CL05A105KL5NRNC

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SPECIFICATION (Reference sheet)

• Supplier : Samsung electro-mechanics · Samsung P/N : CL05A105KL5NRNC
• Product : Multi-layer Ceramic Capacitor · Description : CAP, 1㎌, 35V, ±10%, X5R, 0402 CL 05 A 105 K L 5 N R N C ① ②③ ④ ⑤ ⑥ ⑦⑧⑨⑩⑪ ① Series Samsung Multi-layer Ceramic Capacitor ② Size 0402 (inch code) L : 1.00 ± 0.15 ㎜ W : 0.50 ± 0.15 ㎜ ③ Dielectric X5R ⑧ Inner electrode ④ Capacitance 1 Termination ⑤ Capacitance ±10 % Plating (Pb Free) tolerance ⑨ Product Size control code ⑥ Rated Voltage 35 V ⑩ Special Reserved for future use ⑦ Thickness 0.50 ± 0.15 ㎜ ⑪ Packaging Cardboard Type, 7" reel B. Structure & Dimension A. Samsung Part Number Ni ㎌ Cu Sn 100% BW Samsung P/N Dimension(㎜) LW T

C. Samsung Reliablility Test and Judgement Condition Capacitance Within specified tolerance Tan δ (DF) 0.1 max. Insulation 10,000Mohm or 100Mohm×㎌ Rated Voltage 60~120 sec Resistance Whichever is smaller Appearance No abnormal exterior appearance Microscope (×10) Withstanding No dielectric breakdown or of the rated voltage Voltage mechanical breakdown Temperature X5R Characteristics (From -55℃ to 85℃, Capacitance change should be within ±15%) Adhesive Strength No peeling shall be occur on the 500g·f, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : within ±12.5% Bending to the limit (1 ㎜) with 1.0mm/sec. Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : within ±7.5% Solder pot : 270±5℃, 10±1sec. Soldering Heat Tan δ, IR : initial spec. Vibration Test Capacitance change : within ± 5% Amplitude : 1.5mm Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.) 2hours × 3 direction (x, y, z) Moisture Capacitance change : within ±12.5% With rated voltage Resistance Tan δ : 0.2 max 40±2℃, 90~95%RH, 500+12/-0hrs IR : 500Mohm or 12.5Mohm × ㎌ Whichever is smaller High Temperature Capacitance change : within ±12.5% With of the rated voltage Resistance Tan δ : 0.2 max Max. operating temperature IR : 1,000Mohm or 25Mohm × ㎌ 1,000+48/-0hrs Whichever is smaller Temperature Capacitance change : within ±7.5% 1 cycle condition Cycling Tan δ, IR : initial spec. Min. operating temperature → 25℃ → Max. operating temperature → 25℃ 5 cycle test ※ The reliability test condition can be replaced by the corresponding accelerated test condition. D. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260±5℃, 30sec ) Product specifications included in the specific ations are effective as of March 1, 2013. Please be advised that they are standard product specifications for reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers. *A capacitor prior to measuring the capacitance is heat treated at 150+0/-10 for 1hour and maintained in ambient air for 24±2 hours. 250% 150% Judgement Test condition

E. Recomm (Subs ☞ Ma teria ☞ Caution oduct Ma mended TE strate for be Siz al : Glass ep : Copper f : Abnormali nual EST PCB Size cod ending stren ze code oxy substrat foil (T=0.035 ity can occu ( Adhesive de Siz 1.0 2.0 gth test) Size (mm) 0.4 × 0.2 0.6 × 0.3 1.0 × 0.5 1.6 × 0.8 2.0 × 1.25 3.2 × 1.6 3.2 × 2.5 4.5 × 3.2 5.7 × 5.0 te ☞ T 5 ㎜) ☞ r if lead-bas strength of ze (mm) .4 × 0.2 .6 × 0.3 0. × 0.5 .6 × 0.8 0 × 1.25 .2 × 1.6 .2 × 2.5 .5 × 3.2 .7 × 5.0 a 0.2 0.3 0.4 1.0 1.2 2.2 2.2 3.5 4.5 Thickness : T : So sed solder (K d b termination) a b 0.20 0. 1 0.30 0. 3 0.40 0. 5 1.00 1. 0 1.20 1. 4 2.20 1. 4 2.20 1. 4 3.50 1. 7 4.50 1. 7 (Su b c 0.6 0. 2 0.9 0. 3 1.5 0. 5 3.0 1. 2 4.0 1. 6 5.0 2. 0 5.0 2. 9 7.0 3. 7 8.0 5. 6 T=1.6 ㎜ (T= older resist KSD 6704) w b c 170 . 2 6 300 . 3 0 550 . 5 0 001 . 2 0 401 . 6 5 402 . 0 0 402 . 9 0 753 . 7 0 755 . 6 0 ubstrate for R d 2 5.0 3 5.0 5 5.0 2 5.0 655 . 0 0 5.0 9 5.0 7 5.0 6 5.0 0.8 ㎜ for 0 with 3% silver Reliability te e 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 03/05) r is used. est) e a c

1. Packag This spe When c 1-1. Figur 1-2. Quan Type MLCC oduct Ma ging ecification a customers re e ntity Size Code Inch(mm) 0402 (01005) 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210) 4520 (1808) 4532 (1812) 5750 (2220) nual applies to ta equire, the s Chip Thickness 0.2 mm 0.3 mm 0.5 mm 0.8 mm T≤0.85 mm T≥1.0 mm T≤0.85 mm T≥1.0 mm T≤1.6 mm T≥2.0 mm T≤1.6 mm T≥2.0 mm T≤2.0 mm T>2.0 mm T≥2.5 mm aping of ML specification Taping Typ PAPER PAPER PAPER PAPER PAPER EMBOSSED PAPER EMBOSSED EMBOSSED EMBOSSED EMBOSSED EMBOSSED EMBOSSED EMBOSSED EMBOSSED LCC n may be ch pe Pitch 2mm 2mm 2mm 4mm 4mm D 4mm 4mm D 4mm D 4mm D 4mm D 8mm D 8mm D 8mm D 8mm D 8mm hanged und Plastic inches reel 20k 10K 10K der the agre Plastic 10 inches reel 10K 10K 10K eement. Plast 13 inche 100K 50K 50K 15K / 1 15K / 1 10K 10K 10K 10K nit:p cs] tic s reel K K K 10K 10K K K K K

