog inputs to A/D converter. (6 pins) OSD display vertical sync signal input. OSD display horizontal sync signal input. 8-bit PWM output. (2 pins) External interruption request input. Active at the falling edge. Serial clock I/O. Serial data output. Serial data input. HSYNC counter (CH0) input. HSYNC counter (CH1) input. Remote control reception circuit input. External event input for timer/counter. Rectangular wave output for 8-bit timer/counter. 14-bit PWM output. Connects a crystal for 32kHz timer/counter clock oscillation. When used as an event counter, input to TEX pin and leave TX pin open. 32kHz oscillation frequency dividing output. External interruption request input. Active at the falling edge. OSD display 6-bit output. (6 pins)

– 7 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 (Port F) 8-bit output port and large current (12mA) N-channel open drain output. Lower 4 bits are medium drive voltage (12V); upper 4 bits are 5V drive. (8 pins) (Port G) 5-bit I/O port. I/O can be set in a unit of single bits. (5 pins) Connects a crystal for system clock oscillation. When a clock is supplied externally, input to EXTAL pin and input a reversed phase clock to XTAL pin. System reset; active at Low level. OSD display clock oscillation I/O. Oscillation frequency is determined by the external L and C. No connected. Positive power supply. GND. Connect two Vss pins to GND. 8-bit PWM output. (4 pins) I 2C bus interface transfer clock I/O. (2 pins) I2C bus interface transfer data I/O. (2 pins) Symbol PF0/PWM0 to PF3/PWM3 PF4/SCL0 PF5/SCL1/ PWM4 PF6/SDA0 PF7/SDA1/ PWM5 PG3 to PG6 PG7/INT1 EXTAL XTAL RST EXLC XLC NC V DD Vss Output/Output Output/I/O Output/I/O/ Output Output/I/O Output/I/O/ Output I/O I/O/Input Input Output Input Input Output I/O Description 8-bit PWM output. 8-bit PWM output. External interruption request input. Active at the falling edge.

– 8 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 Port A data Port A direction IP R D (Port A) D ata bus “0” w hen reset Port A function selection “0” w hen reset A/D converter Input m ultiplexer Input protection circuit Port A data Port A direction IP Input polarity R D (Port A) D ata bus H SYN C , VSYN C “0” w hen reset “0” w hen reset Schm itt input Ports B, C , G data Ports B, C , G direction IP R D (Ports B, C , G ) D ata bus IN T1 “0” w hen reset Schm itt input only for PG 7 Input/Output Circuit Formats for Pins Port A Port A Port B Port C 6 pins 2 pins 19 pins Hi-Z Hi-Z Hi-Z Pin When resetCircuit format PA6/VSYNC PA7/HSYNC PB0 to PB7 PC0 to PC5 PG3 to PG6 PG7/INT1 PA0/AN0 to PA5/AN5 Port G Ports C and F data Ports C and F function selection “0” w hen reset “1” w hen reset PW M 0 to PW M 3 PW M 6, PW M 7 ∗ 12V drive voltage Large current 12m A Port C 6 pins PC6/PWM6 PC7/PWM7 PF0/PWM0 to PF3/PWM3 Hi-Z Port F

– 9 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 Port D data Port D direction IP R D (Port D ) D ata bus IN T2, SI, H S0, H S1, R M C , EC “0” w hen reset Schm itt input ∗ Large current 12m A Port D data Port D direction IP R D (Port D ) D ata bus “0” w hen reset Schm itt input only for PD 1 SC K, SO SIO output enable SC K only ∗ Large current 12m A Port E data “1” w hen reset TO AD J16K∗1 AD J2K∗1 M PX D ata bus Port E direction “1” w hen reset Port E function selection (Low er) “00” w hen reset IP Port E function selection (U pper) Internal reset signal ∗1 AD J signals are frequency dividing outputs for 32kH z oscillation frequency adjustm ent. AD J2K provides usage as buzzer output. ∗2 Pull-up resistors approx. 150kΩ R D (Port E) Port D Port D Port E 6 pins 2 pins 1 pin Hi-Z Hi-Z High level (with approximately 150kΩ resistor when reset) Pin When resetCircuit format PD1/SCK PD2/SO PE0/TO/ADJ PD0/INT2 PD3/SI PD4/HS0 PD5/HS1 PD6/RMC PD7/EC

