CL03A104KO3 SAMSUNG | Alldatasheet
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- • •• Supplier : Samsung electro-mechanics•• •• Samsung P/N :CL03A104KO3NNNC
- • •• Product : Multi-layer Ceramic Capacitor•• •• Description :CAP, 100㎋㎋ ㎋㎋, 16V, ±10%, X5R, 0201 CL 03 A 104 K O 3 N N N C ①① ①① ②② ②② ③③ ③③ ④④ ④④ ⑤⑤ ⑤⑤ ⑥⑥ ⑥⑥ ⑦⑦ ⑦⑦ ⑧⑧ ⑧⑧ ⑨⑨ ⑨⑨ ⑩⑩ ⑩⑩ ⑪⑪ ⑪⑪ ①① ①① Series Samsung±Multiflayer±Ceramic±Capacitor ②② ②② Size 0201 (inch±code) L: 0.6 ±±0.03 mm W: ±±0.03 mm ③③ ③③ Dielectric X5R ⑧⑧ ⑧⑧ Inner electrode ④④ ④④ Capacitance 100 ㎋ Termination ⑤⑤ ⑤⑤ Capacitance ±10 % Plating (Pb±Free) tolerance ⑨⑨ ⑨⑨ Product Normal ⑥⑥ ⑥⑥ Rated Voltage 16 V ⑩⑩ ⑩⑩ Special Reserved±for±future±use ⑦⑦ ⑦⑦ Thickness 0.3 ±±0.03 mm ⑪⑪ ⑪⑪ Packaging Cardboard±Type,±7"±reel B. Samsung Reliablility Test and Judgement condition Capacitance Within±specified±tolerance 1㎑±10% 1.0±0.2Vrms Tan δδ δδ (DF) 0.1 max. Insulation 10,000Mohm±or±100Mohm⋅㎌ Rated±Voltage 60~120±sec. Resistance ±Whichever±is±Smaller Appearance No±abnormal±exterior±appearance Microscope±(×10) Withstanding No±dielectric±breakdown±or of±the±rated±voltage Voltage mechanical±breakdown Temperature X5R Characterisitcs(From±f55℃±to±85℃,±Capacitance±change±shoud±be±within±±15%) Adhesive StrengthNo±peeling±shall±be±occur±on±the 200g⋅F,±for±10±1±sec. of Termination terminal±electrode Bending StrengthCapacitance±change±: within ±12.5% Bending±to±the±limit±(1mm) ±with±1.0mm/sec. Solderability More±than±75%±of±terminal±surface SnAg3.0Cu0.5±solder is±to±be±soldered±newly 245±5℃,±3±0.3sec. (preheating±:±80~120℃±for±10~30sec.) Resistance to Capacitance±change±:± within ±7.5% Solder±pot±:±270±5℃,±10±1sec. Soldering heat Tan±δ,±IR±:±initial±spec. Sn±100% Cu Ni 0.3 A. Samsung Part Number Performance Test condition 250%
Vibration Test Capacitance±change±:± within ±5% Amplitude±:±1.5mm Moisture Capacitance±change±: within ±12.5% With±rated±voltage Resistance Tan±δ±:± 0.2 max 40±2℃,±90~95%RH,±500+12/f0hrs High TemperatureCapacitance±change±: within ±12.5% With± of±the±rated±voltage Resistance Tan±δ±:± 0.2 max Max.±operating±temperature 1000+48/f0hrs Temperature Capacitance±change±: within ±7.5% 1±cycle±condition Cycling Tan±δ,±IR±:±initial±spec. Min.±operating±temperature→ 25℃ → Max.±operating±temperature→ 25℃ 5±cycle±test C. Recommended Soldering method : Reflow±(±Reflow±Peak±Temperature±:±260+0/f5℃,±10sec.±Max±) *±For±the±more±detail±Specification,±Please±refer±to±the±Samsung±MLCC±catalogue. 100% Performance Test condition