CXG1101TN SONY | Alldatasheet
Document overview
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- PDF pages: 4
Technical content
Features
- Low second harmonics < –31dBm at 29dBm @2.8V
- Low insertion loss: 0.3dB (Ant. – AMPS)
- Small package size: TSSOP-10pin (3.2mm × 2.8mm)
Applications
TDMA800/1900/AMPS800 triple mode handsets. Structure GaAs J-FET MMIC Absolute Maximum Ratings(Ta = 25°C)
- Control voltage | V CTL |5 V VCTL (H) – VCTL (L) 5 V
- Operating temperature Topr –35 to +85 °C
- Storage temperature Tstg –60 to +150 °C Notes on Handling GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Block Diagram CXG1101TN SP3T Antenna Switch for TDMA800/1900/AMPS800 Triple Mode Application – 1 – E00443B25-PS Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. 10 pin TSSOP (Plastic) Pin Configuration Ant Rx (TDMA1900 (Rx))6 5 Tx (TDMA1900 (Tx)) CTL1 ON AMPS1 CTL2 ON CTL3 ON Ant Rx (TDMA1900 (Rx))56 GND GND47 CTL1 Tx (TDMA1900 (Tx))38 CTL2 GND29 CTL3 AMPS110
– 2– CXG1101TN CTL1 R CTL (1kΩ ) Cbypass (100pF) CRF (100pF) CRF (100pF) Ant Rx (TDMA1900 (Rx)) CRF (100pF) Tx (TDMA1900 (Tx)) CRF (100pF) AMPS CTL2 R CTL (1kΩ ) Cbypass (100pF) CTL3 R CTL (1kΩ ) Cbypass (100pF) When using this IC, the following external parts should be used: R CTL : This resistor is used to improve ESD performance. 1kΩ is recommended. C RF : This capacitor is used for RF de-coupling and must be used for all applications. 100pF is recommended. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended. Recommended Circuit
– 3– CXG1101TN
Electrical Characteristics
VCTL = 0/2.8V control. All measurements are made in a 50Ω system, and unused ports are terminated with 50Ω . (Ta = 25 °C) Item Insertion loss Isolation VSWR Harmonics 1dB compression input power Switching speed Control current ∗1, ∗3 VCTL = 2.8V 0.60 0.65 0.30 1.2 –45 –40 100 0.85 0.90 0.55 1.5 –31 –31 500 dB dB dB dB dB dB dBm dBm dBm ns µA Condition Min. Typ. Max. Unit IL ISO. VSWR 2fo 3fo P1dB TSW I CTL Symbol Ant – Tx Ant – Rx Ant – AMPS Ant – Tx Ant – Rx Ant – AMPS Ant – Tx Ant – AMPS Ant – Tx Ant – AMPS Port ∗1 Pin = 29dBm, 1900MHz ∗2 Pin = 10dBm, 1900MHz ∗3 Pin = 29dBm, 800MHz ∗4 No signal input Truth Table On Pass Ant – Rx (TDMA1900 (Rx)) Ant – Tx (TDMA1900 (Tx)) Ant – AMPS H L L L H L L L H CTL1 CTL2 CTL3
– 4– CXG1101TN Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY PACKAGE STRUCTURE 0.22 0.5 1.2MAX ∗2.8 ± 0.1 10 6 0.1 – 0.05 + 0.15 0.45 ± 0.15 0° to 10° A (0.2) 0.22 – 0.07 + 0.08 (0.1) 0.12 – 0.015+ 0.025 DETAIL A 0.02g TSSOP-10P-L01 10PIN TSSOP(PLASTIC) 0.1 0.1 M NOTE: “∗” Dimensions do not include mold protrusion. 0.25 Sony Corporation LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18 µm SPEC. SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY PACKAGE STRUCTURE 0.22 0.5 1.2MAX ∗2.8 ± 0.1 10 6 0.1 – 0.05 + 0.15 0.45 ± 0.15 0° to 10° A (0.2) 0.22 – 0.07 + 0.08 (0.1) 0.12 – 0.015+ 0.025 DETAIL A 0.02g TSSOP-10P-L01 10PIN TSSOP(PLASTIC) 0.1 0.1 M NOTE: “∗” Dimensions do not include mold protrusion. 0.25 SCT Ass'y