– 10 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 IPIP 32kH z oscillation circuit control R D (Port E) Schm itt input Schm itt input C lock input D ata bus D ata bus IN T0 “1” w hen reset PE2/ TEX/ IN T0 PE3/ TX R D (Port E) Port E data Port E direction IP R D (Port E) D ata bus “1” w hen reset PW M “1” w hen reset Port E function selection “0” w hen reset Port E Port E 1 pin 2 pins 3 pins Pin When resetCircuit format PE2/TEX/INT0 PE3/TX High level Oscillation halted Port input Hi-Z PE1/PWM PE4/YM PE5/YS PE6/I Port E data Port E function selection “0” w hen reset YM , YS, I O utput polarity “0” w hen reset W riting data to output polarity register and port data register brings output to active. Port E

– 11 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 4 pins 3 pins Pin When resetCircuit format R G B Hi-Z Hi-Z I2C bus enable Port F data Port F function selection “0” w hen reset “1” w hen reset PW M 4, PW M 5 SC L, SD A SC L, SD A (I2C bus circuit) IP Schm itt input ∗ Large current 12m A To internal I2C pins (SC L1 for SC L0) BU S SW R , G , B O utput polarity “0” w hen reset W riting data to output polarity register brings output to active. Port F PF4/SCL0 PF5/SCL1/PWM4 PF6/SDA0 PF7/SDA1/PWM5 EXLC XLC IP O scillation control IP O SD display clock IPEXTAL XTAL

  • D iagram show s the circuit com position during oscillation.
  • Feedback resistor is rem oved during stop. (This device does not enter the stop m ode.) /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines Schm itt input Pull-up resistor O P M ask option 2 pins EXLC XLC 2 pins EXTAL XTAL 1 pin RST Oscillation halted Oscillation Low level

– 12 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 *1 VIN and VOUT should not exceed VDD + 0.3 V. *2 The large current output port is Port C (PC6, PC7), Port D (PD) and Port F (PF). Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should be conducted under the recommended operating conditions. Exceeding those conditions may adversely affect the reliability of the LSI. VDD VIN VOUT VOUTP IOH ∑ IOH IOL IOLC ∑ IOL Topr Tstg PD –0.3 to +7.0 –0.3 to +7.0*1 –0.3 to +7.0*1 –0.3 to +15.0 –50 130 –20 to +75 –55 to +150 1000 600 380 V V V V mA mA mA mA mA mW mW mW Total of all output pins Ports excluding large current output (value per pin) Large current output ports (value per pin* Total of all output pins SDIP-64P-01 QFP-64P-L01 LQFP-64P-L01 Item Symbol Ratings Unit Remarks Absolute Maximum Ratings (Vss = 0V reference) Supply voltage High level input voltage Low level input voltage Operating temperature 5.5 5.5 5.5 VDD VDD VDD + 0.3 0.3VDD 0.2VDD 0.4 +75 V V V V V V V V V V Item Symbol Min. Max. Unit Remarks 4.5 3.5 2.7 0.7VDD 0.8VDD VDD – 0.4 –0.3 –20 VIH VIHS VIHEX VIL VILS VILEX Topr Guaranteed operation range for 1/2 and 1/4 frequency dividing modes Guaranteed operation range for 1/16 frequency dividing mode or sleep Guaranteed operation range for TEX mode Guaranteed data hold range for stop* EXTAL pin*4, TEX pin*5 EXTAL pin*4, TEX pin*5 VDD *1 This device does not enter the STOP mode. *2 PA1 to 5, PB3 to 7, PC0 to PC5, PD2, PE0, PE1, PE3, PG3 to PG6, SCL0 to 1, SDA0 to 1 pins *3 VSYNC, HSYNC, INT2, SCK, SI, HS0, HS1, RMC, EC, INT0, INT1, RST pins *4 Specifies only during external clock input. *5 Specifies only during external event count input. Recommended Operating Conditions (Vss = 0V reference) Supply voltage Input voltage Output voltage Medium drive output voltage High level output current High level total output current Low level output current Low level total output current Operating temperature Storage temperature Allowable power dissipation

