CT852 CTMICRO | Alldatasheet

Document overview

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  • PDF pages: 14

Technical content

Features

  • • •• High isolation 5000 VRMS
  • • •• CTR : Min 1000%
  • • •• High B VCEO = 350V
  • • •• Operating temperature range - 55 ° C to 110 ° C

Applications

  • • •• Switch mode power supplies
  • • •• Computer peripheral interface
  • • •• Microprocessor system interface
  • • •• Controller for SSR, DC Motor
  • • •• Telephone Line Interface

Description

The CT852 series consists of high voltage photodarlington optically coupled to a gallium arsenide Infrared-emitting diode in a 4-lead DIP package with bending options.

Proprietary & Confidential Page 2 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler Absolute Maximum Rating at 25 oC Symbol Parameters Ratings Units Notes VISO Isolation voltage 5000 VRMS TOPR Operating temperature -55 ~ +100 oC TSTG Storage temperature -55 ~ +150 oC TSOL Soldering temperature 260 oC Emitter IF Forward current 80 mA IF(TRANS) Peak transient current ( ≤1µs P.W,300pps) 1 A VR Reverse voltage 6 V PD Power dissipation 150 mW Detector PD Power dissipation 300 mW BVCEO Collector-Emitter Breakdown Voltage 350 V BVECO Emitter-Collector Breakdown Voltage 0.1 V IC Collector Current 150 mA

Proprietary & Confidential Page 3 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler

Electrical Characteristics

TA = 25° C (unless otherwise specified) Emitter Characteristics Symbol Parameters Test Conditions Min Typ Max Units Notes VF Forward voltage I F=10mA 1.2 1.4 V IR Reverse Current V R = 5V - - 5 µ A CIN Input Capacitance f= 1MHz - 45 - pF Detector Characteristics Symbol Parameters Test Conditions Min Typ Max Units Notes BVCEO Collector-Emitter Breakdown IC= 100 µ A 350 - - V BVECO Emitter-Collector Breakdown IE= 100 µ A 0.1 - - V ICEO Collector-Emitter Dark Current V CE = 200V, I F=0mA - - 100 nA Transfer Characteristics Symbol Parameters Test Conditions Min Typ Max Units Notes CTR Current Transfer Ratio I F= 1mA, V CE = 2V 1000 15000 % VCE(SAT) Collector-Emitter Saturation Voltage I F= 20mA, I C= 100mA - - 1.2 V RIO Isolation Resistance V IO = 500V DC 5x10 10 /uni2126 CIO Isolation Capacitance f= 1MHz 0.6 pF Switching Characteristics Symbol Parameters Test Conditions Min Typ Max Units Notes tr Rise Time IC=2mA, V CE = 2V, R L= 100 /uni2126 - - 250 µ s tf Fall Time - - 95

Proprietary & Confidential Page 4 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler Typical Characteristic Curves

Proprietary & Confidential Page 5 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler

Proprietary & Confidential Page 6 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler Test Circuit IC RL RIN Input Output IF Input Pulse Output Pulse tr ton tf toff Figure 13: Switching Time Test Circuits

Proprietary & Confidential Page 7 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler Package Dimension Dimensions in mm unless otherwise stated Standard DIP – Through Hole Gullwing (400mil) Lead Forming – Through Hole

Proprietary & Confidential Page 8 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler Surface Mount Lead Forming Surface Mount (Low Profile) Lead Forming

Proprietary & Confidential Page 9 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler Recommended Solder Mask Dimensions in mm unless otherwise stated Marking Information Note: CT : Denotes “CT Micro” 852 : Product Number R : CTR Rank Y : Fiscal Year WW : Work Week D : Production Code CT 852 YWWD

Proprietary & Confidential Page 10 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler

Ordering Information

CT852(Y)(Z)-G Y = Lead form option (S, SL, M or none) Z = Tape and reel option (T1, T2 or none) G= Material option (G: Green, None: Non-green) Option Description Quantity None Standard 4 Pin Dip 100 Units/Tube M Gullwing (400mil) Lead Forming 100 Units/Tube S(T1) Surface Mount Lead Forming – With Option 1 Taping 1 000 Units/Reel S(T2) Surface Mount Lead Forming – With Option 2 Taping 1 000 Units/Reel S(T3) Surface Mount Lead Forming – With Option 3 Taping 1 000 Units/Reel S(T4) Surface Mount Lead Forming – With Option 4 Taping 1 000 Units/Reel SL(T1) Surface Mount (Low Profile) Lead Forming– With Opti on 1 Taping 1000 Units/Reel SL(T2) Surface Mount (Low Profile) Lead Forming – With Opt ion 2 Taping 1000 Units/Reel SL(T3) Surface Mount (Low Profile) Lead Forming– With Opti on 3 Taping 1000 Units/Reel SL(T4) Surface Mount (Low Profile) Lead Forming – With Opt ion 4 Taping 1000 Units/Reel

Proprietary & Confidential Page 11 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler Carrier Tape Specifications Dimensions in mm unless otherwise stated Option S(T1) & SL(T1) Option S(T2) & SL(T2)

Proprietary & Confidential Page 12 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler Option S(T3) & SL(T3) Option S(T4) & SL(T4)

Proprietary & Confidential Page 13 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler Reflow Profile Profile Feature Pb-Free Assembly Profile Temperature Min. (Tsmin) 150° C Temperature Max. (Tsmax) 200° C Time (ts) from (Tsmin to Tsmax) 60-120 seconds Ramp-up Rate (t L to t P) 3° C/second max. Liquidous Temperature (T L) 217° C Time (t L) Maintained Above (T L) 60 – 150 seconds Peak Body Package Temperature 260° C +0° C / -5° C Time (t P) within 5° C of 260° C 30 seconds Ramp-down Rate (T P to T L) 6° C/second max Time 25° C to Peak Temperature 8 minutes max.

Proprietary & Confidential Page 14 Aug, 2013 CT852 4-Pin High Power Photodarlington Optocoupler DISCLAIMER CT MICRO RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. CT MICRO DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. DISCOLORATION MIGHT OCCUR ON THE PACKAGE SURFACE AFTER SOLDERING, REFLOW OR LONG TERM USE. THIS DOES NOT IMPACT THE PRODUCT PERFORMANCE NOR THE PRODUCT RELIABILITY. CT MICRO ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF CT MICRO INTERNATIONAL CORPORATION. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instruction for use provided in the labelling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.