CPC1150N

CPC1150N_1 CLARE | Alldatasheet

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Technical content

Features

Description

Ordering Information

 Telecommunications  Telecom Switching  Tip/Ring Circuits  Modem Switching (Laptop, Notebook, Pocket S i z e )  Hook Switch  Dial Pulsing  Ground Start  Ringing Injection  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment-Patient/Equipment Isolation  Security  Aerospace  Industrial Controls  Small 4-Pin SOP Package  Low Drive Power Requirements (TTL/CMOS Compatible)  No Moving Parts  High Reliability  Arc-Free With No Snubbing Circuits  1500Vrms Input/Output Isolation  No EMI/RFI Generation  Machine Insertable, Wave Solderable  Tape & Reel Version Available The CPC1150N is a miniature 1-Form-B solid state relay which uses optically coupled MOSFET technology to provide 1500V rms of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare’s patented OptoMOS architecture. The optically coupled output is controlled by a highly efficient GaAIAs infrared LED. The CPC1150N uses Clare’s state of the art double molded vertical construction packaging to produce one of the world’s smallest 4-Pin solid state relays. The CPC1150N offers board space savings over the competitor’s larger 4-Pin SOP relay. Approvals  UL Recognized Component: File # E76270  EN/IEC 60950 Compliant  CSA Certified Component: Certificate # 1172007 2 3 + Control – Control Load Load Switching Characteristics of Normally Closed (Form B) Devices CONTROL 10% 90% ILOAD tONtOFF

www.clare.com2 CPC1150N R06 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings (@ 25˚C) Parameter Ratings Units Blocking Voltage 350 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 70 mW T otal Power Dissipation 1 400 mW Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate Linearly 3.33 mw / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics @ 25°C Load Current Continuous 1 -I L - - 120 mA Peak t = 10ms I LPK - - 350 On-Resistance I L=120mA R ON -- 5 0 Ω Off-State Leakage Current V L=350V , IF=2mA I LEAK --5 µ A Switching Speeds T urn-On I F=5mA, VL=10V tON --1 ms T urn-Off t OFF --2 Output Capacitance I F=2mA, 50V , f=1MHz C OUT -2 5 - p F Input Characteristics @ 25°C Input Control Current 2 IL=120mA I F - 0.6 2 mA Input Dropout Current - I F 0.3 0.55 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics @ 25°C Capacitance, Input to Output - C I/O -1 - p F 1 Load current derates linearly from 120mA @ 25oC to 85mA @ 85oC. 2 For applications requiring high temperature operation (greater than 60°C) an LED drive current of 4mA is recommended.

Electrical Characteristics

www.clare.com 3R06 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (TA=25ºC, IF=5mA) 38.5 39.5 40.5 41.539 40 41 Device Count (N) Typical On-Resistance Distribution (TA=25ºC, IL=90mA) On-Resistance (Ω) Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (TA=25ºC) LED Current (mA) Device Count (N) Typical IF for Switch Operation (TA=25ºC, IL=90mA) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (TA=25ºC, IL=90mA) Turn-On (ms) Device Count (N) Typical Turn-On Time (TA=25ºC, IL=90mA, IF=5mA) Turn-Off (ms) Device Count (N) Typical Turn-Off Time (TA=25ºC, IL=90mA, IF=5mA) Load Current (mA) 180 160 140 120 100 Temperature (ºC) -40 -20 0 20 40 60 80 120 100 Typical Load Current vs. Temperature (IF=0mA) Leakage (µA) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured Across Pins 3 & 4 (VL=350V) Temperature (ºC) Blocking Voltage (VP) -40 430 425 420 415 410 405 400 395 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature Typical Turn-On vs. Temperature (IL=50mA) Turn-On (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 IF=5mA IF=10mA Temperature (ºC) IF=5mA IF=10mA Turn-Off (ms) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Temperature (ºC) Typical Turn-Off vs. Temperature (IL=50mA)

www.clare.com4 CPC1150N R06 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA Temperature (ºC) LED Forward Current (mA) Turn-On (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Typical Turn-On vs. LED Forward Current (IL=100mA) LED Forward Current (mA) Turn-Off (ms) 0 5 1 01 52 02 53 03 54 04 5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 Typical Turn-Off vs. LED Forward Current (IL=100mA) -40 -20 0 20 40 60 80 100 Temperature (ºC) On-Resistance (Ω) Typical On-Resistance vs. Temperature (IL=Max Rated, IF=0mA) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Operation vs. Temperature (IL=50mA) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Temperature (ºC) Typical IF for Switch Turn-On vs. Temperature (IL=50mA) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 -6 -4 -2 0 2 4 6 Typical Load Current vs. Load Voltage (TA=25ºC, IF=0mA) Time Load Current (A) 10s 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1ms100s 100ms 1s10ms 10s 100s Energy Rating Curve

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1150N-R06 ©Copyright 2008, Clare, Inc. OptoMOS® is a registered trademark of Clare, Inc. All rights reserved. Printed in USA. 9/16/08 For additional information please visit our website at: www.clare.com CPC1150N MECHANICAL DIMENSIONS RoHS 2002/95/EC e3Pb MANUFACTURING INFORMATION Moisture Sensitivity Clare has characterized the moisture reflow sensitivity of this package, and has determined that this component must be handled in accordance with IPC/JEDEC standard J-STD-033 moisture sensitivity level (MSL), level 3 classification. Soldering Reflow Profile For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated solvents. 4-Pin SOP Package Recommended PCB Land Pattern 2.54 (0.10) 5.60 (0.2205) 1.30 (0.0512) 0.60 (0.0217) Pin 1 4.089 ± 0.203 (0.161 ± 0.008)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.076 (0.017 ± 0.005) 0.200 ± 0.025 (0.008 ± 0.001) 1.02 ± 0.025 (0.040 ± 0.001) Dimensions mm (inches)

2.184 Max

(0.086 Max) 0.381 TYP . (0.015 TYP .) 0.0254 - 0.102 (0.001 - 0.004) Embossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 Tape and Reel Packaging for 4-Pin SOP Package User Direction of Feed B0=4.70 (0.185) W=12.00 Max (0.472 Max) P=8.00 (0.315) A0=6.50 (0.256) Pin 1 K0=2.70 (0.106) K1=2.30 (0.091) Dimensions mm (inches)