– 13 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 VDD = 4.5V, IOH = –0.5mA VDD = 4.5V, IOH = –1.2mA VDD = 4.5V, IOL = 1.8mA VDD = 4.5V, IOL = 3.6mA VDD = 4.5V, IOL = 3.0mA VDD = 4.5V, IOL = 4.0mA VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL= 0.4V VDD = 5.5V, VIH = 5.5V VDD = 4.5V, IOL = 12.0mA High level output voltage Low level output voltage Input current I/O leakage current Open drain I/O leakage current (in N-ch Tr off state) Supply current*2 4.0 3.5 1.2 µA mA µA µA 120 2.1 mA µA µA Ω 0.4 0.6 1.5 0.4 0.6 –40 –10 –400 ±10 V V V V V µA µA µA µA µA µA 0.5 –0.5 0.1 –0.1 –1.5 V V PA, PB, PC0 to PC5, PD, PE0 to PE1, PE4 to PE6, PG, R, G, B PA to PD, PE0 to PE1, PE4 to PE6, PF0 to PF3, PG, R, G, B PC6, PC7, PD, PF PF4 to PF7 (SCL0, SCL1, SDA0, SDA1) EXTAL RST * PA to PE, PG, R, G, B, RST*1 PC6, PC7, PF0 to PF3 PF4 to PF7 SCL0: SCL1 SDA0: SDA1 VDD = 5.5V, VIL= 0.4V VDD = 5.5V, VI= 0, 5.5V VDD = 5.5V, VOH = 12.0V VDD = 5.5V, VOH = 5.5V VDD = 4.5V VSCL0 = VSCL1 = 2.25V VSDA0 = VSDA1 = 2.25V VDD VDD = 3.3V, 32MHz crystal oscillation (C1 = C2 = 47pF) Item Symbol Pins Conditions Min. Typ. Max. Unit VOH VOL IIZ ILOH R BS IDD1 IDD2 IDDS1 IDDS2 IDDS3 IIHE IILE IIHT IILT IILR

Electrical Characteristics

DC characteristics (Ta = –20 to +75°C, Vss = 0V reference) 1/2 frequency dividing mode TEX VDD = 5.5V, 16MHz crystal oscillation (C1 = C2 = 15pF) VDD = 3.3V, 32MHz crystal oscillation (C1 = C2 = 47pF) Sleep mode VDD = 5.5V, 16MHz crystal oscillation (C1 = C2 = 15pF) Stop mode*3 VDD = 5.5V, termination of 16MHz and 32MHz oscillation I2C bus switch connection impedance (in output Tr off state)

– 14 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 *1 For RST pin, specifies the input current when pull-up resistance is selected, and specifies the leakage current when non-resistor is selected. *2 When all output pins are left open. Specifies only when the OSD oscillation is halted. *3 This device does not enter the stop mode. Input capacitance 10 20 pF PA to PD, PE0 to PE3, R, G, B, PF4 to PF7, PG3 to PG7, EXTAL, TEX, EXLC, RST Clock 1 MHz 0V other than the measured pins Item Symbol Pins Conditions Min. Typ. Max. Unit C IN

– 15 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 *1 Indicates three values according to the contents of the clock control register (CLC: 00FEh) upper 2 bits (CPU clock selection). tsys (ns) = 2000/fc (Upper 2 bits = “00”), 4000/fc (Upper 2 bits = “01”), 16000/fc (Upper 2 bits = “11”) EXTAL tXH tXLtC F tC R 0.4V VD D – 0.4V 1/fc /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines C rystal oscillation C eram ic oscillation EXTAL XTAL External clock EXTAL XTAL 74H C 04C 1 C 2 /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines 32kH z clock applied condition C rystal oscillation TEX TX C 1 C 2 TEX EC tEH tELtEF tER 0.2VD D 0.8VD D tTH tTLtTF tTR AC Characteristics (1) Clock timing System clock frequency System clock input pulse width System clock input rise and fall times Event count input clock pulse width Event count input clock rise and fall times System clock frequency Event count input clock input pulse width Event count input clock rise and fall times f C tXL, tXH tCR , tCF tEH , tEL tER , tEF fC tTL, tTH tTR , tTF XTAL EXTAL EXTAL EXTAL EC EC TEX TX TEX TEX MHz ns ns ns ms kHz µs ms Item Symbol Pins Conditions Min. Unit Fig. 1, Fig.2 Fig. 1, Fig.2 External clock drive Fig. 1, Fig.2 External clock drive Fig. 3 Fig. 3 V DD = 2.7 to 5.5 V Fig. 2 (32kHz clock applied conditions) Fig. 3 Fig. 3 4tsys*1 Typ. 32.768 Max 200 (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Fig.2. Clock applied conditions Fig. 1. Clock timing Fig. 3. Event count clock timing

– 16 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 (2) Serial transfer (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Item SCK cycle time tKCY SCK Input mode Output mode SCK input mode SCK output mode SCK input mode SCK output mode SCK input mode SCK output mode SCK input mode SCK output mode 1000 8000/fc 400 4000/fc – 50 100 200 200 100 200 100 ns ns ns ns ns ns ns ns ns ns SCK SI SI SO tKH tKL tSIK tKSI tKSO SCK High and Low level width SI input setup time (for SCK ›) SI hold time (for SCK ›) SCK fl fi SO delay time Symbol Pins Conditions Min. Max. Unit Note) The load of SCK output mode and SO output delay time is 50pF + 1TTL. Fig. 4. Serial transfer timing 0.2VD D 0.8VD D tKL tKH SO tKC Y tSIK tKSI 0.2VD D 0.8VD D tKSO 0.2VD D 0.8VD D O utput data Input dataSI SC K

