CP645-MJE15031 CENTRAL | Alldatasheet
Document overview
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Technical content
PNP - Power Transistor Die
8.0 Amp, 150 Volt
MECHANICAL SPECIFICATIONS: Die Size 120 x 145 MILS Die Thickness 12.7 MILS Base Bonding Pad Size 20 x 45 MILS Emitter Bonding Pad Size 14 x 70 MILS Top Side Metalization Al - 50,000Å Back Side Metalization Ti/Ni/Ag - 1,000Å/6,000Å/10,000Å Scribe Alley Width 4.0 MILS Wafer Diameter 4 INCHES Gross Die Per Wafer 640 The CP645-MJE15031 is a silicon PNP power transistor designed for audio amplifi er applications. MAXIMUM RATINGS: (TA=25°C) SYMBOL UNITS Collector-Base Voltage V CBO 150 V Collector-Emitter Voltage V CEO 150 V Emitter-Base Voltage V EBO 5.0 V Continuous Collector Current I C 8.0 A Peak Collector Current I CM 16 A Continuous Base Current I B 2.0 A Operating and Storage Junction Temperature T J, Tstg -65 to +150 °C ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN MAX UNITS ICBO V CB=150V 10 μA ICEO V CE=150V 100 μA IEBO V EB=5.0V 10 μA BVCEO I C=10mA 150 V VCE(SAT) I C=1.0A, IB=100mA 0.5 V VBE(ON) V CE=2.0V, IC=1.0A 1.0 V hFE V CE=2.0V, IC=100mA 40 hFE V CE=2.0V, IC=2.0A 40 hFE V CE=2.0V, IC=3.0A 40 hFE V CE=2.0V, IC=4.0A 20 fT V CE=10V, I C=500mA, f=10MHz 30 MHz B E R1 (4-October 2019) www.centralsemi. com
WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) R2 (3-April 2017) www.centralsemi.com
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http://www.centralsemi.com 8/11/23 Summary:The following bare die transistor devices are discontinued and now classified as of End of Life (EOL). Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed EOL (End of Life) by other manufacturers, it is an accepted industry practice to discontinue certain devices when customer demand falls below a minimum level of sustainability. Accordingly, the following product(s) have been transitioned to End of Life status as part of Central's ongoing Product Portfolio Management. Any replacement products are noted below. The effective date for placing last purchase orders will be six (6) months from the date of this notice and twelve (12) months from the notice date for final shipments, and minimum order quantities may apply. The last purchase and shipment dates may be extended if inventory is available. * All Plating types (PBFREE,TIN/LEAD) for each item listed are included in this notice. Central Part Number Suggested Replacement CPP55-BC177-CT N/A CP188-BC546B-CM CP388X-BC546B-CT CP212-CZTA44HC-CT N/A CP235-2N3055-CT N/A CP235-2N3715-CT N/A CP588-BC556B-CM CP788X-BC556B-CT CP608-H2N3741-CM N/A CP608-TIP32C-CM N/A CP608-TIP32C-CT N/A CP608-TIP32C-WN N/A CP608-2N3741-CT N/A CP608-2N6475-CT N/A CP611-TIP42-CT N/A CP611-TIP42C-CT N/A CP611-TIP42C-WN N/A CP611-2N5955-CT N/A CP611-2N6107-CM N/A CP611-2N6107-CT N/A CP645-MJE15031-CM N/A Central would be happy to assist you by providing additional information or technical data to help locate an alternate source if we have no replacement available. If you would like assistance, please visit https://my.centralsemi.com/submit-inquiry?type=ER to submit an online inquiry.