CMZ20

CMZ12 TOSHIBA | Alldatasheet

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CMZ12~CMZ53 2006-11-09 1 TOSHIBA Zener Diode Silicon Diffused Type CMZ12~CMZ53 Applications: Communication, Control and Measurement Equipment Constant Voltage Regulation Transient Suppressors

• Average power dissipation : P = 2.0 W
• Zener voltage : V Z = 12 V ~ 53 V
• Suitable for compact assembly due to small surface-mount package “M −FLATTM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Power dissipation P 2.0 (Note 1) W Junction temperature Tj −40~150 °C Storage temperature range Tstg −40~150 °C Note 1: Ta = 30°C Device mounted on a ceramic board Board size: 50 mm × 50 mm Soldering size: 2 mm × 2 mm Board thickness: 0.64 t Note 2: Using continuously under heavy loads (e.g. t he application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Standard Soldering Pad Unit: mm JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) 3.0 1.4 2.1 Unit: mm 1.4

CMZ12~CMZ53 2006-11-09 2 Electrical Characteristics (Ta = 25°C) Zener Voltage Vz (V) Zener Impedance rd (Ω) Temperature Coefficient Of Zener Forward Voltage VF (V) Reverse Current IR (μA) αT (mV/°C) Type Min Typ. Max Measure- ment Current IZ (mA) Max Measure- ment Current IZ (mA) Typ. Max Max Measure- ment Current IF (A) Max Measure- ment Voltage VR (V) CMZ12 10.8 12 13.2 10 30 10 8 13 1.2 0.2 10 8 CMZ13 11.7 13 14.3 10 30 10 9 14 1.2 0.2 10 9 CMZ15 13.5 15 16.5 10 30 10 11 17 1.2 0.2 10 10 CMZ16 14.4 16 17.6 10 30 10 12 19 1.2 0.2 10 11 CMZ18 16.2 18 19.8 10 30 10 14 23 1.2 0.2 10 13 CMZ20 18.0 20 22.0 10 30 10 16 26 1.2 0.2 10 14 CMZ22 19.8 22 24.2 10 30 10 18 28 1.2 0.2 10 16 CMZ24 21.6 24 26.4 10 30 10 20 32 1.2 0.2 10 17 CMZ27 24.3 27 29.7 10 30 10 23 36 1.2 0.2 10 19 CMZ30 27.0 30 33.0 10 30 10 25 40 1.2 0.2 10 21 Marking Abbreviation Code Part No.

12 CMZ12

13 CMZ13

15 CMZ15

16 CMZ16

18 CMZ18

20 CMZ20

22 CMZ22

24 CMZ24

27 CMZ27

30 CMZ30

33 CMZ33

36 CMZ36

39 CMZ39

43 CMZ43

47 CMZ47

51 CMZ51

53 CMZ53

CMZ12~CMZ53 2006-11-09 3 Handling Precaution 1) The absolute maximum ratings denote the absolute maximum ratings, which are rate d values and must not be exceeded during operation, even fo r an instant. The following are the general derating methods that we recommend when you design a circuit with a device. P : We recommend that the worst case power dissipation be no greater than 50% of the absolute maximum rating of power dissipation. Carry out adequate heat design. P RSM : We recommend that a device be used wi thin the recommended area in thefigure, PRSM-tw. T j : Derate this rating when using a devi ce in order to ensure high reliability. We recommend that the device be used at a Tj of below 120°C. 2) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a so ldering land size to match the appropriate thermal resistance value. 3) Please refer to the Rectifiers databook for further information.

CMZ12~CMZ53 2006-11-09 4 0.1 100 1000 0.001 0.01 0.1 1 10 100 1000 10 14 18 22 26 100 120 140 160 100 1000 0.1 1 10 26 30 34 38 42 46 50 54 58 Ta max – P Maximum allowable temperature Ta max (°C) Power dissipation P (W) PRSM – tW (reference value) Non-repetitive peak reverse Power dissipation P RSM (W) Pulse width t W ( m s ) αT – VZ (typ.) Temperature coefficient of Zener voltage αT ( m V / ° C ) Zener voltage V Z (V) αT – VZ (typ.) Temperature coefficient of Zener voltage αT (mV/°C) Zener voltage V Z ( V ) CMZ12~CMZ27 CMZ30~CMZ53 Recommended Ta = 25°C Rectangular pulse PRSM tW Device mounted on a ceramic board: board size: 50 mm × 50 mm Soldering land: 2.0 mm × 2.0 mm board thickness: 0.64 t Device mounted on a ceramic board: Soldering land: 2.0 mm × 2.0 mm rth (j-a) – t Transient thermal impedance rth (j-a) (°C/W) Time t (s) Device mounted on a glass-epoxy board: Soldering land: 2.1 mm × 1.4 mm Device mounted on a glass-epoxy board: Soldering land: 6.0 mm × 6.0 mm

CMZ12~CMZ53 2006-11-09 5 RESTRICTIONS ON PRODUCT USE 20070701-EN

• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity an d vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIB A products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconduct or Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
• The TOSHIBA products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringement s of patents or other rights of the third parties which may result from its use. No license is granted by implic ation or otherwise under any patents or other rights of TOSHIBA or the third parties.
• Please contact your sales representative for product- by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.