– 17 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 Resolution Linearity error Zero transition voltage Full-scale transition voltage Conversion time Sampling time Analog input voltage V ZT*1 VFT*2 tCONV tSAMP VIAN AN0 to AN5 Ta = 25°C VDD = 5.0V Vss = 0V –10 4910 26/fADC *3 6/fADC *3 4970 5030 VDD Bits LSB mV mV µs µs V Item Symbol Pins Conditions Min. Typ. Max. Unit (3) A/D converter (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Linearity error VZT VFT Analog input FFh FEh 01h 00h Digital conversion value Fig. 5. Definitions for A/D converter terms *1 VZT: Value at which the digital conversion value changes from 00h to 01h and vice versa. *2 VFT: Value at which the digital conversion value changes from FEh to FFh and vice versa. *3 fADC indicates the below values due to the contents of bit 6 (CKS) of the A/D control register (ADC: 00F6h): fADC = fc (CKS = “0”), fc/2 (CKS = “1”)

– 18 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 External interruption High, Low level width Reset input Low level width INT0 INT1 INT2 RST 32/fc µs µs Item Symbol Pins Conditions Min. Max. Unit tIH tIL tRSL (4) Interruption, reset input (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) 0.2VD D 0.8VD D tIH tIL IN T0 IN T1 IN T2 (falling edge) Fig. 6. Interruption input timing tR SL 0.2VD D R ST Fig. 7. RST input timing

– 19 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 (5) I2C bus timing (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Item SCL clock frequency Bus-free time before starting transfer Hold time for starting transfer Clock Low level width Clock High level width Setup time for repeated transfers Data hold time Data setup time SDA, SCL rise time SDA, SCL fall time Setup time for transfer completion f SLC tBUF tHD; STA tLOW tHIGH tSU; STA tHD; DAT tSU; DAT tR tF tSU; STO SCL SDA, SCL SDA, SCL SCL SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL 4.7 4.0 4.7 4.0 4.7 250 4.7 100 300 kHz µs µs µs µs µs µs ns µs ns µs Symbol Pins Conditions Min. Max. Unit *1 The data hold time should be 300ns or more because the SCL rise time (300ns Max.) is not included in it. Fig. 8. I2C bus transfer timing PSt tSU ; STOtSU ; STA tH D ; STA tSU ; D ATtH IG HtH D ; D AT tFtR tLO W tH D ; STA SP tBU F SD A SC L Fig. 9. I2C bus device recommended circuit I2C bus device I2C bus device R S R S R S R S R P R P SD A0 (or SD A1) SC L0 (or SC L1)

  • A pull-up resistor (Rp) must be connected to SDA0 (or SDA1) and SCL0 (or SCL1).
  • The SDA0 (or SDA1) and SCL0 (or SCL1) series resistance (Rs = 300Ω or less) can be used to reduce the spike noise caused by CRT flashover.

– 20 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 (6) OSD timing (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Item OSD clock frequency HSYNC pulse width VSYNC pulse width HSYNC afterwrite rise and fall times VSYNC beforewrite rise and fall times f OSC tHWD tVWD tHCG tVCG EXLC XLC HSYNC VSYNC HSYNC VSYNC Fig. 11 Fig. 10 Fig. 10 Fig. 10 Fig. 10 30.4 200 1.0 MHz µs H *2 ns µs Symbol Pins Conditions UnitMin. Max Fig. 10. OSD timing 0.8VD D 0.2VD D tH C G tH W D H SYN C For O SD I/O polarity register (O PO L: 01FEh) bit 7 at “0” 0.8VD D 0.2VD D tVC G VSYN C For O SD I/O polarity register (O PO L: 01FEh) bit 6 at “0” tVW D Fig. 11. LC oscillation circuit connection L C 2C 1 EXLC XLC R ∗1 *1 The series resistor for XLC (R = 1kΩ or less) can reduce the frequency of occurrence of the undesired radiation. *1 The maximum value of fosc is specified with the following equation. fosc [max] ≤ fc · 1.9 *2 H indicates 1HSYNC period.

