CXG1134EN SONY | Alldatasheet

Document overview

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  • PDF pages: 4

Technical content

Features

  • Low insertion loss: 0.25dB @900MHz, 0.35dB @1.9GHz  High linearity: IIP3 (typ.) = 70dBm  1 CMOS compatible control line  Small package size: 10-pin VSON

Applications

 Cellular handsets  PDC, CDMA Structure GaAs J-FET MMIC Absolute Maximum Ratings (T a = 25°C)  Bias voltage V DD 7V  Control voltage Vctl 5 V  Operating temperature T opr –35 to +85 °C  Storage temperature Tstg –65 to +150 °C GaAs MMICs are ESD sensitive devices. Special handling precautions are required.

– 2 – CXG1134EN Block Diagram and Recommended Circuit Truth Table ON OFF OFF ON OFF ON ON OFF CTL H L On Pass RF1 – RF2 RF1 – RF3 Item Vctl (H) Vctl (L) VDD Min. 2.2 2.7 Typ. 3.0 3.0 Max. 3.6 0.4 3.6 Unit V V V When using this IC, the following external parts should be used: Rctl: This resistor is used to improve ESD performance. 1kΩ is recommended. C RF : This capacitor is used for RF de-coupling and must be used for all applications. 100pF is recommended. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended. DC Bias Condition (T a = 25°C) GND GND VDD Cbypass (100pF) RF1 C RF (100pF) RF3 C RF (100pF) CTL GND GND GND RF2 C RF (100pF) GND (recommended) GND (recommended) F2F1 F3 F4 Cbypass (100pF) Rctl (1kΩ )

– 3 – CXG1134EN

Electrical Characteristics

µs µA µA Max. 0.50 1.4 –60 –60 100 Typ. 0.25 1.2 –75 –75 Min. Condition 900MHz 900MHz 900MHz VDD = 3.0V , 0/3V control Vctl (High) = 3V VDD = 3V Symbol IL ISO. VSWR 2fo 3fo P1dB TSW Ictl IDD Item Insertion loss Isolation VSWR Harmonics 1dB compression input power Switching speed Control current Bias current ∗1 Pin = 30dBm, 900MHz, VDD = 3.0V , 0/3V control (T a = 25°C)

– 4 – CXG1134EN Sony Corporation Package Outline Unit: mm 0.05 SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY PACKAGE STRUCTURE 10PIN VSON(PLASTIC) VSON-10P-01

0.15 S B

A 2.5 2.72.5 0.4 B

0.15 S BA

0.05 M S AB

S S 0.6 0.5 ± 0.2 0.8 610 0.35 ± 0.1 0.35 ± 0.1 0.8 – 0.05 + 0.1 TERMINAL SECTION 0.2 ± 0.01 0.225 ± 0.03 Solder Plating 0.14 – 0.03 0.13 ± 0.025 + 0.09 (Stand Off)0.03 ± 0.03 PIN 1 INDEX 0.013g ranges of 0.1mm and 0.25mm from the end of a terminal. NOTE: 1) The dimensions of the terminal section apply to the LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18 µm SPEC.