R1245X NISSHINBO | Alldatasheet
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Technical content
1.2 A, 30 V Step-Down DC/DC Converter
No. EA-269-240903 OUTLINE The R1245x is a CMOS-based Step-down DC/DC converter with internal N -channel high side Tr. The ON resistance of the built-in high-side transistor is 0.35 and the R1245x can provide the maximum 1.2 A output current. Each of t he ICs consists of an oscillator, a PWM control circuit, a voltage reference unit, an error amplifier, a phase compensation circuit, a slope compensation circuit, a soft-start circuit, protection circuits, an internal voltage regulator, a nd a switch for bootstrap circuit. The ICs can make up a s tep-down DC/DC converter with an inductor, resistors, a diode, and capacitors. The R1245x is a current mode operating type DC/DC converter without an external current sense resistor, and realizes fast response and high efficiency. As an output capacitor, a ceramic type capacitor can be used with the R1245x. The options of the internal os cillator frequency are preset at 330 kHz for version A and B, 500 kHz for version C and D, 1000 kHz for version E and F, 2400 kHz for version G and H. As for protection, an Lx peak current limit circuit cycle by cycle, a thermal shutdown function and an under voltage lockout (UVLO) function are built in. Furthermore, there are two types for short protection, for A/C/E/G version, a latch protection function which makes the output latch off if the output voltage keeps lower than the set output voltage for a certain time after detecting current limit is buil t in, for B/D/F/H version, a fold-back protection function which changes the oscillator frequency slower after detecting short circuit or equivalent. As for the packages of the R1245x, HSOP-8E, DFN(PL)2020-8, SOT23-6W are available.
FEATURES
- Adjustable Output Voltage with External Resistor ···· 0.8 V or more 1000 kHz (Ver. E/F), 2400 kHz (Ver. G/H)
- Ceramic Capacitors Recommended for Input and Output.
No. EA-269-240903
APPLICATIONS
- Digital Home Appliances: Digital TVs, DVD Players
- Office Equipment: Printers, Faxes
- 5V PSU or 2-cell or more Li-ion Battery Powered Communication Equipment, Cameras, VCRs, Camcorders
- High Voltage Battery-powered Equipment SELECTION GUIDE In the R1245x, the package, type of short protection (Latch or Fold-back), and the oscillator frequency can be selected with the user’s request. Selection Guide Product code Package Quantity per Reel Pb Free Halogen Free R1245S003-E2-FE HSOP-8E 1,000 pcs Yes Yes R1245K003-TR DFN(PL)2020-8 5,000 pcs Yes Yes R1245N001-TR-FE SOT-23-6W 3,000 pcs Yes Yes : Designation of the oscillator frequency and the protection function option. Symbol Oscillator Frequency Latch Protection Fold-back Protection A 330 kHz ✓ B 330 kHz ✓ C 500 kHz ✓ D 500 kHz ✓ E 1000 kHz ✓ F 1000 kHz ✓ G 2400 kHz ✓ H 2400 kHz ✓
No. EA-269-240903 BLOCK DIAGRAM FB CE Oscillator BST Regulator R S DSETPULSE MAXDUTY Current Slope Circui t Reference Soft Start Circuit(1ms) UVLO 0.8V Regulator Thermal Shutdown Peak Current Limit Circuit Lx VIN GND Limit Latch Circuit (4ms) Shutdown R1245x Block Diagram Version Oscillator Frequency Short Protection Type A 330 kHz 330 kHz B 330 kHz 330 kHz C 500 kHz 500 kHz D 500 kHz 500 kHz E 1000 kHz 1000 kHz F 1000 kHz 1000 kHz G 2400 kHz 2400 kHz H 2400 kHz 2400 kHz
No. EA-269-240903 PIN DESCRIPTIONS Top View Bottom View 8 7 6 5 5 6 7 8 1 2 3 4 4 3 2 1 DFN(PL)2020-8 Pin Configuration Top View Bottom View 8 7 6 5 5 6 7 8 1 2 3 4 4 3 2 1 Top View 6 5 4 1 2 3 HSOP-8E Pin Configuration SOT-23-6W Pin Configuration * Connect the backside heat radiation tub to GND or same as GND level (recommendation). The tub is connected to the GND pin.
No. EA-269-240903 R1245S Pin Description Pin No. Symbol Description
1 Lx Lx Switching Pin
2 VIN Power Supply Pin
3 CE Chip Enable Pin, Active with ”H”
4 TEST TEST pin (must be open for user side.)
5 GND Ground Pin
6 FB Feedback Pin
7 NC No connection
8 BST Bootstrap Pin
- Connect the backside heat radiation tub to GND or same as GND level (recommendation). The tub is connected to the GND pin. R1245K Pin Description Pin No. Symbol Description
3 VIN Power Supply Pin
4 CE Chip Enable Pin, Active with ”H”
7 TEST Test Pin (must be open for user side.)
- Connect the backside heat radiation tub to GND or same as GND level (recommendation). The tub is connected to the GND pin. R1245N Pin Description Pin No. Symbol Description
1 BST Bootstrap Pin
2 GND Ground Pin
3 FB Feedback Pin
5 VIN Power Supply Pin
6 Lx Lx Switching Pin
No. EA-269-240903 INTERNAL EQUIVALENT CIRCUIT FOR EACH PIN <BST pin> <Lx pin> <FB pin> <CE pin> <TEST pin> BST LX Regulator VIN LX Regulator FB VIN CE Regulator TEST
No. EA-269-240903 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings (GND = 0 V) Symbol Item Rating Unit VIN Input Voltage −0.3 V to 32 V V VBST BST Pin Voltage VLX −0.3 V to VLX + 6 V V VLX Lx Pin Voltage −0.3 V to VIN + 0.3 V VCE CE Pin Input Voltage −0.3 V to VIN + 0.3 V VFB Feedback Pin Voltage −0.3 V to 6 V V PD Power Dissipation* HSOP-8E Ultra High Wattage Land Pattern 2900 mW DFN(PL)2020-8 Standard Land Pattern 880 SOT-23-6W Standard Land Pattern 430 Tj Junction Temperature Range −40 to 125 ºC Tstg Storage Temperature Range −55 to 125 ºC * Refer to POWER DISSIPATION for detailed information. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Symbol Item Rating Unit VIN Operating Input Voltage 4.5 to 30 V Ta Operating Temperature Range −40 to 105 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.