1-3. Tape Size 1-3-1. Cardb oard(Paper) tape : 4mm pitch [unit:mm] Size Inch(mm) A B W F E P1 P2 P0 D t 0603 (1608) 1.00 ±0.10 1.90 ±0.10 8.00 ±0.30 3.50 ±0.05 1.75 ±0.10 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 φ1.50 +0.10/-0 1.1 Below 0805 (2012) 1.55 ±0.10 2.30 ±0.10 1206 (3216) 2.05 ±0.10 3.60 ±0.10 ※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances. 1-3-2. Cardboard(Paper) tape : 2mm pitch [unit:mm] Size Inch(mm) A B W F E P1 P2 P0 D t 01005 (0402) 0.25 ±0.02 0.46 ±0.02 8.00 ±0.30 3.50 ±0.05 1.75 ±0.10 2.00 ±0.05 2.00 ±0.05 4.00 ±0.10 φ1.50 +0.10 /-0.03 0.25 ±0.02 0201 (0603) 0.38 ±0.03 0.68 ±0.03 0.35 ±0.03 0402 (1005) 0.62 ±0.05 1.12 ±0.05 0.60 ±0.05 0204 (0510) 0.62 +0.05 /-0.10 1.12 +0.05 /-0.10 0.37 ±0.03 ※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances.

1-3-3. Embossed(Plastic) tape [unit:mm] Size Inch(mm) A B W F E P1 P2 P0 D t1 t0 01005 (0402) 0.23 ±0.02 0.45 ±0.02 4.00 ±0.05 1.80 ±0.02 0.90 ±0.05 1.00 ±0.02 1.00 ±0.02 2.00 ±0.03 φ0.80 ±0.04 0.35 Below 0.50 Below 015008 (05025) 0.32 ±0.03 0.58 ±0.03 8.00 ±0.30 3.50 ±0.05 1.75 ±0.10 2.00 ±0.05 2.00 ±0.05 4.00 ±0.10 φ1.50 +0.10 /-0.03 0603 (1608) 1.05 ±0.15 1.90 ±0.15 4.00 ±0.10 φ1.50 +0.10 /-0 2.50 Below 0.60 Below 0805 (2012) 1.45 ±0.20 2.30 ±0.20 1206 (3216) 1.90 ±0.20 3.50 ±0.20 1210 (3225) 2.80 ±0.20 3.60 ±0.20 1808 (4520) 2.30 ±0.20 4.90 ±0.20 12.0 ±0.30 5.60 ±0.05 8.00 ±0.10 3.80 Below 1812 (4532) 3.60 ±0.20 4.90 ±0.20 2220 (5750) 5.50 ±0.20 6.20 ±0.20 0204 (0510) 0.62 +0.05 /-0.10 1.12 +0.05 /-0.10 8.00 ±0.30 3.50 ±0.05 4.00 ±0.10 2.50 Below 0306 (0816) 1.10 ±0.20 1.90 ±0.20 ※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances.

1-3-4. Reel Symbol 7”Reel 10”Reel 13”Reel 1-4. Cover 1-4-1. Peel- 10 g 1-4-2. Meas -Tap (IE * If t oduct Ma Size Tape Widt 4mm 8mm 12mm 8mm 8mm 12mm r tape pee -off force .f ≤ peel-o f surement M ping Packag C 60286-3 P he static ele nual th A φ178±2. φ178±2. φ178±2. φ258±2. φ330±2. φ330±2. l-off force ff force ≤ 7 0 ethod ing design : Packaging of ectricity of SM B

0 MIN φ50

0 MIN φ70

0 g.f Packaging f componen MT process C φ13±0.5 φ13±0.5 φ13±0.5 φ13±0.5 φ13±0.5 φ13±0.5 design follo ts for autom causes any D 21±0.8 21±0.8 21±0.8 21±0.8 21±0.8 21±0.8 ws IEC 6028 matic handlin problems, p E 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 86-3 standard ng - parts 3) lease contac W 5±0.5 10±1.5 13±0.5 10±1.5 10±1.5 13±0.5 ct us. [unit:mm] t 1.2±0.2 0.9±0.2 1.2±0.2 1.8±0.2 1.8±0.2 2.2±0.2

1-5. BOX 1-5-1. Pack REEL Labe 1-5-2. Box 1) Dou 2) Avo i 3) Rem ※ If sp 1-5-3. 7" Bo - Inner - Outer oduct Ma package kaging Label L & Box Type el includes th Chip size Temperature Nominal Ca Model Nam LOT Numbe Q’ty Packaging ble packagin id any dama mark informat pecial packag ox packaging r Box (7" x 5 r Box (7" x 2 nual e he informatio e Characteris apacitance me er & Reel Nu ng with the ages during tion of cont ging is requi g REEL )

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1-5-4. 13” Box packaging - Inner Box (13" x 4 REEL) - Outer Box (13" x 20 REEL) 1-6. Chip Weight Size(L/W) Inch(mm) Size(T) (mm) Temp. Weight (mg/pc) Size(L/W) Inch(mm) Size(T) (mm) Temp. Weight (mg/pc) 01005 (0402) 0.20 C0G 0.082 0201 (0603) 0.30 C0G 0.233 0.20 X7R 0.083 0.30 X7R 0.285 0.20 X5R 0.093 0.30 X5R 0.317 0402 (1005) 0.50 C0G 1.182 0603 (1608) 0.80 C0G 4.615 0.50 X7R 1.559 0.80 X7R 5.522 0.50 X5R 1.560 0.80 X5R 5.932 0805 (2012) 0.65 C0G 7.192 1206 (3216) 1.25 C0G 28.086 1.25 X7R 16.523 1.60 X7R 54.050 1.25 X5R 16.408 1.60 X5R 45.600 1210 (3225) 2.50 X7R 116.197 1808 (4520) 1.25 C0G 47.382 2.50 X5R 121.253 1.25 X7R 63.136 1812 (4532) 1.25 X7R 96.697 2220 (5750) 1.60 X7R 260.897 The weight of product is typical value per size, for more details, please contact us.

