CSD10030 CREE | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 5
Technical content
Page 1 • CSD10030, Rev B ZERO RECOVERYTM RECTIFIER
- 300 Volt Schottky Rectifier · Replace Bipolar with Unipolar Rectifiers
- Zero Reverse Recovery · Essentially No Switching Losses
- Zero Forward Recovery · Higher Efficiency
- High Frequency Operation · Reduction Of Heat Sink Requirements
- Temperature Independent Switching Behavior · Parallel Devices without Thermal Runaway
- Extremely Fast Switching
- Positive Temperature Coefficient on VF
- Switch Mode Power Supplies
- Power Factor Correction
- Motor Drives
- Output Rectification CSD10030A Maximum Ratings Parameter Symbol Value Unit Repetitive Peak Reverse Voltage VRRM 300 V Surge Peak Reverse Voltage VRSM 300 V DC Blocking Voltage VDC 300 V Average Forward Current TC=150°C IF(AV) 10 A Repetitive Peak Forward Surge Current TC=25°C, tP=8.3ms, Half Sine Wave IFRM 40 A Non-Repetitive Peak Forward Surge Current TC=25°C, tP=10ms, Pulse IFSM 200 A Power Dissipation TC = 25 °C Ptot 79 W Operating Junction and Storage Temperature TJ , Tstg -55 to +175 °C
Page 2 • CSD10030, Rev B
ELECTRICAL CHARACTERISTICS
Parameter Symbol Min Typ Max Units Forward Voltage IF = 10A TJ=25°C IF = 10A TJ=175°C VF 1.2 1.4 1.4 1.8 V Reverse Current VR = 300V TJ=25°C VR = 300V TJ=175°C IR 1000 200 2000 mA Total Capacitive Charge VR = 300V,IF = 10A, di/dt = 500 A/ms, TJ = 25°C QC 11.5 nC Total Capacitance VR = 0V, TJ = 25°C, f =1MHz VR = 150V, TJ = 25°C, f =1MHz VR = 300V, TJ = 25°C, f =1MHz C 660 pF NOTE: 1. This is a majority carrier diode, so there is no reverse recovery charge. THERMAL CHARACTERISTICS Characteristic Symbol Min Typ Max Units Thermal Resistance from Junction to Case RqJC 1.9 °C/W Typical Performance Figure 1. Forward Characteristics Figure 2. Reverse Characteristics
Page 4 • CSD10030, Rev B Package Dimensions Package TO-220-2 Part Number Package Marking CSD10030A TO-220-2 CSD10030 A C E D G H B J L M N PIN 1 PIN 2 CASE 1 2 F P Q S T U V W X Y Min Max Min Max A .381 .391 9.677 9.931 B .240 .250 6.096 6.350 C .100 .120 2.540 3.048 D .223 .227 5.664 5.766 E .595 .615 15.113 15.621 F .143 .147 3.632 3.734 G 1.105 1.115 28.067 28.321 H .500 .510 12.700 12.954 J L .025 .035 .635 .889 M .045 .055 1.143 1.397 N .198 .202 5.029 5.131 P .165 .185 4.191 4.699 Q .048 .052 1.219 1.321 S 4° 6° 4° 6° T 4° 6° 4° 6° U 4° 6° 4° 6° V .094 .098 2.387 2.489 W .018 .025 .458 .635 Y .385 .405 9.779 10.287 Inches MillimetersPOS R 0.197 R 5.004
Page 5 • CSD10030, Rev B Recommended solder pad layout. TO-220-2 This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, air traffic control systems, or weapons systems. Copyright © 2001-2004 Cree, Inc. All rights reserved. Permission is given to reproduce this document provided the entire document (including this copyright notice) is duplicated. The information in this document is subject to change without notice. Cree and the Cree logo are trademarks of Cree, Inc. Cree, Inc. Power Products
4600 Silicon Drive · Durham, NC 27703 · USA
Tel: 919-313-5300 · Fax: 919-313-5451 www.cree.com