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Copyright © 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device des- ignations, and all other words and logos that are identified as tr ademarks and/or service marks ar e, unless noted otherwise, th e trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Al- tera products are protected under numerous U.S. and foreign patents and pending app lications, maskwork rights, and copyrights. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the ap- plication or use of any info rmation, product, or service desc ribed herein except as expressly agreed to in writing by Altera Corporation. Altera customers are advised to obtain the latest version of device specifications before relying on any published in- formation and before placing orders for products or services. ii Altera Corporation Preliminary

Cyclone Device Handbook, Volume 1 Chapter 3. Configuration and Testing Chapter 4. DC and Switching Characteristics

Cyclone Device Handbook, Volume 1 Section III. Memory Chapter 7. On-Chip Memory Implementations Using Cyclone Memory Blocks Section IV. I/O Standards Chapter 8. Using Selectable I/O Standards in Cyclone Devices 2.5-V LVCMOS Normal and Wide Voltage Ranges (EIA/JEDEC Standard EIA/JESD8-5) . 8–4

Cyclone Device Handbook, Volume 1 Section V. Design Considerations Chapter 10. Implementing Double Data Rate I/O Signaling in Cyclone Devices Chapter 11. Using Cyclone Devices in Multiple-Voltage Systems Chapter 12. Designing with 1.5-V Devices

Cyclone Device Handbook, Volume 1

The chapters in this book, Cyclone Device Handbook, Volume 1, were revised on the following dates. Where chapters or groups of chapters are available separately, part numbers are listed. Chapter 1. Introduction Revised: May 2008 Part number: C51001-1.5 Chapter 2. Cyclone Architecture Revised: May 2008 Part number: C51002-1.6 Chapter 3. Configuration and Testing Revised: May 2008 Part number: C51003-1.4 Chapter 4. DC and Switching Characteristics Revised: May 2008 Part number: C51004-1.7 Chapter 5. Reference and Ordering Information Revised: May 2008 Part number: C51005-1.4 Chapter 6. Using PLLs in Cyclone Devices Revised: May 2008 Part number: C51006-1.5 Chapter 7. On-Chip Memory Implementa tions Using Cyclone Memory Blocks Revised: May 2008 Part number: C51007-1.4 Chapter 8. Using Selectable I/O Standards in Cyclone Devices Revised: May 2008 Part number: C51008-1.6 Chapter 9. High-Speed Differentia l Signaling in Cyclone Devices Revised: May 2008 Part number: C51009-1.6

Cyclone Device Handbook, Volume 1 Chapter 10. Implementing Double Data Ra te I/O Signaling in Cyclone Devices Revised: May 2008 Part number: C51010-1.2 Chapter 11. Using Cyclone Devices in Multiple-Voltage Systems Revised: May 2008 Part number: C51011-1.2 Chapter 12. Designing with 1.5-V Devices Revised: May 2008 Part number: C51012-1.4 Chapter 13. Configuring Cyclone FPGAs Revised: May 2008 Part number: C51013-1.8 Chapter 14. Serial Configuration Devices (EPCS1 , EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Revised: May 2008 Part number: C51014-3.1 Chapter 15. Package Information for Cyclone Devices Revised: May 2008 Part number: C52006-1.3

This handbook provides comprehensive information about the Altera® Cyclone® family of devices. How to Find Information You can find more information in the following ways: ■ The Adobe Acrobat Find feature, which searches the text of a PDF document. Click the binoculars toolbar icon to open the Find dialog box. ■ Acrobat bookmarks, which serve as an additional table of contents in PDF documents. ■ Thumbnail icons, which provide miniature previews of each page, provide a link to the pages. ■ Numerous links, shown in green text, which allow you to jump to related information. How to Contact Altera For the most up-to-date information about Altera products, refer to the following table. Contact (1) Contact Method Address Technical support Website www.altera.com/support Technical training Website www.altera.com/training Email custrain@altera.com Product literature Website www.altera.com/literature Altera literature services Email literature@altera.com Non-technical support (General) (Software Licensing) Email nacomp@altera.com Email authorization@altera.com Note to table: (1) You can also contact your local Altera sales office or sales representative.

Cyclone Device Handbook, Volume 1 Typographic Conventions This document uses the typographic conventions shown below. Visual Cue Meaning Bold Type with Initial Capital Letters Command names, dialog box titles, checkbox options, and dialog box options are shown in bold, initial capital letters. Example: Save As dialog box. bold type External timing parameters, directory names, project names, disk drive names, filenames, filename extensions, and software utility names are shown in bold type. Examples: fMAX, \\qdesigns directory, d: drive, chiptrip.gdf file. Italic Type with Initial Capital Letters Document titles are shown in italic type with initial capital letters. Example: AN 75: High-Speed Board Design. Italic type Internal timing parameters and variables are shown in italic type. Examples: tPIA, n + 1. Variable names are enclosed in angle brackets (< >) and shown in italic type. Example: <file name>, <project name>.pof file. Initial Capital Letters Keyboard keys and menu names ar e shown with initial capital letters. Examples: Delete key, the Options menu. “Subheading Title” References to sections within a document and titles of on-line help topics are shown in quotation marks. Example: “Typographic Conventions.” Courier type Signal and port names are shown in lowercase Courier type. Examples: data1, tdi, input. Active-low signals are denoted by suffix n, e.g., resetn. Anything that must be typed exactly as it appears is shown in Courier type. For example: c:\\qdesigns\\tutorial\\chiptrip.gdf. Also, sections of an actual file, such as a Report File, references to parts of files (e.g., the AHDL keyword SUBDESIGN), as well as logic function names (e.g., TRI) are shown in Courier. 1., 2., 3., and a., b., c., etc. Numbered steps are used in a list of items when the sequence of the items is important, such as the steps listed in a procedure. ■ ●  Bullets are used in a list of items when the sequence of the items is not important. v The checkmark indicates a procedur e that consists of one step only. 1 The hand points to information that requires special attention. r The angled arrow indicates you should press the Enter key. f The feet direct you to more information on a particular topic.

Altera Corporation Section I–1 Preliminary Section I. Cyclone FPGA Family Data Sheet This section provides designers with the data sheet specifications for Cyclone® devices. The chapters contain feature definitions of the internal architecture, configuration and JTAG boundary-scan testing information, DC operating conditions, AC timing parameters, a reference to power consumption, and ordering information for Cyclone devices. This section contains the following chapters: ■ Chapter 1. Introduction ■ Chapter 2. Cyclone Architecture ■ Chapter 3. Configuration and Testing ■ Chapter 4. DC and Switching Characteristics ■ Chapter 5. Reference and Ordering Information Revision History Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the complete handbook.

Section I–2 Altera Corporation Preliminary Revision History Cyclone Device Handbook, Volume 1

Altera Corporation 1–1 May 2008 Preliminary 1. Introduction Introduction The Cyclone® field programmable gate array family is based on a 1.5-V , 0.13-μm, all-layer copper SRAM process, with densities up to 20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like phase-locked loops (PLLs) for clocking and a dedicated double data rate (DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM) memory requirements, Cyclone devices are a cost-effective solution for data-path applications. Cyclone devices support various I/O standards, including LVDS at data rates up to 640 megabits per second (Mbps), and 66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI), for interfacing with and supporting ASSP and ASIC devices. Altera also offers new low-cost serial configuration devices to configure Cyclone devices. Features The Cyclone device family offers the following features: ■ 2,910 to 20,060 LEs, see Table 1–1 ■ Up to 294,912 RAM bits (36,864 bytes) ■ Supports configuration through low-cost serial configuration device ■ Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards ■ Support for 66- and 33-MHz, 64- and 32-bit PCI standard ■ High-speed (640 Mbps) LVDS I/O support ■ Low-speed (311 Mbps) LVDS I/O support ■ 311-Mbps RSDS I/O support ■ Up to two PLLs per device provide clock multiplication and phase shifting ■ Up to eight global clock lines with six clock resources available per logic array block (LAB) row ■ Support for external memory, including DDR SDRAM (133 MHz), FCRAM, and single data rate (SDR) SDRAM ■ Support for multiple intellectual property (IP) cores, including Altera ® MegaCore® functions and Altera Megafunctions Partners Program (AMPPSM) megafunctions. Table 1–1. Cyclone Device Features (Part 1 of 2) Feature EP1C3 EP1C4 EP1C6 EP1C12 EP1C20 LEs 2,910 4,000 5,980 12,060 20,060 M4K RAM blocks (128 × 3 6 b i t s ) 1 31 72 05 26 4 C51001-1.5

1–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Cyclone devices are available in quad flat pack (QFP) and space-saving FineLine® BGA packages (see Tables 1–2 through 1–3). Vertical migration means you can migrate a design from one device to another that has the same dedicated pins, JTAG pins, and power pins, and are subsets or supersets for a given package across device densities. The largest density in any package has the highest number of power pins; you must use the layout for the largest planned density in a package to provide the necessary power pins for migration. For I/O pin migration across densities, cross-reference the available I/O pins using the device pin-outs for all planned densities of a given package type to identify which I/O pins can be migrated. The Quartus® II software can automatically cross-reference and place all pins for you when given a device migration list. If one device has power or ground pins, but these same pins are user I/O on a different device that is in the migration path,the Quartus II software ensures the pins are not used as user I/O in the Quartus II software. Ensure that these pins are connected Total RAM bits 59,904 78,336 92,160 239,616 294,912 P L L s 12222 Maximum user I/O pins (1) 104 301 185 249 301 Note to Table 1–1: (1) This parameter includes global clock pins. Table 1–1. Cyclone Device Features (Part 2 of 2) Feature EP1C3 EP1C4 EP1C6 EP1C12 EP1C20 Table 1–2. Cyclone Package Options and I/O Pin Counts Device 100-Pin TQFP (1) 144-Pin TQFP (1), (2) 240-Pin PQFP (1) 256-Pin FineLine BGA 324-Pin FineLine BGA 400-Pin FineLine BGA EP1C3 65 104 — — — — E P 1 C 4 ———— 2 4 9 3 0 1 EP1C6 — 98 185 185 — — EP1C12 — — 173 185 249 — E P 1 C 2 0 ———— 2 3 3 3 0 1 Notes to Tab le 1– 2: (1) TQFP: thin quad flat pack. PQFP: plastic quad flat pack. (2) Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package).

Altera Corporation 1–3 May 2008 Preliminary Document Revision History to the appropriate plane on the board. The Quartus II software reserves I/O pins as power pins as necessary for layout with the larger densities in the same package having more power pins. Document

Revision History

Table 1–4 shows the revision history for this document. Table 1–3. Cyclone QFP and FineLine BGA Package Sizes Dimension 100-Pin TQFP 144-Pin TQFP 240-Pin PQFP 256-Pin FineLine BGA 324-Pin FineLine BGA 400-Pin FineLine BGA Area (mm2) 256 484 1,024 289 361 441 Length × width (mm × mm) 16×16 22×22 34.6×34.6 17×17 19×19 21×21 Table 1–4. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.5 Minor textual and style changes. — January 2007 v1.4 Added document revision history. — August 2005 v1.3 Minor updates. — October 2003 v1.2 Added 64-bit PCI support information. — September 2003 v1.1

• Updated LVDS data rates to 640 Mbps from 311 Mbps.
• Updated RSDS feature information. May 2003 v1.0 Added document to Cyclone Device Handbook. —

1–4 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1

Altera Corporation 2–1 May 2008 Preliminary 2. Cyclone Architecture Functional

Description

Cyclone® devices contain a two-dimensional row- and column-based architecture to implement custom logic. Column and row interconnects of varying speeds provide signal interconnects between LABs and embedded memory blocks. The logic array consists of LABs, with 10 LEs in each LAB. An LE is a small unit of logic providing efficient implementation of user logic functions. LABs are grouped into rows and columns across the device. Cyclone devices range between 2,910 to 20,060 LEs. M4K RAM blocks are true dual-port memory blocks with 4K bits of memory plus parity (4,608 bits). These blocks provide dedicated true dual-port, simple dual-port, or single-port memory up to 36-bits wide at up to 250 MHz. These blocks are grouped into columns across the device in between certain LABs. Cyclone devices offer between 60 to 288 Kbits of embedded RAM. Each Cyclone device I/O pin is fed by an I/O element (IOE) located at the ends of LAB rows and columns around the periphery of the device. I/O pins support various single-ended and differential I/O standards, such as the 66- and 33-MHz, 64- and 32-bit PCI standard and the LVDS I/O standard at up to 640 Mbps. Each IOE contains a bidirectional I/O buffer and three registers for registering input, output, and output-enable signals. Dual-purpose DQS, DQ, and DM pins along with delay chains (used to phase-align DDR signals) provide interface support with external memory devices such as DDR SDRAM, and FCRAM devices at up to 133 MHz (266 Mbps). Cyclone devices provide a global clock network and up to two PLLs. The global clock network consists of eight global clock lines that drive throughout the entire device. The global clock network can provide clocks for all resources within the device, such as IOEs, LEs, and memory blocks. The global clock lines can also be used for control signals. Cyclone PLLs provide general-purpose clocking with clock multiplication and phase shifting as well as external outputs for high-speed differential I/O support. Figure 2–1 shows a diagram of the Cyclone EP1C12 device. C51002-1.6

2–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 2–1. Cyclone EP1C12 Device Block Diagram The number of M4K RAM blocks, PLLs, rows, and columns vary per device. Table 2–1 lists the resources available in each Cyclone device. Logic Array PLL IOEs M4K Blocks EP1C12 Device Table 2–1. Cyclone Device Resources Device M4K RAM PLLs LAB Columns LAB Rows Columns Blocks EP1C3 1 13 1 24 13 EP1C4 1 17 2 26 17 EP1C6 1 20 2 32 20 EP1C12 2 52 2 48 26 EP1C20 2 64 2 64 32

Altera Corporation 2–3 May 2008 Preliminary Logic Array Blocks Logic Array Blocks Each LAB consists of 10 LEs, LE carry chains, LAB control signals, a local interconnect, look-up table (LUT) chain, and register chain connection lines. The local interconnect transfers signals between LEs in the same LAB. LUT chain connections transfer the output of one LE's LUT to the adjacent LE for fast sequential LUT connections within the same LAB. Register chain connections transfer the output of one LE's register to the adjacent LE's register within a LAB. The Quartus® II Compiler places associated logic within a LAB or adjacent LABs, allowing the use of local, LUT chain, and register chain connections for performance and area efficiency. Figure 2–2 details the Cyclone LAB. Figure 2–2. Cyclone LAB Structure LAB Interconnects The LAB local interconnect can drive LEs within the same LAB. The LAB local interconnect is driven by column and row interconnects and LE outputs within the same LAB. Neighboring LABs, PLLs, and M4K RAM blocks from the left and right can also drive a LAB's local interconnect through the direct link connection. The direct link connection feature minimizes the use of row and column interconnects, providing higher Direct link interconnect from adjacent block Direct link interconnect to adjacent block Row Interconnect Column Interconnect Local InterconnectLAB Direct link interconnect from adjacent block Direct link interconnect to adjacent block

2–4 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 performance and flexibility. Each LE can drive 30 other LEs through fast local and direct link interconnects. Figure 2–3 shows the direct link connection. Figure 2–3. Direct Link Connection LAB Control Signals Each LAB contains dedicated logic for driving control signals to its LEs. The control signals include two clocks, two clock enables, two asynchronous clears, synchronous clear, asynchronous preset/load, synchronous load, and add/subtract control signals. This gives a maximum of 10 control signals at a time. Although synchronous load and clear signals are generally used when implementing counters, they can also be used with other functions. Each LAB can use two clocks and two clock enable signals. Each LAB's clock and clock enable signals are linked. For example, any LE in a particular LAB using the labclk1 signal will also use labclkena1. If the LAB uses both the rising and falling edges of a clock, it also uses both LAB-wide clock signals. Deasserting the clock enable signal will turn off the LAB-wide clock. Each LAB can use two asynchronous clear signals and an asynchronous load/preset signal. The asynchronous load acts as a preset when the asynchronous load data input is tied high. LAB Direct link interconnect to right Direct link interconnect from right LAB, M4K memory block, PLL, or IOE output Direct link interconnect from left LAB, M4K memory block, PLL, or IOE output Local Interconnect Direct link interconnect to left

2–6 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 2–5. Cyclone LE Each LE's programmable register can be configured for D, T, JK, or SR operation. Each register has data, true asynchronous load data, clock, clock enable, clear, and asynchronous load/preset inputs. Global signals, general-purpose I/O pins, or any internal logic can drive the register's clock and clear control signals. Either general-purpose I/O pins or internal logic can drive the clock enable, preset, asynchronous load, and asynchronous data. The asynchronous load data input comes from the data3 input of the LE. For combinatorial functions, the LUT output bypasses the register and drives directly to the LE outputs. Each LE has three outputs that drive the local, row, and column routing resources. The LUT or register output can drive these three outputs independently. Two LE outputs drive column or row and direct link routing connections and one drives local interconnect resources. This allows the LUT to drive one output while the register drives another output. This feature, called register packing, improves device utilization because the device can use the register and the LUT for unrelated labclk1 labclk2 labclr2 labpre/aload Carry-In1 Carry-In0 LAB Carry-In Clock & Clock Enable Select LAB Carry-Out Carry-Out1 Carry-Out0 Look-Up Table (LUT) Carry Chain Row, column, and direct link routing Row, column, and direct link routing Programmable Register PRN/ALD CLRN D Q ENA Register Bypass Packed Register Select Chip-Wide Reset labclkena1 labclkena2 Synchronous Load and Clear Logic LAB-wide Synchronous Load LAB-wide Synchronous Clear Asynchronous Clear/Preset/ Load Logic data1 data2 data3 data4 LUT chain routing to next LE labclr1 Local Routing Register chain output ADATA addnsub Register Feedback Register chain routing from previous LE

Altera Corporation 2–7 May 2008 Preliminary Logic Elements functions. Another special packing mode allows the register output to feed back into the LUT of the same LE so that the register is packed with its own fan-out LUT. This provides another mechanism for improved fitting. The LE can also drive out registered and unregistered versions of the LUT output. LUT Chain and Register Chain In addition to the three general routing outputs, the LEs within a LAB have LUT chain and register chain outputs. LUT chain connections allow LUTs within the same LAB to cascade together for wide input functions. Register chain outputs allow registers within the same LAB to cascade together. The register chain output allows a LAB to use LUTs for a single combinatorial function and the registers to be used for an unrelated shift register implementation. These resources speed up connections between LABs while saving local interconnect resources. “MultiTrack Interconnect” on page 2–12 for more information on LUT chain and register chain connections. addnsub Signal The LE's dynamic adder/subtractor feature saves logic resources by using one set of LEs to implement both an adder and a subtractor. This feature is controlled by the LAB-wide control signal addnsub. The addnsub signal sets the LAB to perform either A + B or A − B. The LUT computes addition; subtraction is computed by adding the two's complement of the intended subtractor. The LAB-wide signal converts to two's complement by inverting the B bits within the LAB and setting carry-in = 1 to add one to the least significant bit (LSB). The LSB of an adder/subtractor must be placed in the first LE of the LAB, where the LAB-wide addnsub signal automatically sets the carry-in to 1. The Quartus II Compiler automatically places and uses the adder/subtractor feature when using adder/subtractor parameterized functions. LE Operating Modes The Cyclone LE can operate in one of the following modes: ■ Normal mode ■ Dynamic arithmetic mode Each mode uses LE resources differently. In each mode, eight available inputs to the LE⎯the four data inputs from the LAB local interconnect, carry-in0 and carry-in1 from the previous LE, the LAB carry-in from the previous carry-chain LAB, and the register chain connection⎯are directed to different destinations to implement the desired logic function. LAB-wide signals provide clock, asynchronous clear, asynchronous

2–8 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 preset/load, synchronous clear, synchronous load, and clock enable control for the register. These LAB-wide signals are available in all LE modes. The addnsub control signal is allowed in arithmetic mode. The Quartus II software, in conjunction with parameterized functions such as library of parameterized modules (LPM) functions, automatically chooses the appropriate mode for common functions such as counters, adders, subtractors, and arithmetic functions. If required, you can also create special-purpose functions that specify which LE operating mode to use for optimal performance. Normal Mode The normal mode is suitable for general logic applications and combinatorial functions. In normal mode, four data inputs from the LAB local interconnect are inputs to a four-input LUT (see Figure 2–6). The Quartus II Compiler automatically selects the carry-in or the data3 signal as one of the inputs to the LUT. Each LE can use LUT chain connections to drive its combinatorial output directly to the next LE in the LAB. Asynchronous load data for the register comes from the data3 input of the LE. LEs in normal mode support packed registers. Figure 2–6. LE in Normal Mode Note to Figure 2–6: (1) This signal is only allowed in normal mode if the LE is at the end of an adder/subtractor chain. data1 4-Input LUT data2 data3 cin (from cout of previous LE) data4 addnsub (LAB Wide) clock (LAB Wide) ena (LAB Wide) aclr (LAB Wide) aload (LAB Wide) ALD/PRE CLRN D Q ENA ADATA sclear (LAB Wide) sload (LAB Wide) Register chain connection LUT chain connection Register chain output Row, column, and direct link routing Row, column, and direct link routing Local routing Register Feedback (1)

Altera Corporation 2–9 May 2008 Preliminary Logic Elements Dynamic Arithmetic Mode The dynamic arithmetic mode is ideal for implementing adders, counters, accumulators, wide parity functions, and comparators. An LE in dynamic arithmetic mode uses four 2-input LUTs configurable as a dynamic adder/subtractor. The first two 2-input LUTs compute two summations based on a possible carry-in of 1 or 0; the other two LUTs generate carry outputs for the two chains of the carry select circuitry. As shown in Figure 2–7, the LAB carry-in signal selects either the carry-in0 or carry-in1 chain. The selected chain's logic level in turn determines which parallel sum is generated as a combinatorial or registered output. For example, when implementing an adder, the sum output is the selection of two possible calculated sums: data1 + data2 + carry-in0 or data1 + data2 + carry-in1 The other two LUTs use the data1 and data2 signals to generate two possible carry-out signals⎯one for a carry of 1 and the other for a carry of 0. The carry-in0 signal acts as the carry select for the carry-out0 output and carry-in1 acts as the carry select for the carry-out1 output. LEs in arithmetic mode can drive out registered and unregistered versions of the LUT output. The dynamic arithmetic mode also offers clock enable, counter enable, synchronous up/down control, synchronous clear, synchronous load, and dynamic adder/subtractor options. The LAB local interconnect data inputs generate the counter enable and synchronous up/down control signals. The synchronous clear and synchronous load options are LAB-wide signals that affect all registers in the LAB. The Quartus II software automatically places any registers that are not used by the counter into other LABs. The addnsub LAB-wide signal controls whether the LE acts as an adder or subtractor.

