CLD-DS71

CLD-DS71 CREE | Alldatasheet

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Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. CLD-DS71 Rev 0 cree Xlamp Xh-G led Product descriPtioN Unlike common plastic packages, XLamp XH LeDs use a ceramic package to deliver the unique combination of high performance and reliability not available elsewhere in mid-power LeDs. The ceramic -based XH LeDs are designed to deliver the long L70 lifetimes of Cree’s other high-power LeDs, such as XP or XT LeDs, as well as industry‑leading LED efficacy levels. Optimized for fluorescent replacement lighting applications, such as troffers and panel lights, where high efficacy, long lifetime and smooth appearance are critical, the XH LeDs allow lighting manufacturers to offer products that meet the lifetime expectations of LeD technology.

features

• Package size: 3.0 X 3.0 mm
• Available in white, 70-minimum CRI cool white, 80-minimum CRI white and 85- and 90-minimum CRI warm white
• 300 mA maximum drive current
• viewing angle: 130°
• Reflow solderable ‑ JEDEC J‑STD‑020C compatible
• Unlimited floor life at ≤ 30 °C/85% RH www.CREE.COm/XLamp Cree, Inc.

4600 Silicon Drive

Durham, NC 27703 USA Tel: +1.919.313.5300 table of coNteNts Relative Spectral Power Relative Flux vs. Junction Reflow Soldering Characteristics . 7

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led characteristics characteristics unit minimum typical maximum Thermal resistance, junction to solder point °C/w 20 viewing angle (FWHM) degrees 130 Temperature coefficient of voltage mV/°C -1.2 ESD classification (HBm per mil‑Std‑883D) Class 2 DC forward current mA 300 Reverse voltage v -5 Forward voltage (@ 65 mA, 25 °C) v 2.9 3.4 LeD junction temperature °C 150

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led fluX characteristics (tJ = 25 °c) The following table provides several base order codes for XLamp XH-G LeDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order ‑code nomenclature, please consult the XLamp XH Family Binning and Labeling document. color cct range base order codes minimum luminous flux @ 65 ma calculated minimum luminous flux (lm)* order code min. max. Group flux (lm) 300 ma Cool White 5000 K 8300 K J3 26.8 100 XHGAWT-00-0000-00000LX51 Neutral White 3700 K 5000 K J2 23.5 88 XHGAWT-00-0000-00000LXe5 Warm White 2600 K 3700 K J2 23.5 88 XHGAWT-00-0000-00000LXe7 70-CRI White 5000 K 8300 K J3 26.8 100 XHGawT‑00‑0000‑00000BX51 3700 K 5000 K J2 23.5 88 XHGawT‑00‑0000‑00000BXE5 2600 K 3700 K J2 23.5 88 XHGawT‑00‑0000‑00000BXE7 80-CRI White 5000 K 8300 K J3 26.8 100 XHGAWT-00-0000-00000HX51 3700 K 5000 K J2 23.5 88 XHGAWT-00-0000-00000HWe5 2600 K 3700 K J2 23.5 88 XHGAWT-00-0000-00000HWe7 85-CRI White 2600 K 3200 K H0 18.1 67 XHGAWT-00-0000-00000Pve7 90-CRI White 2600 K 3200 K H0 18.1 67 XHGAWT-00-0000-00000Uve7 Notes:

• Cree maintains a tolerance of ±7% on flux and power measurements , ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements.
• Typical CRI for Neutral White, 3700 K - 5000 K CCT is 75.
• Typical CRI for Warm White, 2600 K - 3700 K CCT is 80.
• Minimum CRI for 70-CRI Minimum Cool White is 70.
• Minimum CRI for 80-CRI Minimum White is 80.
• Minimum CRI for 85-CRI Minimum White is 85.
• Minimum CRI for 90-CRI Minimum White is 90. * Calculated flux values at 300 ma are for reference only.

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led relative sPectral Power distributioN relative fluX vs. JuNctioN temPerature (if = 65 ma) Relative Spectral Power 100 380 430 480 530 580 630 680 730 780 Relative Radiant Power (%) Wavelength (nm) Cool White Warm White Relative Flux Output vs. Junction Temperature 100 25 50 75 100 125 150 Relative Luminous Flux Junction Temperature (ºC)

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led electrical characteristics (tJ = 25 °c) thermal desiGN The maximum forward current is determined by the thermal resistance between the LeD junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. Electrical Characteristics (Tj = 85ºC) 100 125 150 175 200 225 250 275 300 Forward Current (mA) Forward Voltage (V) Thermal Design 100 150 200 250 300 350 0 20 40 60 80 100 120 140 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 25 °C/W Rj-a = 30 °C/W Rj-a = 35 °C/W Rj-a = 40 °C/W

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led relative fluX vs. curreNt (tJ = 25 °c) tyPical sPatial distributioN Relative Intensity vs. Current (Tj = 85ºC) 100 150 200 250 300 350 400 25 50 75 100 125 150 175 200 225 250 275 300 Relative Luminous Flux (%) Forward Current (mA) Typical Spatial Radiation Pattern 100 -90 -70 -50 -30 -10 10 30 50 70 90 Relative Luminous Intensity (%) Angle (º)

