CP373-CMPDM303NH CENTRAL | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 5
Technical content
The CP373-CMPDM303NH is a silicon N-Channel MOSFET designed for high speed pulsed amplifi er and driver applications. Die Size 39 x 27 MILS Die Thickness 7.5 MILS Gate Bonding Pad Size 6.5 x 6.5 MILS Source Bonding Pad Size 33 x 21 MILS Top Side Metalization Al – 40,000Å Back Side Metalization Ti/Ni/Ag – 1,000Å/3,000Å/10,000Å Scribe Alley Width 3.15 MILS Wafer Diameter 8 INCHES Gross Die Per Wafer 43,500 MECHANICAL SPECIFICATIONS: MAXIMUM RATINGS: (TA=25°C) SYMBOL UNITS Drain-Source Voltage V DS 30 V Gate-Source Voltage V GS 12 V Continuous Drain Current (Steady State) I D 3.6 A Maximum Pulsed Drain Current, tp=10μs I DM 14.4 A Operating and Storage Junction Temperature T J, Tstg -55 to +150 °C ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN TYP MAX UNITS IGSSF, IGSSR V GS=12V, VDS=0 10 μA IDSS V DS=20V, VGS=0 1.0 μA BVDSS V GS=0, ID=250μA 30 V VGS(th) VGS=VDS, ID=250μA 0.6 1.2 V rDS(ON) V GS=4.5V, ID=1.8A 0.04 Ω rDS(ON) V GS=2.5V, ID=1.8A 0.078 Ω gFS V DS=5.0V, ID=3.6A 11.8 S Crss V DS=10V, VGS=0, f=1.0MHz 55 pF Ciss V DS=10V, VGS=0, f=1.0MHz 590 pF Coss VDS=10V, VGS=0, f=1.0MHz 50 pF Qg(tot) VDD=10V, VGS=4.5V, ID=3.6A 13 nC Qgs VDD=10V, VGS=4.5V, ID=3.6A 1.4 nC Qgd VDD=10V, VGS=4.5V, ID=3.6A 2.7 nC ton VDD=10V, VGS=4.0V, ID=3.6A, RG=10Ω 15 ns toff VDD=10V, VGS=4.0V, ID=3.6A, RG=10Ω 29 ns R0 (23-March 2018) www.centralsemi. com
Typical Electrical Characteristics R0 (23-March 2018) www.centralsemi. com
WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) R2 (3-April 2017) www.centralsemi.com
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time.
- Supply management (Customer portals) • Custom bar coding for shipments
- Inventory bonding • Custom product packing
- Consolidated shipping options CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask.
- Free quick ship samples (2nd day air) • Special wafer diffusions
- Online technical data and parametric search • PbSn plating options
- SPICE models • Package details
- Custom electrical curves • Application notes
- Environmental regulation compliance • Application and design sample kits
- Customer specific screening • Custom product and package development
- Up-screening capabilities (001) REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). www.centralsemi.com
http://www.centralsemi.com 4/18/20 Summary:The CP373 wafer process is being discontinued and is now classified as End of Life (EOL). The replacement wafer process is CP398X. Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed EOL (End of Life) by other manufacturers, it is an accepted industry practice to discontinue certain devices when customer demand falls below a minimum level of sustainability. Accordingly, the following product(s) have been transitioned to End of Life status as part of Central's ongoing Product Management Process. Any replacement products are noted below. The effective date for placing last purchase orders will be six (6) months from the date of this notice and twelve (12) months from the notice date for final shipments, and minimum order quantities may apply. The last purchase and shipment dates may be extended if inventory is available. Central Part Number Replacement CP373-CMPDM303-CT20 CP398X-CPDM303-CT20 CP373-CMPDM303NH-CT CP398X-CPDM303NH-CT CP373-CMPDM303NH-WN CP398X-CPDM303NH-WN CP373-CTLDM303N-CT CP398X-CTLDM303N-CT CP373-CTLDM303N-WN CP398X-CTLDM303N-WN Central would be happy to assist you by providing additional information or technical data to help locate an alternate source if we have no replacement available. Please email your requests to engineering@centralsemi.com.