2–10 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 2–7. LE in Dynamic Arithmetic Mode Note to Figure 2–7: (1) The addnsub signal is tied to the carry input for the first LE of a carry chain only. Carry-Select Chain The carry-select chain provides a very fast carry-select function between LEs in dynamic arithmetic mode. The carry-select chain uses the redundant carry calculation to increase the speed of carry functions. The LE is configured to calculate outputs for a possible carry-in of 0 and carry-in of 1 in parallel. The carry-in0 and carry-in1 signals from a lower-order bit feed forward into the higher-order bit via the parallel carry chain and feed into both the LUT and the next portion of the carry chain. Carry-select chains can begin in any LE within a LAB. The speed advantage of the carry-select chain is in the parallel pre-computation of carry chains. Since the LAB carry-in selects the precomputed carry chain, not every LE is in the critical path. Only the propagation delays between LAB carry-in generation (LE 5 and LE 10) are now part of the critical path. This feature allows the Cyclone architecture to implement high-speed counters, adders, multipliers, parity functions, and comparators of arbitrary width. data1 LUT data2 data3 addnsub (LAB Wide) clock (LAB Wide) ena (LAB Wide) aclr (LAB Wide) ALD/PRE CLRN D Q ENA ADATA Register chain connection LUT LUT LUT Carry-Out1Carry-Out0 LAB Carry-In Carry-In0 Carry-In1 (1) sclear (LAB Wide) sload (LAB Wide) LUT chain connection Register chain output Row, column, and direct link routing Row, column, and direct link routing Local routing aload (LAB Wide) Register Feedback

2–12 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 The Quartus II Compiler automatically creates carry chain logic during design processing, or you can create it manually during design entry. Parameterized functions such as LPM functions automatically take advantage of carry chains for the appropriate functions. The Quartus II Compiler creates carry chains longer than 10 LEs by linking LABs together automatically. For enhanced fitting, a long carry chain runs vertically allowing fast horizontal connections to M4K memory blocks. A carry chain can continue as far as a full column. Clear and Preset Logic Control LAB-wide signals control the logic for the register's clear and preset signals. The LE directly supports an asynchronous clear and preset function. The register preset is achieved through the asynchronous load of a logic high. The direct asynchronous preset does not require a NOT-gate push-back technique. Cyclone devices support simultaneous preset/ asynchronous load and clear signals. An asynchronous clear signal takes precedence if both signals are asserted simultaneously. Each LAB supports up to two clears and one preset signal. In addition to the clear and preset ports, Cyclone devices provide a chip-wide reset pin (DEV_CLRn) that resets all registers in the device. An option set before compilation in the Quartus II software controls this pin. This chip-wide reset overrides all other control signals. MultiTrack Interconnect In the Cyclone architecture, connections between LEs, M4K memory blocks, and device I/O pins are provided by the MultiTrack interconnect structure with DirectDriveTM technology. The MultiTrack interconnect consists of continuous, performance-optimized routing lines of different speeds used for inter- and intra-design block connectivity. The Quartus II Compiler automatically places critical design paths on faster interconnects to improve design performance. DirectDrive technology is a deterministic routing technology that ensures identical routing resource usage for any function regardless of placement within the device. The MultiTrack interconnect and DirectDrive technology simplify the integration stage of block-based designing by eliminating the re-optimization cycles that typically follow design changes and additions. The MultiTrack interconnect consists of row and column interconnects that span fixed distances. A routing structure with fixed length resources for all devices allows predictable and repeatable performance when

Altera Corporation 2–13 May 2008 Preliminary MultiTrack Interconnect migrating through different device densities. Dedicated row interconnects route signals to and from LABs, PLLs, and M4K memory blocks within the same row. These row resources include: ■ Direct link interconnects between LABs and adjacent blocks ■ R4 interconnects traversing four blocks to the right or left The direct link interconnect allows a LAB or M4K memory block to drive into the local interconnect of its left and right neighbors. Only one side of a PLL block interfaces with direct link and row interconnects. The direct link interconnect provides fast communication between adjacent LABs and/or blocks without using row interconnect resources. The R4 interconnects span four LABs, or two LABs and one M4K RAM block. These resources are used for fast row connections in a four-LAB region. Every LAB has its own set of R4 interconnects to drive either left or right. Figure 2–9 shows R4 interconnect connections from a LAB. R4 interconnects can drive and be driven by M4K memory blocks, PLLs, and row IOEs. For LAB interfacing, a primary LAB or LAB neighbor can drive a given R4 interconnect. For R4 interconnects that drive to the right, the primary LAB and right neighbor can drive on to the interconnect. For R4 interconnects that drive to the left, the primary LAB and its left neighbor can drive on to the interconnect. R4 interconnects can drive other R4 interconnects to extend the range of LABs they can drive. R4 interconnects can also drive C4 interconnects for connections from one row to another.

2–14 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 2–9. R4 Interconnect Connections Notes to Figure 2–9: (1) C4 interconnects can drive R4 interconnects. (2) This pattern is repeated for every LAB in the LAB row. The column interconnect operates similarly to the row interconnect. Each column of LABs is served by a dedicated column interconnect, which vertically routes signals to and from LABs, M4K memory blocks, and row and column IOEs. These column resources include: ■ LUT chain interconnects within a LAB ■ Register chain interconnects within a LAB ■ C4 interconnects traversing a distance of four blocks in an up and down direction Cyclone devices include an enhanced interconnect structure within LABs for routing LE output to LE input connections faster using LUT chain connections and register chain connections. The LUT chain connection allows the combinatorial output of an LE to directly drive the fast input of the LE right below it, bypassing the local interconnect. These resources can be used as a high-speed connection for wide fan-in functions from LE 1 to LE 10 in the same LAB. The register chain connection allows the register output of one LE to connect directly to the register input of the next LE in the LAB for fast shift registers. The Quartus II Compiler automatically takes advantage of these resources to improve utilization and performance. Figure 2–10 shows the LUT chain and register chain interconnects. Primary LAB (2) R4 Interconnect Driving Left Adjacent LAB can Drive onto Another LAB's R4 Interconnect C4 Column Interconnects (1) R4 Interconnect Driving Right LAB Neighbor LAB Neighbor

Altera Corporation 2–15 May 2008 Preliminary MultiTrack Interconnect Figure 2–10. LUT Chain and Register Chain Interconnects The C4 interconnects span four LABs or M4K blocks up or down from a source LAB. Every LAB has its own set of C4 interconnects to drive either up or down. Figure 2–11 shows the C4 interconnect connections from a LAB in a column. The C4 interconnects can drive and be driven by all types of architecture blocks, including PLLs, M4K memory blocks, and column and row IOEs. For LAB interconnection, a primary LAB or its LAB neighbor can drive a given C4 interconnect. C4 interconnects can drive each other to extend their range as well as drive row interconnects for column-to-column connections. LE 1 LE 2 LE 3 LE 4 LE 5 LE 6 LE 7 LE 8 LE 9 LE 10 LUT Chain Routing to Adjacent LE Local Interconnect Register Chain Routing to Adjacent LE's Register Input Local Interconnect Routing Among LEs in the LAB

2–16 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 2–11. C4 Interconnect Connections Note (1) Note to Figure 2–11: (1) Each C4 interconnect can drive either up or down four rows. C4 Interconnect Drives Local and R4 Interconnects Up to Four Rows Adjacent LAB can drive onto neighboring LAB's C4 interconnect C4 Interconnect Driving Up C4 Interconnect Driving Down LAB Row Interconnect Local Interconnect

Altera Corporation 2–17 May 2008 Preliminary MultiTrack Interconnect All embedded blocks communicate with the logic array similar to LAB-to-LAB interfaces. Each block (i.e., M4K memory or PLL) connects to row and column interconnects and has local interconnect regions driven by row and column interconnects. These blocks also have direct link interconnects for fast connections to and from a neighboring LAB. Table 2–2 shows the Cyclone device's routing scheme. Table 2–2. Cyclone Device Routing Scheme Source Destination LUT Chain Register Chain Local Interconnect Direct Link Interconnect R4 Interconnect C4 Interconnect LE M4K RAM Block PLL Column IOE Row IOE Local Interconnect —————— vvvvv Direct Link

2–18 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Embedded Memory The Cyclone embedded memory consists of columns of M4K memory blocks. EP1C3 and EP1C6 devices have one column of M4K blocks, while EP1C12 and EP1C20 devices have two columns (refer to Table 1–1 on page 1–1 for total RAM bits per density). Each M4K block can implement various types of memory with or without parity, including true dual-port, simple dual-port, and single-port RAM, ROM, and FIFO buffers. The M4K blocks support the following features: ■ 4,608 RAM bits ■ 250 MHz performance ■ True dual-port memory ■ Simple dual-port memory ■ Single-port memory ■ Byte enable ■ Parity bits ■ Shift register ■ FIFO buffer ■ ROM ■ Mixed clock mode

1 Violating the setup or hold time on the address registers could

corrupt the memory contents. This applies to both read and write operations. Memory Modes The M4K memory blocks include input registers that synchronize writes and output registers to pipeline designs and improve system performance. M4K blocks offer a true dual-port mode to support any combination of two-port operations: two reads, two writes, or one read and one write at two different clock frequencies. Figure 2–12 shows true dual-port memory. Figure 2–12. True Dual-Port Memory Configuration dataA[ ] addressA[ ] wrenA clockA clockenA qA[ ] aclrA dataB[ ] addressB[ ] wrenB clockB clockenB qB[ ] aclrB AB

Altera Corporation 2–19 May 2008 Preliminary Embedded Memory In addition to true dual-port memory, the M4K memory blocks support simple dual-port and single-port RAM. Simple dual-port memory supports a simultaneous read and write. Single-port memory supports non-simultaneous reads and writes. Figure 2–13 shows these different M4K RAM memory port configurations. Figure 2–13. Simple Dual-Port and Single-Port Memory Configurations Note to Figure 2–13: (1) Two single-port memory blocks can be implemented in a single M4K block as long as each of the two independent block sizes is equal to or less than half of the M4K block size. The memory blocks also enable mixed-width data ports for reading and writing to the RAM ports in dual-port RAM configuration. For example, the memory block can be written in ×1 mode at port A and read out in ×16 mode from port B. The Cyclone memory architecture can implement fully synchronous RAM by registering both the input and output signals to the M4K RAM block. All M4K memory block inputs are registered, providing synchronous write cycles. In synchronous operation, the memory block generates its own self-timed strobe write enable (wren) signal derived from a global clock. In contrast, a circuit using asynchronous RAM must generate the RAM wren signal while ensuring its data and address signals meet setup and hold time specifications relative to the wren data[ ] wraddress[ ] wren inclock inclocken inaclr rdaddress[ ] rden q[ ] outclock outclocken outaclr data[ ] address[ ] wren inclock inclocken inaclr q[ ] outclock outclocken outaclr Single-Port Memory (1) Simple Dual-Port Memory

2–20 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 signal. The output registers can be bypassed. Pseudo-asynchronous reading is possible in the simple dual-port mode of M4K blocks by clocking the read enable and read address registers on the negative clock edge and bypassing the output registers. When configured as RAM or ROM, you can use an initialization file to pre-load the memory contents. Two single-port memory blocks can be implemented in a single M4K block as long as each of the two independent block sizes is equal to or less than half of the M4K block size. The Quartus II software automatically implements larger memory by combining multiple M4K memory blocks. For example, two 256×16-bit RAM blocks can be combined to form a 256×32-bit RAM block. Memory performance does not degrade for memory blocks using the maximum number of words allowed. Logical memory blocks using less than the maximum number of words use physical blocks in parallel, eliminating any external control logic that would increase delays. To create a larger high-speed memory block, the Quartus II software automatically combines memory blocks with LE control logic. Parity Bit Support The M4K blocks support a parity bit for each byte. The parity bit, along with internal LE logic, can implement parity checking for error detection to ensure data integrity. You can also use parity-size data words to store user-specified control bits. Byte enables are also available for data input masking during write operations. Shift Register Support You can configure M4K memory blocks to implement shift registers for DSP applications such as pseudo-random number generators, multi-channel filtering, auto-correlation, and cross-correlation functions. These and other DSP applications require local data storage, traditionally implemented with standard flip-flops, which can quickly consume many logic cells and routing resources for large shift registers. A more efficient alternative is to use embedded memory as a shift register block, which saves logic cell and routing resources and provides a more efficient implementation with the dedicated circuitry. The size of a w × m × n shift register is determined by the input data width (w), the length of the taps (m), and the number of taps (n). The size of a w × m × n shift register must be less than or equal to the maximum number of memory bits in the M4K block (4,608 bits). The total number of shift

Altera Corporation 2–21 May 2008 Preliminary Embedded Memory register outputs (number of taps n × width w) must be less than the maximum data width of the M4K RAM block (×36). To create larger shift registers, multiple memory blocks are cascaded together. Data is written into each address location at the falling edge of the clock and read from the address at the rising edge of the clock. The shift register mode logic automatically controls the positive and negative edge clocking to shift the data in one clock cycle. Figure 2–14 shows the M4K memory block in the shift register mode. Figure 2–14. Shift Register Memory Configuration Memory Configuration Sizes The memory address depths and output widths can be configured as 4,096 × 1, 2,048 × 2, 1,024 × 4, 512 × 8 (or 512 × 9 bits), 256 × 16 (or 256 × 18 bits), and 128 × 32 (or 128 × 36 bits). The 128 × 32- or 36-bit configuration m-Bit Shift Register w w m-Bit Shift Register m-Bit Shift Register m-Bit Shift Register w w w w w w w × m × n Shift Register n Number of Taps

2–22 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 is not available in the true dual-port mode. Mixed-width configurations are also possible, allowing different read and write widths. Tables 2–3 and 2–4 summarize the possible M4K RAM block configurations. When the M4K RAM block is configured as a shift register block, you can create a shift register up to 4,608 bits (w × m × n). Table 2–3. M4K RAM Block Configurations (Simple Dual-Port) Read Port Write Port 4K × 12 K × 21 K × 4 512 × 8 256 × 16 128 × 32 512 × 9 256 × 18 128 × 36 4K × 1 vvv v v v —— — 2K × 2 vvv v v v —— — 1K × 4 vvv v v v —— — 512 × 8 vvv v v v —— — 256 × 16 vvv v v v —— — 128 × 32 vvv v v v —— — Table 2–4. M4K RAM Block Configurations (True Dual-Port) Port A Port B 4K × 12 K × 21 K × 4 512 × 8 256 × 16 512 × 9 256 × 18 4K × 1 vvvvv —— 2K × 2 vvvvv —— 1K × 4 vvvvv —— 512 × 8 vvvvv —— 256 × 16 vvvvv ——

Altera Corporation 2–23 May 2008 Preliminary Embedded Memory Byte Enables M4K blocks support byte writes when the write port has a data width of 16, 18, 32, or 36 bits. The byte enables allow the input data to be masked so the device can write to specific bytes. The unwritten bytes retain the previous written value. Table 2–5 summarizes the byte selection. Control Signals and M4K Interface The M4K blocks allow for different clocks on their inputs and outputs. Either of the two clocks feeding the block can clock M4K block registers (renwe, address, byte enable, datain, and output registers). Only the output register can be bypassed. The six labclk signals or local interconnects can drive the control signals for the A and B ports of the M4K block. LEs can also control the clock_a, clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and clocken_b signals, as shown in Figure 2–15. The R4, C4, and direct link interconnects from adjacent LABs drive the M4K block local interconnect. The M4K blocks can communicate with LABs on either the left or right side through these row resources or with LAB columns on either the right or left with the column resources. Up to 10 direct link input connections to the M4K block are possible from the left adjacent LABs and another 10 possible from the right adjacent LAB. M4K block outputs can also connect to left and right LABs through 10 direct link interconnects each. Figure 2–16 shows the M4K block to logic array interface. Table 2–5. Byte Enable for M4K Blocks Notes (1), (2) byteena[3..0] datain ×18 datain ×36 [2] = 1 — [26..18] [3] = 1 — [35..27] Notes to Tab le 2 –5: (1) Any combination of byte enables is possible. (2) Byte enables can be used in the same mann er with 8-bit words, i.e., in ×16 and ×32 modes.

Altera Corporation 2–25 May 2008 Preliminary Embedded Memory Independent Clock Mode The M4K memory blocks implement independent clock mode for true dual-port memory. In this mode, a separate clock is available for each port (ports A and B). Clock A controls all registers on the port A side, while clock B controls all registers on the port B side. Each port, A and B, also supports independent clock enables and asynchronous clear signals for port A and B registers. Figure 2–17 shows an M4K memory block in independent clock mode. Figure 2–17. Independent Clock Mode Notes (1), (2) Notes to Figure 2–17: (1) All registers shown have asynchronous clear ports. (2) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. Input/Output Clock Mode Input/output clock mode can be implemented for both the true and simple dual-port memory modes. On each of the two ports, A or B, one clock controls all registers for inputs into the memory block: data input, wren, and address. The other clock controls the block's data output registers. Each memory block port, A or B, also supports independent clock enables and asynchronous clear signals for input and output registers. Figures 2–18 and 2–19 show the memory block in input/output clock mode. D ENA Q D ENA Q D ENA Q dataA[ ] addressA[ ] Memory Block 256 ´ 16 (2) 512 ´ 8 1,024 ´ 4 2,048 ´ 2 4,096 ´ 1 Data In Address A Write/Read Enable Data Out Data In Address B Write/Read Enable Data Out clkenA clockA D ENA Q wrenA

6 LAB Row Clocks

qA[ ] dataB[ ] addressB[ ] clkenB clockB wrenB qB[ ] ENA AB ENA DQ D ENA QbyteenaA[ ] Byte Enable A Byte Enable B byteenaB[ ] ENA DQ ENA DQ ENA DQ DQ Write Pulse Generator Write Pulse Generator

2–26 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 2–18. Input/Output Clock Mode in True Dual-Port Mode Notes (1), (2) Notes to Figure 2–18: (1) All registers shown have asynchronous clear ports. (2) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. D ENA Q D ENA Q D ENA Q dataA[ ] addressA[ ] Memory Block 256 × 16 (2) 512 × 8 1,024 × 4 2,048 × 2 4,096 × 1 Data In Address A Write/Read Enable Data Out Data In Address B Write/Read Enable Data Out clkenA clockA D ENA Q wrenA qA[ ] dataB[ ] addressB[ ] clkenB clockB wrenB qB[ ] ENA AB ENA DQ ENA DQ ENA DQ DQ D ENA QbyteenaA[ ] Byte Enable A Byte Enable B byteenaB[ ] ENA DQ Write Pulse Generator Write Pulse Generator

Altera Corporation 2–27 May 2008 Preliminary Embedded Memory Figure 2–19. Input/Output Clock Mode in Simple Dual-Port Mode Notes (1), (2) Notes to Figure 2–19: (1) All registers shown except the rden register have asynchronous clear ports. (2) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. D ENA Q D ENA Q D ENA Q D ENA Q D ENA Q data[ ] D ENA Qwraddress[ ] address[ ] Memory Block 256 ´ 16 512 ´ 8 1,024 ´ 4 2,048 ´ 2 4,096 ´ 1 Data In Read Address Write Address Write Enable Read Enable Data Out outclken inclken inclock outclock wren rden

6 LAB Row

D ENA Qbyteena[ ] Byte Enable Write Pulse Generator

2–28 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Read/Write Clock Mode The M4K memory blocks implement read/write clock mode for simple dual-port memory. You can use up to two clocks in this mode. The write clock controls the block's data inputs, wraddress, and wren. The read clock controls the data output, rdaddress, and rden. The memory blocks support independent clock enables for each clock and asynchronous clear signals for the read- and write-side registers. Figure 2–20 shows a memory block in read/write clock mode. Figure 2–20. Read/Write Clock Mode in Simple Dual-Port Mode Notes (1), (2) Notes to Figure 2–20: (1) All registers shown except the rden register have asynchronous clear ports. (2) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. D ENA Q D ENA Q D ENA Q D ENA Q D ENA Q data[ ] D ENA Qwraddress[ ] address[ ] Memory Block 256 × 16 512 × 8 1,024 × 4 2,048 × 2 4,096 × 1 Data In Read Address Write Address Write Enable Read Enable Data Out rdclken wrclken wrclock rdclock wren rden D ENA Qbyteena[ ] Byte Enable Write Pulse Generator

Altera Corporation 2–29 May 2008 Preliminary Global Clock Network and Phase-Locked Loops Single-Port Mode The M4K memory blocks also support single-port mode, used when simultaneous reads and writes are not required. See Figure 2–21. A single M4K memory block can support up to two single-port mode RAM blocks if each RAM block is less than or equal to 2K bits in size. Figure 2–21. Single-Port Mode Note (1) Note to Figure 2–21: (1) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. Global Clock Network and Phase-Locked Loops Cyclone devices provide a global clock network and up to two PLLs for a complete clock management solution. Global Clock Network There are four dedicated clock pins (CLK[3..0], two pins on the left side and two pins on the right side) that drive the global clock network, as shown in Figure 2–22. PLL outputs, logic array, and dual-purpose clock (DPCLK[7..0]) pins can also drive the global clock network. D ENA Q D ENA Q D ENA Q D ENA Q data[ ] address[ ] RAM/ROM 256 × 16 512 × 8 1,024 × 4 2,048 × 2 4,096 × 1 Data In Address Write Enable Data Out outclken inclken inclock outclock Write Pulse Generator wren

2–30 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 The eight global clock lines in the global clock network drive throughout the entire device. The global clock network can provide clocks for all resources within the device—IOEs, LE s, and memory blocks. The global clock lines can also be used for control signals, such as clock enables and synchronous or asynchronous clears fed from the external pin, or DQS signals for DDR SDRAM or FCRAM interfaces. Internal logic can also drive the global clock network for internally generated global clocks and asynchronous clears, clock enables, or other control signals with large fanout. Figure 2–22 shows the various sources that drive the global clock network. Figure 2–22. Global Clock Generation Note (1) Notes to Figure 2–22: (1) The EP1C3 device in the 100-pin TQFP package has five DPCLK pins (DPCLK2, DPCLK3, DPCLK4, DPCLK6, and DPCLK7). (2) EP1C3 devices only contain one PLL (PLL 1). (3) The EP1C3 device in the 100-pin TQFP package does not have dedicated clock pins CLK1 and CLK3. Global Clock Network PLL1 PLL2 (2) CLK0 CLK1 (3) CLK2 CLK3 (3) DPCLK1 DPCLK0 DPCLK4 DPCLK5 DPCLK2 DPCLK3 DPCLK7 DPCLK6 2 2 From logic array From logic array Cyclone Device

2–32 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 2–24. I/O Clock Regions PLLs Cyclone PLLs provide general-purpose clocking with clock multiplication and phase shifting as well as outputs for differential I/O support. Cyclone devices contain two PLLs, except for the EP1C3 device, which contains one PLL. Column I/O Clock Region IO_CLK[5..0] Column I/O Clock Region IO_CLK[5..0] I/O Clock Regions I/O Clock Regions Global Clock Network Row I/O Regions Cyclone Logic Array LAB Row Clocks labclk[5..0] LAB Row Clocks labclk[5..0] LAB Row Clocks labclk[5..0] LAB Row Clocks labclk[5..0] LAB Row Clocks labclk[5..0] LAB Row Clocks labclk[5..0]

Altera Corporation 2–33 May 2008 Preliminary Global Clock Network and Phase-Locked Loops Table 2–6 shows the PLL features in Cyclone devices. Figure 2–25 shows a Cyclone PLL. Figure 2–25. Cyclone PLL Note (1) Notes to Figure 2–25: (1) The EP1C3 device in the 100-pin TQFP package does not support external outputs or LVDS inputs. The EP1C6 device in the 144-pin TQFP package does not support external output from PLL2. (2) LVDS input is supported via the secondary function of the dedicated clock pins. For PLL 1, the CLK0 pin’s secondary function is LVDSCLK1p and the CLK1 pin’s secondary function is LVDSCLK1n. For PLL 2, the CLK2 pin’s secondary function is LVDSCLK2p and the CLK3 pin’s secondary function is LVDSCLK2n. (3) PFD: phase frequency detector. Table 2–6. Cyclone PLL Features Feature PLL Support Clock multiplication and division m/(n × post-scale counter) (1) Phase shift Down to 125-ps increments (2), (3) Programmable duty cycle Y es Number of internal clock outputs 2 Number of external clock outputs One differential or one single-ended (4) Notes to Tab le 2 –6: (1) The m counter ranges from 2 to 32. The n counter and the post-scale counters range from 1 to 32. (2) The smallest phase shift is determined by the voltage-controlled oscillator (VCO) period divided by 8. (3) For degree increments, Cyclone device s can shift all output frequencies in increments of 45°. Smaller degree increments are possible depending on the frequency and divide parameters. (4) The EP1C3 device in the 100-pin TQFP package does not support external clock output. The EP1C6 device in the 144-pin TQFP package does not support external clock output from PLL2. Charge Pump VCOPFD (3) Loop Filter CLK0 or LVDSCLK1p (2) CLK1 or LVDSCLK1n (2) Δt Δt Global clock Global clock I/O buffer ÷g0 ÷g1 VCO Phase Selection Selectable at Each PLL Output Port Post-Scale Counters

