CP188-2N2919 CENTRAL | Alldatasheet
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Technical content
NPN - Low Noise Transistor Die Die Size 14.6 x 14.6 MILS Die Thickness 9.0 MILS Base Bonding Pad Size 3.9 x 3.9 MILS Emitter Bonding Pad Size 5.5 x 5.5 MILS Top Side Metalization Al – 30,000Å Back Side Metalization Au-As – 18,000Å Scribe Alley Width 2.4 MILS Wafer Diameter 4 INCHES Gross Die Per Wafer 54,599 The CP188-2N2919 is a silicon NPN transistor designed for low noise amplifi er applications. MECHANICAL SPECIFICATIONS: BACKSIDE COLLECTOR R1 MAXIMUM RATINGS: (TA=25°C) SYMBOL UNITS Collector-Base Voltage V CBO 60 V Collector-Emitter Voltage V CEO 60 V Emitter-Base Voltage V EBO 6.0 V Continuous Collector Current I C 30 mA Operating and Storage Junction Temperature T J, Tstg -65 to +150 °C ELECTRICAL CHARACTERISTICS: (TA=25°C) SYMBOL TEST CONDITIONS MIN MAX UNITS ICBO V CB=45V 2.0 nA ICEO V CE=5.0V 2.0 nA IEBO V EB=5.0V 2.0 nA BVCBO I C=10μA 60 V BVCEO I C=10mA 60 V BVEBO I E=10μA 6.0 V VCE(SAT) I C=1.0mA, IB=100μA 0.35 V VBE(ON) V CE=5.0V, IC=100μA 0.70 V hFE V CE=5.0V, IC=10μA 60 240 hFE V CE=5.0V, IC=100μA 100 hFE V CE=5.0V, IC=1.0mA 150 fT V CE=5.0V, IC=500μA, f=20MHz 60 MHz Cob V CB=5.0V, IE=0, f=140kHz 6.0 pF NF V CE=5.0V, IC=10μA, RS=10kΩ, f=1.0kHz, BW=200Hz 4.0 dB R0 (20-May 2019) www.centralsemi. com
Typical Electrical Characteristics R0 (20-May 2019) www.centralsemi. com
WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) R2 (3-April 2017) www.centralsemi.com
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http://www.centralsemi.com 3/13/21 Summary:The CP188 and CP588 wafer processes are being discontinued and are now classified as End of Life (EOL). The replacement wafer processes are the CP388X and CP788X, respectively. Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed EOL (End of Life) by other manufacturers, it is an accepted industry practice to discontinue certain devices when customer demand falls below a minimum level of sustainability. Accordingly, the following product(s) have been transitioned to End of Life status as part of Central's ongoing Product Management Process. Any replacement products are noted below. The effective date for placing last purchase orders will be six (6) months from the date of this notice and twelve (12) months from the notice date for final shipments, and minimum order quantities may apply. The last purchase and shipment dates may be extended if inventory is available. Central Part Number Replacement CP188-BC107A-CT CP388X-BC107A-CT CP188-BC108-CT CP388X-BC108-CT CP188-BC546B-CT CP388X-BC546B-CT CP188-BC546B-WR CP388X-BC546B-WR CP188-2N2919-CT CP388X-2N2919-CT CP188-2N5088-CT CP388X-2N5088-CT CP588-BCY70-WN CP788X-BCY70-WN CP588-BC556B-CT CP788X-BC556B-CT CP588-BC556B-WN CP788X-BC556B-WN CP588-BC556B-WR CP788X-BC556B-WR CP588-HBC556B-CM CP788X-HBC556B-CM CP588-2N2605-CT CP788X-2N2605-CT CP588-2N2605-WN CP788X-2N2605-WN Central would be happy to assist you by providing additional information or technical data to help locate an alternate source if we have no replacement available. Please email your requests to engineering@centralsemi.com.