DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

ç

1 July-2010

ç CM500HA-34A

  • Flat base Type Copper (non-plating) base plate No accessory (terminal screw) attach
  • RoHS Directive compliant Single APPLICATION AC Motor Control, Motion/Servo Control, Power supply, etc. OUTLINE DRAWING & INTERNAL CONNECTION Dimension in mm ç ç Tolerance otherwise specified ç Division of Dimension Tolerance 0.5 to 3 ±0.2 over 3 to 6 ±0.3 over 6 to 30 ±0.5 over 30 to 120 ±0.8 over 120 to 400 ±1.2 çç INTERNAL CONNECTION ç CE E G Tr1 Di1 ç

ç ç MITSUBISHI IGBT MODULES ç CM500HA-34A ç HIGH POWER SWITCHING USE ç ç INSULATED TYPE ç çç

2 July-2010

ABSOLUTE MAXIMUM RATINGS (T j=25 °C, unless otherwise specified) Symbol Item Conditions Rating Unit VCES Collector-emitter voltage G-E short-circuited 1700 V VGES Gate-emitter voltage C-E short-circuited ±20 V IC DC, T C=87 °C (Note.2) 500 ICRM Collector current Pulse, Repetitive (Note.3) 1000 A Ptot Total power dissipation T C=25 °C (Note.2, 4) 5000 W IE (Note.1) TC=25 °C (Note.2, 4) 500 IERM (Note.1) Emitter current (Free wheeling diode forward current) Pulse, Repetitive (Note.3) 1000 A Tj Junction temperature - -40 ~ +150 Tstg Storage temperature - -40 ~ +125 Visol Isolation voltage Terminals to base pl ate, RMS, f=60 Hz, AC 1 min 3500 V MECHANICAL CHARACTERISTICS Limits Symbol Item Conditions Min. Typ. Max. Unit Mt Main terminals M 6 screw 1.96 2.45 2.94 Mt Auxiliary terminals M 4 screw 0.98 1.18 1.47 Ms Mounting torque Mounting to heat sink M 6 screw 1.96 2.45 2.94 N·m m Weight - - 480 - g ec Flatness of base plate On the centerline X, Y (Note.5) ±0 - +100 μm ELECTRICAL CHARACTERISTICS (T j =25 °C, unless otherwise specified) Limits Symbol Item Conditions Min. Typ. Max. Unit ICES Collector-emitter cut-off current V CE=VCES, G-E short-circuited - - 1 mA IGES Gate-emitter leakage current ±V GE=VGES, C-E short-circuited - - 3 μA VGE(th) Gate-emitter threshold voltage I C=50 mA, VCE=10 V 5.5 7 8.5 V IC=500 A (Note.6) , T j =25 °C - 2.2 3.0 VCEsat Collector-emitter saturation voltage VGE=15 V T j =125 °C - 2.45 - V Cies Input capacitance - - 120 Coes Output capacitance - - 14 Cres Reverse transfer capacitance VCE=10 V, G-E short-circuited - - 2.6 nF QG Gate charge V CC=1000 V, IC=500 A, VGE=15 V - 3300 - nC td(on) Turn-on delay time - - 900 tr Rise time VCC=1000 V, I C=500 A, V GE=±15 V, - - 500 td(off) Turn-off delay time - - 700 tf Fall time RG=3.0 Ω, Inductive load - - 350 ns VEC (Note.1) Emitter-collector voltage I E=500 A (Note.6) , G-E short-circuited - 2.3 3.2 V trr (Note.1) Reverse recovery time V CC=1000 V, IE=500 A, VGE=±15 V, - - 650 ns Qrr (Note.1) Reverse recovery charge R G=3.0 Ω, Inductive load - 50 - μC Eon Turn-on switching energy per pulse V CC=1000 V, I C=IE=500 A, - 267.8 - Eoff Turn-off switching energy per pulse V GE=±15 V, R G=3.0 Ω, - 138.5 - Err (Note.1) Reverse recovery energy per pulse T j =125 °C, Inductive load - 98.1 - mJ rg Internal gate resistance T C=25 °C - 1.0 - Ω RG External gate resistance - 3.0 - 10 Ω THERMAL RESISTANCE CHARACTERISTICS Limits Symbol Item Conditions Min. Typ. Max. Unit Rth(j-c)Q Junction to case, IGBT part - - 25 K/kW Rth(j-c)D Thermal resistance (Note.2) Junction to case, FWDi part - - 42 K/kW Rth(c-s) Contact thermal resistance (Note.2) Case to heat sink, Thermal grease applied (Note.7) - 20 - K/kW

ç ç MITSUBISHI IGBT MODULES ç CM500HA-34A ç HIGH POWER SWITCHING USE ç ç INSULATED TYPE ç çç

3 July-2010

Note.1: Represent ratings and characteristics of the ant i-parallel, emitter-collector free wheeling diode (FWDi). Note.2: Case temperature (T C) and heat sink temperature (T s ) are defined on the each surface of base plate and heat sink just under the chips. (Refer to the figure of chip location) The heat sink thermal resistance {R th(s-a) } should measure just under the chips. Note.3: Pulse width and repetition rate should be such that the device junction temperature (T j ) dose not exceed T jmax rating. Note.4: Junction temperature (T j ) should not increase beyond T jmax rating. Note.5: Base plate flatness measurement point is as in the following figure. Y X +: Convex -: Concave +: Convex Bottom Bottom Bottom -: Concave Note.6: Pulse width and repetition rate should be su ch as to cause negligible temperature rise. (Refer to the figure of test circuit) Note.7: Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K). CHIP LOCATION (Top view) Dimension in mm, tolerance: ±1 mm Tr1: IGBT, Di1: FWDi. Each mark points the center position of each chip.

