CX6SM STATEK | Alldatasheet

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STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com SYSTEM CERTIFICATION ISO 9001

DESCRIPTION

The CX6SM quartz crystals are leadless devices designed for surface mounting on printed circuit boards or hybrid substrates. They are hermetically sealed in a rugged, miniature ceramic package. They are manufactured using the STATEK-developed photolithographic process, and are designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications. Maximum process temperature should not exceed 260 OC.

FEATURES

Ultra-low profile (1mm) Extensional mode Ideal for use with microprocessors Designed for low power applications Low aging Full military testing available Ideal for battery operated applications Designed and manufactured in the USA CX6SM CRYSTAL 800 kHz to 1.35 MHz Ultra-Low Profile (1mm) Miniature Surface Mount Quartz Crystal ™ 10133 - Rev B TYP. MAX. DIM inches mm inches mm A 0.265 6.73 0.280 7.11 B 0.103 2.62 0.114 2.90 C- - see below D 0.050 1.27 0.060 1.52 DIM “C“ GLASS LID CERAMIC LID MAX inches mm inches mm SM1 0.039 0.99 0.053 1.35 SM2 0.041 1.04 0.055 1.40 SM3 0.044 1.12 0.058 1.47 0.070 (1.78) 0.215 (5.46) 0. 120 (3.05) inches (mm) A B D D TOP BOTTOM C PACKAGE DIMENSIONS SUGGESTED LAND PATTERN C1 R1 21 L1 EQUIVALENT CIRCUIT R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance actual size side view Glass Lid Shown

HOW TO ORDER CX6SM CRYSTALS CX6 S C SM1 1.0M, 500 / M STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com SYSTEM CERTIFICATION ISO 9001 10133 - Rev B SPECIFICATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Frequency Range 800 kHz - 1.35 MHz Functional Mode Extensional Calibration Tolerance* 500 ppm (0.05%) 1000 ppm (0.1%) 10000 ppm (1.0%) Load Capacitance 7 pF (Unless specified by customer) Motional Resistance (R1)5 k Ω MAX Motional Capacitance (C1) 1.2fF Quality Factor (Q) 150 k Shunt Capacitance (C 0) 1.0 pF Drive Level 3 µW MAX Turning Point (T0)** 35 OC Temperature Coefficient (k) -0.035 ppm/OC2 Aging, first year 5 ppm MAX Shock, survival 1,000 g peak, 0.3 ms,1/2 sine Vibration, survival 10 g RMS, 20-1,000 Hz random Operating Temp. Range -10 OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Storage Temp. Range -55 OC to +125OC Max Process Temperature 260 OC for 20 sec. Note: Frequency f at temperature T is related to frequency f0 at turning point temperature T0 by: *T ighter tolerances available. ** Other values available. f-f0 = k(T -T0) TERMINATIONS Designation Termination SM1 Gold Plated SM2 Solder Plated SM3 Solder Dipped PACKAGING CX6SM - Tray Pack - Tape and Reel (Reference tape and reel data sheet 10109) TYPICAL APPLICATION FOR A PIERCE OSCILLATOR The low profile CX miniature surface mount crystal is ideal for small, high density, battery operated portable products. The CX crystal designed in a Pierce oscillator (single inverter) circuit provides very low current consumption and high stability. A conventional CMOS Pierce oscillator circuit is shown below. The crystal is effectively inductive and in a PI-network circuit with C D and CG provides the additional phase shift necessary to sustain oscillation. The oscillation frequency (f 0) is 15 to 150 ppm above the crystal’s series resonant frequency (fS). Drive Level RA is used to limit the crystal’s drive level by forming a voltage divider between RA and CD. RA also stabilizes the oscillator against changes in the amplifiers output resistance (R 0). RA should be increased for higher voltage operation. Load Capacitance The CX crystal calibration tolerance is influenced by the effective circuit capacitances, specified as the load capacitance (C L). CL is approximately equal to: NOTE: CD and CG include stray layout to ground and CS is the stray shunt capacitance between the crystal terminal. In practice, the effective value of CL will be less than that calculated from CD, CG and CS values because of the effect of the amplifier output resistance. CS should be minimized. The oscillation frequency (f0) is approximately equal to: CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT AMPLIFIER BUFFER CG CD RA CX6 OSC Freq (f Rf f0 = fS [1+ C1 ]2(C0 + CL) (2) Where fS = Series resonant frequency of the crystal C1 = Motional Capacitance C0 = Shunt Capacitance CL = CD x CG +CS CD + CG (1) “S” if special or custom design. Blank if Srd. Blank = Glass Lid C = Ceramic Lid SM1 = Gold Plated SM2 = Solder Plated SM3 = Solder Dipped Frequency K = kHz M=MHz Calibration Tolerance @ 25OC (in ppm) Operating Temp. Range: C= -10OC to +70OC I= -40OC to +85OC M= -55OC to +125OC S= Customer Specified