Altera Corporation 2–35 May 2008 Preliminary Global Clock Network and Phase-Locked Loops Clock Multiplication and Division Cyclone PLLs provide clock synthesis for PLL output ports using m/(n × post scale counter) scaling factors. The input clock is divided by a pre-scale divider, n, and is then multiplied by the m feedback factor. The control loop drives the VCO to match fIN × (m/n). Each output port has a unique post-scale counter to divide down the high-frequency VCO. For multiple PLL outputs with different frequencies, the VCO is set to the least-common multiple of the output frequencies that meets its frequency specifications. Then, the post-scale dividers scale down the output frequency for each output port. For example, if the output frequencies required from one PLL are 33 and 66 MHz, the VCO is set to 330 MHz (the least-common multiple in the VCO's range). Each PLL has one pre-scale divider, n, that can range in value from 1 to 32. Each PLL also has one multiply divider, m, that can range in value from 2 to 32. Global clock outputs have two post scale G dividers for global clock outputs, and external clock outputs have an E divider for external clock output, both ranging from 1 to 32. The Quartus II software automatically chooses the appropriate scaling factors according to the input frequency, multiplication, and division values entered. Dual-Purpose Clock Pins Notes to Tab le 2– 7: (1) EP1C3 devices only have one PLL (PLL 1). (2) EP1C3 devices in the 100-pin TQFP package do not have dedicated clock pins CLK1 and CLK3. (3) EP1C3 devices in the 100-pin TQFP package do not have the DPCLK0, DPCLK1, or DPCLK5 pins. Table 2–7. Global Clock Network Sources (Part 2 of 2) Source GCLK0 GCLK1 GCLK2 GCLK3 GCLK4 GCLK5 GCLK6 GCLK7

2–36 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 External Clock Inputs Each PLL supports single-ended or differential inputs for source- synchronous receivers or for general-purpose use. The dedicated clock pins (CLK[3..0]) feed the PLL inputs. These dual-purpose pins can also act as LVDS input pins. See Figure 2–25. Table 2–8 shows the I/O standards supported by PLL input and output pins. For more information on LVDS I/O support, refer to “LVDS I/O Pins” on page 2–54. External Clock Outputs Each PLL supports one differential or one single-ended output for source-synchronous transmitters or for general-purpose external clocks. If the PLL does not use these PLL_OUT pins, the pins are available for use as general-purpose I/O pins. The PLL_OUT pins support all I/O standards shown in Table 2–8. The external clock outputs do not have their own VCC and ground voltage supplies. Therefore, to minimize jitter, do not place switching I/O pins next to these output pins. The EP1C3 device in the 100-pin TQFP package Table 2–8. PLL I/O Standards I/O Standard CLK Input EXTCLK Output 3.3-V LVTTL/LVCMOS vv 2.5-V LVTTL/LVCMOS vv 1.8-V LVTTL/LVCMOS vv 1.5-V LVCMOS vv 3.3-V PCI vv LVDS vv SSTL-2 class I vv SSTL-2 class II vv SSTL-3 class I vv SSTL-3 class II vv Differential SSTL-2 — v

Altera Corporation 2–37 May 2008 Preliminary Global Clock Network and Phase-Locked Loops does not have dedicated clock output pins. The EP1C6 device in the 144-pin TQFP package only supports dedicated clock outputs from PLL 1. Clock Feedback Cyclone PLLs have three modes for multiplication and/or phase shifting: ■ Zero delay buffer mode⎯The external clock output pin is phase- aligned with the clock input pin for zero delay. ■ Normal mode⎯If the design uses an internal PLL clock output, the normal mode compensates for the internal clock delay from the input clock pin to the IOE registers. The external clock output pin is phase shifted with respect to the clock input pin if connected in this mode. You defines which internal clock output from the PLL should be phase-aligned to compensate for internal clock delay. ■ No compensation mode⎯In this mode, the PLL will not compensate for any clock networks. Phase Shifting Cyclone PLLs have an advanced clock shift capability that enables programmable phase shifts. You can enter a phase shift (in degrees or time units) for each PLL clock output port or for all outputs together in one shift. You can perform phase shifting in time units with a resolution range of 125 to 250 ps. The finest resolution equals one eighth of the VCO period. The VCO period is a function of the frequency input and the multiplication and division factors. Each clock output counter can choose a different phase of the VCO period from up to eight taps. You can use this clock output counter along with an initial setting on the post-scale counter to achieve a phase-shift range for the entire period of the output clock. The phase tap feedback to the m counter can shift all outputs to a single phase. The Quartus II software automatically sets the phase taps and counter settings according to the phase shift entered. Lock Detect Signal The lock output indicates that there is a stable clock output signal in phase with the reference clock. Without any additional circuitry, the lock signal may toggle as the PLL begins tracking the reference clock. Therefore, you may need to gate the lock signal for use as a system-control signal. For correct operation of the lock circuit below –20 C, fIN/N > 200 MHz.

2–38 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Programmable Duty Cycle The programmable duty cycle allows PLLs to generate clock outputs with a variable duty cycle. This feature is supported on each PLL post-scale counter (g0, g1, e). The duty cycle setting is achieved by a low- and high-time count setting for the post-scale dividers. The Quartus II software uses the frequency input and the required multiply or divide rate to determine the duty cycle choices. Control Signals There are three control signals for clearing and enabling PLLs and their outputs. You can use these signals to control PLL resynchronization and the ability to gate PLL output clocks for low-power applications. The pllenable signal enables and disables PLLs. When the pllenable signal is low, the clock output ports are driven by ground and all the PLLs go out of lock. When the pllenable signal goes high again, the PLLs relock and resynchronize to the input clocks. An input pin or LE output can drive the pllenable signal. The areset signals are reset/resynchronization inputs for each PLL. Cyclone devices can drive these input signals from input pins or from LEs. When areset is driven high, the PLL counters will reset, clearing the PLL output and placing the PLL out of lock. When driven low again, the PLL will resynchronize to its input as it relocks. The pfdena signals control the phase frequency detector (PFD) output with a programmable gate. If you disable the PFD, the VCO will operate at its last set value of control voltage and frequency with some drift, and the system will continue running when the PLL goes out of lock or the input clock disables. By maintaining the last locked frequency, the system has time to store its current settings before shutting down. You can either use their own control signal or gated locked status signals to trigger the pfdena signal. f For more information about Cyclone PLLs, refer to Using PLLs in Cyclone Devices chapter in the Cyclone Device Handbook.

Altera Corporation 2–39 May 2008 Preliminary I/O Structure I/O Structure IOEs support many features, including: ■ Differential and single-ended I/O standards ■ 3.3-V , 64- and 32-bit, 66- and 33-MHz PCI compliance ■ Joint Test Action Group (JTAG) boundary-scan test (BST) support ■ Output drive strength control ■ Weak pull-up resistors during configuration ■ Slew-rate control ■ Tri-state buffers ■ Bus-hold circuitry ■ Programmable pull-up resistors in user mode ■ Programmable input and output delays ■ Open-drain outputs ■ DQ and DQS I/O pins Cyclone device IOEs contain a bidirectional I/O buffer and three registers for complete embedded bidirectional single data rate transfer. Figure 2–27 shows the Cyclone IOE structure. The IOE contains one input register, one output register, and one output enable register. You can use the input registers for fast setup times and output registers for fast clock-to-output times. Additionally, you can use the output enable (OE) register for fast clock-to-output enable timing. The Quartus II software automatically duplicates a single OE register that controls multiple output or bidirectional pins. IOEs can be used as input, output, or bidirectional pins.

2–40 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 2–27. Cyclone IOE Structure Note to Figure 2–27: (1) There are two paths available for combinatorial inputs to the logic array. Each path contains a unique programmable delay chain. The IOEs are located in I/O blocks around the periphery of the Cyclone device. There are up to three IOEs per row I/O block and up to three IOEs per column I/O block (column I/O blocks span two columns). The row I/O blocks drive row, column, or direct link interconnects. The column I/O blocks drive column interconnects. Figure 2–28 shows how a row I/O block connects to the logic array. Figure 2–29 shows how a column I/O block connects to the logic array. Output Register Output Combinatorial input (1) Input OE Register OE Input Register Logic Array DQ DQ DQ

Altera Corporation 2–41 May 2008 Preliminary I/O Structure Figure 2–28. Row I/O Block Connection to the Interconnect Notes to Figure 2–28: (1) The 21 data and control signal s consist of three data out lines, io_dataout[2..0], three output enables, three clocks, io_cclk[2..0], three asynchronous clear signals, io_caclr[2..0], and three synchronous clear signals, io_csclr[2..0]. (2) Each of the three IOEs in the row I/O block can have one io_datain input (combinatorial or registered) and one comb_io_datain (combinatorial) input. R4 Interconnects C4 Interconnects I/O Block Local Interconnect

21 Data and

from Logic Array (1 io_datain[2..0] and comb_io_datain[2..0] (2) io_clk[5:0] Row I/O Block Contains up to Three IOEs Direct Link Interconnect to Adjacent LAB Direct Link Interconnect from Adjacent LAB LAB Local Interconnect LAB Row I/O Block

2–42 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 2–29. Column I/O Block Connection to the Interconnect Notes to Figure 2–29: (1) The 21 data and control signal s consist of three data out lines, io_dataout[2..0], three output enables, three clocks, io_cclk[2..0], three asynchronous clear signals, io_caclr[2..0], and three synchronous clear signals, io_csclr[2..0]. (2) Each of the three IOEs in th e column I/O block can have one io_datain input (combinatorial or registered) and one comb_io_datain (combinatorial) input.

21 Data &

from Logic Array (1) Column I/O Block Contains up to Three IOE s I/O Block Local Interconnect IO_datain[2:0] & comb_io_datain[2..0] (2) R4 Interconnects LAB Local Interconnect C4 Interconnects LAB LAB LAB io_clk[5..0] Column I/O Block

Altera Corporation 2–45 May 2008 Preliminary I/O Structure Figure 2–32. Cyclone IOE in Bidirectional I/O Configuration The Cyclone device IOE includes programmable delays to ensure zero hold times, minimize setup times, or increase clock to output times. A path in which a pin directly drives a register may require a programmable delay to ensure zero hold time, whereas a path in which a pin drives a register through combinatorial logic may not require the delay. Programmable delays decrease input-pin-to-logic-array and IOE input register delays. The Quartus II Compiler can program these delays Chip-Wide Reset OE Register VCCIO Optional PCI Clamp Column or Row Interconect ioe_clk[5..0] Input Register Input Pin to Input Register Delay or Input Pin to Logic Array Delay Input Pin to Logic Array Delay Drive Strength Control Open-Drain Output Slew Control sclr/preset OE clkout ce_out aclr/prn clkin ce_in Programmable Pull-Up Resistor Bus Hold PRN CLRN DQ Output Register PRN CLRN DQ PRN CLRN DQ VCCIO comb_datain data_in ENA ENA ENA Output Pin Delay

2–46 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 to automatically minimize setup time while providing a zero hold time. Programmable delays can increase the register-to-pin delays for output registers. Table 2–9 shows the programmable delays for Cyclone devices. There are two paths in the IOE for a combinatorial input to reach the logic array. Each of the two paths can have a different delay. This allows you adjust delays from the pin to internal LE registers that reside in two different areas of the device. The designer sets the two combinatorial input delays by selecting different delays for two different paths under the Decrease input delay to internal cells logic option in the Quartus II software. When the input signal requires two different delays for the combinatorial input, the input register in the IOE is no longer available. The IOE registers in Cyclone devices share the same source for clear or preset. The designer can program preset or clear for each individual IOE. The designer can also program the registers to power up high or low after configuration is complete. If programmed to power up low, an asynchronous clear can control the registers. If programmed to power up high, an asynchronous preset can control the registers. This feature prevents the inadvertent activation of another device's active-low input upon power up. If one register in an IOE uses a preset or clear signal then all registers in the IOE must use that same signal if they require preset or clear. Additionally a synchronous reset signal is available to the designer for the IOE registers. External RAM Interfacing Cyclone devices support DDR SDRAM and FCRAM interfaces at up to 133 MHz through dedicated circuitry. DDR SDRAM and FCRAM Cyclone devices have dedicated circuitry for interfacing with DDR SDRAM. All I/O banks support DDR SDRAM and FCRAM I/O pins. However, the configuration input pins in bank 1 must operate at 2.5 V because the SSTL-2 VCCIO level is 2.5 V . Additionally, the configuration Table 2–9. Cyclone Programmable Delay Chain Programmable Delays Quartus II Logic Option Input pin to logic array delay Decrease input delay to internal cells Input pin to input register delay Decr ease input delay to input registers Output pin delay Increase delay to output pin

Altera Corporation 2–47 May 2008 Preliminary I/O Structure output pins (nSTATUS and CONF_DONE) and all the JTAG pins in I/O bank 3 must operate at 2.5 V because the VCCIO level of SSTL-2 is 2.5 V . I/O banks 1, 2, 3, and 4 support DQS signals with DQ bus modes of × 8. For × 8 mode, there are up to eight groups of programmable DQS and DQ pins, I/O banks 1, 2, 3, and 4 each have two groups in the 324-pin and 400-pin FineLine BGA packages. Each group consists of one DQS pin, a set of eight DQ pins, and one DM pin (see Figure 2–33). Each DQS pin drives the set of eight DQ pins within that group. Figure 2–33. Cyclone Device DQ and DQS Groups in ×8 Mode Note (1) Note to Figure 2–33: (1) Each DQ group consists of one DQS pin, eight DQ pins, and one DM pin. Table 2–10 shows the number of DQ pin groups per device. DQ Pins DQS Pin DM Pin Top, Bottom, Left, or Right I/O Bank Table 2–10. DQ Pin Groups (Part 1 of 2) Device Package Number of × 8 DQ Pin Groups Total DQ Pin Count EP1C3 100-pin TQFP (1) 32 4 144-pin TQFP 4 32 EP1C4 324-pin FineLine BGA 8 64 400-pin FineLine BGA 8 64

2–48 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 A programmable delay chain on each DQS pin allows for either a 90° phase shift (for DDR SDRAM), or a 72° phase shift (for FCRAM) which automatically center-aligns input DQS synchronization signals within the data window of their corresponding DQ data signals. The phase-shifted DQS signals drive the global clock network. This global DQS signal clocks DQ signals on internal LE registers. These DQS delay elements combine with the PLL’s clocking and phase shift ability to provide a complete hardware solution for interfacing to high-speed memory. The clock phase shift allows the PLL to clock the DQ output enable and output paths. The designer should use the following guidelines to meet

133 MHz performance for DDR SDRAM and FCRAM interfaces:

■ The DQS signal must be in the middle of the DQ group it clocks ■ Resynchronize the incoming data to the logic array clock using successive LE registers or FIFO buffers ■ LE registers must be placed in the LAB adjacent to the DQ I/O pin column it is fed by Figure 2–34 illustrates DDR SDRAM and FCRAM interfacing from the I/O through the dedicated circuitry to the logic array. EP1C6 144-pin TQFP 4 32 240-pin PQFP 4 32 256-pin FineLine BGA 4 32 EP1C12 240-pin PQFP 4 32 256-pin FineLine BGA 4 32 324-pin FineLine BGA 8 64 EP1C20 324-pin FineLine BGA 8 64 400-pin FineLine BGA 8 64 Note to T able 2–10: (1) EP1C3 devices in the 100-pin TQFP package do not have any DQ pin groups in I/O bank 1. Table 2–10. DQ Pin Groups (Part 2 of 2) Device Package Number of × 8 DQ Pin Groups Total DQ Pin Count

Altera Corporation 2–49 May 2008 Preliminary I/O Structure Figure 2–34. DDR SDRAM and FCRAM Interfacing Programmable Drive Strength The output buffer for each Cyclone device I/O pin has a programmable drive strength control for certain I/O standards. The LVTTL and LVCMOS standards have several levels of drive strength that the designer can control. SSTL-3 class I and II, and SSTL-2 class I and II support a minimum setting, the lowest drive strength that guarantees the IOH/IOL VCC GND PLL Phase Shifted -90˚ DQS Adjacent LAB LEs Global Clock Resynchronizing Global Clock Programmable Delay Chain Output LE Register Output LE Registers DQ Input LE Registers Input LE Registers LE Register LE Register Δ t Adjacent LAB LEs OE OE LE Register OE LE Register OE OE LE Register OE LE Register Output LE Registers Output LE Register DataA DataB clk -90˚ clk

2–50 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 of the standard. Using minimum settings provides signal slew rate control to reduce system noise and signal overshoot. Table 2–11 shows the possible settings for the I/O standards with drive strength control. Open-Drain Output Cyclone devices provide an optional open-drain (equivalent to an open-collector) output for each I/O pin. This open-drain output enables the device to provide system-level control signals (e.g., interrupt and write-enable signals) that can be asserted by any of several devices. Table 2–11. Programmable Drive Strength Note (1) I/O Standard IOH/IOL Current Strength Setting (mA) LVTTL (3.3 V) 4 24(2) LVCMOS (3.3 V) 2 12(2) LVTTL (2.5 V) 2 16(2) LVTTL (1.8 V) 2 12(2) LVCMOS (1.5 V) 2 8(2) Notes to Tab le 2 –11: (1) SSTL-3 class I and II, SSTL-2 class I an d II, and 3.3-V PCI I/O Standards do not support programmable drive strength. (2) This is the default current strength setting in the Quartus II software.

Altera Corporation 2–51 May 2008 Preliminary I/O Structure Slew-Rate Control The output buffer for each Cyclone device I/O pin has a programmable output slew-rate control that can be configured for low noise or high-speed performance. A faster slew rate provides high-speed transitions for high-performance systems. However, these fast transitions may introduce noise transients into the system. A slow slew rate reduces system noise, but adds a nominal delay to rising and falling edges. Each I/O pin has an individual slew-rate control, allowing the designer to specify the slew rate on a pin-by-pin basis. The slew-rate control affects both the rising and falling edges. Bus Hold Each Cyclone device I/O pin provides an optional bus-hold feature. The bus-hold circuitry can hold the signal on an I/O pin at its last-driven state. Since the bus-hold feature holds the last-driven state of the pin until the next input signal is present, an external pull-up or pull-down resistor is not necessary to hold a signal level when the bus is tri-stated. The bus-hold circuitry also pulls undriven pins away from the input threshold voltage where noise can cause unintended high-frequency switching. The designer can select this feature individually for each I/O pin. The bus-hold output will drive no higher than V CCIO to prevent overdriving signals. If the bus-hold feature is enabled, the device cannot use the programmable pull-up option. Disable the bus-hold feature when the I/O pin is configured for differential signals. The bus-hold circuitry uses a resistor with a nominal resistance (RBH) of approximately 7 kΩ to pull the signal level to the last-driven state. Table 4–15 on page 4–6 gives the specific sustaining current for each VCCIO voltage level driven through this resistor and overdrive current used to identify the next-driven input level. The bus-hold circuitry is only active after configuration. When going into user mode, the bus-hold circuit captures the value on the pin present at the end of configuration. Programmable Pull-Up Resistor Each Cyclone device I/O pin provides an optional programmable pull-up resistor during user mode. If the designer enables this feature for an I/O pin, the pull-up resistor (typically 25 kΩ) holds the output to the VCCIO level of the output pin's bank. Dedicated clock pins do not have the optional programmable pull-up resistor.

2–52 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Advanced I/O Standard Support Cyclone device IOEs support the following I/O standards: ■ 3.3-V LVTTL/LVCMOS ■ 2.5-V LVTTL/LVCMOS ■ 1.8-V LVTTL/LVCMOS ■ 1.5-V LVCMOS ■ 3.3-V PCI ■ LVDS ■ RSDS ■ SSTL-2 class I and II ■ SSTL-3 class I and II ■ Differential SSTL-2 class II (on output clocks only) Table 2–12 describes the I/O standards supported by Cyclone devices. Cyclone devices contain four I/O banks, as shown in Figure 2–35. I/O banks 1 and 3 support all the I/O standards listed in Table 2–12. I/O banks 2 and 4 support all the I/O standards listed in Table 2–12 except the 3.3-V PCI standard. I/O banks 2 and 4 contain dual-purpose DQS, DQ, Table 2–12. Cyclone I/O Standards I/O Standard Type Input Reference Voltage (VREF) (V) Output Supply Voltage (VCCIO) (V) Board Termination Voltage (VTT) (V) 3.3-V LVTTL/LVCMOS Single-ended N/A 3.3 N/A 2.5-V LVTTL/LVCMOS Single-ended N/A 2.5 N/A 1.8-V LVTTL/LVCMOS Single-ended N/A 1.8 N/A 1.5-V LVCMOS Single-ended N/A 1.5 N/A 3.3-V PCI (1) Single-ended N/A 3.3 N/A LVDS (2) Differential N/A 2.5 N/A RSDS (2) Differential N/A 2.5 N/A SSTL-2 class I and II Voltage-referenced 1.25 2.5 1.25 SSTL-3 class I and II Voltage-referenced 1.5 3.3 1.5 Differential SSTL-2 (3) Differential 1.25 2.5 1.25 Notes to T able 2–12: (1) There is no megafunction support for EP1C3 devices for the PCI compiler. However, EP1C3 devices support PCI by using the LVTTL 16-mA I/O standard and drive strength assignments in the Quartus II software. The device requires an external diode for PCI compliance. (2) EP1C3 devices in the 100-pin TQFP package do not support the LVDS and RSDS I/O standards. (3) This I/O standard is only available on output clock pins ( PLL_OUT pins). EP1C3 devices in the 100-pin package do not support this I/O standard as it does not have PLL_OUT pins.

Altera Corporation 2–53 May 2008 Preliminary I/O Structure and DM pins to support a DDR SDRAM or FCRAM interface. I/O bank 1 can also support a DDR SDRAM or FCRAM interface, however, the configuration input pins in I/O bank 1 must operate at 2.5 V . I/O bank 3 can also support a DDR SDRAM or FCRAM interface, however, all the JTAG pins in I/O bank 3 must operate at 2.5 V . Figure 2–35. Cyclone I/O Banks Notes (1), (2) Notes to Figure 2–35: (1) Figure 2–35 is a top view of the silicon die. (2) Figure 2–35 is a graphic representation only. Refer to the pin list and the Quartus II software for exact pin locations. Each I/O bank has its own VCCIO pins. A single device can support 1.5-V , 1.8-V , 2.5-V , and 3.3-V interfaces; each individual bank can support a different standard with different I/O voltages. Each bank also has dual-purpose VREF pins to support any one of the voltage-referenced standards (e.g., SSTL-3) independently. If an I/O bank does not use voltage-referenced standards, the VREF pins are available as user I/O pins. I/O Bank 2 I/O Bank 3 I/O Bank 4 I/O Bank 1 All I/O Banks Support ■ 3.3-V LVTTL/LVCMOS ■ 2.5-V LVTTL/LVCMOS ■ 1.8-V LVTTL/LVCMOS ■ 1.5-V LVCMOS ■ LVDS ■ RSDS ■ SSTL-2 Class I and II ■ SSTL-3 Class I and II I/O Bank 3 Also Supports the 3.3-V PCI I/O Standard I/O Bank 1 Also Supports the 3.3-V PCI I/O Standard Individual Power Bus

2–54 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Each I/O bank can support multiple standards with the same VCCIO for input and output pins. For example, when VCCIO is 3.3-V , a bank can support LVTTL, LVCMOS, 3.3-V PCI, and SSTL-3 for inputs and outputs. LVDS I/O Pins A subset of pins in all four I/O banks supports LVDS interfacing. These dual-purpose LVDS pins require an external-resistor network at the transmitter channels in addition to 100-Ω termination resistors on receiver channels. These pins do not contain dedicated serialization or deserialization circuitry; therefore, internal logic performs serialization and deserialization functions. Table 2–13 shows the total number of supported LVDS channels per device density. MultiVolt I/O Interface The Cyclone architecture supports the MultiVolt I/O interface feature, which allows Cyclone devices in all packages to interface with systems of different supply voltages. The devices have one set of VCC pins for internal operation and input buffers (VCCINT), and four sets for I/O output drivers (VCCIO). Table 2–13. Cyclone Device LVDS Channels Device Pin Count Number of LVDS Channels EP1C3 100 (1) 144 34 EP1C4 324 103 400 129 EP1C6 144 29 240 72 256 72 EP1C12 240 66 256 72 324 103 EP1C20 324 95 400 129 Note to T able 2–13: (1) EP1C3 devices in the 100-pin TQFP package do not support the LVDS I/O standard.