1. Product Characteristic data 2-1. Capacitance The cap acitance is the ratio of the change in an electric charge according to voltage change. Due to the fact that the capacitance may be subject to change with the measured voltage and frequency, it is highly recommended to measure the capacitance based on the following conditions. 2-1-1. Measure capacitance with voltage and frequency specified in this document. Regarding the voltage/frequency condition for capacitance measurement of each MLCC model, please make sure to follow a section “C. Reliability test Condition - Capacitance” in this document. The following table shows the voltage and frequency condition according to the capacitance range. [The voltage and frequency condition according to MLCC the capacitance range] ◆ Class I Capacitance Frequency Voltage ≤ 1,000 pF 1 MHz ± 10% 0.5 ~ 5 Vrms > 1,000 pF 1 kHz ± 10% ◆ Class II Capacitance Frequency Voltage ≤ 10 ㎌ 1 kHz ± 10% 1.0 ± 0.2 V rms > 10 ㎌ 120 Hz ± 20% 0.5 ± 0.1 Vrms Exception* 1 kHz ± 10% 0.5 ± 0.1 V rms Capacitance shall be measured after the heat treatment of 150+0/-10℃ for 1hr, leaving at room temperature for 24±2hr. (Class II) 2-1- 2. It is recommended to use measurement equipment with the ALC (Auto Level Control) option. The reason is that when capacitance or measurement frequency is high, the output voltage of measurement equipment can be lower than the setting voltage due to the equipment limitation. Note that when capacitance or measurement frequency is excessively high, the measurement equipment may show ALC off warning and provide a lower output voltage than the setting voltage even with ALC option selected. It is necessary to ensure the output voltage of measurement equipment is the same as the setting voltage before measuring capacitance.

2-1-3. Capacitance value of high dielectric constant (Class II) MLCC changes with applied AC and DC voltage. Therefore, it is necessary to take into account MLCC’s AC voltage characteristics and DC- bias voltage characteristics when applying MLCC to the ac tual circuit. 2-1-4. The capacitance is in compliance with the EIA RS-198-1-F-2002. 2-2. Tan δ (DF) 2-2-1. An i deal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of electrode. DF (Dissipation Factor) is defined as the ratio of loss energy to stored energy and typically being calculated as percentage. 2-2-2. Quality factor (Q factor) is defined as the ratio of stored energy to loss energy. The equation can be described as 1/DF. Normally the loss characteristic of Class I MLCC is presented in Q, since the DF value is so small whereas the loss characteristic of Class II MLCC is presented in DF . 2-2-3. It is recommended to use Class I MLCC for applications to require good linearity and low loss such as coupling circuit, filter circuit and time constant circuit. 2-3. Insulation Resistance Ceramic diel ectric has a low leakage current with DC voltage due to the high insulating properties. Insulation resistance is defined as the ratio of a leakage current to DC voltage. 2-3-1. When applying DC voltage to MLCC, a charging current and a leakage current flow together at the initial stage of measurement. While the charging current decreases, and insulation resistance (IR) in MLCC is saturated by time. Therefore, insulation resistance shall be measured 1 minute after applying the rated voltage. 2-4. Capacitance Aging The ag ing characteristic is that the high dielectric (Class II) MLCC decreases capacitance value over time. It is also necessary to consider the aging characteristic with voltage and temperature characteristics when Class II MLCC is used in circuitry.

2-4-1. In ge follo w diffe 2-4-2. Aft er shou 2-5. Temp Please capac 2-5-1. It is Char [ Exam oduct Ma eneral, aging wing graph. rent models r heat treatm uld be consid perature Ch e consider te itance chang necessary to racteristics” f ple of Temp * Sample nual g causes cap Please chec ment (150 °C dered again haracteristi emperature ges which is o check the v for the temp erature Cha : 10uF, Rated pacitance to ck with SEMC C, 1hour), the from the tim [ Example * Samp ics of Capa characteristi caused by a values speci perature and racteristics (X d voltage 6.3 decrease lin CO for more e capacitanc me of heat t of Capacitan ple : C0G, X7 acitance (T cs of capaci a change in fied in sectio capacitance X5R) ] 3V * nearly with th e details, sin ce decreased reatment. nce Aging ] 7R, X5R TCC) tance since ceramic die on “C. Reliab e change ran [ E x Sample : 10 he log of tim ce the value d by aging is the electrica electric const bility test Co nge of MLCC xample of Bia uF, Rated vo me as shown e may vary b s recovered, al characteris tant by temp ondition–Tem as TCC ] oltage 6.3V n in the between so aging stics such as perature. mperature s

2-5-2. Whe tem p ML CC 2-5-3. In ad 2-6. Self-h It is n (Equi 2-6-1. Whe or p u insul 2-6-2. The circu Ther e 1) Th A C 2) Th oduct Ma en selecting perature and ddition, Bias heating Te necessary to valent Series en MLCC is u ulse current ating prope reliability of it, even the efore, make he surface te C or Pulse vo he rise in inc nual MLCC, it is n d TCC of MLC TCC of MLC mperature o design the s Resistance) used in an A flows throug rties. MLCC may AC voltage sure to chec emperature o oltage is app crease by sel * S necessary to CC, since the CC should be system, with ) of MLCC w C voltage or gh MLCC. Sh be affected or the pulse ck the follow of MLCC mu plied. lf-heating of [ Examp Sample : X5R consider th e applied tem e taken into h considerin when AC volt r pulse volta hort-circuit m by MLCC be e voltage is w wing conditi ust stay with f MLCC must le of Ripple R 10uF, Rate he heat chara mperature m account wh g self-heatin tage or puls age circuit, se may be occu eing used in within the ra ons. in the maxim t not exceed current ] ed voltage 6. acteristics of may change en DC volta ng generated e voltage is elf-heating i urred by the an AC volta ange of rated mum operati d 20℃ .3V f a system, r the capacita ge is applied d by the ESR applied to M s generated degradation age or pulse d voltage. ing tempera oom ance of d to MLCC. R MLCC. when AC n of MLCC’s e voltage ature after

