CPD40-CTLSH5-100 CENTRAL | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 4
Technical content
5.0 Amp, 100 Volt
Die Thickness 11.8 ±1.2 MILS Anode Bonding Pad Size 63.3 x 63.3 MILS Top Side Metalization Ti/Ni/Ag – 20,000Å Back Side Metalization Ti/Ni/Ag – 8,000Å Scribe Alley Width 5.24 MILS Wafer Diameter 5 INCHES Gross Die Per Wafer 3,717 The CPD40-CTLSH5-100 is a silicon Schottky rectifi er ideal for all types of commercial, industrial, entertainment, and computer applications. MECHANICAL SPECIFICATIONS: MAXIMUM RATINGS: (TA=25°C unless otherwise noted) SYMBOL UNITS Peak Repetitive Reverse Voltage V RRM 100 V DC Blocking Voltage V R 100 V RMS Reverse Voltage V R(RMS) 70 V Average Forward Current (TJ=125°C) I O 5.0 A Peak Forward Surge Current, tp=8.3ms I FSM 150 A Operating and Storage Junction Temperature T J, Tstg -55 to +150 °C ELECTRICAL CHARACTERISTICS: (TA=25°C) SYMBOL TEST CONDITIONS MIN TYP MAX UNITS IR V R=100V 2.5 15 μA BVR I R=1.0mA 100 112 V VF I F=5.0A 0.73 0.8 V CJ V R=0, f=1.0MHz 475 pF R2 (5-December 2017) www.centralsemi. com
Typical Electrical Characteristics R2 (5-December 2017) www.centralsemi. com
WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) R2 (3-April 2017) www.centralsemi.com
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time.
- Supply management (Customer portals) • Custom bar coding for shipments
- Inventory bonding • Custom product packing
- Consolidated shipping options CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask.
- Free quick ship samples (2nd day air) • Special wafer diffusions
- Online technical data and parametric search • PbSn plating options
- SPICE models • Package details
- Custom electrical curves • Application notes
- Environmental regulation compliance • Application and design sample kits
- Customer specific screening • Custom product and package development
- Up-screening capabilities (001) REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). www.centralsemi.com