CP688-2N5115 CENTRAL | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 3
Technical content
Die Thickness 8.0 MILS Drain Bonding Pad Size 3.0 x 3.0 MILS Source Bonding Pad Size 3.0 x 3.0 MILS Gate Bonding Pad Size 3.0 x 3.0 MILS Top Side Metalization Al-Si – 17,000Å Back Side Metalization Au-As – 13,000Å Scribe Alley Width 3.0 MILS Wafer Diameter 5 INCHES Gross Die Per Wafer 28,136 The CP688-2N5115 is a silicon P-Channel small signal JFET designed for analog switching and chopper applications. MECHANICAL SPECIFICATIONS: MAXIMUM RATINGS: (TA=25°C) SYMBOL UNITS Gate-Drain Voltage V GD 30 V Gate-Source Voltage V GS 30 V Gate Current I G 50 mA Operating and Storage Junction Temperature T J, Tstg -65 to +150 °C ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN MAX UNITS IGSS V GS=20V 500 pA IDSS V DS=15V 15 60 mA ID(OFF) V DS=15V, VGS=7.0V 500 pA BVGSS I G=1.0μA 30 V VGS(OFF) V DS=15V, ID=1.0nA 3.0 6.0 V VGS(f) I G=1.0mA 1.0 V VDS(ON) I D=7.0mA 0.8 V rDS(ON) I D=1.0mA, VGS=0 100 Ω rds(ON) V GS=0, ID=0, f=1.0kHz 100 Ω Ciss V DS=15V, VGS=0, f=1.0MHz 25 pF Crss V GS=7.0V, VDS=0, f=1.0MHz 7.0 pF ton V DD=6.0V, VGS=7.0V, 30 ns toff I D=7.0mA, RL=743Ω 38 ns BACKSIDE GATE R0 D GS R0 (17-July 2017) www.centralsemi. com
WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) R2 (3-April 2017) www.centralsemi.com
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time.
- Supply management (Customer portals) • Custom bar coding for shipments
- Inventory bonding • Custom product packing
- Consolidated shipping options CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask.
- Free quick ship samples (2nd day air) • Special wafer diffusions
- Online technical data and parametric search • PbSn plating options
- SPICE models • Package details
- Custom electrical curves • Application notes
- Environmental regulation compliance • Application and design sample kits
- Customer specific screening • Custom product and package development
- Up-screening capabilities (001) REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). www.centralsemi.com