2-7. DC & It is r dielec 2-7-1. Pleas parti capa char a 2-7-2. It is since AC v oduct Ma & AC Voltag required to c ctric constan se ensure th cular, when citance toler acteristics an necessary to e the capacit voltage. nual ge Charact consider volt nt MLCC(Cla e capacitanc high dielect rance, a syst nd aging cha o consider th tance value [ E * S teristics tage charact ss II) is chan ce change is ric constant tem should b aracteristics [ Example of Sample : X5 he AC voltag of high diele Example of A Sample : X5R teristics in th nged by app s within the type MLCC be designed of MLCC. f DC Bias cha R 10uF, Rate ge character ectric consta AC voltage c R 10uF, Rate he circuit sin plied DC & A allowed ope (Class II) is d with consid aracteristics ] d voltage 6.3 istics of MLC ant type MLC characteristic ed voltage 6. nce the capa AC voltage. erating range used in circu dering DC vo CC and the A CC (Class II) cs ] .3V acitance valu e of a system uit with narr oltage, temp AC voltage o varies with e of high m. In row allowed perature of a system, the applied

2-8. Impe Electr curre (Z=V/ consi There MLCC 2-8-1. MLC incre The from 2-8-2. MLC (Equi frequ come 2-8-3. SRF induc 2-8-4. The Whe imp e oduct Ma dance Cha rical impeda ent (I) when a /I). Impedan isting of the efore, it is re C based on t C operates a eases ( X_C= resistance (E m the loss of C operates a ivalent Serie uency increa es from the (Self Resona ctive reactan impedance o n using the edance of low nual racteristic nce (Z) of M a voltage (V nce extends t real part of equired to de the frequenc as a capacito 1/j2πfC ) wh ESR; Equivale its dielectric as an induct es Inductance ses ( X_L=j2 loss of its e ant Frequenc nce(XL) canc of MLCC can network ana w capacitan MLCC is the m V) is applied. the concept f resistance ( esign circuit cy ( Z = R + or in the low here f is freq ent Series Re c material. tor in the hig e). The react 2πf∙ESL ). The lectrode me cy) of MLCC el each othe n be measur alyzer, pleas ce caused b Example of I * Sample : X5 measuremen It is defined of resistanc (R) and the i with consid jX ) w frequency quency and C esistance) of gh frequency tance (XL) of e resistance etal. is the frequ er and the im red by a net e note that by the AC vo Impedance c 5R 1uF, Rated nt of the opp d as the ratio ce to AC circ imaginary pa deration of th and its reac C is capacita f MLCC in th y and the in f MLCC in th (ESR) of ML uency where mpedance o twork analyz the small-sig oltage charac characteristics d voltage 6.3 position that o of the volt uits and is a art of reacta he impedanc tance (XC) d ance. he low freque ductance of he high frequ LCC in the hi its capacitiv f MLCC has er or an imp gnal input m cteristic of M s ] V t MLCC pres tage to the c a complex n ance (X) as Z ce character decreases as ency mainly f MLCC is ca uency increa igh frequenc ve reactance only ESR at pedance ana may lead to MLCC. sents to a current umber Z=R+jX. ristics of s frequency comes alled ESL ases as cy mainly (XC) and SRF. alyzer. the

1. Electric 3-1. Derat MLCC are la derate test vo 3-1-1. The follow 3-1-2. The MLCC gives defin oduct Ma cal & Mec ting C with the te beled as “de ed as shown oltage at 15 derated MLC wing graph. “Temperatur C including s the maxim ned in sectio nual chanical C st voltage at erated MLCC n in the follo 0% of the ra CC should b re of MLCC” self-heating um operatin on “3-2. App [Exam Caution t 100% of th C.” For this ty owing graph ated voltage be applied w in the x-axi effect. The ng voltage o lied Voltage mple of derat * Vmax * Only the D he rated volt ype of MLCC for the equ e in the high with the dera is of the gra “Voltage De of MLCC with e.” ting graph f ≤ Derated Derating ma tage in the h C, the voltag ivalent life t h temperatur ting voltage ph below in erating Ratio h reference t for derated M Voltage rked models high temper ge and temp ime of a nor re resistance and tempe dicates the o” in the y-ax to the maxim MLCC] s rature resista perature sho rmal MLCC w e test. rature as sh surface tem xis of the gr mum voltage ance test uld be with the own in the perature of raph below e (Vmax) as

3-2. Appli The a 3-2-1. Caut

• For n o
• For sho
• Abn ML DC Vo 3-2-2. Effec
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• Dow diele abou
• Plea pre (1) Surge When induc electr surge (2) ESD Since comp oduct Ma ied Voltage actual applie tions by type r DC voltage ot exceed the r AC voltage ould not exc normal volta LCC. oltage ct of EOS (El ctrical Overs e electrical s wn time of M ectric shock c ut a failure o ase use caut eparing MLC e n the overcu ce the overs rical short fa e current into (Electrostatic e the voltage pared to the nual e ed voltage o es of voltage e or DC+AC e rated volta or pulse vo ceed the rate age such as [Typ AC Volta ectrical Ove stress such a short failure MLCC is vari caused by E of MLCC in a tion not to a CC for testing urrent caused hooting phe ailure in MLC o MLCC. c Discharge) e of the stat surge, ESD on MLCC sho e applied to voltage, DC age of MLCC oltage, the p ed voltage o surge voltag pes of Voltag ge DC rstress) as a surge vo caused by t ed with the OS can acce market at t apply excess g or evaluati d by surge is enomenon o CC. Therefore ic electricity can cause d ould not exc MLCC voltage or t eak-to-peak of MLCC. ge, static ele ge Applied t C+AC Voltag oltage or EO the dielectric applied volt elerate heati the early sta ive electrica ing. s applied to of voltage as e, it is neces is very high damage to M ceed the rate the maximum k value of AC ectricity shou to the Capac ge 1 DC+A OS can cause c breakdown tage and the ng on the d ge. l overstress MLCC, the shown in th ssary to be c h but the qu MLCC with lo ed voltage s m value of D C voltage or uld not excee citor] AC Voltage 2 e damages to n in MLCC. e room temp ielectric. The including sp influx of cur he graph be careful to pre antity of ele ow capacitan set in the spe DC + AC vol pulse voltag ed the rated

