CXG1194XR SONY | Alldatasheet
Document overview
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Technical content
Features
Insertion loss (Tx) : 0.35dB (Typ.) at 34dBm (GSM900) 0.45dB (Typ.) at 32dBm (GSM1800) Package Small and Low height package size: 14-pin XQFN (2.5mm × 2.5mm × 0.35mm (Typ.)) Structure GaAs JPHEMT MMIC
- 2 - Absolute Maximum Ratings (Ta = 25°C) ECopper-clad lamination of glass board (4 layers) : 30mm square, t = 0.8mm, FR-4. Note) Use this product without exceeding the PD value specified in this specification. If it is used with exceeding the PD value even for a moment, the heat generated by the operation may cause the degradation or breakdown of the product. Block Diagram Pin Configuration Truth Table Bias Voltage V DD 7V Control Voltage Vctl 5 V Input power max. [ANT, RF1, RF4] 35 dBm (Duty cycle = 12.5 to 50%) Input power max. [RF2, RF3] 13 dBm Operating temperature Topr –35 to +85 °C Maximum power dissipation PD 500 mW ANT RF1 (Tx) RF4 (Tx) RF3 (Rx) F3 F7 RF2 (Rx) 11 12 13 14 7 6 5 4 RF1 GND ANT GND RF3 GND RF4 GND VDD CTLA CTLB GND RF2 GND ON Path CTLA CTLB F1 F2 F3 F4 F5 F6 F7 F8 ANT – RF1 L L ON OFF OFF OFF OFF ON ON ON ANT – RF2 H L OFF ON OFF OFF ON OFF ON ON ANT – RF3 L H OFF OFF ON OFF ON ON OFF ON ANT – RF4 H H OFF OFF OFF ON ON ON ON OFF
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Electrical Characteristics
(Ta = 25°C) Note) Electrical Characteristics are measured with all RF ports terminated in 50 Ω. *1 Harmonics measured with Tx inputs harmonically matched. The use of harmonic matching is recommended to ensure optimum performance. *2 Power incident on Tx, Pin = 34dBm, 824 to 915MHz, VDD = 2.8V, RF1 or RF4 enabled *3 Power incident on Tx, Pin = 32dBm, 1710 to 1910MHz, VDD = 2.8V, RF1 or RF4 enabled Item Symbol Port Condition Min. Typ. Max. Unit Insertion loss IL ANT – RF1 824 to 960MHz 0.35 0.50 dB 1710 to 1990MHz 0.45 0.65 dB ANT – RF2 824 to 960MHz 0.45 0.60 dB 1710 to 1990MHz 0.55 0.70 dB ANT – RF3 824 to 960MHz 0.45 0.60 dB 1710 to 1990MHz 0.55 0.70 dB ANT – RF4 824 to 960MHz 0.35 0.50 dB 1710 to 1990MHz 0.45 0.65 dB Isolation ISO. ANT – RF1 824 to 960MHz 25 30 dB 1710 to 1990MHz 22 26 dB ANT – RF2 824 to 960MHz 30 35 dB 1710 to 1990MHz 25 30 dB ANT – RF3 824 to 960MHz 30 35 dB 1710 to 1990MHz 25 30 dB ANT – RF4 824 to 960MHz 30 35 dB 1710 to 1990MHz 25 30 dB VSWR VSWR 824 to 960MHz 1.2 — 1710 to 1990MHz 1.2 — Harmonics*1 2fo ANT – RF1 –33 –28 dBm 3fo –34 –28 dBm 2fo –35 –30 dBm 3fo –37 –33 dBm 2fo ANT – RF4 –34 –30 dBm 3fo –35 –30 dBm 2fo –35 –30 dBm 3fo –38 –34 dBm P1dB compression input power P1dB ANT – RF1, 4 *2 35 dBm ANT – RF1, 4 *3 33 dBm Control current Ictl Vctl = 2.8V 15 40 µA Supply current I DD VDD = 2.8V 0.12 0.23 mA
- 4 - DC Bias Condition (Ta = 25°C) Item Min. Typ. Max. Unit Vctl (H) 2.0 2.8 3.6 V Vctl (L) 0 — 0.4 V V DD 2.6 2.8 3.6 V
- 5 - Recommended Circuit 11 12 13 14 7 6 5 4 RF1 ANT GNDGND RF3 VDD Cbypass CTLA Cbypass CTLB Cbypass RF2 CRF CRF CRF CRF RF4 CRF GND GND GND GND When using this IC, the following external components should be used: CRF: This capacitor is used for RF decoupling and must be used for all applications. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended.
- 6 - Sony Corporation Package Outline (Unit: mm) SONY CODE EIAJ CODE JEDEC CODE XQFN-14P-01 14PIN XQFN (PLASTIC) TERMINAL SECTION Note:Cutting burr of lead are 0.05mm MAX. PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY PACKAGE STRUCTURE PACKAGE MASS C S S AB CS A-BM S PIN 1 INDEX 8-C0.1 0.24 0.5 0.05 0.05 0.24 +0.09 -0.03 MAX 0.02 Solder Plating 0.01g 2.5 2.5 CA-BS 0.05 LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm SPEC.