Altera Corporation 2–55 May 2008 Preliminary Power Sequencing and Hot Socketing The Cyclone VCCINT pins must always be connected to a 1.5-V power and 3.3-V tolerant. The VCCIO pins can be connected to either a 1.5-V , 1.8-V , 2.5-V , or 3.3-V power supply, depending on the output requirements. The output levels are compatible with systems of the same voltage as the power supply (i.e., when VCCIO pins are connected to a 1.5-V power supply, the output levels are compatible with 1.5-V systems). When VCCIO pins are connected to a 3.3-V power supply, the output high is 3.3-V and is compatible with 3.3-V or 5.0-V systems. Table 2–14 summarizes Cyclone MultiVolt I/O support. Power Sequencing and Hot Socketing Because Cyclone devices can be used in a mixed-voltage environment, they have been designed specifically to tolerate any possible power-up sequence. Therefore, the VCCIO and VCCINT power supplies may be powered in any order. Signals can be driven into Cyclone devices before and during power up without damaging the device. In addition, Cyclone devices do not drive out during power up. Once operating conditions are reached and the device is configured, Cyclone devices operate as specified by the user. Table 2–14. Cyclone MultiVolt I/O Support Note (1) VCCIO (V) Input Signal Output Signal Notes to T able 2–14: (1) The PCI clamping diode must be disabled to drive an input with voltages higher than VCCIO. (2) When V CCIO = 1.5-V or 1.8-V and a 2.5-V or 3.3-V input signal feeds an input pin, higher pin leakage current is expected. Turn on Allow voltage overdrive for LVTTL / LVCMOS input pins in the Assignments > Device > Device and Pin Options > Pin Placement tab when a device has this I/O combinations. (3) When V CCIO = 1.8-V , a Cyclone device can drive a 1.5-V device with 1.8-V tolerant inputs. (4) When V CCIO = 3.3-V and a 2.5-V input signal feeds an input pin, the VCCIO supply current will be slightly larger than expected. (6) Cyclone devices can be 5.0-V tolerant with the use of an external resistor and the internal PCI clamp diode. (8) When V CCIO = 3.3-V , a Cyclone device can drive a device with 5.0-V LVTTL inputs but not 5.0-V LVCMOS inputs.

2–56 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Referenced Documents This chapter references the following document: ■ Using PLLs in Cyclone Devices chapter in the Cyclone Device Handbook Document Table 2–15 shows the revision history for this chapter. Table 2–15. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.6 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.5

• Added document revision history.
• Updated Figures 2–17, 2–18, 2–19, 2–20, 2–21, and 2–32. August 2005 v1.4 Minor updates. — February 2005 v1.3
• Updated JTAG chain limits. Added test vector information.
• Corrected Figure 2-12.
• Added a note to Tables 2-17 through 2-21 regarding violating the setup or hold time. October 2003 v1.2
• Updated phase shift information.
• Added 64-bit PCI support information. September 2003 v1.1 Updated LVDS data rates to 640 Mbps from 311 Mbps. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

Altera Corporation 3–1 May 2008 Preliminary 3. Configuration and Testing IEEE Std. 1149.1 (JTAG) Boundary Scan Support All Cyclone® devices provide JTAG BST circuitry that complies with the IEEE Std. 1149.1a-1990 specification. JTAG boundary-scan testing can be performed either before or after, but not during configuration. Cyclone devices can also use the JTAG port for configuration together with either the Quartus® II software or hardware using either Jam Files (.jam) or Jam Byte-Code Files (.jbc). Cyclone devices support reconfiguring the I/O standard settings on the IOE through the JTAG BST chain. The JTAG chain can update the I/O standard for all input and output pins any time before or during user mode. Designers can use this ability for JTAG testing before configuration when some of the Cyclone pins drive or receive from other devices on the board using voltage-referenced standards. Since the Cyclone device might not be configured before JTAG testing, the I/O pins might not be configured for appropriate electrical standards for chip-to-chip communication. Programming those I/O standards via JTAG allows designers to fully test I/O connection to other devices. TDO pin voltage is determined by the V CCIO of the bank where it resides. The bank VCCIO selects whether the JTAG inputs are 1.5-V , 1.8-V , 2.5-V , or 3.3-V compatible. Cyclone devices also use the JTAG port to monitor the operation of the device with the SignalTap® II embedded logic analyzer. Cyclone devices support the JTAG instructions shown in Table 3–1. Table 3–1. Cyclone JTAG Instructions (Part 1 of 2) JTAG Instruction Instr uction Code Description SAMPLE/PRELOAD 00 0000 0101 Allows a snapshot of signals at the device pins to be captured and examined during normal device operation, and permits an initial data pattern to be output at the device pins. Also used by the SignalTap II embedded logic analyzer. EXTEST (1) 00 0000 0000 Allows the external circui try and board-level interconnects to be tested by forcing a test pattern at the output pins and capturing test results at the input pins. BYPASS 11 1111 1111 Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST data to pass synchronously through selected devices to adjacent devices during normal device operation. C51003-1.4

3–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 In the Quartus II software, there is an Auto Usercode feature where you can choose to use the checksum value of a programming file as the JTAG user code. If selected, the checksum is automatically loaded to the USERCODE register. Choose Assignments > Device > Device and Pin Options > General. Turn on Auto Usercode. USERCODE 00 0000 0111 Selects the 32-bit USERCODE register and places it between the TDI and TDO pins, allowing the USERCODE to be serially shifted out of TDO. IDCODE 00 0000 0110 Selects the IDCODE register and places it between TDI and TDO, allowing the IDCODE to be serially shifted out of TDO. HIGHZ (1) 00 0000 1011 Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST data to pass synchronously through selected devices to adjacent devices during normal device operation, while tri-stating all of the I/O pins. CLAMP (1) 00 0000 1010 Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST data to pass synchronously through selected devices to adjacent devices during normal device operation while holding I/O pins to a state defined by the data in the boundary-scan register. ICR instructions — Used when configuring a Cyclone device via the JTAG port with a MasterBlasterTM or ByteBlasterMVTM download cable, or when using a Jam File or Jam Byte-Code File via an embedded processor. PULSE_NCONFIG 00 0000 0001 Emulates pulsing the nCONFIG pin low to trigger reconfiguration even though the physical pin is unaffected. CONFIG_IO 00 0000 1101 Allows configuration of I/O standards through the JTAG chain for JTAG testing. Can be executed before, after, or during configuration. Stops configuration if executed during configuration. Once issued, the CONFIG_IO instruction will hold nSTATUS low to reset the configuration device. nSTATUS is held low until the device is reconfigured. SignalTap II instructions — Monitors internal device operation with the SignalTap II embedded logic analyzer. Note to Table 3–1: (1) Bus hold and weak pull-up resistor feat ures override the high-impedance state of HIGHZ, CLAMP, and EXTEST. Table 3–1. Cyclone JTAG Instructions (Part 2 of 2) JTAG Instruction Instr uction Code Description

Altera Corporation 3–3 May 2008 Preliminary IEEE Std. 1149.1 (JTAG) Boundary Scan Support The Cyclone device instruction register length is 10 bits and the USERCODE register length is 32 bits. Tables 3–2 and 3–3 show the boundary-scan register length and device IDCODE information for Cyclone devices. Table 3–2. Cyclone Boundary-Scan Register Length Device Boundary-Scan Register Length EP1C3 339 EP1C4 930 EP1C6 582 EP1C12 774 EP1C20 930 Table 3–3. 32-Bit Cyclone Device IDCODE Device IDCODE (32 bits) (1) Version (4 Bits) Part Number (16 Bits) Manufacturer Identity (11 Bits) LSB (1 Bit) (2) EP1C3 0000 0010 0000 1000 0001 000 0110 1110 1 EP1C4 0000 0010 0000 1000 0101 000 0110 1110 1 EP1C6 0000 0010 0000 1000 0010 000 0110 1110 1 EP1C12 0000 0010 0000 1000 0011 000 0110 1110 1 EP1C20 0000 0010 0000 1000 0100 000 0110 1110 1 Notes to Tab le 3– 3: (1) The most significant bit (MSB) is on the left. (2) The IDCODE’s least significant bit (LSB) is always 1.

Altera Corporation 3–5 May 2008 Preliminary SignalTap II Embedded Logic Analyzer

1 Cyclone devices must be within the first 8 devices in a JTAG

chain. All of these devices have the same JTAG controller. If any of the Cyclone devices are in the 9th or after they will fail configuration. This does not affect the SignalTap® II logic analyzer. f For more information on JTAG, refer to the following documents: ■ AN 39: IEEE Std. 1149.1 (JTAG) Boundary-Scan Testing in Altera Devices ■ Jam Programming & Test Language Specification SignalTap II Embedded Logic Analyzer Cyclone devices feature the SignalTap II embedded logic analyzer, which monitors design operation over a period of time through the IEEE Std. 1149.1 (JTAG) circuitry. A designer can analyze internal logic at speed without bringing internal signals to the I/O pins. This feature is particularly important for advanced packages, such as FineLine BGA packages, because it can be difficult to add a connection to a pin during the debugging process after a board is designed and manufactured. Configuration The logic, circuitry, and interconnects in the Cyclone architecture are configured with CMOS SRAM elements. Altera FPGAs are reconfigurable and every device is tested with a high coverage production test program so the designer does not have to perform fault testing and can instead focus on simulation and design verification. Cyclone devices are configured at system power-up with data stored in an Altera configuration device or provided by a system controller. The Cyclone device's optimized interface allows the device to act as controller in an active serial configuration scheme with the new low-cost serial configuration device. Cyclone devices can be configured in under 120 ms using serial data at 20 MHz. The serial configuration device can be programmed via the ByteBlaster II download cable, the Altera Programming Unit (APU), or third-party programmers. In addition to the new low-cost serial configuration device, Altera offers in-system programmability (ISP)-capable configuration devices that can configure Cyclone devices via a serial data stream. The interface also enables microprocessors to treat Cyclone devices as memory and configure them by writing to a virtual memory location, making reconfiguration easy. After a Cyclone device has been configured, it can be reconfigured in-circuit by resetting the device and loading new data. Real-time changes can be made during system operation, enabling innovative reconfigurable computing applications.

3–6 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Operating Modes The Cyclone architecture uses SRAM configuration elements that require configuration data to be loaded each time the circuit powers up. The process of physically loading the SRAM data into the device is called configuration. During initialization, which occurs immediately after configuration, the device resets registers, enables I/O pins, and begins to operate as a logic device. Together, the configuration and initialization processes are called command mode. Normal device operation is called user mode. SRAM configuration elements allow Cyclone devices to be reconfigured in-circuit by loading new configuration data into the device. With real- time reconfiguration, the device is forced into command mode with a device pin. The configuration process loads different configuration data, reinitializes the device, and resumes user-mode operation. Designers can perform in-field upgrades by distributing new configuration files either within the system or remotely. A built-in weak pull-up resistor pulls all user I/O pins to V CCIO before and during device configuration. The configuration pins support 1.5-V/1.8-V or 2.5-V/3.3-V I/O standards. The voltage level of the configuration output pins is determined by the V CCIO of the bank where the pins reside. The bank VCCIO selects whether the configuration inputs are 1.5-V , 1.8-V , 2.5-V , or 3.3-V compatible. Configuration Schemes Designers can load the configuration data for a Cyclone device with one of three configuration schemes (see Table 3–5), chosen on the basis of the target application. Designers can use a configuration device, intelligent controller, or the JTAG port to configure a Cyclone device. A low-cost configuration device can automatically configure a Cyclone device at system power-up.

Altera Corporation 3–7 May 2008 Preliminary Referenced Documents Multiple Cyclone devices can be configured in any of the three configuration schemes by connecting the configuration enable (nCE) and configuration enable output (nCEO) pins on each device. Referenced Documents This chapter references the following documents: ■ AN 39: IEEE Std. 1149.1 (JTAG) Boundary-Scan Testing in Altera Devices ■ Jam Programming & Test Language Specification Document Table 3–6 shows the revision history for this chapter. Table 3–5. Data Sources for Configuration Configuration Scheme Data Source Active serial Low-cost serial configuration device Passive serial (PS) Enhanced or EPC2 configuration device, MasterBlaster or ByteBlasterMV download cable, or serial data source JTAG MasterBlaster or ByteBlasterMV download cable or a microprocessor with a Jam or JBC file Table 3–6. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.4 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.3

• Added document revision history.
• Updated handpara note below Table 3–4. August 2005 V1.2 Minor updates. — February 2005 V1.1 Updated JTAG chain limits. Added information concerning test vectors. May 2003 v1.0 Added document to Cyclone Device Handbook. —

3–8 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1

Altera Corporation 4–1 May 2008 Preliminary 4. DC and Switching Characteristics Operating Conditions Cyclone® devices are offered in both commercial, industrial, and extended temperature grades. However, industrial-grade and extended- temperature-grade devices may have limited speed-grade availability. Tables 4–1 through 4–16 provide information on absolute maximum ratings, recommended operating conditions, DC operating conditions, and capacitance for Cyclone devices. Table 4–1. Cyclone Device Absolute Maximum Ratings Notes (1), (2) Symbol Parameter Conditions Minimum Maximum Unit VCCINT Supply voltage With respect to ground (3) –0.5 2.4 V VCCIO –0.5 4.6 V VCCA Supply voltage With respect to ground (3) –0.5 2.4 V VI DC input voltage –0.5 4.6 V IOUT DC output current, per pin –25 25 mA TSTG Storage temperature No bias –65 150 °C TAMB Ambient temperature Under bias –65 135 °C TJ Junction temperature BGA packages under bias — 135 °C Table 4–2. Cyclone Device Recommended Operating Conditions (Part 1 of 2) Symbol Parameter Conditions Minimum Maximum Unit VCCINT Supply voltage for internal logic and input buffers (4) 1.425 1.575 V VCCIO Supply voltage for output buffers, 3.3-V operation (4) 3.00 3.60 V Supply voltage for output buffers, 2.5-V operation (4) 2.375 2.625 V Supply voltage for output buffers, 1.8-V operation (4) 1.71 1.89 V Supply voltage for output buffers, 1.5-V operation (4) 1.4 1.6 V V I Input voltage (3), (5) –0.5 4.1 V C51004-1.7

4–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 VO Output voltage 0 V CCIO V TJ Operating junction temperature For commercial use 08 5 ° C For industrial use –40 100 ° C For extended- temperature use –40 125 ° C Table 4–3. Cyclone Device DC Operating Conditions Note (6) Symbol Parameter Conditions Minimum Typical Maximum Unit II Input pin leakage current V I = VCCIOmax to 0 V (8) –10 — 10 μA IOZ Tri-stated I/O pin leakage current VO = VCCIOmax to 0 V (8) –10 — 10 μA ICC0 VCC supply current (standby) (All M4K blocks in power-down mode) (7) EP1C3 — 4 — mA EP1C4 — 6 — mA EP1C6 — 6 — mA EP1C12 — 8 — mA EP1C20 — 12 — mA RCONF (9) Value of I/O pin pull-up resistor before and during configuration VI = 0 V; VCCI0 = 3.3 V 15 25 50 k Ω VI = 0 V; VCCI0 = 2.5 V 20 45 70 k Ω VI = 0 V; VCCI0 = 1.8 V 30 65 100 k Ω VI = 0 V; VCCI0 = 1.5 V 50 100 150 k Ω Recommended value of I/O pin external pull-down resistor before and during configuration —— 12 k Ω Table 4–4. LVTTL Specifications Symbol Parameter Conditions Minimum Maximum Unit VCCIO Output supply voltage — 3.0 3.6 V VIH High-level input voltage — 1.7 4.1 V VIL Low-level input voltage — –0.5 0.7 V VOH High-level output voltage I OH = –4 to –24 mA (11) 2.4 — V VOL Low-level output voltage I OL = 4 to 24 mA (11) —0 . 4 5 V Table 4–2. Cyclone Device Recommended Operating Conditions (Part 2 of 2) Symbol Parameter Conditions Minimum Maximum Unit

Altera Corporation 4–3 May 2008 Preliminary Operating Conditions Table 4–5. LVCMOS Specifications Symbol Parameter Conditions Minimum Maximum Unit VCCIO Output supply voltage — 3.0 3.6 V VIH High-level input voltage — 1.7 4.1 V VIL Low-level input voltage — –0.5 0.7 V VOH High-level output voltage V CCIO = 3.0, IOH = –0.1 mA VCCIO – 0.2 — V VOL Low-level output voltage V CCIO = 3.0, IOL = 0.1 mA —0 . 2 V Table 4–6. 2.5-V I/O Specifications Symbol Parameter Conditions Minimum Maximum Unit VCCIO Output supply voltage — 2.375 2.625 V VIH High-level input voltage — 1.7 4.1 V VIL Low-level input voltage — –0.5 0.7 V VOH High-level output voltage I OH = –0.1 mA 2.1 — V IOH = –1 mA 2.0 — V IOH = –2 to –16 mA (11) 1.7 — V VOL Low-level output voltage I OL = 0.1 mA — 0.2 V IOH = 1 mA — 0.4 V IOH = 2 to 16 mA (11) —0 . 7 V Table 4–7. 1.8-V I/O Specifications Symbol Parameter Conditions Minimum Maximum Unit VCCIO Output supply voltage — 1.65 1.95 V VIH High-level input voltage — 0.65 × VCCIO 2.25 (12) V VIL Low-level input voltage — –0.3 0.35 × VCCIO V VOH High-level output voltage I OH = –2 to –8 mA (11) VCCIO – 0.45 — V VOL Low-level output voltage I OL = 2 to 8 mA (11) —0 . 4 5 V

4–4 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Table 4–8. 1.5-V I/O Specifications Symbol Parameter Conditions Minimum Maximum Unit VCCIO Output supply voltage — 1.4 1.6 V VIH High-level input voltage — 0.65 × VCCIO VCCIO + 0.3 (12) V VIL Low-level input voltage — –0.3 0.35 × VCCIO V VOH High-level output voltage I OH = –2 mA (11) 0.75 × VCCIO VOL Low-level output voltage I OL = 2 mA (11) —0 . 2 5 × VCCIO V Table 4–9. 2.5-V LVDS I/O Specifications Note (13) Symbol Parameter Conditions Minimum Typical Maximum Unit VCCIO I/O supply voltage — 2.375 2.5 2.625 V VOD Differential output voltage R L = 100 Ω 250 — 550 mV Δ VOD Change in VOD between high and low RL = 100 Ω ——5 0 m V VOS Output offset voltage R L = 100 Ω 1.125 1.25 1.375 V Δ VOS Change in VOS between high and low RL = 100 Ω ——5 0 m V VTH Differential input threshold V CM = 1.2 V –100 — 100 mV VIN Receiver input voltage range —0 . 0 — 2 . 4 V RL Receiver differential input resistor — 90 100 110 Ω Table 4–10. 3.3-V PCI Specifications (Part 1 of 2) Symbol Parameter Conditions Minimum Typical Maximum Unit VCCIO Output supply voltage — 3.0 3.3 3.6 V VIH High-level input voltage — 0.5 × VCCIO —V CCIO + 0.5 V VIL Low-level input voltage — –0.5 — 0.3 × VCCIO V

Altera Corporation 4–5 May 2008 Preliminary Operating Conditions VOH High-level output voltage I OUT = –500 μA0 . 9 × VCCIO —— V VOL Low-level output voltage I OUT = 1,500 μA— — 0 . 1 × VCCIO V Table 4–11. SSTL-2 Class I Specifications Symbol Parameter Conditions Minimum Typical Maximum Unit VCCIO Output supply voltage — 2.375 2.5 2.625 V VTT Termination voltage — V REF – 0.04 V REF VREF + 0.04 V VREF Reference voltage — 1.15 1.25 1.35 V VIH High-level input voltage — V REF + 0.18 — 3.0 V VIL Low-level input voltage — –0.3 — V REF – 0.18 V VOH High-level output voltage I OH = –8.1 mA (11) VTT + 0.57 — — V VOL Low-level output voltage I OL = 8.1 mA (11) —— V TT – 0.57 V Table 4–12. SSTL-2 Class II Specifications Symbol Parameter Conditions Minimum Typical Maximum Unit VCCIO Output supply voltage — 2.3 2.5 2.7 V VTT Termination voltage — V REF – 0.04 V REF VREF + 0.04 V VREF Reference voltage — 1.15 1.25 1.35 V VIH High-level input voltage — V REF + 0.18 — V CCIO + 0.3 V VIL Low-level input voltage — –0.3 — V REF – 0.18 V VOH High-level output voltage I OH = –16.4 mA (11) VTT + 0.76 — — V VOL Low-level output voltage I OL = 16.4 mA (11) —— V TT – 0.76 V Table 4–13. SSTL-3 Class I Specifications (Part 1 of 2) Symbol Parameter Conditions Minimum Typical Maximum Unit VCCIO Output supply voltage — 3.0 3.3 3.6 V VTT Termination voltage — V REF – 0.05 V REF VREF + 0.05 V Table 4–10. 3.3-V PCI Specifications (Part 2 of 2) Symbol Parameter Conditions Minimum Typical Maximum Unit

4–6 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 VREF Reference voltage — 1.3 1.5 1.7 V VIH High-level input voltage — V REF + 0.2 — V CCIO + 0.3 V VIL Low-level input voltage — –0.3 — V REF – 0.2 V VOH High-level output voltage I OH = –8 mA (11) VTT + 0.6 — — V VOL Low-level output voltage I OL = 8 mA (11) —— V TT – 0.6 V Table 4–14. SSTL-3 Class II Specifications Symbol Parameter Conditions Minimum Typical Maximum Unit VCCIO Output supply voltage — 3.0 3.3 3.6 V VTT Termination voltage — V REF – 0.05 V REF VREF + 0.05 V VREF Reference voltage — 1.3 1.5 1.7 V VIH High-level input voltage — V REF + 0.2 — V CCIO + 0.3 V VIL Low-level input voltage — –0.3 — V REF – 0.2 V VOH High-level output voltage I OH = –16 mA (11) VTT + 0.8 — — V VOL Low-level output voltage I OL = 16 mA (11) —— V TT – 0.8 V Table 4–15. Bus Hold Parameters Parameter Conditions VCCIO Level Unit1 . 5 V1 . 8 V2 . 5 V3 . 3 V Min Max Min Max Min Max Min Max Low sustaining current VIN > VIL (maximum) High sustaining current VIN < VIH (minimum) Low overdrive current

0 V < VIN <

Table 4–13. SSTL-3 Class I Specifications (Part 2 of 2) Symbol Parameter Conditions Minimum Typical Maximum Unit

Altera Corporation 4–7 May 2008 Preliminary Operating Conditions Table 4–16. Cyclone Device Capacitance Note (14) Symbol Parameter Typical Unit CIO Input capacitance for user I/O pin 4.0 pF CLVDS Input capacitance for dual-purpose LVDS/user I/O pin 4.7 pF CVREF Input capacitance for dual-purpose VREF /user I/O pin. 12.0 pF CDPCLK Input capacitance for dual-purpose DPCLK/user I/O pin. 4.4 pF CCLK Input capacitance for CLK pin. 4.7 pF Notes to Tab les 4 –1 through 4–16: (1) Refer to the Operating Requirements for Altera Devices Data Sheet. (2) Conditions beyond those listed in Table 4–1 may cause permanent damage to a device. Additionally, device operation at the absolute maximum ratings for extended periods of time may have adverse affects on the device. (3) Minimum DC input is –0.5 V . During transitions, the in puts may undershoot to –2.0 V or overshoot to 4.6 V for input currents less than 100 mA and periods shorter than 20 ns. (4) Maximum V CC rise time is 100 ms, and VCC must rise monotonically. (5) All pins, including dedicated inputs, clock, I/O, and JTAG pins, may be driven before VCCINT and VCCIO are powered. (7) V I = ground, no load, no toggling inputs. (8) This value is specified for normal device operation. The value may vary during power-up. This applies for all (9) R CONF is the measured value of internal pull-up resistance when the I/O pin is tied directly to GND. RCONF value will be lower if an external source drives the pin higher than VCCIO . (10) Pin pull-up resistance values will lower if an external source drives the pin higher than VCCIO. (11) Drive strength is programmable according to values in Cyclone Architecture chapter in the Cyclone Device Handbook. voltage overdrive” for LVTTL/LVCMOS input pins in the Assignments > Device > Device and Pin Options > Pin Placement tab when a device has this I/O combination. However, higher leakage current is expected. (13) The Cyclone LVDS interface requires a resist or network outside of the transmitter channels. (14) Capacitance is sample-tested only. Capacitance is me asured using time-domain reflections (TDR). Measurement accuracy is within ±0.5 pF.

