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Document overview

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Technical content

Features

  • 650-Volt Schottky Rectifier
  • Zero Reverse Recovery
  • Zero Forward Recovery
  • High-Frequency Operation
  • Temperature-Independent Switching Behavior
  • Extremely Fast Switching
  • Positive Temperature Coefficient on VF Chip Outline Maximum Ratings (TC = 25 ˚C unless otherwise specified) Symbol Parameter Value Unit Test Conditions Note VRRM Repetitive Peak Reverse Voltage 650 V VRSM Surge Peak Reverse Voltage 650 V VR DC Peak Blocking Voltage 650 V IF Maximum DC Current 30 A TJ=150˚C 1 TJ , Tstg Operating Junction and Storage Temperature -55 to +175 ˚C TProc Maximum Processing Temperature 325 ˚C 10 min Maximum VRRM = 650 V IF = 30 A Qc = 65 nC Note: 1. Assumes θJC Thermal Resistance < 0.53˚C/W and TC = 110˚C Part Number Die Size Anode Cathode CPW5-0650-Z030B 2.8 x 2.8 mm2 Al Ni/Ag

CPW5-0650-Z030B Rev. A

Electrical Characteristics

Symbol Parameter Typ. Max. Unit Test Conditions Note VF DC Forward Voltage 1.60 1.37

1.70 V IF = 30 A TJ=25°C

IF = 20 A TJ=25°C Fig 1 2.20 1.67

2.50 V IF = 30 A TJ=175°C

IF = 20 A TJ=175°C IR Reverse Current 0.4 80 μA VR = 650 V , TJ=25°C VR = 400 V , TJ=25°C Fig 2 320 μA VR = 650 V , TJ=175°C VR = 400 V , TJ=175°C QC Total Capacitive Charge 65 nC VR = 400 V, TJ = 25°C Fig 4 C Total Capacitance 1137 116 110 pF VR = 0 V, TJ = 25°C, f = 1 MHz VR = 200 V, TJ = 25˚C, f = 1 MHz VR = 400 V, TJ = 25˚C, f = 1 MHz Fig 3 Mechanical Parameters Parameter Typ. Unit Die Size 2.8 x 2.8 mm Anode Pad Opening 1.9 x 1.9 mm Thickness 180 ± 10% μm Wafer Size 100 mm Anode Metalization (Al) 4 μm Cathode Metalization (Ni/Ag) 1.8 μm Frontside Passivation Polyimide

CPW5-0650-Z030B Rev. A Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc. Cree, Inc.

4600 Silicon Drive

Durham, NC 27703 USA Tel: +1.919.313.5300 Fax: +1.919.313.5451 www.cree.com/power

  • RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com.
  • REACh Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemi- cal Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future,please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request.
  • This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, air traffic control systems, or weapons systems. Notes Chip Dimensions symbol dimension mm inch A 2.8 0.110 B 2.8 0.110 C 1.9 0.075 D 1.9 0.075 A B C D