DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
GROSS DIE PER 4 INCH WAFER 4,608 PROCESS CPD79 Schottky Rectifier
2 Amp Schottky Rectifier Chip
Die Thickness 9.8 MILS Anode Bonding Pad Area 39 x 39 MILS Top Side Metalization Al/Ni/Au - 30,000Å/3,000Å/1,500Å Back Side Metalization Ti/Ni/Au - 1,600Å/5,500Å/1,600Åwww.centralsemi.com R0 (19-July 2010)
Typical Electrical Characteristics www.centralsemi.com R0 (19-July 2010)