2 DC+Pul

o MLCC, res perature and erefore, it ca pike voltage rrent into ML elow and res revent the in ectric charge nce as shown ecifications. tage should ge d voltage of se Voltage ulting in d a an bring MLCC when LCC can ult in the flux of is small n in the n

[ Ex 3-3. Vibra Pleas Man a Whe and 3-4. Shock Mecha Do no When preven 3-5. Piezo MLC C consta MLCC oduct Ma wing graph, capacitance xample of Su ation se check the age MLCC n n MLCC is u consider spe k anical stress ot use a drop n piling up o nt cracks or o-electric P may genera ant MLCC (C may cause nual whereas sur MLCC. urge applied e types of vib not to genera used in a vib ecial MLCC s caused by a pped MLCC or handling p any other d henomeno ate a noise d Class Ⅱ) at A a noise if M rge with lots to MLCC ] bration and ate resonanc ration enviro such as Soft- a drop may to avoid any printed circu damages to t on due to vibra AC or Pulse c MLCC is affec s of electric c sho ck, and ce and avoid onment, plea -term, etc. cause dama y quality and it boards, do the MLCC. tion at spec circuits. cted by any charge quan [ Example the status o d any kind o ase make su ages to a die d reliability d o not hit ML ific frequenc mechanical v ntity can cau of ESD appl * Simulatio f resonance. of impact to ure to contac electric or a deterioration LCC with the cy when usin vibrations or use damages ied to MLCC on for ESD 8 terminals. ct us for the crack in ML e corners of ng the high r shocks. s to even C ] 8kV e situation CC a PCB to dielectric

1. Proces 4-1. Moun 4-1-1. Mou It is r is ap 4-1-2. Caut Pleas PCB. locat 4-1-3. Caut If ML Mou oduct Ma ss of Mou nting nting positio recommend pplied. Not r tions during se take the f Select the m tion and a d tions during LCC is moun nt MLCC as nual nting and on ed to locate ecommende mounting n following me mounting lo irection of M mounting n nted near a s far from the N d Soldering e the major a ed near the cuto easures to e cation show MLCC mount near screw screw hole, t e screw hole Not recomm g axis of MLCC out effectively red wn below, sin ted near the the board d es as possibl mended C in parallel R eco duce the str nce the mech e cutting line eflection ma R ecomm to the direct ommended ess generate hanical stres ay be occurre ended tion in whic ed from the ss is affected red by screw h the stress cutting of d by a w torque.

4-2. Caution before Mounting 4-2-1. It is recomme nded to store and use MLCC in a reel. Do not re-use MLCC that was isolated from the reel. 4-2-2. Check the capacitance characteristics under actual applied voltage. 4-2-3. Check the mechanical stress when actual process and equipment is in use. 4-2-4. Check the rated capacitance, rated voltage and other electrical characteristics before assembly. Heat treatment must be done prior to measurement of capacitance. 4-2-5. Check the solderability of MLCC that has passed shelf life before use. 4-2-6. The use of Sn-Zn based solder may deteriorate the reliability of MLCC. 4-3. C autions during Mounting with Mounting (pick-and-place) Machines 4-3-1. Mou nting Head Pressure Excessive pressure may cause cracks in MLCC. It is recommended to adjust the nozzle pressure within the maximum value of 300g.f. Additional conditions must be set for both thin film and special purpose MLCC. 4-3-2. Bending Stress When using a two-sided substrate, it is required to mount MLCC on one side first before mounting on the other side due to the bending of the substrate caused by the mounting head. Support the substrate as shown in the picture below when MLCC is mounted on the other side. If the substrate is not supported, bending of the substrate may cause cracks in MLCC. 4-3-3. Suction nozzle Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of the nozzle. This may cause cracks in MLCC due to the excessive force during mounting. If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during positioning. A regular inspection such as maintenance, monitor and replacement for the suction nozzle and mounting claw should be conducted.

4-4. Reflo MLC C poten Theref For th 4-4-1. Reflo Use c Pre-h on M to th As fo thre e time s MLC C oduct Ma ow solderin is in a direc ntial mechan fore, MLCC m he reason, th Reflo ow Profile caution not heating is ne MLCC. The te he minimum. or reflow sol e times. Plea s. Care must C as they ca nual ng ct contact w ical stress ca may be cont he mounting M ow soldering to exceed th ecessary for emperature d dering, it is ase check wit t be exercise an be affecte ith the disso aused by the taminated b process mu Method g Overa Loca [Reflow S he peak tem all constitue difference be recommend th us when ed especially ed by therma olved solder e sudden tem by the locatio ust be closel all heating al heating Soldering Co mperature (26 ents includin etween the ded to keep the number y for the ultr al stress mo during sold mperature c on movemen y monitored C In VPS L onditions] 60℃) and tim ng the PCB t PCB and the the number of reflow so ra-small size, ore easily. ering, which hange. nt and flux. lassification nfrared rays Hot plate S(Vapor phas Air heater Laser Light beam me (30sec) a o prevent th e componen r of reflow so oldering nee , thin film an h may be ex n se) as shown. he mechanic nt surface mu oldering to eds to excee nd high cap posed to cal damages ust be kept less than d three acitance

4-4-2. Reflow temperature The following quality problem may occur when MLCC is mounted with a lower temperature than the reflow temperature recommended by a solder manufacturer. The specified peak temperature must be maintained after taking into consideration the factors such as the placement of peripheral constituent and the reflow temperature. ･Drop in solder wettability ･Solder voids ･Potential occurrence of whisker ･Drop in adhesive strength ･Drop in self-alignment properties ･Potential occurrence of tombstones 4-4-3. Cooling Natural cooling with air is recommended. 4-4-4. Optimum solder flux for reflow soldering

• Overly the thick application of solder pastes results in an excessive solder fillet height. This makes MLCC more vulnerable to the mechanical and thermal stress from the board, which may cause cracks in MLCC.
• Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to isolate from PCB
• Check if solder has been applied uniformly after soldering is completed.
• It is required to design a PCB with consideration of a solder land pattern and its size to apply an appropriate amount of solder to MLCC. The amount of the solder at the edge may impact directly on cracks in MLCC.
• The design of a suitable solder land is necessary since the more the solder amount is, the larger the force MLCC experiences and the higher the chance MLCC cracks. Too Much Solder large stress may cause cracks Not enough solder Weak holding force may cause bad connections or detaching of the capacitor

