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Technical content
Dual, Common Cathode, High Speed Switching Diode Chip GEOMETRY PROCESS DETAILS PRINCIPAL DEVICE TYPE CMLD2838 GROSS DIE PER 4 INCH WAFER 46,200 Die Size 15.4 x 15.4 MILS Die Thickness 7.1 MILS Anode 1 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS Anode 2 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au-As - 10,000Å BACKSIDE COMMON CATHODE R0 www.centralsemi.com R2 (6-October 2011)
Typical Electrical Characteristics www.centralsemi.com R2 (6-October 2011)