CSC-SERIES VITROHM | Alldatasheet
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File Nr. 3980.18-450.105.03 | Revision: 202010 CSC Series Datasheet SMD Power Shunt Resistor Current Sensor Open Frame Type / Size CSC402 Nominal Power Rating (For details information check table below) P70 [W] Up to 12 P100 Up to 5 Resistance Range (Preferred values) [Ω] R0002, R0003, R0005, R0007, R001, R002, R003, R004, R005 Tolerances ±[%] F = 1% ; H = 3% ; J = 5% Temperature Coefficient [ppm/ºC] See table Operating Temperature Range [ºC] -55 … +170 Load Capacity See next page Inductance [nH] < 3 Max. working voltage [V]RMS Automotive Industrial Power & Energy New SAP Part Nr.: CSC 402 F K - 13- L2 AA Serie * Power rating Tol. Pack-Code TCR Forming type *R Value Special 402 = 4026 F = ±1% H = ±3% J = ±5% Blister Tape - Base on spec. 13 inch L = mΩ AA = Standard SOLDER PAD DIMENSIONS Type Value [mΩ] Resistance values Thickness t1 t2 CSC402
0.2 L2 1,20 0,40
0.3 L3 0,99 0,40
0.5 L5 0,65 0,40
0.7 L7 0,47 0,40
1.0 R001 0,35 0,40
2.0 R002 0,50 0,40
3.0 R003 0,34 0,40
4.0 R004 0,34 0,40
5.0 R005 0,34 0,40
Constant Current up to 160 amps (0.2mΩ) AEC-Q200 qualified Heavy copper connection 4 - Terminals Connection Excellent Long-term Stability Max. Solder Temperature up to 350ºC / 30s. RoHS REACH Compliant
File Nr. 3980.18-450.105.03 | Revision: 202010 Type CSC402 Derating Linear [ºC] 70…170 (0W) Endurance IEC60115-1 clause 4.25 ±[%] 1,0 Resistance to Soldering Heat IEC60115-1 clause 4.18 ±[%] N.A. Low Temperature Exposure High Temperature Exposure Rapid change of temperature IEC60115-1 clause 4.19 and IEC60068-2-14 (30 [min] -55 [ºC] and 30 [min] +150 [ºC]) ±[%] 0,5 Biased Humidity MIL-STD-202 Method 103 ±[%] 0,5 Vibrations Mil-STD-202 Method 204 (10 to 2000 [Hz], 5 [G] for 20 [min], 12 cycles, each of 3 orientation ±[%] 0,2 Mechanical Shock Mil-STD-202 Method 213 (Method C, peak value 100 [G], Half sine) ±[%] 0,2 Solderability IEC60068-2-20 Solder bath method (> 95% coverage) Stability deviation * Tt = Terminal Temperature ±[%] < 0.5 after 2000 Hours * Tt = 110ºC < 1.0 after 2000 Hours * Tt = 140ºC Marking IEC60062 Value imprinted Size Value Resistance values TCR Material Power Rating Resistive alloy [mΩ] [ppm/ºC] P70 [W] P100 [W] TCR [ppm] CSC402 0.2 L2 < 50 Copper Manganese MC2Alloy 12 5 <±10
0.3 L3 Copper Manganese 38 Alloy 10 5
0.5 L5 Copper Manganese 38 Alloy 9 5
0.7 L7 Copper Manganese 43 Alloy 8 5
1.0 R001 Copper Manganese 43 Alloy 7 4
2.0 R002 Aluchrom Alloy 7 4
<-25
3.0 R003 Aluchrom Alloy 5 3
4.0 R004 Aluchrom Alloy 4 2
5.0 R005 Aluchrom Alloy 3 2
Note: Please contact with sales offices, distributors and representatives in your region before ordering.
File Nr. 3980.18-450.105.03 | Revision: 202010 Below table shows the recommended reflow, IR-soldering solder parameters for CSC series. The standard packaging for CSC dimensions below (blister tape [mm]). Packing according to IEC60286-3 Size Packaging SPQ Tape width Pack Code CSC402 Blister tape 1400 24 K TEMPERATURE [ºC] 260 255 217 TIME [S] Peak 40 90 Resistance Change vs Temperature [Copper Manganese 43 Alloy] Resistance Change vs Temperature [Copper Manganese 38 Alloy] Resistance Change vs Temperature [Copper Manganese MC-2 Alloy] Resistance Change vs Temperature [Aluchrom A1 Alloy] Power Derating Curve