No. EA-269-240903
ELECTRICAL CHARACTERISTICS
Electrical Characteristics (Unless o therwise noted, V IN = 12 V, Ta = 25ºC) Symbol Item Conditions Min. Typ. Max. Unit IIN Consumption Current VIN = 30 V, VFB = 1.0 V 0.5 1.0 mA VUVLO1 UVLO Detect Voltage Specified VIN falling edge 3.6 VUVLO2 −0.2 VUVLO2 −0.1 V VUVLO2 UVLO Released Voltage Specified rising edge 3.8 4.0 4.2 V VFB VFB Voltage Tolerance 0.792 0.800 0.808 V ΔVFB/ΔTa VFB Voltage Temperature Coefficient −40ºC ≤ Ta ≤ 105ºC ±100 ppm/ ºC fosc Oscillator Frequency Ver. A/B 300 330 360 kHz Ver. C/D 450 500 550 Ver. E/F 900 1000 1100 Ver. G/H 2200 2400 2600 fFLB Fold back Frequency VF B < 0.56 V Ver. B/D 170 kHz Ver. F 250 Ver. H 400 Maxduty Oscillator Maximum Duty Cycle Ver. A/B/C/D 92 % Ver. E/F 88 Ver. G/H 76 tstart Soft-start Time VFB = 0.72 V 1 ms tDLY Delay Time for Latch Protection Ver. A/C/E/G 4 ms RLXH Lx High Side Switch ON Resistance VBST − VLX = 4.5 V 0.35 ILXHOFF Lx High Side Switch Leakage Current VIN = 30 V, VCE = 0 V 0 5 μA ILIMLXH Lx High Side Switch Limited Current VBST − VLX = 4.5 V 1.5 2.0 2.7 A VCEL CE “L” Input Voltage VIN = 30 V 0.3 V VCEH CE “H” Input Voltage VIN = 30 V 1.6 V IFB VFB Input Current VIN = 30.0 V, VFB = 1.0 V −1.0 1.0 μA ICEL CE “L” Input Current VIN = 30 V, VCE = 0 V −1.0 1.0 μA ICEH CE “H” Input Current VIN = 30 V, VCE = 30 V −1.0 1.0 μA TTSD Thermal Shutdown Detect Temperature Hysteresis 30ºC 160 ºC Istandby Standby Current VIN = 30 V 0 5 μA
No. EA-269-240903 OPERATING DESCRIPTIONS OPERATION OF THE BUCK CONVERTER AND THE OUTPUT CURRENT The DC/DC converter charges energy in the inductor when the switch turns on, and discharges the energy from the inductor when the switch turns off and controls with less energy loss, so that a lower output voltage than the input voltage is obtained. Refer to the following figures. Basic Circuit Current flowing through the Inductor Step 1: The switch turns on and current IL ( = i1) flows, and energy is charged into C OUT. At this moment, IL increases from ILmin (= 0) to reach ILmax in proportion to the on-time period (ton) of the switch. Step 2: When the switch turns off, the diode turns on in order to maintain IL at IL max, and current IL ( = i2) flows. Step 3: IL (= i2) decreases gradually and reaches IL = ILmin = 0 after a time period of topen, and the diode turns off. This case is called as discontinuous mode. If the output current becomes large, next switching cycle starts before IL becomes 0 and the diode turns off. In this case, IL value increases from IL min (> 0), and this case is called continuous mode. In the case of PWM control system, the output voltage is maintained by controlling the on -time period (t on), with the oscillator frequency (fosc) being maintained constant. Switch L Diode VIN VOUT COUT GND t=1/fosc toff topen ILmin ILmax ton IL
No. EA-269-240903 TYPICAL APPLICATION CIRCUIT R1245x00xA/B Typical Application Circuit, 330 kHz, VOUT = 1.2 V, VIN = 24 V R1245x00xC/D Typical Application Circuit, 500 kHz, VOUT = 3.3 V, VIN = 24 V * TEST pin must be open. 6k 12k VIN 24V CIN 10µF CSPD 470pF CBST 0.47µF L 10µH COUT 47µF RCE 10k (recommended) VIN FB TEST GND BST Lx CE “H”active D 6k 12k VIN 24V CIN 10µF CSPD 470pF CBST 0.47µF L 10µH COUT 47µF RCE 10k (recommended) VIN FB TEST GND BST Lx CE “H”active D 3.75k 1.2k VIN 24V CIN 10µF CSPD 1000pF CBST 0.47µF L 10µH COUT 22µF RCE 10k (recommended) VIN FB TEST GND BST Lx CE “H”active D 3.75k 1.2k VIN 24V CIN 10µF CSPD 1000pF CBST 0.47µF L 10µH COUT 22µF RCE 10k (recommended) VIN FB TEST GND BST Lx CE “H”active D
No. EA-269-240903 R1245x00xE/F Typical Application Circuit, 1000 kHz, VOUT = 3.3 V VIN = 12 V R1245x00xG/H Typical Application Circuit, 2400 kHz, VOUT = 5. 0 V, VIN = 12 V * TEST pin must be open. 3.75k 1.2k VIN 12V CIN 4.7µF CSPD 470pF CBST 0.47µF L 4.7µH COUT 10µF RCE 10k (recommended) VIN FB TEST GND BST Lx CE “H”active D 3.75k 1.2k VIN 12V CIN 4.7µF CSPD 470pF CBST 0.47µF L 4.7µH COUT 10µF RCE 10k (recommended) VIN FB TEST GND BST Lx CE “H”active D 6.3k 1.2k VIN 12V CIN 2.2µF CSPD 470pF CBST 0.47µF L 2.2µH COUT 4.7µF RCE 10k (recommended) VIN FB TEST GND BST Lx CE “H”active D 6.3k 1.2k VIN 12V CIN 2.2µF CSPD 470pF CBST 0.47µF L 2.2µH COUT 4.7µF RCE 10k (recommended) VIN FB TEST GND BST Lx CE “H”active D
No. EA-269-240903 OUTPUT CURRENT AND SELECTION OF EXTERNAL COMPONENTS The relation between the output current and external components is as follows: When the switch of Lx turns on: (Wherein, the peak to peak value of the r ipple current is described as I RP, the ON resistance of the switch is described as RONH, and the diode forward voltage as VF, and the DC resistance of the inductor is described as RL, and on time of the switch is described as ton) When the switch turns off (the diode turns on) as toff: Put Equation 2 to Equation 1 and solve for ON duty of the switch, ton / (toff + ton) = DON, Ripple Current is as follows: wherein, peak current that flows through L, and the peak current ILmax is as follows: As for the valley current ILmin, If ILmin < 0, the step-down DC/DC converter operation becomes current discontinuous mode. Therefore the current condition of the current discontinuous mode, the next formula is true. Consider ILmax and ILmin, conditions of input and output and select external components. *The above explanation is based on the calculation in an ideal case in continuous mode.
current limit, Lx peak current limit is used. Therefore the upper limit of the inductor current is fixed. peak current becomes also large. The characteristic is used for the fold-back current limit of version B/D/F/H. of the Lx current limit function is described. Figure 1. LX Limit function sequence
No. EA-269-240903 Latch Protection Function for Version A/C/E/G The latch function works after detecting current limit and if the output voltage becomes low for a certain time, the output is latched off. Refer to the TECHNICAL NOTES. Fold-back Protection Function for Version B/D/F/H If FB voltage becomes lower than approximately 0.56 V, the fold-back protection function limits the oscillator frequency to typically 170 kHz for version B/D, typically 250 kHz fir version F, typically 400 kHz for version H. By reducing frequency, the ripple current increases. The R1245x has the peak current limit function, therefore as in the equation 8, the Lx average current decreases by the increase of the ripple current. If FB voltage becomes less than 0.56 V, the oscillator frequency is reduced. At heavy load, if the R1245x becomes into the fold-back protection mode, the situation may not be released by increase the ripple current. In terms of other notes on this protection function, refer to the TECHNICAL NOTES.
