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Technical content
0.080 (2.03) 0.132 (3.35) 0.048 (1.22) inches (mm)
DESCRIPTION
Designed and manufactured in the USA, the CX9V quartz crystal is available in frequencies from 32 kHz to 250 kHz. Using micro-machining processes, this surface-mountable crystal is hermetically sealed within a ultra-miniature ceramic package to ensure high stability and low aging. Tight calibration and custom laser tuning make the CX9V ideally suited for all low frequency applications.
FEATURES
Ultra-miniature, surface mount design (4.1mm x 1.5mm) Low profile (typically 0.80mm) Available with glass or ceramic lid Hermetically sealed ceramic package High shock and vibration survival Excellent aging characteristics Designed for low power applications Full military testing available Designed and manufactured in the USA
APPLICATIONS
Pacemaker, defibrillator, and other implantables Medical instruments Industrial, Computer, & Communications Smart card Down hole instrumentation Transponder / Animal migration Process instrumentation Military & Aerospace Airborne hybrid Navigational computer Real time clock CX9VSM CRYSTAL 32 kHz to 250 kHz Ultra-Miniature, Low Profile Surface Mount Quartz Crystal 10157 - Rev D C1 R1 21 L1 EQUIVALENT CIRCUIT R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com TYP. MAX. DIM inches mm inches mm A0 . 1 6 0 4 . 1 0 0 . 1 7 0 4 . 3 2 B0 . 0 6 0 1 . 5 0 0 . 0 6 8 1 . 7 3 C- - s e e b e l o w D0 . 0 3 1 0 . 7 9 0 . 0 3 8 0 . 9 7 PACKAGE DIMENSIONS SUGGESTED LAND PATTERN Glass Lid THICKNESS (DIM C) MAXIMUM GLASS LID CERAMIC LID MAX inches mm inches mm SM1 0.034 0.87 0.035 0.90 SM2/SM4 0.034 0.87 0.035 0.90 SM3/SM5 0.036 0.91 0.037 0.94 TOP BOTTOM B A C D Ceramic Lid
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com 10157 - Rev D SPECIFICATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Parameters Fundamental Overtone Frequency, (kHz) 32.768 100 180 240 Motional Resistance R1(kΩ) 60 19 5 4 Motional Capacitance C1 (fF) 2.2 1.0 2.0 1.5 Quality Factor Q (k) 37 80 90 110 Shunt Capacitance C0 (pF) 1.0 0.85 1.0 0.9 Load Capacitance (pF)1 99 9 9 Turning Point (oC) 20 16 20 25 Standard Calibration Tolerance for 32.768 kHz2 Glass Lid: 30 ppm 100 ppm 1000 ppm Ceramic Lid: 100 ppm 1000 ppm 10000 ppm Drive Level 0.5 µW MAX Temperature Coefficient (k) -0.035 ppm/OC2 Note: Frequency f at temperature T is related to frequency f0 at turning point temperature T0 by: Aging, first year 3 ppm Shock, survival 5,000 g, 0.3 ms, 1/2 sine Vibration, survival 20 g RMS, 10-2,000 Hz random Operating Temp. Range -10 OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Storage Temp. Range -55 OC to +125OC Max Process Temperature 260 OC for 20 sec. 1. Other values available 2. Tighter tolerances available 3. Higher shock available +_+_+_ +_+_+_ f-f0 = k(T -T0) HOW TO ORDER CX9VSM CRYSTALS S C SM1 32.768K , 100 / I C = Ceramic Lid Blank = Glass Lid AMPLIFIER BUFFER CG CD RA CX9 OSC Freq (f )O Rf CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT “S” if special or custom design. Blank if Std. CX9V PACKAGING OPTIONS Tray Pack or 16mm tape, 7” or 13” reels (Reference tape and reel data sheet 10109) Frequency K = kHz Calibration Tolerance @ 25OC (in ppm) Operating Temp. Range: C=- 1 0 OC to +70OC I =- 4 0OC to +85OC M=- 5 5 OC to +125OC S=C u s t o m e r S p e c i f i e d TERMINATIONS Designation Termination SM1 Gold Plated (Lead Free) SM2 Solder Plated SM3 Solder Dipped SM4 Solder Plated (Lead Free) SM5 Solder Dipped (Lead Free) Max Process Temperature 260OC for 20 sec. SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) TYPICAL APPLICATION FOR A PIERCE OSCILLATOR The CX9 family of surface mount crystals are ideal for small, high density, battery operated portable products. The CX9 crystal designed in a Pierce oscillator (single inverter) circuit provides very low current consumption and high stability. A conventional CMOS Pierce oscillator circuit is shown below. The crystal is effectively inductive and in a PI- network circuit with CD and CG provides the additional phase shift necessary to sustain oscillation. The oscillation frequency (f0) is 50 to 150 ppm above the crystal’s series resonant frequency (fS). Drive Level RA is used to limit the crystal’s drive level by forming a voltage divider between RA and CD. RA also stabilizes the oscillator against changes in the amplifiers output resistance (R0). RA should be increased for higher voltage operation. Load Capacitance The CX9 crystal calibration tolerance is influenced by the effective circuit capacitances, specified as the load capacitance (CL). CL is approximately equal to: NOTE: CD and CG include stray layout to ground and CS is the stray shunt capacitance between the crystal terminal. In practice, the effective value of CL will be less than that calculated from CD, CG and CS values because of the effect of the amplifier output resistance. CS should be minimized. The oscillation frequency (f0) is approximately equal to: f0 = fS [1+ C1 ]2(C0 + CL) (2) Where fS =S e r i e s r e s o n a n t f r e q u e n c y o f t h e c r y s t a l C1 =M o t i o n a l C a p a c i t a n c e C0 =S h u n t C a p a c i t a n c e CL = CD x CG +CS CD + CG (1)