4-5. Flow 4-5-1. Flow Ta In re P ex 4-5-2. Caut

• Wh inter the m surfa
• If t may valu e term oduct Ma soldering w profile ake caution n case of flo ecommende lease contac xceptions th tion before F hen a sudden nal deforma mechanical d ace of MLCC he flow time be deteriora e may be dro ination. nual not to exce w soldering, d to use. ct us before hat may be c Flow solderin n heat is ap ation of MLC damages on must be ke e is too long ated by the opped by w [Flow So ed peak tem , only 1608(0 use the typ caused. ng plied to MLC CC. Preheatin MLCC. The pt to the m g or the flow leaching ph eak adhesio oldering Con mperature (2 0603inch), 2 e of high ca CC, the mec ng all the co temperature inimum. w temperatur enomenon o on between t nditions] 60℃) and ti 012(0805inc apacitance an hanical rigid nstituents in e difference re is too hig of the outer the internal me (5sec) as h), 3216(120 nd thin film ity of MLCC ncluding PCB between the h, the adhes termination termination s shown. 06inch) case MLCC for so is deteriora B is required e solder and sive strength n, or the cap and the out size are ome ated by the to prevent d the h with PCB acitance ter

4-6. Soldering Iron Manual solde ring can pose a great risk on creating thermal cracks in MLCC. The high temperature soldering iron tip may come into a direct contact with the ceramic body of MLCC due to the carelessness of an operator. Therefore, the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. 4-6-1. How to use a soldering Iron

• In order to minimize damages on MLCC, preheating MLCC and PCB is necessary. A hot plate and a hot air type preheater should be used for preheating . Do not cool down MLCC and PCB rapidly after soldering.
• Keep the contact time between the outer termination of MLCC and the soldering iron as short as possible. Long soldering time may cause problems such as adhesion deterioration by the leaching phenomenon of the outer termination. Variation of Temp. Soldering Temp.(℃) Pre-heating Time(sec) Soldering Time(sec) Cooling Time(sec) ΔT ≤ 130 300±10℃ max ≥60 ≤4 - * Control Δ T in the solder iron and preheating temperature. Condition of Iron facilities Wattage Tip diameter Soldering time 20W max 3 ㎜ max 4sec max * Caution - Iron tip should not contact with ceramic body directly Lead-free solder: Sn-3.0Ag-0.5CU 4-6-2. How to use a spot heater Compared to local heating using a solder iron, heat by a spot heater heats the overall MLCC and the PCB, which is likely to lessen the thermal shocks. For a high density PCB, a spot heater can prevent the problem to connect between a solder iron and MLCC directly.
• If the distance from the air nozzle outlet to MLCC is too close, MLCC may be cracked due to the thermal stress. Follow the conditions set in the table below to prevent this problem.
• The spot heater application angle as shown in the figure is recommended to create a suitable solder fillet shape.

4-6-3. Cau tions for re-work

• Too much solder amount will increase the risk of PCB bending or cause other damages.
• Too little solder amount will result in MLCC breaking loose from the PCB due to the inadequate adhesive strength.
• Check if the solder has been applied properly and ensure the solder fillet has a proper shape. Soldering wire below ø0.5mm is required for soldering. 4-7. Cleaning 4-7-1. In general, cle aning is unnecessary if rosin flux is used. When acidic flux is used strongly, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the performance of MLCC. This means that the cleansing solution must be carefully selected and should always be new. 4-7-2. Cautions for cleaning MLCC or solder joint may be cracked with the vibration of PCB, if ultrasonic vibration is too strong during cleaning. When high pressure cleaning equipment is used, test should be done for the cleaning equipment and its process before the cleaning in order to avoid damages on MLCC. Distance 5㎜ ≤ Hot Air Application angle 45℃ Hot Air Temperature Nozzle Outlet 400℃ ≥ Application Time 10s＞

4-8. Cautions for using electrical measuring probes

• C onfirm the position of the support pin or jig when checking the electrical performance of MLCC after mounting on the PCB.
• Watch for PCB bending caused by the pressure of a test-probe or other equipment.
• If the PCB is bent by the force from the test probe, MLCC may be cracked or the solder joint may be damaged.
• Avoid PCB flexing by using the support pin on the back side of the PCB.
• Place equipment with the support pin as close to the test-probe as possible.
• Prevent shock vibrations of the board when the test-probe contacts a PCB. Not recommended R ecommended 4-9. Print ed Circuit Board Cropping
• Do not apply any stress to MLCC such as bending or twisting the board after mounting MLCC on the PCB.
• The stress as shown may cause cracks in MLCC when cutting the board.
• Cracked MLCC may cause degradation to the insulation resistance, thereby causing short circuit.
• Avoid these types of stresses applied to MLCC. [Bending] [T wisting] 4-9-1. Cautions for cutting PCB Check a cutting method of PCB in advance. The high density board is separated into many individual boards after the completion of soldering. If the board is bent or deformed during separation, MLCC may be cracked. Carefully select a separation method that minimizes the deformation of the PCB.

4-10. Assembly Handling 4-10-1. Cauti ons for PCB handling Hold the edges of the board mounted with MLCC with both hands since holding with one hand may bend the board. Do not use dropped boards, which may degrade the quality of MLCC. 4-10-2. Mounting other components Pay attention to the following conditions when mounting other components on the back side of The board after MLCC has been mounted on the front side. When the suction nozzle is placed too close to the board, board deflection stress may be applied to MLCC on the back side, resulting in cracks in MLCC. Check if proper value is set on each chip mounter for a suction location, a mounting gap and a suction gap by the thickness of components. 4-10-3. Board mounting components with leads If the board is bent when inserting components (transformer, IC, etc.) into it, MLCC or solder joint may be cracked. Pay attention to the following:

• Reduce the stress on the board during insertion by increasing the size of the lead insertion hole.
• Insert components with leads into the board after fixing the board with support pins or a dedicated jig.
• Support the bottom side of the board to avoid bending the board.
• Check the status of the height of each support pin regularly when the support pins are used. Not recommended R ecommended

4-10-4. Socket and / or connector attach / detach Since the insertion or removal from sockets and connectors may cause the board to bent, make sure that MLCC mounted on the board should not be damaged in this process. 4-10-5. Fastening screw When attaching a shield on a board, the board may be bent during a screw tightening work Pay attention to the following conditions before performing the work.

