CXG1034TN SONY | Alldatasheet

Document overview

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Technical content

Features

  • Low distortion Input IP3=+1.5 dBm (Typ.)
  • Low LO input power operation P LO =–15 dBm
  • RF, LO input matching circuit
  • Single 3 V power supply operation
  • 10-pin TSSOP package Function Frequency conversion

Applications

Japan digital cordless telephones (PHS) Structure GaAs J-FET MMIC Receiving Mixer 10 pin TSSOP (Plastic) CXG1034TN

— 2— CXG1034TN

Electrical Characteristics

VDD =3.0 V, fRF =1.9 GHz, fLO =1.66 GHz, PLO =–15 dBm, when 50 Ω IF output matching; unless otherwise specified (Ta=25 °C) Item Current consumption Conversion gain Noise figure Input IP3 LO to RF leak level RF input VSWR LO input VSWR Symbol I DD Gc NF IIP3 PLK VSWR RF VSWR LO Min. –1.5 Typ. 8.5 1.5 –19 1.5 Max. 10.5 –14 2.5 3.5 Unit mA dB dB dBm dBm Measurement condition When no signal Block Diagram Pin Configuration 10-pin TSSOP (Plastic) /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines R FIN IFO U T IF AM PM IX /LiteDiagLines /LiteDiagLines /LiteDiagLines /LiteDiagLines LO AM P LO IN N C IF O U T/VD D (M IX, IF AM P) R FIN C AP G N D G N D N C C AP VD D (LO AM P) LO IN 10 1

— 3— CXG1034TN Recommended Evaluation Circuit C 4 C 6 C 3 LO IN 50Ω R FIN 50Ω IF O U T 50Ω C 1C 2 VD D (LO AM P) C 5 VD D (M IX, IF AM P) 10 1 56 nH 18 pF 1000 pF 18 pF 8 pF 1000 pF 0.1 µF

— 4— CXG1034TN Example of Representative Characteristics(Ta=25 °C) PO U T, IM 3 vs. PIN –20 –40 –60 –80 –35 –25 –15 –5 5 P OUT-IF output power (dBm PIN -R F input pow er (dBm ) PO U T IM 3 G c, N F vs. PLO PLO -LO input pow er (dBm ) Gc-Conversion gain (dB) NF-Noise figure (dB) G c N F VD D =3.0V fR F=1.90G H z fLO =1.66G H z IIP3, PLK vs. PLO PLO -LO input pow er (dBm ) IIP3-Input IP3 (dBm –10 –15 –20 –25 –30 P LK-LO-RF leak level (dBm IIP3 PLK VD D =3.0V fR F=1.90G H z fLO =1.66G H z VD D =3.0V fR F1=1.90G H z fR F2=1.9006G H z fLO =1.66G H z PLO =–15dBm

— 5— CXG1034TN Recommended Evaluation Board Front Back CC XX GG 11003344TT NN EE VV BB SSOO NN YY 25m m C 4 C 1 C 2 C 5 C 6 C 3 R FIN IFO U T LO IN VD D (LO AM P) G N D VD D (M IX, IF AM P) VD D (LO AM P)G N DVD D (M IX, IF AM P) Glass fabric-base 4-layer epoxy board (thickness: 0.3 mm · 2) GND for the 2nd and 3rd layers

0.22 – 0.07 0.5 1.2M AX ∗2.8 ± 0.1 10 6 ∗2.2 ± 0.1 3.2 ± 0.2 0.1 – 0.05 + 0.15 0.45 ± 0.15 0° to 10° A (0.2) 0.22 – 0.07 + 0.08 (0.1) 0.12 – 0.015 + 0.025 D ETAIL A 0.02g TSSO P-10P-L01 10PIN TSSO P(PLASTIC ) 0.1 0.1 M N O TE: D im ension “∗” does not include m old protrusion. 0.25 + 0.08 Package Outline Unit : mm CXG1034TN — 6—