No. EA-269-240903 MAXIMUM OUTPUT CURRENT The output current of the R1245x is limit by the power dissipation P D of the package and the maximum specification 1.2 A. The loss of the IC includes the switching loss, and it is difficult to estimate. To estimate the maximum output, using the efficiency data is one method. By using the efficiency data, the loss including the external components can be calculated with the equation, (100 / efficiency (%) - 1) x (VOUT (V) x IOUT (A)). From this equation, by reducing the loss of external components, the loss of the IC can be estimated. The main loss of the external components is composed by the rectifier diode and DCR of the inductor. Supposed that the forward voltage of the diode is described as VF, the loss of the diode can be described as follows: (VIN (V) - RON () x IOUT (A) - VOUT (V) - VF (V))) / VIN (V) x VF (V) x IOUT (A) The loss by the DCR of the inductor can be calculated by the formula DCR () x IOUT2 (A). Thus, The loss of the IC = (100 / efficiency (%) - 1) x (VOUT (V) x IOUT (A) - (VIN (V) - RON () x IOUT (A) - VOUT (V) -VF (V)) / VIN (V) x VF (V) x IOUT (A) – DCR () x IOUT2 (A) The efficiency of the R1245 x at Ta = 25C, VIN = 12 V, VOUT = 3.3 V, IOUT = 600 mA is approximately 89.5% for version A/B (Oscillator frequency: 330 kHz). Supposed that the On resistance of the internal driver is 0.35 , the DCR of the inductor is 65 m, the VF of the rectifier diode is 0.3 V and applied to the formula above, V x 0.6 A - 0.065 x 0.62 A = 86 mW The power dissipation P D of the package is specified at Ta = 25C based on the Tjmax = 125C. Thus the thermal resistance of the package ja = (Tjmax (C) - Ta(C)) / PD (W), therefore the thermal resistance of the each available package is as follows: Due to the loss of the IC is 86mW for this example, therefore Tj increase of the each package is as follows: HSOP-8E: 34.5C/W x 86 mW = 2.96C DFN(PL)2020-8: 114C/W x 86 mW = 9.80C SOT-23-6W: 233C/W x 86 mW = 20.0C For all the packages, even if the ambient temperature is at 105 C, Tj can be suppressed less than 125 C. By the increase of the temperature, on resistance and switching loss increases, therefore, temperature margin is not enough, measure the efficiency at the actual maximum temperature and recalculation is necessary. At the same condition, if the preset frequency is 2400 kHz, the efficiency will be down to approximately 81%. The result of the loss calculation is 310 mW, therefore the Tj increase of each package is, HSOP-8E: 34.5C/W x 310 mW = 11C DFN(PL)2020-8: 114C/W x 310 mW = 35C SOT-23-6W: 233C/W x 310 mW = 72C
No. EA-269-240903 HSOP-8E can be used at the ambient temperature 105C, DFN(PL)2020-8 can be used at the ambient temperature up to 90C, SOT-23-6W can be used at the ambient temperature up to 53C. Note that the result is different by the frequency. The next graphs are the output current and estimated ambient temperature limit. Maximum Output Current VIN = 12 V, VOUT = 3.3 V, fosc = 330 kHz Maximum Output Current VIN = 12 V, VOUT = 3.3 V, fosc = 2400 kHz 200 400 600 800 1000 1200 1400 -50 0 50 100 150 Ta[°C] IOUT[mA] SOT-23-6W DFN2020-8 HSOP-8E -40°C 105°C 200 400 600 800 1000 1200 1400 -50 0 50 100 150 Ta[°C] IOUT[mA] SOT-23-6W DFN2020-8 HSOP-8E -40°C 105°C
No. EA-269-240903 TECHNICAL NOTES
- External components must be connected as close as possible to the ICs and make wiring as short as possible. Especially, the capacitor connected in between VIN pin and GND pin must be wiring the shortest. If their impedance is high, internal voltage of the IC may shift by the switching current, and t he operating may be unstable. Make the power supply and GND lines sufficient. In the wiring of the power supply, GND, LX, VOUT and the inductor , large current by switching may flow. To avoid the bad influence, the wiring between the resistance, “RUP” for setting the output voltage and loading, and the wiring between the inductor and loading must be separated.
- The ceramic capacitors have low ESR (Equivalent Series Resistance) and recommended for the ICs. The recommendation of CIN capacitor between VIN and GND is 10 F or more for A/B/C/D version , 4.7 F or more for E/F version, and 2.2 F or more for G/H version. Verify the bias dependence and the temperature characteristics of the ceramic capacitors. Recommendation conditions are written based on the case which the recommendation parts are used with the R1245x.
- The R1245x is designed with the recommendation inductance value and ceramic capacitor value and phase compensation has been made. If the inductance value is large, due to the lack of current sensing amount of the current mode, unstable operation may result. On the contr ary, if the inductance value is small, the current sensing amount may increase too much, low frequency oscillation may occur when the on duty ratio is beyond 50%. Not only that, if the inductance value is small, according to the increase of the load current, the peak current of the switching may increase, as a result, the current may reach the current limit value and the current limit may work.
- As f or the diode, use the Schottky diode with small capacitance between terminals. The reference characteristic of the capacitance between terminals is around 100 pF or less at 10 V. If the capacitance between terminals is large, excess switching current may flow and the operation of the IC may be unstable. If the capacitance between terminals of the Schottky diode is beyond 100 pF at 10 V or unknown, verify the load regulation, line regulation, and the load transient response. If a diode with a small current rating and a large Vf is used, the LX terminal voltage may exceed the negative MAXIMUM rating when the VOUT is shorted, depending on the configuration of the peripheral circuit, and the IC may be damaged. This depends on the short-circuit conditions, other peripheral components, and the board layout, but please be especially careful when using a diode with a Vf value of more than 0.7V at 4-5A.
- If the VOUT Terminal is shorted under high input voltage conditions, the limit current value may become significantly larger. (Refer to “MINIMUM ON TIME ” page) In the case, we recommended the foldback protection version or a version with frequency of 500kHz or less. Also, please take external measures for current protection such as using a fuse, as necessary.
- Output voltage can be set by adjustment of the values of R1 and R2. The equation of setting the output voltage is V OUT = VFB (R1 + R2) / R2. If the values of R1 and R2 are large, the impedance of FB pin increases, and pickup the noise may result. T he recommendation value range of R2 is approximately between 1.0 kΩ to 16 kΩ. If the operation may be unstable, reduce the impedance of FB pin.
- For the CE pin, as an ESD protection element, a diode to V IN pin is formed internal of the IC. If CE pin voltage may become higher than V IN pin voltage, to prevent flowing large current from CE pin to V IN pin, connect 10 k or more resistor between CE and VIN pin.
- Connect the backside heat radiation tub of the DFN(PL)2020-9/HSOP-8E to the GND. As for multi-layered boards, to make better power dissipation, putting some thermal via on the thermal pad in the land pattern and radiation of the heat to another layer is effective.
No. EA-269-240903
- After the soft-start operation, the latch function is enabled for version A/C/E/G. The latch protection starts the internal counter when the internal current limit protection circuit detects the current limit. When the internal counter counts up to the latch timer limit, typically 4 ms, the output is latched off. To reset the latch function, make the CE pin “L”, or make V IN pin voltage lower than UVLO detector threshold. Then in the case that the output voltage or FB voltage becomes setting voltage within t he latch timer preset time, counter is initialized. If the slew rate of the power supply is too slow and after the soft-start time, the output voltage does not reach the set output voltage even if the latch timer preset time is over, the latch function may work unexpectedly.
