CHC TTELEC | Alldatasheet

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Superior TaNFilm® resistors on ceramic substrate High density networks on a reduced footprint Excellent high frequency performance Standard tolerances to ±1% RoHS compliant terminations available General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc• 4222 South Staples Street • Corpus Christi Texas 78411 USA© IRC Advanced Film Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com CHC Series Issue April 2011 Sheet 1 of 4 Package Resistance Range (Ω) Absolute Tolerances Absolute TCR Package Power Rating 70°C* Element Power Rating 70°C* Operating Temperature CB0565A ±100ppm/°C 0.6W 0.1W -40°C to +85°C 10R to 10.0K ±5% CB0565B 10R to 4.7K ±5% CD0865A ±100ppm/°C 1.2W 10R to 10.0K ±5% CD0865B 10R to 4.7K ±5% CD1065A ±100ppm/°C 1.6W 10R to 10.0K ±5% CD1065B 10R to 4.7K ±5% CC0910A ±100ppm/°C 1.2W 10R to 10.0K ±5% CC0910B 10R to 4.7K ±5% CD0910A ±100ppm/°C 1.2W 10R to 10.0K ±5% CD0910B 10R to 4.7K ±5% Electrical Data *Rated power is from 0°C to 70°C derated linearly to 0W at 85°C. Ceramic Ball Grid Termination Arrays CHC Series

  • Superior TaNFilm® resistors on ceramic substrate
  • High density networks on a reduced footprint
  • Excellent high frequency performance
  • Standard tolerances to ±1%
  • RoHS compliant terminations available IRC’s Chipscale on ceramic CHC offers high performance terminal solutions in a small surface mount package. Sn/Pb solder balls placed on a ceramic substrate permit very low parasitic inductance and capacitance. This improves speeds, lowers propagation delays, and reduces ground bounce. IRC’s proven tantalum nitride thin film technology can handle the most demanding applications. For all of your high density, small footprint termination needs, use IRC’s CHC Termination arrays. High purity alumina substrate Ball grid terminations General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc• 4222 South Staples Street • Corpus Christi Texas 78411 USA© IRC Advanced Film Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com CHC Series Issue April 2011 Sheet 1 of 4 Package Resistance Range (Ω) Absolute Tolerances Absolute TCR Package Power Rating 70°C* Element Power Rating 70°C* Operating Temperature CB0565A ±100ppm/°C 0.6W 0.1W -40°C to +85°C 10R to 10.0K ±5% CB0565B 10R to 4.7K ±5% CD0865A ±100ppm/°C 1.2W 10R to 10.0K ±5% CD0865B 10R to 4.7K ±5% CD1065A ±100ppm/°C 1.6W 10R to 10.0K ±5% CD1065B 10R to 4.7K ±5% CC0910A ±100ppm/°C 1.2W 10R to 10.0K ±5% CC0910B 10R to 4.7K ±5% CD0910A ±100ppm/°C 1.2W 10R to 10.0K ±5% CD0910B 10R to 4.7K ±5% Electrical Data *Rated power is from 0°C to 70°C derated linearly to 0W at 85°C. Ceramic Ball Grid Termination Arrays CHC Series
  • Superior TaNFilm® resistors on ceramic substrate
  • High density networks on a reduced footprint
  • Excellent high frequency performance
  • Standard tolerances to ±1%
  • RoHS compliant terminations available IRC’s Chipscale on ceramic CHC offers high performance terminal solutions in a small surface mount package. Sn/Pb solder balls placed on a ceramic substrate permit very low parasitic inductance and capacitance. This improves speeds, lowers propagation delays, and reduces ground bounce. IRC’s proven tantalum nitride thin film technology can handle the most demanding applications. For all of your high density, small footprint termination needs, use IRC’s CHC Termination arrays. High purity alumina substrate Ball grid terminations High purity alumina substrate Ball grid terminations Make Possible Resistors 07.14 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronicsresistors.com All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2)

CHC Series Issue April 2011 Sheet 2 of 4

  • 4222 South Staples Street • Corpus Christi Texas 78411 USA© IRC Advanced Film Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Ceramic Ball Grid Termination Arrays 0 5 10 15 20 25 30 35 40 Frequency (GHz) Average return loss for 1mm pitc hed bussed schematic respect to reference pin. Where reference pins are B1 to B9 referring to CC0910B schematic. )Bd-( edutinga M Frequency (GHz) 0246 8 1 0 1 2 14 16 18 20 Average return loss for 0.65mm pitched bussed schematic for elements away from reference pins. For example: CB0565B, reference pins are A3 or B3 )Bd-( edutinga M Typical Return Loss For CD1065B-01-50R0-F Return Loss Data (50Ω Nominal) Typical Return Loss For CC0910B-01-50R0-F Eye Diagram Data Ideal Terminator IRC CHC-CC0910B-01-50R0-F Terminator 140 130 120 110 100 150 Time, nsec zs1 Ideal 50 Terminator Impedance response to 100psec rising edge Impedance Response Data 140 130 120 110 100 150 Time, nsec zs1 IRC CHC-CC0910B-01-50R0-F Terminator Impedance response to 100psec rising edge Make Possible 07.14 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronicsresistors.com

