CSH266A4 CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • On-chip Hall sensor IC with two different sensitivity and hysteresis settings
  • Internal bandgap regulator allows temperature compensated operations and a wide operating voltage range
  • High output sinking capability up to 300mA for driving large load
  • Lower current change rate reduces the peak output voltage during switching
  • Build in protection diode for chip reverse power connecting
  • Package: SIP-4L

Applications

  • Brushless DC motor
  • Brushless DC fan
  • Revolution counting
  • Speed measurement Functional Block Diagrams CSH266A4 CYStek Product Specification

CYStech Electronics Corp. Spec. No. : C500A4 Issued Date : 2007.09.26 Revised Date : Page No. : 2/6 CSH266A4 CYStek Product Specification

CYStech Electronics Corp. Spec. No. : C500A4 Issued Date : 2007.09.26 Revised Date : Page No. : 3/6 CSH266A4 CYStek Product Specification

CYStech Electronics Corp. Spec. No. : C500A4 Issued Date : 2007.09.26 Revised Date : Page No. : 4/6 CSH266A4 CYStek Product Specification

CYStech Electronics Corp. Spec. No. : C500A4 Issued Date : 2007.09.26 Revised Date : Page No. : 5/6 CSH266A4 CYStek Product Specification

CYStech Electronics Corp. Spec. No. : C500A4 Issued Date : 2007.09.26 Revised Date : Page No. : 6/6 CSH266A4 CYStek Product Specification SIP-4L Dimension Inches Millimeters Marking: Device name Date Code: Year+Month Year: 2006→6 2007→7, …, etc Month : Jan→A, Feb→B, Mar→ C, Apr→D,May →E, Jun→F,Jul →G, A u g→H, Sep→J,Oct→K Nov→L, Dec→ M Lot Code: 01~99 serially 4-Lead SIP-4L Plastic Package CYStek Package Code: A4Style: Pin 1.VCC 2.Output 3.Output 4. Ground Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 18,2002. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.