- After the soft -start operation, fold -back protection function is enabled for version B/D/F/H. The fold -back function will limit the oscillator frequency if the FB pin voltage becomes lower than typically 0.56 V. For B/D version, the oscillator frequency will be reduced typically into 170 kHz, for F version, into 250 kHz, for H version, into 400 kHz.
- If the slew rate of the power supply is too slow, and even after the soft-start time, the output voltage is still less than 70% of the set output voltage, or FB pin voltage is less than typically 0.56 V, then this function may work unexpectedly.
- The performance of power circuit using this IC largely depends on external components. Selection of external components is very important, especially, do not exceed each rating value (voltage/current/power).
Table 1. Recommended Values for Each Output Voltage
No. EA-269-240903 *1 Divider Resisters Values and Possible Setting Range of Input/ Output VOUT [V] R1 (RUP) [kΩ] R2 (RBOT) [kΩ] Input Voltage Range [V] Ver. A/B Ver. C/D Ver. E/F Ver. G/H 0 16 1.2 8 16 4.5 to 30 4.5 to 20 4.5 to 10 - 6 12 14 16 15 12 2 24 16 4.5 to 30 4.5 to 30 4.5 to 17 4.5 to 7 1.8 1.2 2.5 34 16 2.55 1.2 6 7.8 1.2 6.5 to 30 6.5 to 30 7 to 30 8 to 20 9 12.3 1.2 10 to 30 10 to 30 11 to 30 12 to 30 12 16.8 1.2 13 to 30 13 to 30 14 to 30 16 to 30 15 21.3 1.2 16.5 to 30 16.5 to 30 17 to 30 20 to 30
Table 2. Recommended External Components Examples (Considering All the Range)
50 V/ X5R 10 F CGA6P3X7S1H106K TDK
50 V/ X7R 10 F KTS500B106M55N0T00 Nippon Chemi-Con
25 V/ X7R 10 F GRM31CR71E106K Murata
10 V/ X7R 22 F GRM31CR71A226M Murata
16 V/ B 47 F GRM32EB31C476KE15 Murata
10 V/ X7R 47 F GRM32ER71A476KE15 Murata
1.9 A 10 H NR6028T100M TAIYO YUDEN
2.3 A 15 H NR6045T150M TAIYO YUDEN
1.9 A 22 H NR6045T220M TAIYO YUDEN
1.9 A 33 H NR8040T330M TAIYO YUDEN
RCE An up diode is formed between the CE pin and the VIN pin as an ESD protection element.
No. EA-269-240903
APPLICATION INFORMATION
TO IMPROVE THE PERFORMANCE The R1245 can make its performance better, by adding components as shown below. Cspd: Speed up capacitor Cspd has two roles, one is to improve the stability, and the other is to improve the transient speed. The transfer function from VOUT (-which is made of Cspd and feedback resisters, R1(Rup) and R2(Rbot)) to FB will make a forward bump by low frequency zero and high frequency pole, and improve the stability of feedback loop. Cspd can improve the gain and make the transient speed fast at high frequency. Figure 2. Transfer function BODE plot from VOUT to FB (R1=3.75kΩ, R2=1.2kΩ, Cspd=470pF)
No. EA-269-240903 To improve the stability If the resistance values of the R1 and R2 have to be changed, make the value of R1*Cspd be constant. (For example, with the R1245x00xA/B and making V OUT=1.2V, if R1=0.6k Ω, R2=1.2kΩ are used, Cspd=4700pF. By making the values of R1 and R2 increase, the impedance of FB pin also increases, as a result, the influence by noise must be cared. To avoid this, recommendation value range of R2 is from 1.0kΩ to 16kΩ. If the operation becomes unstable by increasing the impedance, choose low resistance value. If COUT and L are necessary to be changed, or unusual voltage setting is necessary, the Cspd value must be adjusted. The instruction of the adjustment is as follows: 1. Without Cspd, measure the output under-shoot amount by load transient response. 2. Further, with using a small value Cspd, measure the output under -shoot amount by load transient response. The appropriate initial value is about 1/10 of the recommendation Cspd value. If Cspd is too small, the under-shoot amount is almost same as the one without Cspd. If the value of Cspd is changed bigger gradually, the under-shoot amount will be less. Supposed that this new good Cspd as Cspd1, and continue to make it bigger, and finally, the under -shoot amount becomes unchanged, at this point, supposed that the maximum Cspd as Cspd2. 3. Select an appropriate value according to the formula, Cspd=√(Cspd1*Cspd2). To improve the transient response speed If the stability is enough, (for example, in the case that C OUT is big enough), make Cspd value bigger. The stability will be same, but the gain at high frequency will be large, and improve the transient response speed. However, if Cspd value is set Cspd2 value or more, the result will not be improved, not only that, due to the high gain at high frequency, compared with the result without Cspd, the stability will be worse.
No. EA-269-240903 ①R1=3.75kΩ, R2=1.2kΩ, Cspd: none, VOUT=3.3V Due to no Cspd, the stability is not good enough, and under-shoot amount is big during the load transient. ②R1=3.75kΩ, R2=1.2kΩ, Cspd=2200pF, VOUT=3.3V Cspd value is appropriate, and stability and response speed is adjusted properly. ③R1=3.75kΩ, R2=1.2kΩ, Cspd=33000pF, VOUT=3.3V Cspd value is too big, the response speed is fast, but the stability decreases slightly. VOUT ILX IOUT VOUT ILX IOUT VOUT ILX IOUT
No. EA-269-240903 Rspd: Noise reduction filter for speed up capacitor Cspd can improve the high frequency characteristics due to its differential function. In other words, the high frequency component is passed through without change, therefore the spike noise of V OUT is transferred to FB pin as it is. If the spike noise is too big, by its noise of FB pin, the output voltage may be changed especially at heavy load. To avoid this situation, by setting an Rspd which inserts in series in Cspd and making a pole at high frequency, filtering is possible and effective. The appropriate value range of Rspd is from 10 Ω to 30Ω. If the resistance value is too big, the effect of Cspd is cancelled by the lowering pole at high frequency by Rspd. By removing FB pin noise, using low R1 and R2 resistance value.