4–8 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Power Consumption Designers can use the Altera web Early Power Estimator to estimate the device power. Cyclone devices require a certain amount of power-up current to successfully power up because of the nature of the leading-edge process on which they are fabricated. Table 4–17 shows the maximum power-up current required to power up a Cyclone device. Designers should select power supplies and regulators that can supply this amount of current when designing with Cyclone devices. This specification is for commercial operating conditions. Measurements were performed with an isolated Cyclone device on the board. Decoupling capacitors were not used in this measurement. To factor in the current for decoupling capacitors, sum up the current for each capacitor using the following equation: I = C (dV/dt) The exact amount of current that is consumed varies according to the process, temperature, and power ramp rate. If the power supply or regulator can supply more current than required, the Cyclone device may consume more current than the maximum current specified in Table 4–17. However, the device does not require any more current to successfully power up than what is listed in Table 4–17. The duration of the I CCINT power-up requirement depends on the VCCINT voltage supply rise time. The power-up current consumption drops when the VCCINT supply reaches approximately 0.75 V . For example, if the VCCINT rise time has a linear rise of 15 ms, the current consumption spike drops by 7.5 ms. Table 4–17. Cyclone Maximum Power-Up Current (ICCINT) Requirements (In-Rush Current) Device Commercial Specification Industrial Specification Unit EP1C3 150 180 mA EP1C4 150 180 mA EP1C6 175 210 mA EP1C12 300 360 mA EP1C20 500 600 mA Notes to T able 4–17: (1) The Cyclone devices (except for the EP1C20 devi ce) meet the power up specification for Mini PCI. (2) The lot codes 9G0082 to 9G2999, or 9G3109 and later comply to the specifications in Table 4–17 and meet the Mini PCI specification. Lot codes appear at the top of the device. (3) The lot codes 9H0004 to 9H29999, or 9H3014 and later comply to the specifications in this table and meet the Mini PCI specification. Lot codes appear at the top of the device.

Altera Corporation 4–9 May 2008 Preliminary Timing Model Typically, the user-mode current during device operation is lower than the power-up current in Table 4–17. Altera recommends using the Cyclone Power Calculator, available on the Altera web site, to estimate the user-mode ICCINT consumption and then select power supplies or regulators based on the higher value. Timing Model The DirectDrive technology and MultiTrack interconnect ensure predictable performance, accurate simulation, and accurate timing analysis across all Cyclone device densities and speed grades. This section describes and specifies the performance, internal, external, and PLL timing specifications. All specifications are representative of worst-case supply voltage and junction temperature conditions. Preliminary and Final Timing Timing models can have either preliminary or final status. The Quartus® II software issues an informational message during the design compilation if the timing models are preliminary. Table 4–18 shows the status of the Cyclone device timing models. Preliminary status means the timing model is subject to change. Initially, timing numbers are created using simulation results, process data, and other known parameters. These tests are used to make the preliminary numbers as close to the actual timing parameters as possible. Final timing numbers are based on actual device operation and testing. These numbers reflect the actual performance of the device under worst-case voltage and junction temperature conditions. Table 4–18. Cyclone Device Timing Model Status Device Preliminary Final EP1C3 — v EP1C4 — v EP1C6 — v EP1C12 — v EP1C20 — v

4–10 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Performance The maximum internal logic array clock tree frequency is limited to the specifications shown in Table 4–19. Table 4–20 shows the Cyclone device performance for some common designs. All performance values were obtained with the Quartus II software compilation of library of parameterized modules (LPM) functions or megafunctions. These performance values are based on EP1C6 devices in 144-pin TQFP packages. Table 4–19. Clock Tree Maximum Performance Specification Parameter Definition -6 Speed Grade -7 Speed Grade -8 Speed Grade Units Min Typ Max Min Typ Max Min Typ Max Clock tree fMAX Maximum frequency that the clock tree can support for clocking registered logic Table 4–20. Cyclone Device Performance Resource Used Design Size and Function Mode Resources Used Performance LEs M4K Memory Bits M4K Memory Blocks -6 Speed Grade (MHz) -7 Speed Grade (MHz) -8 Speed Grade (MHz) LE 16-to-1 multiplexer — 21 — — 405.00 320.00 275.00 32-to-1 multiplexer — 44 — — 317.36 284.98 260.15 16-bit counter — 16 — — 405.00 320.00 275.00 64-bit counter (1) — 66 — — 208.99 181.98 160.75

Altera Corporation 4–11 May 2008 Preliminary Timing Model Internal Timing Parameters Internal timing parameters are specified on a speed grade basis independent of device density. Tables 4–21 through 4–24 describe the Cyclone device internal timing microparameters for LEs, IOEs, M4K memory structures, and MultiTrack interconnects. M4K memory block RAM 128 × 36 bit Single port — 4,608 1 256.00 222.67 197.01 RAM 128 × 36 bit Simple dual-port mode — 4,608 1 255.95 222.67 196.97 RAM 256 × 18 bit True dual- port mode — 4,608 1 255.95 222.67 196.97 FIFO 128 × 36 bit — 40 4,608 1 256.02 222.67 197.01 Shift register 9×4×1 2 8 Shift register 11 4,536 1 255.95 222.67 196.97 Note to Table 4–20: (1) The performance numbers for this function are from an EP1C6 device in a 240-pin PQFP package. Table 4–20. Cyclone Device Performance Resource Used Design Size and Function Mode Resources Used Performance LEs M4K Memory Bits M4K Memory Blocks -6 Speed Grade (MHz) -7 Speed Grade (MHz) -8 Speed Grade (MHz) Table 4–21. LE Internal Timing Microparameter Descriptions Symbol Parameter tSU LE register setup time before clock tH LE register hold time after clock tCO LE register clock-to-output delay tLUT LE combinatorial LUT delay for data-in to data-out tCLR Minimum clear pulse width tPRE Minimum preset pulse width tCLKHL Minimum clock high or low time

4–12 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Table 4–22. IOE Internal Timing Microparameter Descriptions Symbol Parameter tSU IOE input and output register setup time before clock tH IOE input and output register hold time after clock tCO IOE input and output register clock-to-output delay tPIN2COMBOUT_R Row input pin to IOE combinatorial output tPIN2COMBOUT_C Column input pin to IOE combinatorial output tCOMBIN2PIN_R Row IOE data input to combinatorial output pin tCOMBIN2PIN_C Column IOE data input to combinatorial output pin tCLR Minimum clear pulse width tPRE Minimum preset pulse width tCLKHL Minimum clock high or low time Table 4–23. M4K Block Internal Timing Microparameter Descriptions Symbol Parameter tM4KRC Synchronous read cycle time tM4KWC Synchronous write cycle time tM4KWERESU Write or read enable setup time before clock tM4KWEREH Write or read enable hold time after clock tM4KBESU Byte enable setup time before clock tM4KBEH Byte enable hold time after clock tM4KDATAASU A port data setup time before clock tM4KDAT AAH A port data hold time after clock tM4KADDRASU A port address setup time before clock tM4KADDRAH A port address hold time after clock tM4KDATABSU B port data setup time before clock tM4KDAT ABH B port data hold time after clock tM4KADDRBSU B port address setup time before clock tM4KADDRBH B port address hold time after clock tM4KDAT ACO1 Clock-to-output delay when using output registers tM4KDAT ACO2 Clock-to-output delay without output registers tM4KCLKHL Minimum clock high or low time tM4KCLR Minimum clear pulse width

4–14 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Internal timing parameters are specified on a speed grade basis independent of device density. Tables 4–25 through 4–28 show the internal timing microparameters for LEs, IOEs, TriMatrix memory structures, DSP blocks, and MultiTrack interconnects. Table 4–25. LE Internal Timing Microparameters Symbol -6 -7 -8 Unit M i nM a xM i nM a xM i nM a x tSU 29 — 33 — 37 — ps tH 12 — 13 — 15 — ps tCO — 173 — 198 — 224 ps tLUT — 454 — 522 — 590 ps tCLR 129 — 148 — 167 — ps tPRE 129 — 148 — 167 — ps tCLKHL 1,234 — 1,562 — 1,818 — ps Table 4–26. IOE Internal Timing Microparameters Symbol -6 -7 -8 Unit M i nM a xM i nM a xM i nM a x tSU 348 — 400 — 452 — ps tH 0—0—0— p s tCO — 511 — 587 — 664 ps tPIN2COMBOUT_R — 1,130 — 1,299 — 1,469 ps tPIN2COMBOUT_C — 1,135 — 1,305 — 1,475 ps tCOMBIN2PIN_R — 2,627 — 3,021 — 3,415 ps tCOMBIN2PIN_C — 2,615 — 3,007 — 3,399 ps tCLR 280 — 322 — 364 — ps tPRE 280 — 322 — 364 — ps tCLKHL 1,234 — 1,562 — 1,818 — ps

Altera Corporation 4–15 May 2008 Preliminary Timing Model External Timing Parameters External timing parameters are specified by device density and speed grade. Figure 4–2 shows the timing model for bidirectional IOE pin timing. All registers are within the IOE. Table 4–27. M4K Block Internal Timing Microparameters Symbol -6 -7 -8 Unit M i nM a xM i nM a xM i nM a x tM4KRC — 4,379 5,035 5,691 ps tM4KWC — 2,910 3,346 3,783 ps tM4KWERESU 72 — 82 — 93 — ps tM4KWEREH 43 — 49 — 55 — ps tM4KBESU 72 — 82 — 93 — ps tM4KBEH 43 — 49 — 55 — ps tM4KDATAASU 72 — 82 — 93 — ps tM4KDAT AAH 43 — 49 — 55 — ps tM4KADDRASU 72 — 82 — 93 — ps tM4KADDRAH 43 — 49 — 55 — ps tM4KDATABSU 72 — 82 — 93 — ps tM4KDAT ABH 43 — 49 — 55 — ps tM4KADDRBSU 72 — 82 — 93 — ps tM4KADDRBH 43 — 49 — 55 — ps tM4KDAT ACO1 — 621 — 714 — 807 ps tM4KDAT ACO2 — 4,351 — 5,003 — 5,656 ps tM4KCLKHL 1,234 — 1,562 — 1,818 — ps tM4KCLR 286 — 328 — 371 — ps Table 4–28. Routing Delay Internal Timing Microparameters Symbol -6 -7 -8 Unit M i nM a xM i nM a xM i nM a x tR4 — 261 — 300 — 339 ps tC4 — 338 — 388 — 439 ps tLOCAL — 244 — 281 — 318 ps

4–16 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 4–2. External Timing in Cyclone Devices All external I/O timing parameters shown are for 3.3-V LVTTL I/O standard with the maximum current strength and fast slew rate. For external I/O timing using standards other than LVTTL or for different current strengths, use the I/O standard input and output delay adders in Tables 4–40 through 4–44. Table 4–29 shows the external I/O timing parameters when using global clock networks. PRN CLRN DQ PRN CLRN DQ PRN CLRN DQ Dedicated Clock Bidirectional Pin Output Register Input Register OE Register tXZ tZX tINSU tINH tOUTCO Table 4–29. Cyclone Global Clock External I/O Timing Parameters Notes (1), (2) (Part 1 of 2) Symbol Parameter Conditions tINSU Setup time for input or bidirectional pin using IOE input register with global clock fed by CLK pin tINH Hold time for input or bidirectional pin using IOE input register with global clock fed by CLK pin tOUTCO Clock-to-output delay output or bidirectional pin using IOE output register with global clock fed by CLK pin CLOAD = 10 pF tINSUPLL Setup time for input or bidirectional pin using IOE input register with global clock fed by Enhanced PLL with default phase setting tINHPLL Hold time for input or bidirectional pin using IOE input register with global clock fed by enhanced PLL with default phase setting

Altera Corporation 4–17 May 2008 Preliminary Timing Model Tables 4–30 through 4–31 show the external timing parameters on column and row pins for EP1C3 devices. tOUTCOPLL Clock-to-output delay output or bidirectional pin using IOE output register with global clock enhanced PLL with default phase setting CLOAD = 10 pF Notes to T able 4–29: (1) These timing parameters are sample-tested only. (2) These timing parameters are for IOE pins using a 3.3-V LVTTL, 24-mA setting. Designers should use the Quartus II software to verify the external timing for any pin. Table 4–29. Cyclone Global Clock External I/O Timing Parameters Notes (1), (2) (Part 2 of 2) Symbol Parameter Conditions Table 4–30. EP1C3 Column Pin Global Clock External I/O Timing Parameters Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 3.085 — 3.547 — 4.009 — ns tINH 0.000 — 0.000 — 0.000 — ns tINSUPLL 1.795 — 2.063 — 2.332 — ns tINHPLL 0.000 — 0.000 — 0.000 — ns Table 4–31. EP1C3 Row Pin Global Clock External I/O Timing Parameters Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 3.157 — 3.630 — 4.103 — ns tINH 0.000 — 0.000 — 0.000 — ns tINSUPLL 1.867 — 2.146 — 2.426 — ns tINHPLL 0.000 — 0.000 — 0.000 — ns

4–18 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Tables 4–32 through 4–33 show the external timing parameters on column and row pins for EP1C4 devices. Table 4–32. EP1C4 Column Pin Global Clock External I/O Timing Parameters Note (1) Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 2.471 — 2.841 — 3.210 — ns tINH 0.000 — 0.000 — 0.000 — ns tINSUPLL 1.471 — 1.690 — 1.910 — ns tINHPLL 0.000 — 0.000 — 0.000 — ns Table 4–33. EP1C4 Row Pin Global Clock External I/O Timing Parameters Note (1) Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 2.600 — 2.990 — 3.379 — ns tINH 0.000 — 0.000 — 0.000 — ns tINSUPLL 1.300 — 1.494 — 1.689 — ns tINHPLL 0.000 — 0.000 — 0.000 — ns Note to Tables 4–32 and 4–33: (1) Contact Altera Applications fo r EP1C4 device timing parameters.

Altera Corporation 4–19 May 2008 Preliminary Timing Model Tables 4–34 through 4–35 show the external timing parameters on column and row pins for EP1C6 devices. Tables 4–36 through 4–37 show the external timing parameters on column and row pins for EP1C12 devices. Table 4–34. EP1C6 Column Pin Global Clock External I/O Timing Parameters Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 2.691 — 3.094 — 3.496 — ns tINH 0.000 — 0.000 — 0.000 — ns tINSUPLL 1.513 — 1.739 — 1.964 — ns tINHPLL 0.000 — 0.000 — 0.000 — ns Table 4–35. EP1C6 Row Pin Global Clock External I/O Timing Parameters Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 2.774 — 3.190 — 3.605 — ns tINH 0.000 — 0.000 — 0.000 — ns tINSUPLL 1.596 — 1.835 — 2.073 — ns tINHPLL 0.000 — 0.000 — 0.000 — ns Table 4–36. EP1C12 Column Pin Global Clock External I/O Timing Parameters (Part 1 of 2) Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 2.510 — 2.885 — 3.259 — ns tINH 0.000 — 0.000 — 0.000 — ns tINSUPLL 1.588 — 1.824 — 2.061 — ns

4–20 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Tables 4–38 through 4–39 show the external timing parameters on column and row pins for EP1C20 devices. tINHPLL 0.000 — 0.000 — 0.000 — ns Table 4–37. EP1C12 Row Pin Global Clock External I/O Timing Parameters Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 2.620 — 3.012 — 3.404 — ns tINH 0.000 — 0.000 — 0.000 — ns tINSUPLL 1.698 — 1.951 — 2.206 — ns tINHPLL 0.000 — 0.000 — 0.000 — ns Table 4–38. EP1C20 Column Pin Global Clock External I/O Timing Parameters Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 2.417 — 2.779 — 3.140 — ns tINH 0.000 — 0.000 — 0.000 — ns tINSUPLL 1.417 — 1.629 — 1.840 — ns tINHPLL 0.000 — 0.000 — 0.000 — ns Table 4–36. EP1C12 Column Pin Global Clock External I/O Timing Parameters (Part 2 of 2) Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max

Altera Corporation 4–21 May 2008 Preliminary Timing Model External I/O Delay Parameters External I/O delay timing parameters for I/O standard input and output adders and programmable input and output delays are specified by speed grade independent of device density. Tables 4–40 through 4–45 show the adder delays associated with column and row I/O pins for all packages. If an I/O standard is selected other than LVTTL 4 mA with a fast slew rate, add the selected delay to the external tCO and tSU I/O parameters shown in Tables 4–25 through 4–28. Table 4–39. EP1C20 Row Pin Global Clock External I/O Timing Parameters Symbol -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max tINSU 2.417 — 2.779 — 3.140 — ns tINH 0.000 — 0.000 — 0.000 — ns tXZ — 3.645 — 4.191 — 4.740 ns tZX — 3.645 — 4.191 — 4.740 ns tINSUPLL 1.417 — 1.629 — 1.840 — ns tINHPLL 0.000 — 0.000 — 0.000 — ns tXZPLL — 1.588 — 1.826 — 2.066 ns tZXPLL — 1.588 — 1.826 — 2.066 ns Table 4–40. Cyclone I/O Standard Column Pin Input Delay Adders (Part 1 of 2) I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max L V C M O S —0—0—0 p s 3.3-V LVTTL — 0 — 0 — 0 ps 2.5-V LVTTL — 27 — 31 — 35 ps 1.8-V LVTTL — 182 — 209 — 236 ps 1.5-V LVTTL — 278 — 319 — 361 ps SSTL-3 class I — –250 — –288 — –325 ps SSTL-3 class II — –250 — –288 — –325 ps SSTL-2 class I — –278 — –320 — –362 ps

4–22 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 SSTL-2 class II –278 — –320 — –362 ps LVDS –261 — –301 — –340 ps Table 4–41. Cyclone I/O Standard Row Pin Input Delay Adders I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max L V C M O S —0—0—0 p s 3.3-V LVTTL — 0 — 0 — 0 ps 2.5-V LVTTL — 27 — 31 — 35 ps 1.8-V LVTTL — 182 — 209 — 236 ps 1.5-V LVTTL — 278 — 319 — 361 ps 3.3-V PCI (1) —0—0—0 p s SSTL-3 class I — –250 — –288 — –325 ps SSTL-3 class II — –250 — –288 — –325 ps SSTL-2 class I — –278 — –320 — –362 ps SSTL-2 class II — –278 — –320 — –362 ps Table 4–42. Cyclone I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 1 of 2) Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max L V C M O S 2 m A —0—0—0 p s 8 mA — –855 — –984 — –1,112 ps 12 mA — –993 — –1,142 — –1,291 ps 3 . 3 - V L V T T L 4 m A —0—0—0 p s 12 mA — –858 — –987 — –1,116 ps 16 mA — –819 — –942 — –1,065 ps 24 mA — –993 — –1,142 — –1,291 ps Table 4–40. Cyclone I/O Standard Column Pin Input Delay Adders (Part 2 of 2) I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max

Altera Corporation 4–23 May 2008 Preliminary Timing Model 2.5-V LVTTL 2 mA — 329 — 378 — 427 ps 16 mA — –795 — –915 — –1034 ps 1 . 8 - V L V T T L 2 m A —4—4—5 p s 1.5-V LVTTL 2 mA — 2,288 — 2,631 — 2,974 ps 4 mA — 608 — 699 — 790 ps 8 mA — 292 — 335 — 379 ps SSTL-3 class I — –410 — –472 — –533 ps SSTL-3 class II — –811 — –933 — –1,055 ps SSTL-2 class I — –485 — –558 — –631 ps SSTL-2 class II — –758 — –872 — –986 ps LVDS — –998 — –1,148 — –1,298 ps Table 4–43. Cyclone I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins (Part 1 of 2) Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max L V C M O S 2 m A —0—0—0 p s 8 mA — –855 — –984 — –1,112 ps 12 mA — –993 — –1,142 — –1,291 ps 3 . 3 - V L V T T L 4 m A —0—0—0 p s 12 mA — –858 — –987 — –1,116 ps 16 mA — –819 — –942 — –1,065 ps 24 mA — –993 — –1,142 — –1,291 ps 2.5-V LVTTL 2 mA — 329 — 378 — 427 ps 16 mA — –795 — –915 — –1,034 ps Table 4–42. Cyclone I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 2 of 2) Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max

4–24 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 1.8-V LVTTL 2 mA — 1,290 — 1,483 — 1,677 ps 8 m A —4—4—5 p s 1.5-V LVTTL 2 mA — 2,288 — 2,631 — 2,974 ps 4 mA — 608 — 699 — 790 ps 8 mA — 292 — 335 — 379 ps SSTL-3 class I — –410 — –472 — –533 ps SSTL-3 class II — –811 — –933 — –1,055 ps SSTL-2 class I — –485 — –558 — –631 ps SSTL-2 class II — –758 — –872 — –986 ps LVDS — –998 — –1,148 — –1,298 ps Table 4–44. Cyclone I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 1 of 2) I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max L V C M O S 2 m A —1 , 8 0 0—2 , 0 7 0—2 , 3 4 0 p s 4 m A —1 , 3 1 1—1 , 5 0 7—1 , 7 0 4 p s 8 mA — 945 — 1,086 — 1,228 ps 12 mA — 807 — 928 — 1,049 ps 3.3-V LVTTL 4 mA — 1,831 — 2,105 — 2,380 ps 8 m A —1 , 4 8 4—1 , 7 0 5—1 , 9 2 8 p s 12 mA — 973 — 1,118 — 1,264 ps 16 mA — 1,012 — 1,163 — 1,315 ps 24 mA — 838 — 963 — 1,089 ps 2.5-V LVTTL 2 mA — 2,747 — 3,158 — 3,570 ps 8 m A —1 , 7 5 7—2 , 0 1 9—2 , 2 8 3 p s 12 mA — 1,763 — 2,026 — 2,291 ps 16 mA — 1,623 — 1,865 — 2,109 ps 1.8-V LVTTL 2 mA — 5,506 — 6,331 — 7,157 ps 8 m A —4 , 2 2 0—4 , 8 5 2—5 , 4 8 5 p s 12 mA — 4,008 — 4,608 — 5,209 ps Table 4–43. Cyclone I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins (Part 2 of 2) Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max