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led7 reflow solderiNG characteristics In testing, Cree has found XLamp XH‑G LEDs to be compatible with JEDEC J‑ STD‑020C, using the parameters listed below. as a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all pCB designs and configurations of reflow soldering equipment. Profile Feature lead-based solder lead-free solder Average Ramp-Up Rate (Tsmax to Tp) 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C Preheat: Time (tsmin to tsmax) 60-120 seconds 60-180 seconds Time Maintained Above: Temperature (TL) 183 °C 217 °C Time Maintained Above: Time (tL) 60-150 seconds 60-150 seconds peak/Classification Temperature (Tp) 215 °C 260 °C Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-Down Rate 6 °C/second max. 6 °C/second max. Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. TP TL Temperature Time t 25˚C to Peak Preheat ts tS tP Ramp-down Ramp-up Critical Zone TL to TP Tsmax Tsmin

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led8 Notes lumen maintenance Projections Cree now uses standardized IeS LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LeD lumen maintenance. For information on the specific Lm‑80 data sets available for this LED, refer to the public Lm‑80 results document at www.cree.com/xlamp_app_notes/Lm80_results. please read the XLamp Long‑ Term Lumen maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the LeD junction temperature. moisture sensitivity In testing, Cree has found XLamp XH‑G LEDs to have unlimited floor life in conditions ≤30 ºC/85% relative humidity (RH). moisture testing included a 168‑hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LeDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LeDs to the resealable moisture-barrier bag and closing the bag immediately after use. vision advisory claim WARNING: Do not look at exposed lamp in operation. eye injury can result. See the LeD eye Safety application note at www.cree.com/xlamp_app_notes/led_eye_safety.

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led mechaNical dimeNsioNs All dimensions in mm. Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm top view side view bottom view 3.0 3.0 0.635 0.7+/-.2mm 2.8 0.1 1.6 0.7 0.5 2.8 0.1 1.55 0.65 0.65 2.843 1.33 0.33 1.7 0.5 0.8 0.25 0.25 RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED STENCIL PAD NOTCH IS ON CATHODE (-) SIDE 3.0 3.0 0.635 0.7+/-.2mm 2.8 0.1 1.6 0.7 0.5 2.8 0.1 1.55 0.65 0.65 2.843 1.33 0.33 1.7 0.5 0.8 0.25 0.25 RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED STENCIL PAD NOTCH IS ON CATHODE (-) SIDE

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led taPe aNd reel All Cree carrier tapes conform to eIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm Loaded Pockets (1,000 Lamps) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) Trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) STARTEND Cathode Side Anode Side (denoted by + and circle) 160.0 A A B 2.5±.1 SECTION A-A SCALE 2 : 1 1.5±.1 8.0±.1 4.0±.1 1.75±.10 12.0 .0 +.3 DETAIL B SCALE 2 : 1 13mm Cover Tape Pocket Tape User Feed Direction User Feed Direction 178 12.40 0 +0.20 MEASURED AT HUB 12.40 0 +3.20 MEASURED AT INSIDE EDGE 16.40 SHEET 1 OF 11:2 2400-00005 SIZE TITLE REV. C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION .X ± 0.3 X° ± 2° .XX ± .10 .X ± .25 FOR SHEET METAL PARTS ONLY .XX ± .13 X° ± 1° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. TOLERANCE UNLESS SPECIFIED: SCALE A B C D 123456 6 5 4 3 2 1 A B C D Phone (919) 361-4770 Durham, N.C 27703 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE, INC. Reel, 7" x 12mm Wide A R.CHALOUPECKY 6/25/08 ANTI-STATIC HIPS Loaded Pockets (2,000 Lamps) Leader 400 mm (min) of empty pockets with at least 100 mm sealed by tape (50 empty pockets min.) Trailer 160 mm (min) of empty pockets sealed with tape (20 pockets min.) STARTEND Cathode Side Anode Side (denoted by + and circle) 2.5 ±.1 1.5 ±.1 8.0 ±.1 4.0 ±.1 1.75 ±.10 12.0 .0 +.3 13mm Cover Tape Pocket Tape User Feed Direction User Feed Direction

Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. xlamp xH-G led11 PackaGiNG The diagrams below show the packaging and labels Cree uses to ship XLamp XH-G LeDs. XLamp XH-G LeDs are shipped in tape loaded on a reel. each box contains only one reel in a moisture barrier bag. Patent Label (on bottom of box) Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Code, Qty, Reel ID Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Unpackaged Reel Packaged Reel Boxed Reel CREE Bin Code & Barcode Label Vacuum-Sealed Moisture Barrier Bag Label with Customer P/N, Qty, Lot #, PO # Label with Cree Bin Code, Qty, Lot # Label with Cree Bin Code, Qty, Lot # Vacuum-Sealed Moisture Barrier Bag Patent Label Label with Customer Order Code, Qty, Reel ID, PO #