No. EA-269-240903 VOLTAGE BETWEEN Lx PIN AND BST PIN In the boot-strap style switching regulator, when the Lx pin voltage becomes lower than the regulator which supplies BST voltage, CBST is charged. By this charge, while the Lx pin voltage is "H", high side switch can be turned on continuously. Therefore, if Lx pin voltage does not become lower than the BST voltage supply regulator, switching may be abnormal. In the R1245, the output voltage of the BST voltage supply regulator is set at 5V. The abnormal switching may be caused by the following conditions: ・VOUT>5V, the difference between VIN and VOUT is small, inductor current is discontinuous by light load When the inductor current is continuous, or load current is big enough even if the discontinuous mode, the forward current of the diode will make Lx pin voltage down and CBST is charged, but at light load, Lx pin voltage does not become low enough against the BST voltage supply regulator output(5V). The voltage of CBST is not high enough and drive capability will be down. (Figure 3-①) Due to the lack of the drive capability, VOUT cannot be maintained, and under-shoot happens to VOUT, Lx pin voltage may become lower than the BST voltage supply regulator output (5V), but the error amplifier operation may be abnormal. When the charge of CBST is recovered and normal switching starts, VOUT becomes back to set output voltage. However, after recovering the VOUT, to recover the error amplifier's operation, some response time is necessary, during this response time, VOUT may be over-shoot. (Figure 3-②) As a result, LX pin voltage cannot be low enough against the BST voltage supply regulator output voltage (5V), under- shoot and over-shoot may be repeated. (Figure 4)
No. EA-269-240903 To avoid these situations, please refer to the countermeasures shown below: ・ If start-up with VOUT>5V is necessary, avoid the extremely low load, and start up should be done by CE pin control after VIN becomes high enough. ・ If VOUT>5V at low load operation is necessary, make the inductance value bigger and assure the "L" time of Lx. ・ If start-up with VIN=CE is necessary, avoid very slow VIN setting and low load current condition. During the output overshoot while the normal transient response, even the no -switching condition happens, the operation keeps normal. Other than that, low load condition with VOUT<5V is also normal condition for the device.
No. EA-269-240903 THE NOTE OF LAYOUT PATTERN 1. The wire of Power line (VIN, GND) should be broad to minimize the parasitic inductance. The Bypass capacitor (CIN) must be connected as close as possible in between VIN – GND. 2. The wire between Lx pin and the inductor as short as possible to minimize the parasitic inductance. This evaluation board is designed for the product evaluation board. Therefore large inductors or diodes can be set and the large space of Lx area has been secured. The evaluation board, R1245K003x (2400 kHz) with the reduced mounting area including external components, is available due to the small package of R1245K003G/H and the low recommended constant numbers including inductors. 3. The ripple current flows through the output capacitor. If the GND side of the output capacitor is connected very close to GND pin of the IC, the noise might have a bad impact on the IC. Therefore, the GND side of the output capacitor is better to connect t o the outside of the GND of the CIN, or connect to the GND plain layer. 4. Rup, Rbot, Cspd, and Rspd should be mounted on the position as close as possible to the FB pin, and away from the inductor and BST pin. 5. The feed-back must be made as close as possible from the Output capacitor (COUT).
No. EA-269-240903 PCB LAYOUT R1245N001x TOP VIEW BOTTOM VIEW R1245S003x TOP VIEW BOTTOM VIEW
No. EA-269-240903 R1245K003x TOP VIEW BOTTOM VIEW R1245K003x (2400 kHz) TOP VIEW BOTTOM VIEW
No. EA-269-240903 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) FB voltage vs. Temperature 2) Driver On resistance vs. Temperature 3) Oscillator frequency vs. Temperature R1245x00xx (VIN=12V) 0.792 0.794 0.796 0.798 0.8 0.802 0.804 0.806 0.808 -50 -25 0 25 50 75 100 125 Ta (℃) FB Voltage (V) R1245x00xx (VIN=12V) 200 250 300 350 400 450 500 -50 -25 0 25 50 75 100 125 Ta (℃) Driver On Resistance (ｍΩ) R1245x00xA/R1245x00xB (VIN=12V) 300 310 320 330 340 350 360 -50 -25 0 25 50 75 100 125 Ta (℃) Frequency (kHz) R1245x00xC/R1245x00xD (VIN=12V) 450 475 500 525 550 -50 -25 0 25 50 75 100 125 Ta (℃) Frequency (kHz) R1245x00xE/R1245x00xF (VIN=12V) 900 950 1000 1050 1100 -50 -25 0 25 50 75 100 125 Ta (℃) Frequency (kHz) R1245x00xG/R1245x00xH (VIN=12V) 2160 2240 2320 2400 2480 2560 2640 -50 -25 0 25 50 75 100 125 Ta (℃) Frequency (kHz)
No. EA-269-240903 4) Maximum duty cycle vs. Temperature R1245x00xA/R1245x00xB (VIN=12V) -50 -25 0 25 50 75 100 125 Ta (℃) Maxduty (%) R1245x00xC/R1245x00xD (VIN=12V) -50 -25 0 25 50 75 100 125 Ta (℃) Maxduty (%) R1245x00xE/R1245x00xF (VIN=12V) -50 -25 0 25 50 75 100 125 Ta (℃) Maxduty (%) R1245x00xG/R1245x00xH (VIN=12V) -50 -25 0 25 50 75 100 125 Ta (℃) Maxduty (%)
No. EA-269-240903 5) Fold back frequency vs. Temperature 6) High side switch current limit vs. Temperature R1245x00xB (VIN=12V) 100 120 140 160 180 200 220 240 -50 -25 0 25 50 75 100 125 Ta (℃) Fold back Frequency (kHz) R1245x00xD (VIN=12V) 100 120 140 160 180 200 220 240 -50 -25 0 25 50 75 100 125 Ta (℃) Fold back Frequency (kHz) R1245x00xF (VIN=12V) 120 170 220 270 320 370 420 -50 -25 0 25 50 75 100 125 Ta (℃) Fold back Frequency (kHz) R1245x00xH (VIN=12V) 120 220 320 420 520 620 720 -50 -25 0 25 50 75 100 125 Ta (℃) Fold back Frequency (kHz) R1245x00xx (VIN=12V) 1.5 1.7 1.9 2.1 2.3 2.5 2.7 -50 -25 0 25 50 75 100 125 Ta (℃) LX Current Limit (A)
No. EA-269-240903 7) UVLO detector threshold vs. Temperature 8) UVLO released voltage vs. Temperature 9) Soft-start time vs. Temperature 10) Timer latch delay vs. Temperature 11) CE “H” Input voltage vs. Temperature 12) CE “L” Input voltage vs. Temperature R1245x00xx 3.6 3.7 3.8 3.9 4.1 -50 -25 0 25 50 75 100 125 Ta (℃) UVLO Detector Threshold (V) R1245x00xx 3.8 3.9 4.1 4.2 -50 -25 0 25 50 75 100 125 Ta (℃) UVLO Released Voltage (V) R1245x00xx (VIN=12V) 0.4 0.6 0.8 1.2 1.4 1.6 1.8 -50 -25 0 25 50 75 100 125 Ta (℃) Soft Start Time (ms) R1245x00xx (VIN=6V) -50 -25 0 25 50 75 100 125 Ta (℃) Delay Time For Latch Protection (ms) R1245x00xx (VIN=12V) 0.5 1.5 2.5 -50 -25 0 25 50 75 100 125 Ta (℃) CE "H" Voltage (V) R1245x00xx (VIN=12V) 0.5 1.5 2.5 -50 -25 0 25 50 75 100 125 Ta (℃) CE "L" Voltage (V)