Altera Corporation 4–25 May 2008 Preliminary Timing Model 1.5-V LVTTL 2 mA — 6,789 — 7,807 — 8,825 ps 4 m A —5 , 1 0 9—5 , 8 7 5—6 , 6 4 1 p s 8 m A —4 , 7 9 3—5 , 5 1 1—6 , 2 3 0 p s SSTL-3 class I — 1,390 — 1,598 — 1,807 ps SSTL-3 class II — 989 — 1,137 — 1,285 ps SSTL-2 class I — 1,965 — 2,259 — 2,554 ps SSTL-2 class II — 1,692 — 1,945 — 2,199 ps LVDS — 802 — 922 — 1,042 ps Table 4–45. Cyclone I/O Standard Output Delay Adders for Slow Slew Rate on Row Pins (Part 1 of 2) I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max L V C M O S 2 m A —1 , 8 0 0—2 , 0 7 0—2 , 3 4 0 p s 4 m A —1 , 3 1 1—1 , 5 0 7—1 , 7 0 4 p s 8 mA — 945 — 1,086 — 1,228 ps 12 mA — 807 — 928 — 1,049 ps 3.3-V LVTTL 4 mA — 1,831 — 2,105 — 2,380 ps 8 m A —1 , 4 8 4—1 , 7 0 5—1 , 9 2 8 p s 12 mA — 973 — 1,118 — 1,264 ps 16 mA — 1,012 — 1,163 — 1,315 ps 24 mA — 838 — 963 — 1,089 ps 2.5-V LVTTL 2 mA — 2,747 — 3,158 — 3,570 ps 8 m A —1 , 7 5 7—2 , 0 1 9—2 , 2 8 3 p s 12 mA — 1,763 — 2,026 — 2,291 ps 16 mA — 1,623 — 1,865 — 2,109 ps 1.8-V LVTTL 2 mA — 5,506 — 6,331 — 7,157 ps 8 m A —4 , 2 2 0—4 , 8 5 2—5 , 4 8 5 p s 12 mA — 4,008 — 4,608 — 5,209 ps 1.5-V LVTTL 2 mA — 6,789 — 7,807 — 8,825 ps 4 m A —5 , 1 0 9—5 , 8 7 5—6 , 6 4 1 p s 8 m A —4 , 7 9 3—5 , 5 1 1—6 , 2 3 0 p s 3.3-V PCI — 923 — 1,061 — 1,199 ps Table 4–44. Cyclone I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 2 of 2) I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max

4–26 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Tables 4–46 through 4–47 show the adder delays for the IOE programmable delays. These delays are controlled with the Quartus II software options listed in the Parameter column. SSTL-3 class I — 1,390 — 1,598 — 1,807 ps SSTL-3 class II — 989 — 1,137 — 1,285 ps SSTL-2 class I — 1,965 — 2,259 — 2,554 ps SSTL-2 class II — 1,692 — 1,945 — 2,199 ps LVDS — 802 — 922 — 1,042 ps Note to Tables 4–40 through 4–45: (1) EP1C3 devices do not support the PCI I/O standard. Table 4–45. Cyclone I/O Standard Output Delay Adders for Slow Slew Rate on Row Pins (Part 2 of 2) I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max Table 4–46. Cyclone IOE Programmable Delays on Column Pins Parameter Setting -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max Decrease input delay to internal cells Off — 155 — 178 — 201 ps Small — 2,122 — 2,543 — 2,875 ps Medium — 2,639 — 3,034 — 3,430 ps Large — 3,057 — 3,515 — 3,974 ps On — 155 — 178 — 201 ps Decrease input delay to input register O f f —0—0—0p s O n —3 , 0 5 7—3 , 5 1 5—3 , 9 7 4p s Increase delay to output pin O f f —0—0—0p s On — 552 — 634 — 717 ps

Altera Corporation 4–27 May 2008 Preliminary Timing Model Maximum Input and Output Clock Rates Tables 4–48 and 4–49 show the maximum input clock rate for column and row pins in Cyclone devices. Table 4–47. Cyclone IOE Programmable Delays on Row Pins Parameter Setting -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Max Min Max Min Max Decrease input delay to internal cells Off — 154 — 177 — 200 ps Small — 2,212 — 2,543 — 2,875 ps Medium — 2,639 — 3,034 — 3,430 ps Large — 3,057 — 3,515 — 3,974 ps On — 154 — 177 — 200 ps Decrease input delay to input register O f f —0—0—0 p s O n —3 , 0 5 7—3 , 5 1 5—3 , 9 7 4 p s Increase delay to output pin Off — 0 — 0 — 0 ps On — 556 — 639 — 722 ps Note to Table 4–47: (1) EPC1C3 devices do not support the PCI I/O standard. Table 4–48. Cyclone Maximum Input Clock Rate for Column Pins I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit LVTTL 464 428 387 MHz

2.5 V 392 302 207 MHz

1.8 V 387 311 252 MHz

1.5 V 387 320 243 MHz

SSTL-3 class I 405 356 293 MHz SSTL-3 class II 414 365 302 MHz SSTL-2 class I 464 428 396 MHz SSTL-2 class II 473 432 396 MHz LVDS 567 549 531 MHz

4–28 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Tables 4–50 and 4–51 show the maximum output clock rate for column and row pins in Cyclone devices. Table 4–49. Cyclone Maximum Input Clock Rate for Row Pins I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit LVTTL 464 428 387 MHz SSTL-3 class I 405 356 293 MHz SSTL-3 class II 414 365 302 MHz SSTL-2 class I 464 428 396 MHz SSTL-2 class II 473 432 396 MHz 3.3-V PCI (1) 464 428 387 MHz LVDS 567 549 531 MHz Note to Tables 4–48 through 4–49: (1) EP1C3 devices do not support the PCI I/ O standard. These parameters are only available on row I/O pins. Table 4–50. Cyclone Maximum Output Clock Rate for Column Pins I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit LVTTL 304 304 304 MHz

2.5 V 220 220 220 MHz

1.8 V 213 213 213 MHz

1.5 V 166 166 166 MHz

SSTL-3 class I 100 100 100 MHz SSTL-3 class II 100 100 100 MHz SSTL-2 class I 134 134 134 MHz SSTL-2 class II 134 134 134 MHz LVDS 320 320 275 MHz Note to T able 4–50: (1) EP1C3 devices do not support the PCI I/O standard.

Altera Corporation 4–29 May 2008 Preliminary Timing Model PLL Timing Table 4–52 describes the Cyclone FPGA PLL specifications. Table 4–51. Cyclone Maximum Output Clock Rate for Row Pins I/O Standard -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit LVTTL 296 285 273 MHz

2.5 V 381 366 349 MHz

1.8 V 286 277 267 MHz

1.5 V 219 208 195 MHz

SSTL-3 class I 169 166 162 MHz SSTL-3 class II 160 151 146 MHz SSTL-2 class I 160 151 142 MHz SSTL-2 class II 131 123 115 MHz 3.3-V PCI (1) 66 66 66 MHz LVDS 320 303 275 MHz Note to Tables 4–50 through 4–51: (1) EP1C3 devices do not support the PCI I/ O standard. These parameters are only available on row I/O pins. Table 4–52. Cyclone PLL Specifications (Part 1 of 2) Symbol Parameter Min Max Unit fIN Input frequency (-6 speed grade) 15.625 464 MHz Input frequency (-7 speed grade) 15.625 428 MHz Input frequency (-8 speed grade) 15.625 387 MHz f IN DUTY Input clock duty cycle 40.00 60 % tIN JITTER Input clock period jitter — ± 200 ps fOUT_EXT (external PLL clock output) PLL output frequency (-6 speed grade) 15.625 320 MHz PLL output frequency (-7 speed grade) 15.625 320 MHz PLL output frequency (-8 speed grade) 15.625 275 MHz

4–30 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 fOUT (to global clock) PLL output frequency (-6 speed grade) 15.625 405 MHz PLL output frequency (-7 speed grade) 15.625 320 MHz PLL output frequency (-8 speed grade) 15.625 275 MHz t OUT DUTY Duty cycle for external clock output (when set to 50%) 45.00 55 % tJITTER (1) Period jitter for external clock output — ±300 (2) ps tLOCK (3) Time required to lock from end of device configuration 10.00 100 μs f VCO PLL internal VCO operating range 500.00 1,000 MHz - Minimum areset time 10 — ns N, G0, G1, E Counter values 1 32 integer Notes to T able 4–52: (1) The t JITTER specification for the PLL[2..1]_OUT pins are dependent on the I/O pins in its VCCIO bank, how many of them are switching outputs, how much they toggle, and whether or not they use programmable current strength or slow slew rate. (2) f OUT ≥ 100 MHz. When the PLL external clock output frequency (fOUT) is smaller than 100 MHz, the jitter specification is 60 mUI. (3) f IN/N must be greater than 200 MHz to ensure correct lock detect circuit operation below –20 C. Otherwise, the PLL operates with the specified parameters under the specified conditions. Table 4–52. Cyclone PLL Specifications (Part 2 of 2) Symbol Parameter Min Max Unit

Altera Corporation 4–31 May 2008 Preliminary Referenced Document Referenced Document This chapter references the following documents: ■ Cyclone Architecture chapter in the Cyclone Device Handbook ■ Operating Requirements for Altera Devices Data Sheet Document Table 4–53 shows the revision history for this chapter. Table 4–53. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.7 Minor textual and style changes. Added “Referenced Document” section. January 2007 v1.6

• Added document revision history.
• Added new row for VCCA details in Table 4–1.
• Updated RCONF information in Table 4–3.
• Added new Note (12) on voltage overdrive information to Table 4–7 and Table 4–8.
• Updated Note (9) on RCONF information to Table 4–3.
• Updated information in “External I/O Delay Parameters” section.
• Updated speed grade information in Table 4–46 and Table 4–47.
• Updated LVDS information in Table 4–51. August 2005 v1.5 Minor updates. — February 2005 v1.4
• Updated information on Undershoot voltage. Updated Table 4-2.
• Updated Table 4-3.
• Updated the undershoot voltage from 0.5 V to 2.0 V in Note 3 of Table 4-16.
• Updated Table 4-17. January 2004 v.1.3
• Added extended-temperature grade device information. Updated Table 4-2.
• Updated ICC0 information in Table 4-3. October 2003 v.1.2
• Added clock tree information in Table 4-19.
• Finalized timing information for EP1C3 and EP1C12 devices. Updated timing information in Tables 4-25 through 4-26 and Tables 4-30 through 4-51.
• Updated PLL specifications in Table 4-52.

4–32 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 July 2003 v1.1 Updated timing information. Timing finalized for EP1C6 and EP1C20 devices. Updated performance information. Added PLL Timing section. May 2003 v1.0 Added document to Cyclone Device Handbook. —

Altera Corporation 5–1 May 2008 Preliminary 5. Reference and Ordering Information Software Cyclone® devices are supported by the Altera® Quartus® II design software, which provides a comprehensive environment for system-on-a- programmable-chip (SOPC) design. The Quartus II software includes HDL and schematic design entry, compilation and logic synthesis, full simulation and advanced timing analysis, SignalTap® II logic analysis, and device configuration. f For more information about the Quartus II software features, refer to the Quartus II Handbook. The Quartus II software supports the Windows 2000/NT/98, Sun Solaris, Linux Red Hat v7.1 and HP-UX operating systems. It also supports seamless integration with industry-leading EDA tools through the NativeLink® interface. Device Pin-Outs Device pin-outs for Cyclone devices are available on the Altera website (www.altera.com) and in the Cyclone Device Handbook. Ordering Information Figure 5–1 describes the ordering codes for Cyclone devices. For more information about a specific package, refer to the Package Information for Cyclone Devices chapter in the Cyclone Device Handbook. C51005-1.4

5–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 5–1. Cyclone Device Packaging Ordering Information Referenced Documents This chapter references the following documents: ■ Package Information for Cyclone Devices chapter in the Cyclone Device Handbook ■ Quartus II Handbook Document Table 5–1 shows the revision history for this chapter. Device Type Package Type 6, 7, or 8 , with 6 being the fastest Number of pins for a particular package ES: Thin quad flat pack (TQFP) Plastic quad flat pack (PQFP) FineLine BGA EP1C: Cyclone Commercial temperature (t J = 0˚ C to 85˚ C) Industrial temperature (tJ = -40˚ C to 100˚ C) Optional SuffixFamily Signature Operating Temperature Speed Grade Pin Count Engineering sample 7EP1C 20 C 400FE S Indicates specific device options or shipment method. Table 5–1. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.4 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.3 Added document revision history. — August 2005 v1.2 Minor updates. —

Altera Corporation 5–3 May 2008 Preliminary Document Revision History February 2005 v1.1 Updated Figure 5-1. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

5–4 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1

Altera Corporation Section II–1 Preliminary Section II. Clock Management This section provides information on the Cyclone phase-lock loops (PLLs). The PLLs assist designers in managing clocks internally and also have the ability to drive off chip to control system-level clock networks. This chapter contains detailed information on the features, the interconnections to the logic array and off chip, and the specifications for Cyclone PLLs. This section contains the following chapter: ■ Chapter 6. Using PLLs in Cyclone Devices Revision History Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the complete handbook.

Section II–2 Altera Corporation Preliminary Revision History Cyclone Device Handbook, Volume 1

Altera Corporation 6–1 May 2008 Preliminary 6. Using PLLs in Cyclone Devices Introduction Cyclone® FPGAs offer phase locked loops (PLLs) and a global clock network for clock management solutions. Cyclone PLLs offer clock multiplication and division, phase shifting, programmable duty cycle, and external clock outputs, allowing system-level clock management and skew control. The Altera® Quartus® II software enables Cyclone PLLs and their features without using any external devices. This chapter explains how to design and enable Cyclone PLL features. PLLs are commonly used to synchronize internal device clocks with an external clock, run internal clocks at higher frequencies than an external clock, minimize clock delay and clock skew, and reduce or adjust clock-to-out (tCO) and set-up (tSU) times. Hardware Overview Cyclone FPGAs contain up to two PLLs per device. Table 6–1 shows which PLLs are available for each Cyclone FPGA. Table 6–1. Cyclone FPGA PLL Availability Device PLL1 (1) PLL2 (2) EP1C3 v — EP1C4 vv EP1C6 vv EP1C12 vv EP1C20 vv Notes to Tab le 6 –1: (1) Located on the center left side of the device. (2) Located on the center right side of the device. C51006-1.5

6–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Table 6–2 provides an overview of available Cyclone PLL features. Cyclone PLL Blocks The main goal of a PLL is to synchronize the phase and frequency of an internal/external clock to an input reference clock. There are a number of components that comprise a PLL to achieve this phase alignment. Cyclone PLLs align the rising edge of the reference input clock to a feedback clock using a phase-frequency detector (PFD). The falling edges are determined by the duty cycle specifications. The PFD produces an up or down signal that determines whether the VCO needs to operate at a higher or lower frequency. The PFD output is applied to the charge pump and loop filter, which produces a control voltage for setting the frequency of the VCO. If the PFD produces an up signal, then the VCO frequency increases, while a down signal causes the VCO frequency to decrease. The PFD outputs these up and down signals to a charge pump. If the charge pump receives an up signal, current is driven into the loop filter. Conversely, if it receives a down signal, current is drawn from the loop filter. The loop filter converts these up and down signals to a voltage that Table 6–2. Cyclone PLL Features Feature Description Clock multiplication and division M/(N × post-scale counter) (1) Phase shift Down to 125-ps increments (2), (3) Programmable duty cycle v Number of internal clock outputs Two per PLL Number of external clock outputs (4) One per PLL Locked port can feed logic array v PLL clock outputs can feed logic array v Notes to Tab le 6 –2: (1) M, N, and post-scale counter values range from 1 to 32. (2) The smallest phase shift is determined by the Voltage Control Oscillator (VCO) period divided by 8. (3) For degree increments, Cyclone FPGAs can shift output frequencies in increments of at least 45°. Smaller degree increments are possible depending on the multiplication/division ratio needed on the PLL clock output. (4) The EP1C3 device in the 100-pin thin quad flat pack (TQFP) package does not have support for a PLL LVDS input or an external clock output. The EP1C6 PLL2 in the 144-pin TQFP package does not support an external clock output.

6–4 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Software Overview Cyclone PLLs are enabled in the Quartus II software by using the altpll megafunction. Figure 6–2 shows the available ports (as they are named in the Quartus II altpll megafunction) of Cyclone PLLs and their sources and destinations. It is important to note that the c[1..0] and e0 clock output ports from altpll are driven by the post-scale counters G0, G1, and E (not necessarily in that order). The G0 and G1 counters feed the internal global clock network on the c0 and c1 PLL outputs, and the E counter feeds the PLL external clock output pin on the e0 PLL output. Figure 6–2. Cyclone PLL Signals Notes to Figure 6–2: (1) You can assign these signals to either a single-ended I/O standard or LVDS. (2) Inclk0 must be driven by the dedicated clock input pin(s). (3) e0 drives the dual-purpose PLL[2..1]_OUT pins. inclk0 (2) pllena areset pfdena locked c[1..0] (3) e0 Internal clock signal Signal driven by internal logic Physical pins Signal driven to internal logic (1) (1)

Altera Corporation 6–5 May 2008 Preliminary Introduction Tables 6–3 and 6–4 describe the Cyclone PLL input and output ports. Table 6–3. PLL Input Signals Port Description Source Destination inclk0 Clock input to PLL. Dedicated clock input pin (1) ÷n counter pllena (2) pllena is an active-high signal that acts as a combined enable and reset signal for the PLL. Y ou can use It for enabling or disabling one or two PLLs. When this signal is driven low, the PLL clock output ports are driven to GND and the PLL loses lock. Once this signal is driven high again, the lock process begins and the PLL re-synchronizes to its input reference clock. Y ou can drive the pllena port from internal logic or any general-purpose I/O pin. Logic array (3) PLL control signal areset areset is an active-high signal that resets all PLL counters to their initial values. When this signal is driven high, the PLL resets its counters, clears the PLL outputs, and loses lock. Once this signal is driven low again, the lock process begins and the PLL re- synchronizes to its input reference clock. Y ou can drive the areset port from internal logic or any general-purpose I/O pin. Logic array (3) PLL control signal pfdena pfdena is an active-high signal that enables or disables the up/down output signals from the PFD. When pfdena is driven low, the PFD is disabled, while the VCO continues to operate. The PLL clock outputs continue to toggle regardless of the input clock, but can experience some long-term drift. Because the output clock frequency does not change for some time, you can use the pfdena port as a shutdown or cleanup function when a reliable input clock is no longer available. Y ou can drive the pfdena port from internal logic or any general-purpose I/O pin. Logic array (3) PFD Notes to Tab le 6– 3: (1) The inclk0 port to the PLL must be driven by the dedicated clock input pin(s). (2) There is no dedicated pllena pin for all PLLs, allowing you to choose either one pllena pin for both PLLs or each PLL can have its own pllena pin. (3) Logic array source means that you can drive the port from internal logic or any general-purpose I/O pin.

6–6 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 In the Quartus II software, you define which internal clock output from the PLL (c0 or c1) should be compensated. This PLL clock output is phase-aligned with respect to the PLL input clock. For example, if c0 is specified as the compensation clock in normal mode, the compensation is based on the c0 routing on the global clock network. Pins and Clock Network Connections You must drive Cyclone PLLs by the dedicated clock input pins CLK[3..0]. Inverted clocks and internally generated clocks cannot drive the PLL. Table 6–5 shows which dedicated clock pin drives which PLL input clock port. Table 6–4. PLL Output Signals Port Description Source Destination c[1..0] PLL clock outputs driving the internal global clock network. PLL post-scale counter G0 or G1 Global clock network (1) e0 (2) PLL clock output driving the single-ended or LVDS external clock output pin(s). PLL post-scale counter E PLL[2..1]_OUT pin(s) (3) locked Gives the status of the PLL lock. When the PLL is locked, this port drives logic high. When the PLL is out of lock, this port drives logic low. The locked port can pulse high and low during the PLL lock process. PLL lock detect Logic array (4) Notes to Tab le 6– 4: (1) C[1..0] can also drive to any general-purpose I/O pin through the global clock network. (2) The EP1C3 device in the 100-pin TQFP package, and the EP1C6 PLL2 in the 144-pin TQFP package do not have support for the external clock output PLL[2..1]_OUT. (3) The PLL[2..1]_OUT pins are dual-purpose pins. If these pins are not required, they are available for use as general-purpose I/O pins. (4) Logic array destination means that you can drive the port to internal logic or any general-purpose I/O pin.

Altera Corporation 6–7 May 2008 Preliminary Introduction

1 A single clock input pin cannot drive both PLLs, but a single

clock input pin can feed both registers in the logic array, as well as the PLL inclk port. The c[1..0] and e0 clock output ports from altpll are driven by the PLL post-scale counters G0, G1, and E (not necessarily in that order). The G0 and G1 counters feed the internal global clock network on the c0 and c1 PLL outputs, and the E counter feeds the PLL external clock output pin on the e0 PLL output. Table 6–6 shows which global clock network can be driven by which PLL post-scale counter output. Figure 6–3 summarizes Tables 6–5 and 6–6 by showing the PLL input and output clock connections. Table 6–5. PLL Input Clock Sources Clock Input Pins (1) PLL1 PLL2 (2) CLK0 v — CLK1 v — CLK2 — v CLK3 — v Notes to Tab le 6 –5: (1) If you are using the LVDS standard, then both CLK pins driving that PLL are used. (2) The EP1C3 device only supports PLL1. Table 6–6. PLL Output Clock Destinations onto the Global Clock Network PLL Counter Output GCLK0 GCLK1 GCLK2 GCLK3 GCLK4 GCLK5 GCLK6 GCLK7

6–8 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 6–3. Cyclone PLL Clock Connections Notes to Figure 6–3: (1) PLL1 supports one single-end ed or LVDS input via the CLK0 and CLK1 pins. (2) PLL2 supports one single-end ed or LVDS input via the CLK2 and CLK3 pins. (3) PLL1_OUT and PLL2_OUT support single-ended or LVDS outputs. If the external clock output is not required, these pins are available as general-purpose I/O pins. You can invert the clock outputs of the PLL at the logic array block (LAB) and at the input/output element (IOE) level. Hardware

Features

Cyclone PLLs have a number of advanced features available, including clock multiplication and division, phase shifting, programmable duty cycles, external clock outputs, and control signals. Clock Multiplication and Division Cyclone PLLs provide clock synthesis for PLL output ports using M/(N × post-scale) scaling factors. There is one pre-scale divider (N) and one multiply counter (M) per PLL. N and post-scale counter values range from 1 to 32. The M counter ranges from 2 to 32. The input clock (fIN) is divided by a pre-scale counter (N) to produce the input reference clock (fREF) to the PFD. fREF is then multiplied by the M feedback factor. The control loop drives the VCO frequency to match fIN × (M/N). See the following equations: fREF = fIN/N fVCO = fREF × M = fIN × (M/N) CLK2 CLK3 (2) PLL 2 E CLK0 (1) CLK1 PLL 1 E GCLK0 GCLK1 GCLK2 GCLK3 GCLK7 GCLK6 GCLK5 GCLK4 Global Clocks (3) PLL1_OUT PLL2_OUT (3)

Altera Corporation 6–9 May 2008 Preliminary Hardware Features Each output port has a unique post-scale counter to divide down the high-frequency VCO. There are three post-scale counters (G0, G1, and E) that range from 1 to 32. See the following equations: fC0 = fVCO/G0 = fIN × (M/(N × G0)) fC1 = fVCO/G1 = fIN × (M/(N × G1)) fE = fVCO/E = fIN × (M/(N × E)) 1 c0 and c1 can use either post-scale counter, G0 or G1. For multiple PLL outputs with different frequencies, the VCO is set to the least common multiple of the output frequencies that meets the VCO frequency specifications. Then, the post-scale counters scale down the output frequency for each PLL clock output port. For example, if clock output frequencies required from one PLL are 33 and 66 MHz, the VCO is set to 330 MHz (the least common multiple in the VCO’s range). Phase Shifting Cyclone PLLs have advanced clock shift capability to provide programmable phase shifting. You can enter the desired phase shift in the altpll MegaWizard® Plug-In Manager and the Quartus II software automatically sets and displays the closest phase shift achievable. You can enter the phase shift in degrees, or units of time, for each PLL clock output port. This feature is supported on all three PLL post-scale counters, G0, G1, and E and is supported for all available clock feedback modes. Phase shifting is performed with respect to the PLL clock output that is compensated. For example, you have a 100 MHz input clock and request a × 1 multiplication with a +90° phase shift on c0 and a × 1 multiplication with a +45° phase shift on c1. If you choose to compensate for the c0 clock output, the PLL uses a zero phase-shifted c0 clock as a reference point to produce the +90° phase shift on c0. Since c0 is the compensated clock, it is phase-shifted +90° from the input clock. The c1 clock also uses the zero phase-shifted c0 reference to produce the +45° phase shift on c1. For fine phase adjustment, each PLL clock output counter can choose a different phase of the VCO from up to eight phase taps. In addition, each clock output counter can use a unique initial count setting to achieve individual coarse phase shift selection, in steps of one VCO period. The Quartus II software can use this clock output counter, along with an initial setting on the post-scale counter, to achieve a phase shift range for the entire period of the output clock. You can phase shift the PLL clock output up to ±180°. The Quartus II software automatically sets the phase taps and counter settings according to the phase shift requested.

