CP310V-CMPTA42 CENTRAL | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 4
Technical content
NPN - High Voltage Transistor Die Die Size 26 x 26 MILS Die Thickness 7.1 MILS Base Bonding Pad Size 6.1 x 4.9 MILS Emitter Bonding Pad Size 5.2 x 5.2 MILS Top Side Metalization Al – 30,000Å Back Side Metalization Au – 18,000Å Scribe Alley Width 2.2 MILS Wafer Diameter 5 INCHES Gross Die Per Wafer 25,214 The CP310V-CMPTA42 is a silicon NPN transistor designed for high voltage applications. MECHANICAL SPECIFICATIONS: MAXIMUM RATINGS: (TA=25°C) SYMBOL UNITS Collector-Base Voltage V CBO 300 V Collector-Emitter Voltage V CEO 300 V Emitter-Base Voltage V EBO 6.0 V Continuous Collector Current I C 500 mA Operating and Storage Junction Temperature T J, Tstg -65 to +150 °C ELECTRICAL CHARACTERISTICS: (TA=25°C) SYMBOL TEST CONDITIONS MIN MAX UNITS ICBO V CB=200V 100 nA IEBO V EB=6.0V 100 nA BVCBO I C=100µA 300 V BVCEO I C=1.0mA 300 V BVEBO I E=100µA 6.0 V VCE(SAT) I C=20mA, IB=2.0mA 0.5 V VBE(SAT) I C=20mA, IB=2.0mA 0.9 V hFE V CE=10V, IC=1.0mA 25 hFE V CE=10V, IC=10mA 40 hFE V CE=10V, IC=30mA 40 fT V CE=20V, IC=10mA, f=100MHz 50 MHz Cob V CB=20V, IE=0, f=1.0MHz 6.0 pF B E BACKSIDE COLLECTOR R2 R0 (23-February 2017) www.centralsemi. com
Typical Electrical Characteristics R0 (23-February 2017) www.centralsemi. com
WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) R2 (3-April 2017) www.centralsemi.com
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time.
- Supply management (Customer portals) • Custom bar coding for shipments
- Inventory bonding • Custom product packing
- Consolidated shipping options CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask.
- Free quick ship samples (2nd day air) • Special wafer diffusions
- Online technical data and parametric search • PbSn plating options
- SPICE models • Package details
- Custom electrical curves • Application notes
- Environmental regulation compliance • Application and design sample kits
- Customer specific screening • Custom product and package development
- Up-screening capabilities (001) REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). www.centralsemi.com