No. EA-269-240903 13) Soft-start waveform R1245x00xA/R1245x00xB VOUT=3.3V , VIN=12V , IOUT=0mA , Ta=25C R1245x00xA/R1245x00xB VOUT=3.3V , VIN=12V , IOUT=600mA , Ta=25C 14) Switching operation waveform R1245x00xA/R1245x00xB VOUT=3.3V , VIN=12V , IOUT=0mA , Ta=25C R1245x00xA/R1245x00xB VOUT=3.3V , VIN=12V , IOUT=600mA , Ta=25C R1245x00xG/R1245x00xH VOUT=3.3V , VIN=12V , IOUT=20mA , Ta=25C R1245x00xG/R1245x00xH VOUT=3.3V , VIN=12V , IOUT=600mA , Ta=25C VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) 200µs/div VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) 200µs/div VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) 200µs/div VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) 200µs/div VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) VCE (5V/div) ILX (200mA/div) VOUT (1V/div) VLX (10V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) 2µs/div ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) 2µs/div ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) 2µs/div ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) 2µs/div ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) 200ns/div ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) 200ns/div ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) 200ns/div ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) ILX (200mA/div) VOUT (AC) (20mV/div) VLX (5V/div) 200ns/div
No. EA-269-240903 15) Load transient response waveform R1245x00xA/R1245x00xB VOUT=0.8V , VIN=12V , IOUT=600⇔1200mA , Ta=25C R1245x00XA/R1245x00xB VOUT=3.3V , VIN=12V , IOUT=600⇔1200mA , Ta=25C R1245x00xG/R1245x00xH VOUT=1.5V , VIN=4.5V , IOUT=600⇔1200mA , Ta=25C R1245x00xG/R1245x00xH VOUT=3.3V , VIN=12V , IOUT=600⇔1200mA , Ta=25C VOUT (100mV/div) IOUT (500mA/div) 100µs/div VOUT (100mV/div) IOUT (500mA/div) 100µs/div VOUT (200mV/div) IOUT (500mA/div) 100µs/div VOUT (200mV/div) IOUT (500mA/div) 100µs/div VOUT ( 100mV /div ) IOUT ( 500mA /div ) 50us/div VOUT ( 100mV /div ) IOUT ( 500mA /div ) 50us/div 50us/div VOUT ( 100mV /div ) IOUT ( 500mA /div ) 50us/div VOUT ( 100mV /div ) IOUT ( 500mA /div )
No. EA-269-240903 16) Limit latch operation waveform 17) Released waveform from limit latch R1245x00xA VOUT=3.3V , VIN=12V , ROUT=5.5Ω→0.05Ω, Ta=25C R1245x00xA VOUT=3.3V , VIN=12V , ROUT=5.5Ω→0.05Ω→5.5Ω , Ta=25C 18) Fold back operation waveform 19) Released waveform from fold back R1245x00xB VOUT=3.3V , VIN=12V , ROUT=5.5Ω→0.05Ω Ta=25C R1245x00xB VOUT=3.3V , VIN=12V , ROUT=5.5Ω→0.05Ω→5.5Ω Ta=25C 20) Switching waveform at fold back operation R1245x00xB VOUT=3.3V , VIN=12V , ROUT=0.05Ω, Ta=25C VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) 20µs/div VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) 20µs/div VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) 20µs/div VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) 20µs/div VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) 2µs/div VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) 2µs/div VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) 1ms/div VOUT (2V/div) VLX (10V/div) ILX (1A/div) VOUT (2V/div) VLX (10V/div) ILX (1A/div) 1ms/div VOUT (2V/div) VLX (10V/div) ILX (1A/div) 1ms/div VOUT (2V/div) VLX (10V/div) ILX (1A/div) 1ms/div
No. EA-269-240903 21) Output current vs. Efficiency (Version A/B) R1245x00xA/R1245x00xB VOUT=0.8V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 4.5V VIN = 6.0V VIN = 18V R1245x00xA/R1245x00xB VOUT=3.3V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 4.5 V VIN = 12 V VIN = 24 V R1245x00xA/R1245x00xB VOUT=5.0V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 12V VIN = 24V VIN = 30V R1245x00xA/R1245x00xB VOUT=12V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 18V VIN = 24V VIN = 30V R1245x00xA/R1245x00xB VOUT=15V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 24V VIN = 30V R1245x00xA/R1245x00xB VOUT=24V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN=30V
No. EA-269-240903 22) Output Current vs. Efficiency (Version C/D) R1245x00xC/R1245x00xD VOUT=0.8V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 4.5V VIN = 6.0V VIN = 12V R1245x00xC/R1245x00xD VOUT=3.3V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 4.5V VIN = 12V VIN = 24V R1245x00xC/R1245x00xD VOUT=5.0V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 12V VIN = 24V VIN = 30V R1245x00xC/R1245x00xD VOUT=12V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 18V VIN = 24V VIN = 30V R1245x00xC/R1245x00xD VOUT=15V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 24V VIN = 30V R1245x00xC/R1245x00xD VOUT=24V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 30V
No. EA-269-240903 23) Output current vs. Efficiency (Version E/F) R1245x00xE/R1245x00xF VOUT=0.8V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 4.5V VIN = 6.0V R1245x00xE/R1245x00xF VOUT=3.3V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 4.5V VIN = 12V VIN = 24V R1245x00xE/R1245x00xF VOUT=5.0V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 12V VIN = 24V VIN = 30V R1245x00xE/R1245x00xF VOUT=12V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 24V VIN = 30V R1245x00xE/R1245x00xF VOUT=15V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 24V VIN = 30V R1245x00xE/R1245x00xF VOUT=24V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000IOUT (mA) Efficiency (%) VIN = 30V
No. EA-269-240903 24) Output current vs. Efficiency (Version G/H) R1245x00xG/R1245x00xH VOUT=1.5V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 4.5V R1245x00xG/R1245x00xH VOUT=3.3V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 6V VIN = 10V VIN = 12V R1245x00xG/R1245x00xH VOUT=5.0V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 8.0V VIN = 12V R1245x00xG/R1245x00xH VOUT=12V (Ta=25℃) 100 0.01 0.1 1 10 100 1000 10000 IOUT (mA) Efficiency (%) VIN = 24V VIN = 30V
No. EA-269-240903 25) Output current vs Output voltage (Version A/B) R1245x00xA/R1245x00xB VOUT=0.8V (Ta=25℃) 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage(V) VIN=4.5V VIN=6.0V VIN=18V R1245x00xA/R1245x00xB VOUT=3.3V (Ta=25℃) 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 4.5 V VIN = 12 V VIN = 24 V R1245x00xA/R1245x00xB VOUT=5.0V (Ta=25℃) 4.95 4.97 4.99 5.01 5.03 5.05 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 12V VIN = 24V VIN = 30V R1245x00xA/R1245x00xB VOUT=12V (Ta=25℃) 11.90 12.00 12.10 12.20 12.30 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 18V VIN = 24V VIN = 30V R1245x00xA/R1245x00xB VOUT=15V (Ta=25℃) 14.80 15.00 15.20 15.40 15.60 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 24V VIN = 30V R1245x00xA/R1245x00xB VOUT=24V (Ta=25℃) 23.90 24.10 24.30 24.50 24.70 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 30V
