CMS01

CMS01 TOSHIBA | Alldatasheet

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TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CMS01 Switching Mode Power Supply Applications Portable Equipment Battery Applications

• Forward voltage: V FM = 0.37 V (max)
• Average forward current: IF (AV) = 3.0 A
• Repetitive peak reverse voltage: VRRM = 30 V
• Suitable for compact assembly due to small surface-mount package “M-FLAT TM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage VRRM 30 V Average forward current IF (AV) 3.0 (Note 1) A Peak one cycle surge forward current (non-repetitive) IFSM 40 (50 Hz) A Junction temperature Tj −40~125 °C Storage temperature Tstg −40~150 °C Note 1: T ℓ = 68.6°C: Rectangular waveform (α = 180°), VR = 15 V Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit VFM (1) I FM = 0.5 A ⎯ 0.25 ⎯ VFM (2) I FM = 1.0 A ⎯ 0.27 ⎯ Peak forward voltage VFM (3) I FM = 3.0 A ⎯ 0.33 0.37 V IRRM V RRM = 5 V ⎯ 0.15 ⎯ Repetitive peak reverse current IRRM V RRM = 30 V ⎯ 1.8 5.0 mA Junction capacitance Cj V R = 10 V, f = 1.0 MHz ⎯ 190 ⎯ pF Device mounted on a ceramic board (soldering land: 2 mm × 2 mm) ⎯ ⎯ 60 Rth (j-a) Device mounted on a glass-epoxy board (soldering land: 6 mm × 6 mm) ⎯ ⎯ 135 Thermal resistance Rth (j-ℓ) ⎯ ⎯ ⎯ 16 °C/W Unit: mm JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.)

Abbreviation Code Part No. S1 CMS01 Standard Soldering Pad Handling Precaution Schottky barrier diodes have reverse current characteristic compared to the other diodes. There is a possibility SBD may cause th ermal runaway when it is used under high temperature or high voltage. This device is V F-IRRM trade-off type, lower V F higher I RRM; therefore, thermal r unaway might occur when voltage is applied. Please take forward and reverse loss into consideration during design. The absolute maximum ratings denote the absolute maximu m ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. VRRM: Use this rating with reference to the above. V RRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account designing a device at low temperature. IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of I F(AV) and T j be below 100°C. When using this device, take the margin into consideration by using an allowable Tℓ max - IF(AV) curve. IFSM: This rating specifies the non-repetitive peak curren t. This is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 100°C. Thermal resistance between junction and ambient fluctuat es depending on the device’s mounting condition. When using a device, please design a circuit board and a solderin g land size to match the appropriate thermal resistance value. Please refer to the Rectifiers Databook for further information. 3.0 1.4 2.1 Unit: mm 1.4

0.5 0.001 0.01 0.1 1 10 100 1000 100 500 Device mounted on a glass-epoxy board Soldering land: 2.1 mm × 1.4 mm Device mounted on a glass-epoxy board Soldering land: 6.0 mm × 6.0 mm Device mounted on a ceramic board Soldering land: 2.0 mm × 2.0 mm Transient thermal impedance r th (j-a) (°C/W) Junction capacitance C j (pF) Instantaneous forward voltage v F (V) iF – vF Instantaneous forward current i F (A) Average forward current I F (AV) (A) PF (AV) – IF (AV) Average forward power dissipation PF (AV) (W) Average forward current I F (AV) (A) Tℓ max – IF (AV) Maximum allowable lead temperature Tℓ max (°C) Reverse voltage V R ( V ) Cj – VR (typ.) Time t (s) rth (j-a) – t 0.1 100 25°C Tj = 125°C 75°C 1 10 100 100 1000 f = 1 MHz Ta = 25°C 1.4 0.6 0.0 0.2 0.4 0.8 1.0 2.4 4.2 4.8 1.2 α = 120° α = 60° α = 180° DC 360° 0° α Rectangular waveform Conduction angle: α 140 100 2.4 4.2 4.8 120 α = 60° α = 120° α = 180° DC Conduction angle: α VR = 15 V 360° 0° α Rectangular waveform IF (AV)

0.1 0 20 40 60 80 100 120 140 100 1000 Pulse test VR = 3 V VR = 5 V VR = 10 V VR = 15 V VR = 20 V VR = 30 V Average reverse power dissipation PR (AV) (W) Reverse current I R (mA) Number of cycles Surge forward current (non-repetitive) Peak surge forward current I FSM (A) Junction temperature T j (°C) IR – Tj (typ.) Reverse voltage V R ( V ) PR (AV) – VR (typ.) 1 10 100 f = 50 Hz Ta = 25°C 0.0 0 10 20 30 2.0 4.0 6.0 8.0 10.0 12.0 14.0 DC 60° 120° 180° 240° 300° Rectangular waveform 360° 0° Conduction angle: α Tj = 125°C VR α

RESTRICTIONS ON PRODUCT USE 20070701-EN

• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity an d vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIB A products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconduct or Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
• The TOSHIBA products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringement s of patents or other rights of the third parties which may result from its use. No license is granted by implic ation or otherwise under any patents or other rights of TOSHIBA or the third parties.
• Please contact your sales representative for product- by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.