6–10 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 The resolution of the fine phase adjustment is dependent on the input frequency and the multiplication/division factors (i.e., it is a function of the VCO period), with the finest step being equal to an eighth ( × 0.125) of the VCO period. The minimum phase shift is 1/(8 × fVCO) or N/(8 × M × fIN). In Cyclone FPGAs, the VCO ranges from 500 to 1,000 MHz. Therefore, phase shifting can be performed with a resolution range of 1/(8 × 1,000 MHz) to 1/(8 × 500 MHz), which is 125 to 250 ps in time units. Because there are eight VCO phase taps, the maximum step size is 45°. Smaller steps are possible, depending on the multiplication and division ratio necessary on the output clock port. The equation to determine the precision of the phase shifting in degrees is 45° divided by the post-scale counter value. For example, if you have an input clock of 125 MHz with × 1, the post-scale counter G0 is 3. Therefore, the smallest phase shift step is (45°/3 = 15°) and possible phase-shift values would be multiples of 15°. This type of phase shift provides the highest precision since it is the least sensitive to process, voltage and temperature variation. Programmable Duty Cycle The programmable duty cycle feature allows you to set the duty cycle of the PLL clock outputs. The duty cycle is the ratio of the clock output high/low time to the total clock cycle time, which is expressed as a percentage of high time. This feature is supported on all three PLL post-scale counters (G0, G1, and E). The duty cycle is set by using a low- and high-time count setting for the post-scale counters. The Quartus II software uses the input frequency and target multiply/divide ratio to select the post-scale counter. The precision of the duty cycle is determined by the post-scale counter value chosen on a PLL clock output and is defined as 50% divided by the post-scale counter value. For example, if the post-scale counter value is 3, the allowed duty cycle precision would be 50% divided by 3 equaling 16.67%. Because the altpll megafunction does not accept non-integer values for the duty cycle values, the allowed duty cycles are 17, 33, 50, and 67%. Due to hard limitations, you cannot achieve a duty cycle of 84% because you cannot achieve the closest value to 100% for a given counter value. However, you can achieve a duty cycle of 84% by choosing a 17% duty cycle and inverting the PLL clock output. For example, if the G0 counter is 10, increments of 5% are possible for duty cycle choices between 5 and 90%.

Altera Corporation 6–11 May 2008 Preliminary Hardware Features External Clock Output Each PLL supports one single-ended or LVDS external clock output for general-purpose external clocks, or for source-synchronous transmitters. The output of the E counter drives the PLL external clock output (e0), which can only feed to the PLL[2..1]_OUT pins and not to internal logic. You can use PLL[2..1]_OUT in all three clock feedback modes.

1 The EP1C3 device in the 100-pin package, and the EP1C6 PLL2

in the 144-pin package, do not have support for an external clock output. The PLL[2..1]_OUT pins are dual-purpose pins, meaning if the pins are not required by the PLL, they are available for use as general-purpose I/O pins. The I/O standards supported by the PLL[2..1]_OUT pins are listed in Table 6–7. Since the pllena and locked signal can be driven by or driven to general-purpose I/O pins, respectively, they support all Cyclone I/O standards. Table 6–7. Supported I/O Standards for Cyclone PLL Pins I/O Standard Inclk PLL[2..1]_OUT (1) LVTTL vv LVCMOS vv 2.5-V vv 1.8-V vv 1.5-V vv 3.3-V PCI vv LVDS (2) vv SSTL-2 Class I vv SSTL-2 Class II vv SSTL-3 Class I vv SSTL-3 Class II vv Differential SSTL-2 Class II — v Notes to Tab le 6 –7: (1) The EP1C3 device in the 100-pin TQFP package and the EP1C6 PLL2 in the 144-pin TQFP package do not support an external clock output. (2) The EP1C3 device in the 100-pin TQFP package does not support an LVDS input.

6–12 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 The Cyclone external clock output pins (PLL[2..1]_OUT) do not have a separate VCC and GND bank internal to the device. The PLL[2..1]_OUT pins share a VCCIO bank with neighboring I/O pins. Only the I/O pins in the same bank have an effect on the PLL[2..1]_OUT pins. Therefore, to minimize jitter on the PLL[2..1]_OUT pins, I/O pins directly adjacent to these pins should be either inputs or they should not be used. For more information about board design guidelines, see “Jitter Considerations” on page 6–19. Control Signals There are four available control signals, pllena, areset, pfdena, and locked, in Cyclone PLLs that provide added PLL management. pllena The PLL enable signal, pllena, enables or disables the PLL. You can either enable/disable a single PLL (by connecting pllena port independently) or multiple PLLs (by connecting pllena ports together). The pllena signal is an active-high signal. When pllena is low, the PLL clock output ports are driven to logic low and the PLL loses lock. All PLL counters, including gated lock counter return to default state. When pllena goes high again, the PLL relocks and resynchronizes to the input clock. Therefore, pllena is an active-high signal. In Cyclone FPGAs, you can feed the pllena port from internal logic or any general-purpose I/O pin because there is no dedicated pllena pin. This feature offers added flexibility, since each PLL can have its own pllena control circuitry, or both PLLs can share the same pllena circuitry. The pllena signal is optional, and when it is not enabled in the software, the port is internally tied to VCC. areset The PLL areset signal is the reset or resynchronization input for each PLL. The areset signal should be asserted every time the PLL loses lock to guarantee correct phase relationship between the PLL input and output clocks. Users should include the areset signal in designs where phase relationship between input and output clocks need to be maintained after a loss of lock condition. The areset signal is an active high signal and, when driven high, the PLL counters reset, clearing the PLL output and causing the PLL to lose lock. The clock outputs of the PLL are driven to ground as long as areset is active. When areset transitions low, the PLL will resynchronize to its input clock as the PLL relocks. If the target VCO frequency is below this nominal frequency, the PLL clock output frequency will start at a higher value than desired during the lock process. In this case, Altera recommends monitoring the gated locked signal to ensure the PLL is fully in lock before enabling the clock outputs

Altera Corporation 6–13 May 2008 Preliminary Clock Feedback Modes from the PLL. Cyclone FPGAs can drive this PLL input signal from LEs or any general-purpose I/O pin. The areset signal is optional. When it is not enabled in the Quartus II software, the port is internally tied to GND. pfdena The pfdena signal controls the PFD output in the PLL with a programmable gate. If you disable the PFD by driving areset low, the VCO operates at its last set control voltage and frequency value with some long-term drift to a lower frequency. The VCO frequency can drift up to +/- 5% over 25 us. Even though the PLL clock outputs continue to toggle regardless of the input clock, the PLL could lose lock. The system continues running when the PLL goes out of lock, or if the input clock is disabled. Because the last locked output frequency does not change for some time, you can use the pfdena port as a shutdown or cleanup function when a reliable input clock is no longer available. By maintaining this frequency, the system has time to store its current settings before shutting down. If the pfdena signal goes high again, the PLL relocks and resynchronizes to the input clock. Therefore, the pfdena pin is an active-high signal. You can drive the pfdena input signal by any general-purpose I/O pin, or from internal logic. This signal is optional, and when it is not enabled in the software, the port is internally tied to VCC. locked When the locked output is at a logic-high level, this level indicates a stable PLL clock output in phase with the PLL reference input clock. Without any additional circuitry, the locked port may toggle as the PLL begins tracking the reference clock. The locked port of the PLL can feed any general-purpose I/O pin and/or internal logic. This locked signal is optional, but is useful in monitoring the PLL lock process. Whenever the PLL loses lock for any reason (be it excessive inclk jitter, power supply noise, etc.), the PLL must be reset with the areset signal to guarantee correct phase relationship between the PLL output clocks. If the phase relationship between the input clock versus output clock, and between different output clocks from the PLL is not important in your design, the PLL need not be reset. Clock Feedback Modes Cyclone PLLs support three feedback modes: normal, zero delay buffer, and no compensation. Unlike other Altera device families, Cyclone PLLs do not have support for external feedback mode. All three supported

6–14 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 clock feedback modes allow for multiplication/division, phase shifting, and programmable duty cycle. The following sections give a brief description of each mode.

1 The phase relationship shown in Figure 6–4 through 6–6 are for

the default phase shift setting of 0°. Changing the phase-shift setting will change the relationships. Normal Mode In normal mode, the PLL phase aligns the input reference clock with the clock signal at the ports of the registers in the logic array or the IOE to compensate for the internal global clock network delay. In the altpll MegaWizard Plug-In Manager, you can define which internal clock output from the PLL (c0 or c1) should be compensated. If the external clock output (PLL[2..1]_OUT) is used in this mode, there will be a phase shift with respect to the clock input pin. Similarly, if you use the internal PLL clock outputs to drive general-purpose I/O pins, there will be a phase shift with respect to the clock input pin. Figure 6–4 shows an example waveform of the PLL clocks’ phase relationship in normal mode. Figure 6–4. Phase Relationship Between PLL Clocks in Normal Mode Note to Figure 6–4: (1) The external clock output can lead or lag the PLL clock signals. PLL inclk External PLL clock outputs (1) PLL clock at the register clock port Phase Aligned

Altera Corporation 6–15 May 2008 Preliminary Clock Feedback Modes Zero Delay Buffer Mode The clock signal on the PLL external clock output pin (PLL[2..1]_OUT) is phase-aligned with the PLL input clock pin for zero delay. If you use the c[1..0] ports to drive internal clock ports, there will be a phase shift with respect to the input clock pin. Figure 6–5 shows an example waveform of the PLL clocks’ phase relationship in zero delay buffer mode. Figure 6–5. Phase Relationship Between PLL Clocks in Zero Delay Buffer Mode No Compensation In this mode, the PLL does not compensate for any clock networks, which leads to better jitter performance because the clock feedback into the PFD does not pass through as much circuitry. Both the PLL internal and external clock outputs are phase shifted with respect to the PLL clock input. Figure 6–6 shows an example waveform of the PLL clocks’ phase relationship in no compensation mode. PLL inclk External PLL clock outputs at the output pin PLL clock at the register clock port Phase Aligned

6–16 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 6–6. Phase Relationship Between PLL Clocks in No Compensation Mode Note to Figure 6–6: (1) Internal clocks fed by the PLL are in phase alignment with each other. Pins Table 6–8 describes the Cyclone PLL-related physical pins and their functionality. PLL inclk External PLL clock outputs PLL clock at the Register clock port (1) Phase Aligned Table 6–8. Cyclone PLL Pins (Part 1 of 2) Pin Name Description CLK0 Single-ended or LVDS p-pin that can drive the inclk0 port of PLL1. CLK1 (1) Single-ended or LVDS n-pin that can drive the inclk0 port of PLL1. CLK2 Single-ended or LVDS p-pin that can drive the inclk0 port of PLL2. CLK3 (1) Single-ended or LVDS n-pin that can drive the inclk0 port of PLL2. PLL1_OUTp (2) PLL1_OUTn (2) Single-ended or LVDS pins driven by the e0 port from PLL1. If not used by the PLL, these are available as general-purpose I/O pins. PLL2_OUTp (2) PLL2_OUTn (2) Single-ended or LVDS pins driven by the e0 port from PLL2. If not used by the PLL, these are available as general-purpose I/O pins. VCCA_PLL1 (3) Analog power for PLL1. Even if the PLL is not used, you must connect this pin to 1.5 V. GNDA_PLL1 (4) Analog ground for PLL1. Y ou can connect this pin to the GND plane on the board. VCCA_PLL2 (3) Analog power for PLL2. Even if the PLL is not used, you must connect this pin to 1.5 V.

Altera Corporation 6–17 May 2008 Preliminary Board Layout Board Layout Cyclone PLLs contain analog components that are embedded in a digital device. These analog components have separate power and ground pins to provide immunity against noise generated by the digital components. These separate VCC and GND pins are used to isolate circuitry and improve noise resistance. VCCA and GNDA Each PLL has separate VCC and GND pairs for their analog circuitry. The analog circuit power and ground pin for each PLL is called VCCA_PLL# and GNDA_PLL# (# represents the PLL number). Even if the PLL is not used, the VCCA power must be connected to a 1.5-V supply. The power connected to VCCA must be isolated from the power to the rest of the Cyclone FPGA, or any other digital device on the board. The following sections describe three different methods for isolating VCCA. Separate VCCA Power Plane The designer of a mixed-signal system would have already partitioned the system into analog and digital sections, each with its own power planes on the board. In this case, you can connect VCCA to the analog 1.5-V power plane. Partitioned VCCA Island within VCCINT Plane Most systems using Altera devices are fully digital, so there is not a separate analog power plane readily available on the board. Adding new planes to the board may be expensive. Therefore, you can create islands GNDA_PLL2 (4) Analog ground for PLL2. Y ou can connect this pin to the GND plane on the board. GNDG_PLL1 (5) Guard ring ground for PLL1. Y ou can connect this pin to the GND plane on the board. GNDG_PLL2 (5) Guard ring ground for PLL2. Y ou can connect this pin to the GND plane on the board. Notes to Tab le 6– 8: (1) The EP1C3 device in the 100-pin TQFP pa ckage does not have dedicated clock pins CLK1 and CLK3. (2) The EP1C3 device in the 100-pin TQFP package, and the EP1C6 PLL2 in the 144-pin TQFP package do not support an external clock output. (3) Refer to “Board Layout” on page 6–17 for filtering and other recommendations. (4) The EP1C3 device in the 100-pin TQFP package, and the EP1C6 PLL2 in the 144-pin TQFP package do not have a separate GNDA_PLL pin. They are internally tied to GND. (5) The Guard ring power ( VCCG_PLL) is tied internally to VCCINT. Table 6–8. Cyclone PLL Pins (Part 2 of 2) Pin Name Description

6–18 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 for VCCA_PLL. The dielectric boundary that creates the island is approximately 25 mils thick. Figure 6–7 shows a partitioned plane within VCCINT for VCCA. Figure 6–7. VCCINT Plane Partitioned for VCCA Island Thick VCCA Traces Due to board restraints, it may not be possible to partition a VCCA island. Instead, run a thick trace from the power supply to each of the VCCA pins. The traces should be at least 20 mils thick. In all cases, each VCCA pin must be filtered with a decoupling circuit shown in Figure 6–8. You must place a ferrite bead and a 10-μF tantalum parallel capacitor where the power enters the board. Choose a ferrite bead that exhibits high impedance at frequencies of 50 MHz or higher. Each VCCA pin must be decoupled with a 0.1-μF and a 0.001-μF parallel

Altera Corporation 6–19 May 2008 Preliminary Board Layout combination of ceramic capacitors located as close as possible to the Cyclone FPGA. You can connect the GNDA pins directly to the same GND plane as the digital GND of the device. Figure 6–8. PLL Power Schematic for Cyclone PLLs f For more information about board design guidelines, refer to AN 75: High-Speed Board Designs. Jitter Considerations If the input clocks have any low-frequency jitter (below the PLL bandwidth), the PLL attempts to track it, which increases the jitter seen at the PLL clock output. To minimize this effect, avoid placing noisy signals in the same VCCIO bank as those that power the PLL clock input buffer. This is only important if the PLL input clock is assigned to 3.3-V or 2.5-V LVTTL or LVCMOS I/O standards. With these I/O standards, V CCIO Cyclone Device 1.5-V Supply Ferrite Bead 10 μF GND Repeat for each PLL power and ground set GND GND GND PLL<#>_VCCA PLL<#>_GNDA PLL<#>_GNDG -1 μF .001 μF

6–20 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 powers the input clock buffer. Therefore, any noise on this VCCIO supply can affect jitter performance. For all other I/O standards the input buffers are powered by VCCINT. Because Cyclone external clock output pins (PLL[2..1]_OUT) do not have a separate VCC and GND bank, you should avoid placing noisy output signals directly next to these pins. Therefore, Altera recommends that PLL[2..1]_OUT neighboring I/O pins should be either inputs pins or not used at all. If noisy outputs are placed next to the PLL[2..1]_OUT pins, they could inject noise through ground bounce or VCC sag and mutual pin inductance, which would result in worse jitter performance on the PLL[2..1]_OUT pins. Additionally, you should take into consideration the number of simultaneously switching outputs within the same VCCIO bank as the PLL[2..1]_OUT pins. Altera recommends that you switch as few outputs simultaneously in the same direction as possible in these VCCIO banks. Also, if you have switching outputs in the same VCCIO bank as the PLL[2..1]_OUT pins, Altera recommends that you use the low current strength and/or slow slew rate options on those output pins as they will help to improve the jitter performance. Specifications Refer to the DC and Switching Characteristics chapter of the Cyclone Device Handbook for Cyclone FPGA PLL specifications. Software Support Support for Cyclone PLLs is available in the Quartus II software by using the altpll megafunction. The following section describes how the altpll megafunction enables the various Cyclone PLL features and options. This section includes the megafunction symbol, the input and output ports, a description of the MegaWizard Plug-In Manager options, and example MegaWizard screen shots. Quartus II altpll Megafunction Figure 6–9 shows the altpll megafunction symbol in the Quartus II software.

Altera Corporation 6–21 May 2008 Preliminary Software Support Figure 6–9. altpll Megafunction Symbol Targeted for Cyclone FPGAs f Refer to Quartus II Help for the altpll megafunction AHDL functional prototypes (applicable to Verilog HDL), VHDL component declaration, and parameter descriptions.

6–22 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 altpll Input Ports Table 6–9 shows the input ports of the altpll megafunction and describes their function. Table 6–9. Input Ports of the altpll Megafunction Port Name Required Description inclk0 (1) Y es The input clock port that drives the PLL. pllena (2) No pllena is an active-high signal, which acts as a combined enable and reset signal for the PLL. Y ou can use it for enabling or disabling one or both PLLs. When this signal is driven low, the PLL clock output ports are driven to GND and the PLL loses lock. Once this signal is driven high again, the lock process begins and the PLL re-synchronizes to its input reference clock. The pllena port can be driven from internal logic or any general-purpose I/O pin. areset (2) No areset is an active-high signal, which resets all PLL counters to their initial values. When this signal is driven high, the PLL resets its counters, clears the PLL outputs, and loses lock. Once this signal is driven low again, the lock process begins and the PLL re-synchronizes to its input reference clock. Y ou can drive the areset port from internal logic or any general-purpose I/O pin. pfdena (2) No pfdena is an active-high signal, which enables or disables the up/down output signals from the PFD. When pfdena is driven low, the PFD is disabled, while the VCO continues to operate. PLL clock outputs continue to toggle regardless of the input clock, but can experience some long-term drift. Because the output clock frequency does not change for some time, you can use the pfdena port as a shutdown or cleanup function when a reliable input clock is no longer available. Y ou can drive the pfdena port from internal logic or any general-purpose I/O pin. Notes to Tab le 6– 9: (1) The inclk0 port to the PLL must be driven by the dedicated clock input pin(s). (2) See “Control Signals” on page 6–12 for further details.

Altera Corporation 6–23 May 2008 Preliminary Software Support altpll Output Ports Table 6–10 shows the output ports of the altpll megafunction and describes their function. MegaWizard Customization You can use the MegaWizard Plug-In Manager to set the altpll megafunction options for each PLL instance in your design. f If you instantiate the altpll megafunction without using the MegaWizard Plug-In Manager, search for “altpll” in the Quartus II Help for a list of the altpll parameters. In the MegaWizard Plug-In Manager, select the altpll megafunction in the I/O directory from the Available Megafunctions dialog box (see Figure 6–10). The altclklock megafunction is also available from the Quartus II software for backward compatibility, but instantiates the new altpll megafunction when targeting Cyclone FPGAs. Table 6–10. Output Ports of the altpll Megafunction Port Name Required Description c[1..0] (1) No Clock output of the PLL that drives the internal global clock network. e0 (1) No Clock output that feeds the external clock output pins, PLL[2..1]_OUT. locked (2) No Gives the status of the PLL lock. When the PLL is locked, this port drives logic high. When the PLL is out of lock, this port drives logic low. The locked port can pulse high and low during the PLL lock process. Notes to T able 6–10: (1) Either the internal or external clock output of the PLL must be selected. (2) See “Control Signals” on page 6–12 for further details.

Altera Corporation 6–25 May 2008 Preliminary Software Support Figure 6–11. Jump to Page Drop-Down List in the altpll MegaWizard Plug-In MegaWizard Page Description This section describes the options available on the altpll MegaWizard pages. Each of the MegaWizard pages are shown. Tables 6–11 through 6–13 describe the features or settings on that page that apply to Cyclone PLLs. Use these tables, along with the hardware descriptions of the PLL features, to determine appropriate settings for your PLL instance. You can use the General/Modes (Page 1) of the altpll MegaWizard Plug-In Manager for selecting the target device family, clock input frequency, general control signal selection, and clock feedback operation mode (see Figure 6–12 and Table 6–11).

6–26 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 6–12. altpll MegaWizard Plug-In Manager (Page 1) Table 6–11. altpll MegaWizard Plug-In Options Page 1 (Part 1 of 2) Function Description Which device family will you be using? This chapter explains all altpll options that apply when Cyclone is the target device family selected. What is the frequency of the inclock0 input The frequency for the PLL input clock, inclock0. Create an pllena input to selectively enable the PLL Creates a pllena port for this PLL instance. See Table 6–9 for pllena port description. Create an areset input to asynchronously reset the PLL Creates a areset port for this PLL instance. See Table 6–9 for areset port description. Create an pfdena input to selectively enable the PFD Creates a pfdena port for this PLL instance. See Table 6–9 for pfdena port description.

Altera Corporation 6–27 May 2008 Preliminary Software Support Use the feedback path inside the PLL This option sets the OPERATION_MODE parameter to either normal, zero delay buffer, or no compensation mode. In normal mode, the PLL feedback path comes from a global clock network, which minimizes the clock delay to registers for that specific PLL clock output. Y ou can specify which PLL output is compensated for by using the COMPENSATE_CLOCK parameter. In zero delay buffer mode, the PLL feedback path is confined to the dedicated PLL external output pin. The clock signal driven off-chip on the PLL_OUT pin is phase aligned with the PLL clock input for a minimized delay between clock input and external clock output. If the PLL is also used to drive the internal clock network, a corresponding phase shift of that clock network results. In no compensation mode, the PLL feedback path is confined to the PLL loop; it does not come from the global clock network or an external source. There is no clock network compensation, but this mode minimizes jitter on clocks. This mode may lead to positive hold times on IOE registers; you can use manual phase shifting to compensate for positive hold times. For more information, see “Clock Feedback Modes” on page 6–13. Which output clock will be compensated? Indicates which output port of the PLL is compensated. For normal mode, you can select c0 or c1. Table 6–11. altpll MegaWizard Plug-In Options Page 1 (Part 2 of 2) Function Description

Altera Corporation 6–29 May 2008 Preliminary Software Support Figure 6–14. altpll MegaWizard Plug-In Manager Pages 5 of 8 The last 3 pages of the MegaWizard Plug-In Manager (Pages 5 to 7) allow you to set the multiplication/division factors, phase shift, and duty cycle for each PLL output port (see Figure 6–14 and Table 6–13).