No. EA-269-240903 26) Output current vs. Output voltage (Version C/D) R1245x00xC/R1245x00xD VOUT=0.8V (Ta=25℃) 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 4.5V VIN = 6.0V VIN = 12V R1245x00xC/R1245x00xD VOUT=3.3V (Ta=25℃) 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 4.5V VIN = 12V VIN = 24V R1245x00xC/R1245x00xD VOUT=5.0V (Ta=25℃) 4.95 4.97 4.99 5.01 5.03 5.05 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 12V VIN = 24V VIN = 30V R1245x00xC/R1245x00xD VOUT=12V (Ta=25℃) 11.80 11.90 12.00 12.10 12.20 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 18V VIN = 24V VIN = 30V R1245x00xC/R1245x00xD VOUT=15V (Ta=25℃) 14.60 14.80 15.00 15.20 15.40 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 24V VIN = 30V R1245x00xC/R1245x00xD VOUT=24V (Ta=25℃) 23.60 23.80 24.00 24.20 24.40 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 30V
No. EA-269-240903 27) Output current vs. Output voltage (Version E/F) R1245x00xE/R1245x00xF VOUT=0.8V (Ta=25℃) 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage(V) VIN = 4.5V R1245x00xE/R1245x00xF VOUT=3.3V (Ta=25℃) 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 4.5V VIN = 12V VIN = 24V R1245x00xE/R1245x00xF VOUT=5.0V (Ta=25℃) 4.95 4.97 4.99 5.01 5.03 5.05 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 12V VIN = 24V VIN = 30V R1245x00xE/R1245x00xF VOUT=12V (Ta=25℃) 11.80 11.90 12.00 12.10 12.20 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 24V VIN = 30V R1245x00xE/R1245x00xF VOUT=15V (Ta=25℃) 14.80 15.00 15.20 15.40 15.60 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 24V VIN = 30V R1245x00xE/R1245x00xF VOUT=24V (Ta=25℃) 23.60 23.80 24.00 24.20 24.40 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 30V
No. EA-269-240903 28) Output current vs. Output voltage (Version G/H) R1245x00xG/R1245x00xH VOUT=1.5V (Ta=25℃) 1.485 1.490 1.495 1.500 1.505 1.510 1.515 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 4.5V R1245x00xG/R1245x00xH VOUT=3.3V (Ta=25℃) 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 6V VIN = 10V VIN = 12V R1245x00xG/R1245x00xH VOUT=5.0V (Ta=25℃) 4.95 4.97 4.99 5.01 5.03 5.05 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 8.0V VIN = 12V R1245x00xG/R1245x00xH VOUT=12V (Ta=25℃) 11.80 11.90 12.00 12.10 12.20 0 200 400 600 800 1000 1200 IOUT (mA) Output Voltage (V) VIN = 24V VIN = 30V
No. EA-269-240903 29) Input voltage vs. Output voltage (Version A/B) R1245x00xA/R1245x00xB VOUT=0.8V (Ta=25℃) 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 4 6 8 10 12 14 16 18 VIN (V) Output Voltage (V) IOUT=1mA IOUT=100mA IOUT=500mA IOUT=1200mA R1245x00xA/R1245x00xB VOUT=3.3V (Ta=25℃) 3.27 3.28 3.29 3.30 3.31 3.32 3.33 4 8 12 16 20 24 28 VIN (V) Output Voltage (V) IOUT=1mA IOUT=10mA IOUT=100mA IOUT=1200mA R1245x00xA/R1245x00xB VOUT=5.0V (Ta=25℃) 4.95 4.97 4.99 5.01 5.03 5.05 4 6 8 10 12 14 16 18 20 22 24 26 28 30 VIN (V) Output Voltage (V) IOUT=1mA IOUT=100mA IOUT=500mA IOUT=1200mA R1245x00xA/R1245x00xB VOUT=12V (Ta=25℃) 11.95 12.00 12.05 12.10 12.15 12.20 12 14 16 18 20 22 24 26 28 30 VIN (V) Output Voltage (V) IOUT=100mA IOUT=500mA IOUT=1200mA R1245x00xA/R1245x00xB VOUT=15V (Ta=25℃) 14.90 15.00 15.10 15.20 15.30 14 16 18 20 22 24 26 28 30 VIN (V) Output Voltage (V) IOUT=100mA IOUT=500mA IOUT=1200mA R1245x00xA/R1245x00xB VOUT=24V (Ta=25℃) 23.80 23.90 24.00 24.10 24.20 24 25 26 27 28 29 30 VIN (V) Output Voltage (V) IOUT=100mA IOUT=500mA IOUT=1200mA
No. EA-269-240903 30) Input voltage vs. Output voltage (Version C/D) R1245x00xC/R1245x00xD VOUT=0.8V (Ta=25℃) 0.79 0.79 0.80 0.80 0.80 0.80 0.80 0.81 0.81 4.5 6 7.5 9 10.5 12 13.5 VIN (V) Output Voltage (V) 1mA 100mA 500mA 1200mA R1245x00xC/R1245x00xD VOUT=3.3V (Ta=25℃) 3.27 3.28 3.29 3.30 3.31 3.32 3.33 4 8 12 16 20 24 28 VIN (V) Output Voltage (V) 1mA 100mA 500mA 1200mA R1245x00xC/R1245x00xD VOUT=5.0V (Ta=25℃) 4.95 4.97 4.99 5.01 5.03 5.05 4 6 8 10 12 14 16 18 20 22 24 26 28 30 VIN (V) Output Voltage (V) 1mA 100mA 500mA 1200mA R1245x00xC/R1245x00xD VOUT=12V (Ta=25℃) 11.80 11.90 12.00 12.10 12.20 12 14 16 18 20 22 24 26 28 30 VIN (V) Output Voltage (V) 100mA 500mA 1200mA R1245x00xC/R1245x00xD VOUT=15V (Ta=25℃) 14.60 14.70 14.80 14.90 15.00 15.10 15.20 15.30 15.40 14 16 18 20 22 24 26 28 30 VIN (V) Output Voltage (V) 100mA 500mA 1200mA R1245x00xC/R1245x00xD VOUT=24V (Ta=25℃) 23.80 23.90 24.00 24.10 24.20 24 25 26 27 28 29 30 VIN (V) Output Voltage (V) 100mA 500mA 1200mA
No. EA-269-240903 31) Input voltage vs. Output voltage (Version E/F) R1245x00xE/R1245x00xF VOUT=0.8V (Ta=25℃) 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 4.5 5 5.5 6 6.5 VIN (V) Output Voltage (V) 1mA 100mA 500mA 1200mA R1245x00xE/R1245x00xF VOUT=3.3V (Ta=25℃) 3.27 3.28 3.29 3.30 3.31 3.32 3.33 4 8 12 16 20 24 28 VIN (V) Output Voltage (V) 1mA 100mA 500mA 1200mA R1245x00xE/R1245x00xF VOUT=5.0V (Ta=25℃) 4.95 4.97 4.99 5.01 5.03 5.05 5 10 15 20 25 30 VIN (V) Output Voltage (V) 1mA 100mA 500mA 1200mA R1245x00xE/R1245x00xF VOUT=12V (Ta=25℃) 11.80 11.90 12.00 12.10 12.20 12 14 16 18 20 22 24 26 28 30 VIN (V) Output Voltage (V) 100mA 500mA 1200mA R1245x00xE/R1245x00xF VOUT=15V (Ta=25℃) 14.60 14.80 15.00 15.20 15.40 16 18 20 22 24 26 28 30 VIN (V) Output Voltage (V) 100mA 500mA 1200mA R1245x00xE/R1245x00xF VOUT=24V (Ta=25℃) 23.60 23.80 24.00 24.20 24.40 26 27 28 29 30 VIN (V) Output Voltage (V) 100mA 500mA 1200mA
No. EA-269-240903 32) Input voltage vs. Output voltage (Version G/H) R1245x00xG/R1245x00xH VOUT=1.5V (Ta=25℃) 1.485 1.490 1.495 1.500 1.505 1.510 1.515 VIN (V) Output Voltage (V) 1mA 100mA 500mA 1200mA R1245x00xG/R1245x00xH VOUT=3.3V (Ta=25℃) 3.27 3.28 3.29 3.30 3.31 3.32 3.33 VIN (V) Output Voltage (V) 1mA 100mA 500mA 1200mA R1245x00xG/R1245x00xH VOUT=5.0V (Ta=25℃) 4.95 4.97 4.99 5.01 5.03 5.05 6 8 10 12 14 16 18 VIN (V) Output Voltage (V) 1mA 100mA 500mA 1200mA R1245x00xG/R1245x00xH VOUT=12V (Ta=25℃) 11.80 11.90 12.00 12.10 12.20 14 16 18 20 22 24 26 28 30 VIN (V) Output Voltage (V) 100mA 500mA 1200mA
Ver. A i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are used in this measurement. Measurement Conditions Ultra-High Wattage Land Pattern Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layers (First and Fourth Layers): Approx. 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Through-holes φ 0.4 mm × 21 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Ultra-High Wattage Land Pattern Power Dissipation 2.9 W Thermal Resistance θja = (125 − 25°C) / 2.9 W = 35°C/W θjc = 10°C/W IC Mount Area (mm) Power Dissipation vs. Ambient Temperature Measurement Board Pattern Power Dissipation PD (W) 0 25 50 75 100 125 150 Ambient Temperature (°C) 4.0 3.0 2.0 1.0 105 Ultra-High Wattage Land Pattern 2.9 76.2 114.3
PACKAGE DIMENSIONS HSOP-8E i ∗ The tab on the bottom of the package shown by blue circle is substrate potential (GND/VDD). It is recommended that this tab be connected to the ground plane/VDD pin on the board but it is possible to leave the tab floating.
