CLS02 TOSHIBA | Alldatasheet

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TOSHIBA Schottky Barrier Diode CLS02 Switching-Mode Power Supply (Secondary-Rectification) Applications (Low Voltage) DC/DC Converter Applications

  • Forward voltage: V FM = 0.55 V (max)
  • Average forward current: IF (AV) = 10 A
  • Repetitive peak reverse voltage: VRRM = 40 V
  • Suitable for compact assembly due to small surface-mount package: “L −FLATTM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage VRRM 40 V Average forward current IF (AV) 10 (Note.1) A Non-repetitive peak surge current I FSM 100 (50 Hz) A Junction temperature Tj −40~125 °C Storage temperature range Tstg −40~150 °C Note1: Tℓ = 75°C Rectangular waveform (α = 180°), VR = 20 V Note2: Using continuously under heav y loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit VFM (1) I FM = 3.0 A (pulse test) ⎯ 0.36 ⎯ VFM (2) I FM = 5.0 A (pulse test) ⎯ 0.41 ⎯ V Peak forward voltage VFM (3) I FM = 10 A (pulse test) ⎯ 0.5 0.55 IRRM (1) V RRM = 5 V (pulse test) ⎯ 4.0 ⎯ μ A Peak repetitive reverse current IRRM (2) V RRM = 40 V (pulse test) ⎯ 0.03 1.0 mA Junction capacitance Cj V R = 10 V, f = 1.0 MHz ⎯ 420 ⎯ pF Thermal resistance (junction to ambient) Rth (j-a) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm ⎯ ⎯ 100 °C/W Thermal resistance (junction to lead) R th (j-ℓ) ⎯ ⎯ ⎯ 5 °C/W Unit: mm 2.85 ± 0.2 1.8 ± 0.1 0.8 ± 0.2 8.2 ± 0.2 5.5 ± 0.1 0 ~ 0.03 4 ± 0.2 1.5 ± 0.1 2.7 ± 0.2 ① ① ANODE ② CATHODE 1.2 ± 0.1 JEDEC ⎯ JEITA ⎯ TOSHIBA 3-4F1A Weight: 0.15 g (typ.)

Abbreviation Code Part No. S02 CLS02 Standard Soldering Pad Handling Precautions 1) Schottky barrier diodes have reverse current characteri stics compared to other diod es. There is a possibility that SBD will cause thermal runaway when used under hi gh-temperature or high-voltage conditions. Be sure to take forward and reverse loss into consideration during design. 2) The absolute maximum ratings, are ra ted values that must not be exceed ed during operation, even for an instant. The following are the general derating methods that we recommend for when designing a circuit incorporating this device. V RRM: Use this rating with reference to (1) above. V RRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account when designing a device for operation at low temperatures. I F (AV): We recommend that the worst case current be no greater than 80% of the maximum rating of I F (AV) and that T j be below 100°C. When using this device, take the margin into consideration by using an allowable Tamax-IF (AV) curve. I FSM: This rating specifies the non-repetitive peak cu rrent. This applies only to abnormal operation, which seldom occurs during the lifespan of the device. T j: Derate this rating when using the device in or der to ensure high reliability. We recommend that the device be used at a Tj of below 100°C. 3) Thermal resistance between junction and ambient fl uctuates depending on the mounting condition of the device. When using the device, design the circuit boar d and soldering land size to match the appropriate thermal resistance value. 4) Refer to the databook on Rectifiers for further information. Unit: mm 2.6 2.5 1.8 4.8 2.9 5.9

25°C 0.01 0.1 100 75°C Tj = 125°C Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm Maximum allowable temperature Ta max (°C) Instantaneous forward voltage v F ( V ) iF – vF Instantaneous forward current i F (A) Average forward current I F (AV) ( A ) PF (AV) – IF (AV) Average forward power dissipation PF (AV) (W) Average forward current I F (AV) ( A ) Tℓ max – IF (AV) Maximum allowable lead temperature Tℓ max (°C) Average forward current I F (AV) ( A ) Ta max – IF (AV) α = 60° DC 0.0 0 4 8 12 16 4.0 2.0 10.0 180° 120° 6.0 100 120 140 0 4 8 16 100 120 140 4 0 8 16 DC α = 60° 180° 12 12 8.0 120° DC 1000 0.1 100 0.3 0.5 300 500 0.001 1000 0.01 0.1 100 10 1 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm 0.003 0.03 0.3 3 30 300 Transient thermal impedance rth (j-a) ( ° C / W ) Time t (s) rth (j-a) – t 360° 0° Rectangular waveform α Conduction angle α 360° 0° α VR = 20 V IF (AV) Conduction a n g l e α Rectangular waveform 360° 0° α VR = 20 V IF (AV) Conduction a n g l e α Rectangular waveform 1.0 α = 180°

Reverse current I R (mA) 1 10 100 100 120 Ta = 25°C f = 50 Hz 3 5 30 50 Average reverse power dissipation PR (AV) (W) Reverse voltage V R (V) C j – VR (typ.) Junction capacitance C j (pF) Number of cycles Surge forward current (non-repetitive) Peak surge forward current I FSM (A) Junction temperature T j ( ° C ) I R – Tj (typ.) Reverse voltage V R (V) P R (AV) – VR (typ.) 1 5 100 500 1000 10000 Ta = 25°C f = 1 MHz 30 10 3 100 5000 Pulse test 0.001 0 20 40 60 80 100 120 160 0.1 1000 0.01 140 VR = 5 V 10 V 20 V 30 V α = 60° 0.0 0 10 0.5 1.5 2.0 DC 120° 180° 240° 300° 20 40 100 Rectangular waveform 360°0° Conduction angle α Tj = 125°C VR α 40 V 1.0

RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL

  • The information contained herein is subject to change without notice.
  • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity an d vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIB A products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconduct or Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
  • The TOSHIBA products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.
  • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
  • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringement s of patents or other rights of the third parties which may result from its use. No license is granted by implic ation or otherwise under any patents or other rights of TOSHIBA or the third parties.
  • Please contact your sales representative for product- by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.