• Plan the work to prevent the board from bending
• Use a torque driver to prevent over-tightening of the screw.
• Since the board may be bent by soldering, use caution in tightening the screw. 4-11. Adhesive selection Pa y attention to the following if an adhesive is used to position MLCC on the board before soldering. 4-11-1. Requirements for Adhesives
• They must have enough adhesive strength to prevent MLCC from slipping or moving during the handling the board.
• They must maintain their adhesive strength when exposed to soldering temperatures.
• They should not spread when applied to the PCB.
• They should have a long pot life.
• They should hardened quickly.
• They should not corrode the board or MLCC materials.
• They should be an insulator type that does not affect the characteristic of MLCC.
• They should be non-toxic, not harmful, and particularly safe when workers touch the adhesives. 4-11-2. Caution before Applying Adhesive Check the correct application conditions before attaching MLCC to the board with an adhesive. If the dimension of land, the type of adhesives, the amount of coating, the contact surface areas, the curing temperature, or other conditions are not appropriate, it may degrade the MLCC performance.

4-11-3. Cauti ons for selecting Adhesive Depending on the type of the chosen adhesive, MLCC insulation resistance may be degraded. In addition, MLCC may be cracked by the difference in contractile stress caused by the different contraction rate between MLCC and the adhesive. 4-11-4. Cautions for the amount of applied adhesive and curing temperature

• The inappropriate amount of the adhesive cause the weak adhesive strength, resulting in the a mounting defect in MLCC
• Excessive use of the adhesive may cause a soldering defect, loss of electrical connection, incorrect curing, or slippage of a mounting position, thereby an inflow of the adhesive onto a land section should be avoided.
• If the curing temperature is too high or the curing time is too long, the adhesive strength will be degraded. In addition, oxidation both on the outer termination (Sn) of MLCC and the surface of the board may deteriorate the solderability. 4-12. Flux 4-12-1. The e xcessive amount of flux generates excessive flux gases which may deteriorate solderability. Therefore, apply the flux thin and evenly as a whole. 4-12-2. Flux with a high ratio of halogen may oxidize the outer termination of MLCC, if cleaning is not done properly. Therefore, use flux with a halogen content of 0.1% max. 4-12-3. Strong acidic flux can degrade the MLCC performance 4-12-4. Check the solder quality of MLCC and the amount of remaining flux surrounding MLCC after the mounting process. 4-13. Coa ting 4-13-1. Cra ck caused by Coating A crack may be caused in the MLCC due to amount of the resin and stress of thermal contraction of the resin during coating process. During the coating process, the amount of resin and the stress of thermal contraction of the resin may cause cracks in MLCC The difference of thermal expansion coefficient between the coating, or a molding resin may cause destruction, deterioration of insulation resistance or dielectric breakdown of MLCC such as cracks or detachment, etc.

4-13-2. Recommended Coating material

• A thermal expansion coefficient should be as close to that of MLCC as possible.
• A silicone resin can be used as an under-coating to buffer the stress.
• The resin should have a minimum curing contraction rate.
• The resin should have a minimum sensitivity (ex. Epoxy resin).
• The insulation resistance of MLCC can be deteriorated if a high hygroscopic property resin is used in a high humidity condition.
• Do not use strong acid substances due to the fact that coating materials inducing a family of halogen substances and organic acid may corrode MLCC.

1. Design 5-1. Circui t design When the bo ard is dropped or bent, MLCC mounted on the board may be short-circuited by the drop in insulation resistance. Therefore, it is required to install safety equipment such as a fuse to prevent additional accidents when MLCC is short-circuited, otherwise, electric short and fire may occur. This product is not a safety guaranteed product.. 5-2. PCB Design 5-2-1. Unlike lead type components, SMD type components that are designed to be mounted directly on the board are fragile to the stress. In addition, they are more sensitive to mechanical and thermal stress than lead type components. 5-2-2. MLCC crack by PCB material type A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal expansion and contraction, resulting in cracks in MLCC. Even though MLCC is mounted on a board with a fluorine resin or on a single-layered glass epoxy, cracks in MLCC may occur. 5-3. Design system evaluation 5-3-1. Evaluat e the actual design with MLCC to make sure there is no functional issue or violation of specifications of the finished goods. 5-3-2. Please note that the capacitance may differ based on the operating condition of the actual system since Class 2 MLCC capacitance varies with applied voltage and temperature. 5-3-3. Surge resistance must be evaluated since the excessive surge caused by the inductance of the actual system may apply to MLCC. 5-3-4. Note the actual MLCC size and the termination shape.