i : Product Code … Refer to Part Marking List : Lot Number … Alphanumeric Serial Number HSOP-8E Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or our distributor before attempting to use AOI. R1245S003x Part Marking List R1245S003A R S 0 0 5A R1245S003B R S 0 0 5B R1245S003C R S 0 0 5C R1245S003D R S 0 0 5D R1245S003E R S 0 0 5E R1245S003F R S 0 0 5F R1245S003G R S 0 0 5G R1245S003H R S 0 0 5H 8 5 1 4
POWER DISSIPATION DFN(PL)2020-8 Ver. A i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are used in this measurement. Measu rement Conditions Standard Test Land Pattern Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Double-Sided Board) Board Dimensions 40 mm × 40 mm × 1.6 mm Copper Ratio Top Side: Approx. 50% Bottom Side: Approx. 50% Through-holes φ 0.54 mm × 30 pcs Measuremen t Result (Ta = 25°C, Tjmax = 125°C) Standa rd Test Land Pattern Power Dissipation 880 mW Thermal Resistance θja = (125 − 25°C) / 0.88 W = 114°C/W IC Mount Area (mm) Power Dissipation vs. Ambient Temperature Measurement Board Pattern Power Dissipation PD (mW) 1200 1000 800 600 400 200 0 25 50 75 100 125 150 Ambient Temperature (°C) 105 880 Standard Test Land Pattern
PACKAGE DIMENSIONS DFN (PL) 2020-8 Ver. A i 2.00 2.00 A B 0.05 INDEX 0.6MAX. 0.05 SS 0.05min 0.25±0.10.25±0.1 0.5 1.8±0.1 0.25±0.1
0.05 M AB
1.0±0.1 C0.2 Bottom View DFN (PL) 2020-8 Package Dimensions (Unit: mm) ∗ The tab on the bottom of the package is substrate level (GND). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating.
Ver.B ①②③④: Product Code … Refer to Part Marking List ⑤⑥: Lot Number … Alphanumeric Serial Number 8765 1234 DFN(PL)2020-8 Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or our distributor before attempting to use AOI. R1245K Part Marking List Product Name ①②③④ R1245K003A DC01 R1245K003B DC02 R1245K003C DC03 R1245K003D DC04 R1245K003E DC05 R1245K003F DC06 R1245K003G DC07 R1245K003H DC08
POWER DISSIPATION SOT-23-6W Ver. A i Power Dissipation PD (mW) 600 500 400 300 200 100 0 25 50 75 100 125 150 Ambient Temperature (°C) 105 Standard Test Land Pattern 430 The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are used in this measurement. Measurement Conditions Standard Test Land Pattern Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Double-Sided Board) Board Dimensions 40 mm × 40 mm × 1.6 mm Copper Ratio Top Side: Approx. 50% Bottom Side: Approx. 50% Through-holes φ 0.5 mm × 44 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Standard Test Land Pattern Power Dissipation 430 mW Thermal Resistance θja = (125 − 25°C) / 0.43 W = 233°C/W IC Mount Area (mm) Power Dissipation vs. Ambient Temperature Measurement Board Pattern
PACKAGE DIMENSIONS SOT-23-6W Ver. A i
Ver.B ①②③: Product Code … Refer to Part Marking List ④⑤: Lot Number … Alphanumeric Serial Number 6 4 1 2 3 SOT-23-6W Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or our distributor before attempting to use AOI. R1245N Part Marking List Product Name ①②③ R1245N001A 600 R1245N001B 601 R1245N001C 602 R1245N001D 603 R1245N001E 604 R1245N001F 605 R1245N001G 606 R1245N001H 607
- T he products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us. 3. This product and any technical information relating thereto are subject to complementary export controls (so- called KNOW controls) under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade Control Law and its related regulations with respect to the complementary export controls. 4. The technical information described in this document shows typical characteristics and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death should first contact us.
- Aerospace Equipment
- Equipment Used in the Deep Sea
- Power Generator Control Equipment (nuclear, steam, hydraulic, etc.)
- Life Maintenance Medical Equipment
- Fire Alarms / Intruder Detectors
- Vehicle Control Equipment (automotive, airplane, railroad, ship, etc.)
- Various Safety Devices
- Traffic control system
- Combustion equipment In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make sure to contact our company in advance. Note that the important requirements mentioned in this section are not applicable to cases where operation requirements such as application conditions are confirmed by our company in writing after consultation with your company. 6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. The products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead to deterioration, destruction or failure of the products. We shall not be responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or misapplication of the products. 8. Quality Warranty 8-1. Quality Warranty Period In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement, quality assurance agreement, delivery specifications, etc., it shall be followed. 8-2. Quality Warranty Remedies When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute for the defective product or refund the purchase price of the defective product. Note that such delivery or refund is sole and exclusive remedies to your company for the defective product. 8-3. Remedies after Quality Warranty Period With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company. 9. Anti-radiation design is not implemented in the products described in this document. 10. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 11. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 12. Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or power. When the product is disposed of, please follow the related regulation and do not mix this with general industrial waste or household waste. 13. Please contact our sales representatives should you have any questions or comments concerning the products or the technical information. Official website https://www.nisshinbo-microdevices.co.jp/en/ Purchase information https://www.nisshinbo-microdevices.co.jp/en/buy/