– 21 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 Appendix Fig. 12. Recommended oscillation circuit C 2 R d/LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines EXTAL XTAL C 1 (i) M ain clock /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines TEX TX C 1 C 2 R d (iii) Sub clock R d/LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines EXTAL XTAL C 1 C 2 (ii) M ain clock /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines Reset pin pull-up resistor Non-existent Existent Item Content Mask Option Table * Models with an astarisk (*) have the built-in ground capacitance (C1, C2). *1 The series resistor for XTAL (Rd = 500Ω or less) can reduce the effect of the noise caused by the electrostatic discharge. Manufacture RIVER ELETEC CO., LTD. MURATA MFG CO., LTD. CSA10.0MTZ CSA12.0MTZ CSA16.00MXZ040 CST10.0MTW CST12.0MTW * CST16.00MXW0C1 * KINSEKI LTD. Model HC-49/U03 HC-49/U (-S) fc (MHz) 10.0 12.0 16.0 10.0 12.0 16.0 8.0 12.0 16.0 8.0 12.0 16.0 OPEN OPEN 0 * 330 *1 0 *1 120k32.768kHz (iii) C 1 (pF) C 2 (pF) Rd (Ω ) Circuit example (i) (i) (ii)

– 22 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 Fig. 13. Characteristic curves ID D vs. VD D (fc = 16M H z, Ta = 25°C , Typical) Frequency [M H z] IDD – Supply current [m ID D vs. fc (VD D = 5V, Ta = 25°C , Typical) 3 4 5 6 0.1 VD D – Supply voltage [V] IDD – Supply current [m 0.01 1/16 dividing m ode 1/4 dividing m ode Sleep m ode 100 32kH z sleep m ode 32kH z operation m ode 1/2 dividing m ode 1/2 dividing m ode 1/4 dividing m ode 1/16 dividing m ode Sleep m ode 100 5 15 100 L – Inductance [µH] Param eter curve for O SD oscillator L vs. C (Analytically calculated value) C 1, C 2 – C apacitance [pF] 20M H z 24M H z 30M H z 50 10090807060403020100 0.1 0.01 28M H z 16M H z fO SC = C = C 1//C 21 2π √ LC

– 23 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 Package Outline Unit: mm PAC KAG E STR U C TU R E M O LD IN G C O M PO U N D LEAD TR EATM EN T LEAD M ATER IAL PAC KAG E W EIG H T SO N Y C O D E EIAJ C O D E JED EC C O D E SD IP-64P-01

42 ALLO Y

64PIN SD IP (PLASTIC ) 750m il SD IP064-P-0750-A 57.6 – 0.1 + 0.4 64 33 1 32 1.778 19.05 17.1 – 0.1 + 0.3 0° to 15° 0.25 – 0.05 + 0.1 0.5 M IN 4.75 – 0.1 + 0.4 3 M IN 0.5 ± 0.1 0.9 ± 0.15 8.6g SO N Y C O D E EIAJ C O D E JED EC C O D E 23.9 ± 0.4 20.0 – 0.1 1.0 0.4 – 0.1 + 0.15 14.0 – 0.1 1 19 3351 0.15 – 0.05 + 0.1 2.75 – 0.15 16.3 0.1 – 0.05 + 0.2 0.8 ± 0.2 M± 0.12 0.15 + 0.4 17.9 0.4 + 0.4 + 0.35 64PIN Q FP(PLASTIC ) Q FP–64P–L01 ∗Q FP064–P–1420 PAC KAG E M ATER IAL LEAD TR EATM EN T LEAD M ATER IAL PAC KAG E W EIG H T EPO XY R ESIN SO LD ER /PALLAD IU M C O PPER /42 ALLO Y PAC KAG E STR U C TU R E PLATIN G 1.5g

– 24 – CXP86212/86216, CXP86324/86332, CXP86440/86448/86460 SO N Y C O D E EIAJ C O D E JED EC C O D E PAC KAG E M ATER IAL LEAD TR EATM EN T LEAD M ATER IAL PAC KAG E M ASS EPO XY R ESIN PLATIN G 42/C O PPER ALLO Y PAC KAG E STR U C TU R E 12.0 ± 0.2 ∗ 10.0 ± 0.1 (0.22) 0.18 – 0.03 + 0.081 16 3348 0.1 ± 0.1 0.5 ± 0.2 0° to 10° 64PIN LQ FP (PLASTIC ) LQ FP-64P-L01 LQ FP064-P-1010 0.3g D ETAIL A 0.5 ± 0.2 (11.0) 0.127 – 0.02 + 0.05 A 1.5 – 0.1 + 0.2 0.1 SO LD ER /PALLAD IU M N O TE: D im ension “∗” does not include m old protrusion. 0.13 M 0.5