R F oduct Ma dimension commended Reflow Foo Chip Size [mm] 0402 0603 1005 1608 2012 3216 3225 4532 5750 Flow Footp Chip Size [mm] 1608 2012 3216 nual d land dimen otprint Chip Tol. [mm] ± 0.02 ± 0.03 ± 0.05 ± 0.07 ± 0.09 ± 0.05 ± 0.07 ± 0.10 ± 0.15 ± 0.20 ± 0.30 ± 0.40 ± 0.10 ± 0.15 ± 0.20 ± 0.25 ± 0.30 ±0.10 ±0.15 ±0.20 ±0.25 ±0.30 ±0.20 ±0.30 print Chip Tol. [mm] nsion is dete a [mm] 0.14~0.20 0.16~0.20 0.18~0.26 0.20~0.28 0.22~0.30 0.35~0.40 0.37~0.42 0.40~0.45 0.40~0.45 0.45~0.50 0.45~0.50 0.50~0.55 0.50~0.55 0.55~0.60 0.60~0.65 0.65~0.70 0.70~0.75 0.70~0.75 0.75~0.80 0.80~0.85 0.85~0.90 0.90~0.95 1.70~1.90 1.80~2.00 2.00~2.40 2.80~3.20 4.00~4.60 a [mm] 0.60~1.00 1.00~1.20 2.00~2.40 ermined by e b [mm] 0.14~0.22 0.24~0.32 0.24~0.32 0.25~0.35 0.25~0.35 0.37~0.47 0.37~0.47 0.37~0.47 0.40~0.50 0.40~0.50 0.42~0.52 0.45~0.55 0.60~0.65 0.62~0.67 0.65~0.70 0.70~0.75 0.75~0.80 0.75~0.80 0.80~0.85 0.85~0.90 0.95~1.00 1.05~1.10 0.85~1.00 0.95~1.10 1.00~1.40 1.40~1.80 1.70~2.30 b [mm] 0.60~0.80 0.80~1.20 1.00~1.20 evaluating th c [mm] 0.20~0.26 0.30~0.35 0.32~0.37 0.35~0.39 0.35~0.39 0.50~0.55 0.52~0.58 0.55~0.60 0.60~0.65 0.65~0.70 0.70~0.75 0.75~0.80 0.80~0.85 0.85~0.90 0.90~0.95 0.95~1.00 1.00~1.05 1.25~1.30 1.30~1.35 1.35~1.40 1.40~1.45 1.45~1.50 1.60~1.80 1.70~1.90 1.80~2.20 2.40~3.00 4.10~4.90 c [mm] 0.60~0.80 0.80~1.20 1.00~1.40 he actual SET (a+2b) min 0.42 0.64 0.66 0.7 0.72 1.09 1.11 1.14 1.2 1.25 1.29 1.4 1.7 1.79 1.9 2.05 2.2 2.2 2.35 2.5 2.75 3.4 3.7 5.6 7.4 (a+2b) min 1.8 2.6 4.0 T and a boa (a+2b) max 0.64 0.84 0.9 0.98 1.34 1.36 1.39 1.45 1.5 1.54 1.65 1.85 1.94 2.05 2.2 2.35 2.35 2.5 2.65 2.9 3.15 3.9 4.2 5.2 6.8 9.2 (a+2b) max 2.6 3.6 4.8 rd.

1. Others 6-1. Sto rage environment 6-1-1. Recom mendation for temperature/humidity Even taping and packaging materials are designed to endure a long-term storage, they should be stored with a temperature of 0~40°C and an RH of 0~70% otherwise, too high temperatures or humidity may deteriorate the quality of the product rapidly. As oxidization is accelerated when relative humidity is above 70%RH, the lower the humidity is, the better the solderability is. As the temperature difference may cause dew condensation during the storage of the product, it is a must to maintain a temperature control environment 6-1-2. Shelf Life An allowable storage period should be within 6 months from the outgoing date of delivery in consideration of solderability. As for products in storage over 6 months, please check solderability before use. 6-2. Cau tion for corrosive environment As corrosive gases may deteriorate the solderability of MLCC outer termination, it is a must to store MLCC in an environmen t without gases. MLCC that is exposed to corrosive gases may cause its quality issues due to the corrosion of plating layers and the penetration of moisture. 6-3. Equipment in operation 6-3-1. Do not touch MLCC directly with bare hands to prevent an electric shock or damage. 6-3-2. The termination of MLCC shall not be contacted with a conductive object (short –circuit). Do not expose MLCC to conductive liquid containing acidic or alkaline material. 6-3-3. Do not use the equipment in the following conditions. (1) Exposure to water or oil (2) Exposu re to direct sunlight

(3) Exposure to Ozone or ultra-violet radiation. (4) Exposu re to corrosive gas (e.g. hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas) (5) Exposure to vibration or mechanical shock exceeding specified limit (6) Exposure to high humidity 6-3-4. If the equipment starts generating any smoke, fire or smell, immediately switch it off or unplug from the power source. If the equipment is not switched off or unplugged, serious damage may occur due to the continuous power supply. Please be careful with the high temperature in this condition. 6-4. Waste treatment In case o f scrapping MLCC, it is incinerated or buried by a licensed industrial waste company. When scrapping MLCC, it is recommended to incinerate or bury the scrappage by a licensed industrial waste company. 6-5. Operat ing temperature The operating temperature limit is determined by the specification of each models. 6-5-1. Do not use MLCC over the maximum operating temperature. Pay attention to equipment’s temperature distribution and the seasonal fluctuation of ambient temperature. 6-5-2. The surface temperature of MLCC cannot exceed the maximum operating temperature including self -heating effects. 6-6. Transportation The performance of ML C C may be affected by transportation conditions. 6-6-1. MLCC shall be protected from excessive temperature, humidity and a mechanical force during transportation.

During transportation, the cartons shall not be deformed and the inner packaging shall be protected from excessive external forces. 6-6-2. Do not apply excessive vibrations, shocks or excessive forces to MLCC.

• If excessive mechanical shock or stress are applied, MLCC’s ceramic body may crack.
• When the surface of MLCC is hit with the sharp edge of an air driver, a soldering iron, or a tweezer, etc, MLCC may crack or become short-circuited. 6-6-3. MLCC may crack and become non-functional due to the excessive shocks or dropping during transportation . 6-7. Notice Some special pr oducts are excluded from this document. Please be advised that this is a standard product specification for a reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers.

The products listed as follows are NOT designed and manufactured for any use and applications set forth below. Please note that any misuse of the products deviating from products specifications or information provided in this Spec sheet may cause serious property damages or personal injury. ① Aerospace/Aviation equipment ② Automotive of Transportation equipment (vehicles，trains，ships，etc) ③ Military equipment ④ Atomic energy-related equipment ⑤ Undersea equipment ⑥ Any other applications with the same as or similar complexity or reliability to the applications Limitation Please contact us with usage environment information such as voltage, current, temperature, or other special conditions before using our products for the applications listed below. The below application conditions require especially high reliability products to prevent defects that may directly cause damages or loss to third party's life, body or property. If you have any questions regarding this 'Limitation'，you should first contact our sales personnel or application engineers. ① Medical equipment ② Disaster prevention/crime prevention equipment ③ Power plant control equipment ④ Traffic signal equipment ⑤ Data-processing equipment ⑥ Electric heating apparatus，burning equipment ⑦ Safety equipment ⑧ Any other applications with the same as or similar complexity or reliability to the applications