CHC Series Issue April 2011 Sheet 3 of 4

  • 4222 South Staples Street • Corpus Christi Texas 78411 USA© IRC Advanced Film Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Physical Data and Schematic Diagrams for 1.0mm Pitch Series 0.64mm ±0.05 diameter solder bumps 1.00mm ±0.25mm 4.0mm ±0.15mm 0.63m m ±0.1mm0.50mm ±0.25mm 1.00mm ±0.25mm 9.00mm ±0.15mm 1 2 3 987654 1.27m m ±0.16mm 1 2 3 4 5 6 7 8 9 D C B A 1 2 3 4 5 6 7 8 9 D C B A CD0910A isolated schematic (view from top) CD0910B bussed schematic (view from top) 1.00m m ±0.25mm 3.0m m ±0.15mm 0.50mm ±0.25mm 1.00m m ±0.25mm 9.00m m ±0.15mm 1 2 3 987654 0.63m m ±0.1mm1.27m m ±0.16m m 0.64mm ±0.05 diameter solder bump s 1 2 3 4 5 6 7 8 9 C B A 1 2 3 4 5 6 7 8 9 C B A CC0910A isolated schematic (view from top) CC0910B bussed schematic (view from top) Ceramic Ball Grid Termination Arrays Environmental Test Specification Typical Maximum Thermal shock MIL-PRF-83401 ±0.01% ±0.02% Low temperature operation MIL-PRF-83401 ±0.01% ±0.05% Short time overload MIL-PRF-83401 ±0.01% ±0.05% High temperature exposure MIL-PRF-83401 ±0.03% ±0.05% Effects of solder MIL-PRF-83401 ±0.01% ±0.05% Moisture resistance MIL-STD-202, Method 206 65°C, 45% RH, with bias ±0.02% ±0.01% Life MIL-PRF-83401 ±0.01% ±0.02% Environmental Data Note: Contact A1 indicator marked with dot on top of part. Coplanarity between solder bumps 0.06mm. Ceramic Ball Grid Termination Arrays CHC Series Make Possible 07.14 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronicsresistors.com

CHC Series Issue April 2011 Sheet 4 of 4

  • 4222 South Staples Street • Corpus Christi Texas 78411 USA© IRC Advanced Film Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Ceramic Ball Grid Termination Arrays Prefix CHC - CD0865 A - 01 - 51R1 - J Model CB0565 = 2 × 5, 0.65mm pitch array CD0865 = 4 × 8, 0.65mm pitch array CD1065 = 4 × 10, 0.65mm pitch array CC0910 = 3 × 9, 1.0mm pitch array CD0910 = 4 × 9, 1.0mm pitch array Schematic A = Isolated schematic with 60/40 Sn/Pb (0.65mm pitch) or 90/10 Pb/Sn (1.0mm pitch) terminations ALF = Isolated schematic with RoHS compliant terminations B = Bussed schematic with 60/40 Sn/Pb (0.65mm pitch) or 90/10 Pb/Sn (1.0mm pitch) terminations BLF = Bussed schematic with RoHS compliant terminations Absolute TCR Code 01 = ±100ppm/°C Four Digit Resistance Code Standard resistance values 10R0 = 10Ω; 15R0 = 15Ω; 22R0 = 22Ω; 33R0 = 33Ω; 47R0 = 47Ω; 50R0 = 50Ω; 51R1 = 51.1Ω; 75R0 = 75Ω; 1000 = 100Ω; 1001 = 1.00KΩ; 1002 = 10.0KΩ; 2201 = 2.20KΩ; 4701 = 4.70KΩ Absolute Tolerance Code Ordering Data Frequency (GHz) 0246 8 1 0 1 2 14 16 18 20 Average return loss for 0.65mm pitched bussed schematic for elements away from reference pins. For example: CB0565B, reference pins are A3 or B3 )Bd-( edutinga M Physical Data and Schematic Diagrams for 0.65mm Pitch Series 0.65 mm 2.5mm ±0.1m m 0.38 mm 0.64m m D C B A D C B A ±0.1m m ±0.1m m 0.35mm diameter solder bump s 0.275mm ±0.1m m 0.65mm 6.4m m ±0.1m m 1 2 3 987654 10 CD1065A isolated schematic (view from top) CD1065B bussed schematic (view from top) 1 2 3 4 5 6 7 8 9 10 D C B A 1 2 3 4 5 6 7 8 9 10 D C B A 1 2 3 4 5 6 7 8 D C B A 1 2 3 4 5 6 7 8 D C B A 0.65mm 2.5mm ±0.1m m 0.381mm ±0.1m m D C B A 0.643mm ±0.1m m 0.35mm diameter solder bump s 0.275mm ±0.1m m 0.65mm 5.1m m ±0.1m m 1 2 3 87654 CD0865A isolated schematic (view from top) CD0865B bussed schematic (view from top) 0.65mm 1.2mm ±0.1mm 0.38mm ±0.1mm B A 0.64m m ±0.1mm 0.35mm diameter solder bump s 0.275mm ±0.1mm 0.65mm 3.2mm ±0.1mm 1 2 3 541 2 3 4 5 B A B A CB0565A isolated schematic (view from top) CB0565B bussed schematic (view from top) Note: Contact A1 indicator marked with dot on top of part. Coplanarity between solder bumps 0.06mm. Ceramic Ball Grid Termination Arrays CHC Series Make Possible 07.14 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronicsresistors.com