CSU-SERIES VITROHM | Alldatasheet
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File Nr. 3980.18-450.110.02 | Revision: 202205 AEC - Q200 Qualified CSU Series Datasheet Through hole shunt resistor Precision Resistor Type / Size CSU382 Nominal Power Rating P70 [W] See “ELECTRICAL CHARACTERISTICS” table on page 2 P100 Resistance Range (Preferred values. Other’s upon request) [Ω] R0003, R0005, R001, R002 Tolerances ±[%] F = 1% ; H = 3% ; J = 5% Temperature Coefficient [ppm/ºC] <±10 (copper manganese alloys) <-25 (Aluchrom alloy) Temperature Range [ºC] -55 … +170 Inductance [nH] < 3 Max. working voltage [V]RMS Type Value [mΩ] Resistance values T (±0.1) (thickness) CSU382
0.3 L3 0,85
0.5 L5 0,86
1.0 R001 1,36
2.0 R002 0,68
Constant Current up to 100 amps (0.3mΩ) High Conductivity Copper Connectors Excellent Long-term Stability Max. Solder Temperature up to 350ºC / 30s. AEC-Q200 qualified RoHS and REACH Compliant CSU 382 J V - AX- L5 AA Type Size Tol. Pack-Code TC Forming type * R Value Special 382=3820 F = ±1% H = ±3% J = ±5% V = Vacuum packed in plastic bags. Base on spec. L = mΩ AA = Standard *0.05 mΩ to 5 mΩ there are 3~4 digits indicated the resistance value. Letter R/ L is decimal point (0L05 = 0.05mΩ, 0R001 =1mΩ) SOLDER PAD DIMENSIONS Automotive Industrial Power & Energy
File Nr. 3980.18-450.110.02 | Revision: 202205 Type CSU382 Biased Humidity MIL-STD-202 Method 103 (85[ºC], 85[%RH] 1.000[h], 10% rated power) ±[%] 0,5 Operational Life Mil-STD-202 Method 108 125[ºC] at rated power , 1000[H] ±[%] 1,0 Mechanical Shock Mil-STD-202 Method 213 (100 [G] for 6[ms] , Half sine) ±[%] 0,2 Vibrations Mil-STD-202 Method 204 (10 to 2000 [Hz], 5 [G] for 20 [min], 12 cycles, each of 3 orientation ±[%] 0,2 Resistance to Soldering Heat IEC60115-1 clause 4.18 and Mil-STD-202 Method 210 (260[°C], 10[s]) 0,5 Short Time Overload Low Temperature Storage -65[ºC] 24[H] ±[%] 0,5 Solderability IEC60068-2-20 and J-STD-002 Solder bath method (> 95% coverage) Rapid change of temperature IEC60115-1 clause 4.19 and IEC60068-2-14 (30 [min] -55 [ºC] and 30 [min] +150 [ºC] ,1000 Cycles) ±[%] 0,5 High Temperature Exposure Mil-STD-202 Method 108 +170[ºC] 1000[H] ±[%] 1,0 Marking IEC60062 Value imprinted Size Value Resistance values TCR Material Power Rating Resistive alloy [mΩ] [ppm/ºC] P70 [W] P100 [W] TCR [ppm] CSU382 0.3 L3 < 300 Copper Manganese Alloy 10 5 <±10
0.5 L5 Copper Manganese Alloy 9 5
1.0 R001
< 100 Aluchrom Alloy 8 5 <-25
2.0 R002 Aluchrom Alloy 6 4
File Nr. 3980.18-450.110.02 | Revision: 202205 Below table shows the recommended reflow, IR-soldering solder parameters for CSU series. The standard packaging for CSU dimensions below. TEMPERATURE [ºC] 260 255 217 TIME [S] Peak 40 90 Size Packaging SPQ Pack Code CSU382 vacuum packed in plastic bags 3000 V Customized packing available on request Power Derating Curve Resistance Change vs Temperature [Aluchrom A1 Alloy] Resistance Change vs Temperature [Copper Manganese Alloy]