CTT0213 CTMICRO | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 12
Technical content
Features
High isolation 5000 VRMS Supports 0.3 A, 0.6 A, 0.9 A and 1.2 A RoHS compliant REACH compliance External creepage > 7.5mm Internal creepage > 6.0mm Insulation distance > 0.4mm Regulatory Approvals UL - UL1577 (pending approval) VDE - EN60747-5-5(VDE0884-5) CQC – GB4943.1, GB8898 IEC60065, IEC60950
Description
The zero crossing power Triac consists of a Triac and a photo-Triac, which is optically coupled to a gallium arsenide Infrared emitting diode, and house in a 7-lead DIP package. It also comes with different lead forming options.
Applications
Home appliances Industrial equipment
Proprietary & Confidential Page 2 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC Absolute Maximum Rating at 25oC Symbol Parameters Ratings Units Notes Viso Isolation voltage 5000 Vrms TOPR Operating temperature -40 ~+85 oC TSTG Storage temperature -40 ~+125 oC TSOL Soldering temperature 260 oC Wave soldering temperature 260 oC Emitter IF LED forward current 50 mA VR LED reverse voltage 6 V IFP Peak forward current 1 A Pin Power dissipation 75 mW Detector VDRM Repetitive peak OFF-state voltage 600 V IT(RMS) Continuous Current Load CTT02XX 0.3 A CTT12XX 0.6 CTT22XX 0.9 CTT32XX 1.2 ITSM Peak Current Load CTT02XX 3 A CTT12XX 6 CTT22XX 9 CTT32XX 12 Pout Power dissipation 800 mW PT Total power dissipation 850 mW
Proprietary & Confidential Page 3 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC Electrical Characteristics TA = 25°C (unless otherwise specified) Emitter Characteristics Symbol Parameters Test Conditions Min Typ Max Units Notes VF Forward voltage IF=10mA - - 1.3 V IR Reverse Current VR = 6V - - 5 µA CIN Input Capacitance f= 1MHz - 45 - pF Detector Characteristics Symbol Parameters Test Conditions Min Typ Max Units Notes IDRM1 Peak Blocking Current IF= 0mA, VDRM= 600V - - 100 uA IDRM2 Inhibit Leakage Current IF= = Rated IFT, VDRM= 600V 500 uA VINH Inhibit Voltage IF= Rated IFT - - 50 V VTM Peak On-State Voltage IF= Rated IFT, ITM= 100mA - - 2.5 V dv/dt Critical Rate of Rise off-State Voltage VPEAK= Rated VDRM 200 - - V/µs Transfer Characteristics Symbol Parameters Test Conditions Min Typ Max Units Notes IFT Input Trigger Current Terminal Voltage = 3V - - 10 mA IH Holding Current - - 25 mA RIO Isolation Resistance VIO= 500VDC 1x1011 - - Ω CIO Isolation Capacitance f= 1MHz - 0.25 - pF
Proprietary & Confidential Page 4 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC Typical Characteristic Curves
Proprietary & Confidential Page 5 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC
Proprietary & Confidential Page 6 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC Package Dimension Dimensions in mm unless otherwise stated Standard DIP – Through Hole Gullwing (400mil) Lead Forming – Through Hole (M Type)
Proprietary & Confidential Page 7 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC Surface Mount Lead Forming (S Type) Surface Mount (Low Profile) Lead Forming (SL Type)
Proprietary & Confidential Page 8 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC Device Marking Note: CT : Denotes “CT Micro” T3213 : Product Number V : VDE Safety Mark (option) Y : Fiscal Year WW : Work Week K : Production Code
Ordering Information
CTTX213(V)(Y)(Z) CT = Denotes “CT Micro” TX213 = Product Number (Current Rating Option X=0, 1, 2, or 3) V = VDE safety mark option (V, or none) Y = Lead form option (S, SL, M or none) Z = Tape and reel option (T1, T2 or none) Option Description Quantity None Standard 8 Pin Dip 40 Units/Tube M Gullwing (400mil) Lead Forming 40 Units/Tube S(T1) Surface Mount Lead Forming – With Option 1 Taping 1000 Units/Reel S(T2) Surface Mount Lead Forming – With Option 2 Taping 1000 Units/Reel SL(T1) Surface Mount (Low Profile) Lead Forming– With Option 1 Taping 1000 Units/Reel SL(T2) Surface Mount (Low Profile) Lead Forming– With Option 2 Taping 1000 Units/Reel CT T3213 VYWWK
Proprietary & Confidential Page 9 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC Carrier Tape Specifications Dimensions in mm unless otherwise stated Option S(T1) & SL(T1) Option S(T2) & SL(T2)
Proprietary & Confidential Page 10 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC Wave soldering (JEDEC22A111 compliant) One time soldering is recommended within the condition of temperature. Temperature: 260+0/-5˚C. Time: 10 sec. Preheat temperature:25 to 140˚C. Preheat time: 30 to 80 sec. Hand soldering by soldering iron Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 350+0/-5˚C Time: 3 sec max.
Proprietary & Confidential Page 11 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC Reflow Profile Profile Feature Pb-Free Assembly Profile Temperature Min. (Tsmin) 150°C Temperature Max. (Tsmax) 200°C Time (ts) from (Tsmin to Tsmax) 60-120 seconds Ramp-up Rate (tL to tP) 3°C/second max. Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60 – 150 seconds Peak Body Package Temperature 260°C +0°C / -5°C Time (tP) within 5°C of 260°C 30 seconds Ramp-down Rate (TP to TL) 6°C/second max Time 25°C to Peak Temperature 8 minutes max.
Proprietary & Confidential Page 12 Nov, 2017 CTT0213, CTT1213, CTT2213, CTT3213 600V Zero Cross High Power Photo TRIAC DISCLAIMER CT MICRO RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. CT MICRO DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. CT MICRO ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF CT MICRO INTERNATIONAL CORPORATION. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instruction for use provided in the labelling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.