ç ç MITSUBISHI IGBT MODULES ç CM500HA-34A ç HIGH POWER SWITCHING USE ç ç INSULATED TYPE ç çç

4 July-2010

TEST CIRCUIT AND WAVEFORMS VGE=15 V V IC C E Es G short- circuited V IE C E Es G VCEsat test circuit VEC test circuit ʙ t tftr td(on) iC 10 % 90 % 90 % vGE VCC iE iC RG -VGE +VGE -VGE Load ʙ ʙ ʙ 0 V 0 A vCE vGE 0 V td(off) t Irr Qrr =0.5×I rr ×trr 0.5×Irr t trr iE 0 A IE Switching characteristics test circuit and waveforms t rr , Q rr test waveform 0.1×ICM ICM VCC vCE iC t 0 ti 0.1×VCC 0.1×VCC VCC ICM vCE iC 0.02×ICM ti IEM vECiE t0 V ti t VCC 0 A IGBT Turn-on switching energy IGBT Turn-off switching energy FWDi Reverse recovery energy Turn-on, Turn-off switching and Reverse recove ry energy test waveforms (integral range) ç

ç ç MITSUBISHI IGBT MODULES ç CM500HA-34A ç HIGH POWER SWITCHING USE ç ç INSULATED TYPEç

5 July-2010

ç PERFORMANCE CURVES OUTPUT CHARACTERISTICS (TYPICAL) COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) Tj =25 °C VGE=15 V COLLECTOR CURRENT I C (A) 200 400 600 800 1000 02468 1 0 COLLECTOR-EMITTER SATURATION VOLTAGE V CEsat (V) 0 200 400 600 800 1000 COLLECTOR-EMITTER VOLTAGE V CE (V) COLLECTOR CURRENT I C (A) COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) FREE WHEELING DIODE FORWARD CHARACTERISTICS (TYPICAL) Tj =25 °C G-E short-circuited COLLECTOR-EMITTER SATURATION VOLTAGE V CEsat (V) 5 1 01 52 0 EMITTER CURRENT I E (A) 100 1000 0.5 1.5 2.5 3.5 GATE-EMITTER VOLTAGE V GE (V) EMITTER-COLLECTOR VOLTAGE V EC (V) Tj =125 °C Tj =25 °C Tj =125 °C Tj =25 °C IC=1000 A IC=500 A IC=200 A VGE=20 V 12 V 11 V 10 V 9 V 13 V 15 V

ç ç MITSUBISHI IGBT MODULES ç CM500HA-34A ç HIGH POWER SWITCHING USE ç ç INSULATED TYPE ç çç

6 July-2010

(TYPICAL) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCC=1000 V, VGE=±15 V, RG=3.0 Ω, Tj =125 °C INDUCTIVE LOAD VCC=1000 V, IC=500 A, VGE=±15 V, Tj =125 °C INDUCTIVE LOAD SWITCHING TIME (ns) 100 1000 10000 10 100 1000 SWITCHING TIME (ns) 100 1000 10000 11 0 COLLECTOR CURRENT I C (A) EXTERNAL GATE RESISTANCE R G (Ω) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCC=1000 V, VGE=±15 V, RG=3.0 Ω, Tj =125 °C INDUCTIVE LOAD, PER PULSE VCC=1000 V, IC/IE=500 A, VGE=±15 V, Tj =125 °C INDUCTIVE LOAD, PER PULSE SWITCHING ENERGY (mJ) REVERSE RECOVERY ENERGY (mJ) 100 1000 10 100 1000 SWITCHING ENERGY (mJ) REVERSE RECOVERY ENERGY (mJ) 100 1000 1 10 COLLECTOR CURRENT I C (A) EMITTER CURRENT I E (A) EXTERNAL GATE RESISTANCE R G (Ω) Eon Eoff Err Eon Eoff Err td(on) tr td(off) tf td(on) tr td(off) tf

ç ç MITSUBISHI IGBT MODULES ç CM500HA-34A ç HIGH POWER SWITCHING USE ç ç INSULATED TYPE ç çç

7 July-2010

CAPACITANCE CHARACTERISTICS (TYPICAL) GATE CHARGE CHARACTERISTICS (TYPICAL) G-E short-circuited, Tj =25 °C IC=500 A, Tj =25 °C CAPACITANCE (nF) 0.1 100 1000 0.1 1 10 100 GATE-EMITTER VOLTAGE V GE (V) 0 1000 2000 3000 4000 5000 COLLECTOR-EMITTER VOLTAGE V CE (V) GATE CHARGE Q G (nC) FREE WHEELING DIODE REVERSE RECOVERY CHARACTERISTICS (TYPICAL) TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS (MAXIMUM) VCC=1000 V, VGE=±15 V, RG=3.0 Ω, Tj =125 °C INDUCTIVE LOAD Single pulse, T C=25°C trr (ns), Irr (A) 100 1000 10 100 1000 NORMALIZED TRANSIENT THERMAL IMPEDANCE Z th(j-c) 0.001 0.01 0.1 Rth(j-c)Q =25 K/kW, Rth(j-c)D =42 K/kW EMITTER CURRENT I E (A) TIME (S) Cies Coes Cres VCC =800 V VCC =1000 V trr Irr

ç ç MITSUBISHI IGBT MODULES ç CM500HA-34A ç HIGH POWER SWITCHING USE ç ç INSULATED TYPE ç çç

8 July-2010

Keep safety first in your circuit designs!

  • Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials
  • These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
  • Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
  • All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.mitsubishichips.com/Global/index.html).
  • When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.
  • Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
  • The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials.
  • If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
  • Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. ç