6–30 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Each page represents the settings for one PLL clock output port. Table 6–13 describes the options for Pages 5 to 8. Page 8 is the summary page and tells you what files the MegaWizard Plug-In Manager will create (see Figure 6–15). Table 6–13. altpll MegaWizard Plug-In Options Pages 5 of 8 Function Description Clock multiplication factor (ratio) Specifies the clock multiplication for this PLL output. The multiplication factor cannot be greater than 32. Clock division factor (ratio) Specifies the clock division for this PLL output. Clock phase shift (Ph) Sets the programmable phase sh ift for the clock output with respect to the PLL clock output that is compensated. The equation to determine the precision of the phase shifting in degrees is (45° divided by the post-scale counter value). Therefore, the maximum step size is 45°, and smaller steps are possible, depending on the multiplication/division ratio necessary on the clock output port. For example, if you have an input clock of 125 MHz with × 1, the post-scale counter G0 is 3. Therefore, the smallest phase shift step is 15°, and additional phase shifting is in 15° increments. The up/down buttons cycle through the possible phase shift settings with the default M and post-scale dividers that the MegaWizard Pug-In Manager has chosen for your target frequency and multiplication/division ratio. It is possible to get other granularities of phase shifts if you manually enter a number into the phase shift field. For example, you can override the MegaWizard-chosen values and manually enter 7.5°. The MegaWizard Plug-In Manager verifies this is possible by using M = 6 and G0 = 6. The MegaWizard Plug-In Manager tries to achieve the closest phase shift possible. For example, if you enter 10°, the MegaWizard Plug-In Manager verifies that 9° is possible by using M = 5 and G0 = 5. For more information, see “Phase Shifting” on page 6–9. Clock duty cycle (DC) Specifies the cl ock duty cycle of the PLL clock output. The equation to determine the precision of the duty cycle is (50% divided by the post-scale counter value). For example, if post-scale counter G0 is 3, the allowed duty cycles are 50% divided by 3, equaling 16.67%. Because the altpll megafunction does not accept non-integer values for the duty cycle values, the allowed duty cycles are 17, 33, 50, and 67%. Due to hard limitations, a duty cycle of 84% cannot be achieved because the closest value to 100% cannot be achieved for a given counter value. However, you can achieve a duty cycle of 84% by choosing a 17% duty cycle and inverting the PLL clock output. Use the up/down buttons to cycle through all possible settings. For more information, see “Programmable Duty Cycle” on page 6–10.

Altera Corporation 6–31 May 2008 Preliminary Software Support

1 You can click Finish at anytime while in the MegaWizard Plug-

In Manager to update the files. Figure 6–15. altpll MegaWizard Plug-In Manager Page 8 Compilation Report During compilation, an information message displays whether the requested multiplication/division factors, and/or phase shift, and/or duty cycle were achieved. If you enter an invalid multiplication/division ratio, compilation fails, and the Quartus II software displays an error message. If you enter an invalid phase shift or duty cycle value, the compilation proceeds, and you will receive an information message displaying the best alternative values chosen by the Quartus II software. The Resource Section of the compilation report provides two PLL reports: the PLL Summary and the PLL Usage reports. The PLL Summary provides information on each PLL’s parameters (see Figure 6–16). The PLL Summary is column-based in the report file, where each column represents a different PLL instance. Table 6–14 lists and explains the parameters shown in the PLL Summary report. PLL properties not listed in Table 6–14 do not apply to Cyclone PLLs.

6–32 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 6–16. PLL Summary Report Table 6–14. PLL Summary in Compilation Report File (Part 1 of 2) PLL Property Description PLL mode Clock feedback mode Compensate clock Indicates which PLL clock output (clock0, clock1, or extclock0) port is compensated Input frequency 0 Clock input frequency for inclk0

Altera Corporation 6–33 May 2008 Preliminary Software Support The PLL Usage report shows the breakdown information for each PLL clock output (see Figure 6–17). This report is categorized by PLL clock output ports, such that each row represents a different PLL clock output used in your design. Table 6–15 lists and explains the parameters shown in the PLL Usage report file in a row format. PLL parameters not listed in Table 6–15 do not apply to Cyclone PLLs. Figure 6–17. PLL Usage Report Timing Analysis Table 6–15 shows the usage in the compilation report file. Nominal VCO frequency Shows the VCO frequency; f VCO = fIN × M/N Freq min lock Shows the minimum PLL input cloc k frequency for which the current combination of M/N still provides a valid VCO lock Freq max lock Shows the maximum PLL input clock frequency for which the current combination of M/N still provides a valid VCO lock M value M counter value N value N counter value Table 6–14. PLL Summary in Compilation Report File (Part 2 of 2) PLL Property Description Table 6–15. PLL Usage in Compilation Report File (Part 1 of 2) PLL Parameter Description Name Indicates the PLL instance name and clock output reported. Output Clock Indicates the PLL clock output (clock0, clock1, or extclock0) for which the parameter information in this row applies. This is the clock port specified in the MegaWizard Plug-In Manager (c0, c1, e0). Mult Overall multiplication ratio. Div Overall division ratio. Output Frequency Output frequency for this output clock. Phase Shift Achieved phase shift in degrees and units of time (can differ from user-entered value).

6–34 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 The register-to-register timing for each PLL clock output that drives the logic array is reported with slack. The timing analysis section of the report file provides slack information in a clock requirement line for each PLL clock output. You can derive fMAX numbers from the slack reporting. The microparameters tCO, tSU, and the path delay are given for a List Path command on the Actual Maximum P2P timing in the Slack Report window. You can add and invert these to find the fMAX for that path. See the following equation: fMAX = 1/(<register to register delay> - <clock skew delay> + <micro setup delay> + <micro clock to output delay>) During timing analysis for Cyclone designs using PLLs, the project clock settings override the PLL input clock frequency and duty cycle settings. It is important to note the following: ■ A warning during compilation reports that the project clock settings override the PLL clock settings. ■ The project clock setting overrides the PLL clock settings for timing- driven compilation. When you compile a design with timing-driven compilation turned on, you are overconstraining the design so that the fitter can give you a better fMAX performance. For example, if the PLL is set to output a 150 MHz clock, you can set a project clock setting for 170 MHz so that the fitter tries to achieve a design performance of 170 MHz. Duty Cycle Duty cycle for this clock output. Counter Post-scale counter used for this clock output, which counter (G0, G1, E0) feeds the clock output. Counter Value Value of post-scale counter. High/Low High- and low-time counts that make up the counter value. The ratio of high- and low-counts is directly proportional to the duty cycle. Initial Initial value for this post-scale counter (achieves the coarse granularity for phase shifting). Specifies the initial number of VCO cycles before starting the counter. VCO Tap VCO tap ranges from 0 to 7 (achieves fine granularity for phase shift in units of 1/8 of the VCO period). Table 6–15. PLL Usage in Compilation Report File (Part 2 of 2) PLL Parameter Description

Altera Corporation 6–35 May 2008 Preliminary Software Support ■ The Compiler checks the lock frequency range of the PLL. If the frequency specified in the project clock settings is outside the lock frequency range, the PLL clock settings will not be overridden. ■ Overriding the PLL clock settings only changes the timing requirements; it does not change the overall multiplication/division and phase delay on each clock output of the PLL. The MegaWizard Plug-In Manager does not use the project clock settings to determine the altpll parameters. ■ Performing a timing analysis without recompiling your design does not change the programming files. You must recompile your design to update the programming files. ■ A Default Required fMAX setting does not override the PLL clock settings. Only individual clock settings will override the PLL clock settings. This capability is useful when you have configured a Cyclone device and want to see if your timing requirements are met when you feed the PLL a different input clock than what is specified for the PLL parameters. Therefore, this feature allows you to overwrite the PLL input clock frequency settings for timing analysis, meaning you do not have to re- synthesize or re-fit your design. The following procedure allows you to override the PLL input frequency setting and re-generate timing analysis. 1. Choose Timing Settings (Project menu). 2. Click on the Clock Settings tab. 3. Under Specify circuit frequency as, select Settings for individual clock signals. 4. Click New. 5. In the New Clock Settings dialog box, type a <name> for the new clock settings in the Clock settings box. 6. If you want to specify timing re quirements for an absolute clock, follow these steps: a. Under Relationship to other clock settings, select Independent of other clock settings. b. In the Required fMAX box, type the required frequency (fMAX) of the clock signal and select a time unit from the list.

6–36 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 c. In the Duty Cycle list, specify the required duty cycle for the clock. 1 Cyclone PLLs accept input clocks with 40 to 60% duty cycle. d. If you want to include external delays to and from device pins in the fMAX calculations, turn on Include external delays to and from device pins in fMAX calculations. e. Click OK. 7. Click OK to close the Timing Settings window. 8. Open the Assignment Organizer dialog box (Tools menu). 9. Click on the By Node tab. 10. Under Mode, select Edit specific entity & node settings for. 11. If necessary, copy a specific PLL input clock pin name to the Name box using the Node Finder dialog box. 12. Under Assignment Categories, click the + icon next to Timing. 13. Click on Click here to add a new assignment. 14. Under Assignment, select Clock Settings in the Name list, and select the <name> of the clock settings you created in step 5. 15. Under Stored in assignments for, select This instance only, This instance in all occurrences of its parent entity, or Other. 16. Click Add. 17. Click OK or Apply. 18. Select Start Timing Analysis (Processing Menu).

Altera Corporation 6–37 May 2008 Preliminary Software Support Simulation The altpll megafunction supports behavioral and timing simulation in both the Quartus II software and supported third-party simulation tools. You can simulate all digital aspects of the PLL, but none of the analog aspects. Simulation supports all control signals and clock outputs. Table 6–16 explains the simulation support for altpll. You can use the altpll behavioral model to simulate the Cyclone PLLs. The Cyclone behavioral model instantiation must follow the same guidelines and restrictions as the design entry. The altpll behavioral and timing models do not simulate jitter, lock time, or VCO drift. The behavioral models for altpll reside in the \\quartus\\eda\\sim_lib directory. ALTERA_MF.VHD contains the VHDL behavioral models and can be used for Cyclone designs that instantiate altpll. ALTERA_MF.v contains the Verilog HDL behavioral models. The behavioral model does not perform parameter error checking, and you must specify only valid values.

1 You must set the resolution of the simulator to units of pico

seconds (ps) to simulate the model successfully. A larger resolution rounds off the calculations, providing incorrect results. Table 6–16. altpll Simulation Support for Cyclone FPGAs Feature Simulation Support pllena The pllena signal is modeled. When this signal is driven low, the PLL loses lock and the PLL clock outputs are driven to logic low. areset The areset signal is modeled. When this signal is driven high, the PLL loses lock and the PLL clock outputs are driven to logic low. Frequency over-shoot on the PLL clock outputs is not modeled. pfdena The pfdena control signal is modeled. When this signal is driven low, the PLL ’s locked output is undefined and the PLL clock outputs continue to toggle at their last set frequency. The finite frequency long-term drift of the VCO is not modeled. locked The locked signal is modeled for a high-bandwidth condition only. The PLL locks or relocks within 2 to 10 cycles during simulation, and does not necessarily reflect the real lock time. Frequency input change If the input frequenc y of the PLL is changed in simulation, the model checks that fIN × (M/N) is within the VCO frequency range and loses lock if outside the VCO operating range. Jitter Jitter is not modeled in simulation.

6–38 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Global Clock Network Cyclone FPGAs have eight global clock networks. The four dedicated clock input pins (CLK[3..0]), eight dual-purpose clock pins (DPCLK[7..0]), and PLL clock outputs can drive the global clock networks. In addition, internal logic for internally-generated global clocks and asynchronous clears, clock enables, or other control signals with large fanout can drive the global clock networks. The eight global clock lines that comprise the global clock network drive throughout the entire device. You can use the global clock network as clock sources for all device resources, including IOEs, logic elements (LEs), and memory blocks. You can also use global clock resources for control signals, such as clock enables and synchronous or asynchronous clears fed from external pins.

Altera Corporation 6–39 May 2008 Preliminary Global Clock Network Figure 6–18 shows the global clock network resources. Figure 6–18. Global Clock Generation Notes to Figure 6–18: (1) The EP1C3 device contains PLL1 only. (2) The EP1C3 device in the 100-pin TQFP package does not have dedicated clock pins CLK1 and CLK3. (3) The EP1C3 device in the 100-pin TQFP package has five DPCLK pins (DPCLK2, DPCLK3, DPCLK4, DPCLK6, and DPCLK7). For more information, see "“Dual-Purpose Clock I/O Pins” on page 6–40.

8 Global Clock

PLL1 PLL2 (1) CLK0 (2) CLK1 CLK2 CLK3 (2) (3) DPCLK1 (3)DPCLK0 DPCLK4 DPCLK5(3) DPCLK2 DPCLK3 DPCLK7 DPCLK6 2 2 From Core Logic From Core Logic 4 4

6–40 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Dedicated Clock Input Pins Cyclone FPGAs have up to four dedicated clock input pins (CLK[3..0], two on the left and right side of the device. You can use the CLK[3..0] pins to drive the PLLs, or directly drive them onto the global clock network. Table 6–17 shows which clock pins drive which global clock network. Dual-Purpose Clock I/O Pins Cyclone FPGAs can have up to eight dual-purpose clock pins, DPCLK[7..0] (two on each side of the device). These dual-purpose pins can connect to the global clock network. You can use the DPCLK[7..0] pins for high fanout control signals, such as asynchronous clears, presets, clock enables, or protocol control signals (e.g., TRDY and IRDY for PCI, or DQS signals for external memory interfaces). These pins are also available as general-purpose I/O pins, meaning they can be inputs, outputs, or bidirectional pins. Table 6–18 shows which dual-purpose clock pins drive which global clock network in Cyclone FPGAs. Table 6–17. Dedicated Clock Input Pin Connections to Global Clock Network Clock Input Pin GCLK0 GCLK1 GCLK2 GCLK3 GCLK4 GCLK5 GCLK6 GCLK7 Note to Table 6–17: (1) The EP1C3 device in the 100-pin TQFP pa ckage does not have dedicated clock pins CLK1 and CLK3. Table 6–18. Dual-Purpose Clock I/O Connections to the Global Clock Network (Part 1 of 2) Dual- Purpose Clock Pin GCLK0 GCLK1 GCLK2 GCLK3 GCLK4 GCLK5 GCLK6 GCLK7

Altera Corporation 6–41 May 2008 Preliminary Global Clock Network Combined Sources Table 6–19 shows which combined sources drive which global clock network. Note to Table 6–18: (1) The EP1C3 device in the 100-pin TQFP package does not have the DPCLK0, DPCLK1, or DPCLK5 pins. Table 6–18. Dual-Purpose Clock I/O Connections to the Global Clock Network (Part 2 of 2) Dual- Purpose Clock Pin GCLK0 GCLK1 GCLK2 GCLK3 GCLK4 GCLK5 GCLK6 GCLK7 Table 6–19. Global Clock Network Sources (Part 1 of 2) Source GCLK0 GCLK1 GCLK2 GCLK3 GCLK4 GCLK5 GCLK6 GCLK7 PLL Counter Outputs Dedicated Clock Input Pins

Altera Corporation 6–43 May 2008 Preliminary Conclusion Figure 6–20. I/O Clock Regions Conclusion Cyclone PLLs provide significant features such as M/(N × post-scale) multiplication/division, phase shift, and programmable duty cycle for your cost-sensitive clock synthesis applications. The reduction in clock delay, and the elimination of clock skew within the device, improves design speed. Cyclone PLL features simplify board design by running the internal logic of the device at a faster rate than the input clock frequency. Vertical I/O Region IO_CLK[5..0] 6 6 I/O Clock Regions Global Clock Network LAB Row Clocks IO_CLK[5..0] Vertical I/O Region IO_CLK[5..0] LAB Row Clocks IO_CLK[5..0] LAB Row Clocks IO_CLK[5..0] LAB Row Clocks IO_CLK[5..0] LAB Row Clocks IO_CLK[5..0] LAB Row Clocks IO_CLK[5..0] LAB Row Clocks IO_CLK[5..0] LAB Row Clocks IO_CLK[5..0] LAB Row Clocks IO_CLK[5..0] LAB Row Clocks IO_CLK[5..0] Horizontal I/O Regions

6–44 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Referenced Documents This chapter references the following documents: ■ AN 75: High-Speed Board Designs ■ DC and Switching Characteristics chapter of the Cyclone Device Handbook Document Table 6–20 shows the revision history for this chapter. Table 6–20. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.5 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.4

• Added document revision history.
• Updated information about pllena signal in “Control Signals” section.
• Updated “Zero Delay Buffer Mode” section.
• Updated Figure 6–5. August 2005 v1.3 Minor updates. — October 2003 v1.2 Updated phase shift information. — July 2003 v1.1 Updated input and output frequency specifications. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

Altera Corporation Part III–1 Preliminary Section III. Memory This section provides information on the M4K embedded memory blocks internal to Cyclone devices. It contains the following: ■ Chapter 7. On-Chip Memory Implementations Using Cyclone Memory Blocks Revision History Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the complete handbook.

Part III–2 Altera Corporation Preliminary Revision History Cyclone Device Handbook, Volume 1

Altera Corporation 7–1 May 2008 Preliminary 7. On-Chip Memory Implementations Using Cyclone Memory Blocks Introduction Cyclone® devices feature embedded memory blocks that can be easily configured to support a wide range of system requirements. These M4K memory blocks present a very flexible and fast memory solution that you can use to provide excellent memory bandwidth and density for a host of cost-sensitive applications. You can use M4K memory blocks in various memory modes, including single-port, simple dual-port, true dual-port (also known as bidirectional dual-port), shift-register, ROM, and first-in first-out (FIFO) mode. M4K memory blocks also include advanced features such as support for byte-enable operation, parity-bit-based error correction, and mixed-port widths. This chapter describes these modes and other characteristics of the M4K memory blocks. M4K Memory Table 7–1 summarizes the features supported by the M4K memory block. Table 7–1. Summary of M4K Memory Features (Part 1 of 2) Performance 250 MHz Total RAM bits (including parity bits) 4,608 Configurations 4K × 1 2K × 2 1K × 4 512 × 8 512 × 9 256 × 16 256 × 18 128 × 32 128 × 36 (1) Parity bits v Byte enable v Single-port memory v Simple dual-port memory v True dual-port memory v Embedded shift register v ROM v C51007-1.4

7–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Table 7–2 shows the memory capacity for M4K memory blocks in each Cyclone device. Parity Bit Support M4K memory blocks support an optional parity bit for each data byte. Of the 4,608 bits of storage space available in an M4K block, 512 are available for use as parity-bit storage. The parity bit, along with logic implemented in logic elements (LEs), can facilitate parity-checking methods of error detection to ensure data integrity. You can also use parity-size data words to store user-specified control bits or as extra data bits to provide support for 9-bit, 18-bit, or 36-bit wide memories. FIFO buffer v Simple dual-port mixed width support v True dual-port mixed width support v Memory initialization (.mif) v Mixed-clock mode v Power-up condition Outputs cleared Register clears Input and output registers (2) Same-port read-during-write New data available at positive clock edge Mixed-port read-during-write Output s set to unknown or old data Notes to Tab le 7 –1: (1) The Altera ® Quartus® II software will automatically cascade or concatenate multiple M4K memory blocks to provide deeper or wider memory functions. (2) Asserting the clear port of the rden and byte-enable registers drives the output of these registers high. Table 7–2. M4K Memory Distribution in Cyclone Devices Device Columns Blocks Total RAM Bits EP1C3 1 13 59,904 EP1C4 1 17 78,336 EP1C6 1 20 92,160 EP1C12 2 52 239,616 EP1C20 2 64 294,912 Table 7–1. Summary of M4K Memory Features (Part 2 of 2)

Altera Corporation 7–3 May 2008 Preliminary M4K Memory Features Byte-Enable Support Byte-enable signals can be used to mask the input data so that only specific bytes in memory are overwritten. The unwritten bytes retain the data value that was last written to them. The write-enable signal (wren) is used in conjunction with byte-enable signals (byteena) to control the M4K block's write operations. The default value for the byteena signal is high (enabled), in which case no bytes are masked and writing is controlled only by the wren signals. Asserting the clear port of the byte-enable register drives the byte-enable signal to its default high level. M4K blocks support byte write operations when the write port has a data width of 16, 18, 32, or 36 bits. Table 7–3 summarizes how byteena controls which bits are masked. Figure 7–1 shows how both the wren and the byteena signals control the write operations of the RAM. Table 7–3. Byte Enable for M4K Blocks Notes (1), (2) byteena datain × 18 datain × 36 [2] = 1 — [26..18] [3] = 1 — [35..27] Notes to Tab le 7 –3: (1) Any combination of byte -enable signals is possible. (2) Byte enables can be used in the sa me manner with 8-bit words, i.e., in × 16 and × 32 modes.

7–4 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 7–1. Byte-Enable Operation Functional Waveform Power-up Conditions and Memory Initialization Upon power-up, M4K memory is in an idle state. The outputs always power-up to zero, regardless of whether the output registers are used or bypassed. Even if a memory initialization file is used to pre-load the contents of the RAM block, the outputs will still power-up cleared. For example, if address 0 is pre-initialized to FF, the M4K blocks power-up with the output at 00. Using M4K Memory M4K memory blocks include input registers that synchronize write operations and output registers to pipeline designs and improve system performance. All M4K memory blocks are fully synchronous, meaning that all inputs are registered, but outputs can be either registered or combinatorial. M4K memory can emulate asynchronous memory. corrupt the memory contents. This applies to both read and write operations. f For more information, refer to AN 210: Converting Memory from Asynchronous to Synchronous for Stratix and Stratix GX Designs. inclock wren address data_in asynch_data_out an XXXX a0 a1 a2 a0 a1 a2 doutn ABXX XXCD ABCD ABFF FFCD ABCD byteena XX 10 01 11 XXXX XX ABCD ABCDFFFF FFFF FFFF ABFF FFCD contents at a0 contents at a1 contents at a2

Altera Corporation 7–7 May 2008 Preliminary Using M4K Memory In simple dual-port mode, M4K blocks have one write-enable and one read-enable signal. On the M4K block, asserting the clear port of the rden register drives rden high, which allows the read operation to occur. When the read-enable signal is deactivated, the current data is retained at the output ports. If the read-enable signal is activated during a write operation with the same address location selected, the simple dual-port RAM output is either unknown or can be set to output the old data stored at the memory address. For more information, see “Read-during-Write Operation at the Same Address” on page 7–20. Figure 7–5 shows timing waveforms for read and write operations in simple dual-port mode. Table 7–4. M4K Block Mixed-Width Configurations (Simple Dual-Port Mode) Read Port Write Port 4K × 12 K × 21 K × 4 512 × 8 256 × 16 128 × 32 512 × 9 256 × 18 128 × 36 4K × 1 vvvvvv ——— 2K × 2 vvvvvv ——— 1K × 4 vvvvvv ——— 512 × 8 vvvvvv ——— 256 × 16 vvvvvv ——— 128 × 32 vvvvvv ———

Altera Corporation 7–9 May 2008 Preliminary Using M4K Memory Figure 7–6. True Dual-Port Memory Note (1) Note to Figure 7–6: (1) True dual-port memory supports input/output clock mode in addition to the independent clock mode shown. The widest bit configuration of a single M4K block in true dual-port mode is 256 × 16-bit (or 256 × 18-bit with parity). The 128 × 32-bit (128 × 36-bit with parity) configuration of the M4K block is unavailable because the number of output drivers is equivalent to the maximum bit width of the M4K block. Because true dual-port RAM has outputs on two ports, the maximum width of the true dual-port RAM equals half of the total number of output drivers. However, multiple M4K blocks can be concatenated to support wider memory configurations. Table 7–5 lists the possible M4K RAM block configurations. Table 7–5. M4K Block Mixed-Port Width Configurations (True Dual-Port Mode) Port A Port B 4K × 12 K × 21 K × 4 512 × 8 256 × 16 512 × 9 256 × 18 4K × 1 vv v v v —— 2K × 2 vv v v v —— 1K × 4 vv v v v —— 512 × 8 vv v v v —— 256 × 16 vv v v v —— dataA[ ] addressA[ ] wrenA clockA clockenA qA[ ] aclrA dataB[ ] addressB[ ] wrenB clockB clockenB qB[ ] aclrB AB

7–10 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 In true dual-port mode, the RAM outputs can only be configured for read-during-write mode. This means that during write operation, data being written to the A or B port of the RAM flows through to the A or B outputs, respectively. When the output registers are bypassed, the new data is available on the rising edge of the same clock cycle it was written on. For sample waveforms and other information on mixed-port read- during-write mode, see “Read-during-Write Operation at the Same Address” on page 7–20. Potential write conflicts must be resolved external to the RAM because simultaneously writing to the same address location at both ports results in unknown data storage at that location. For a valid write operation to the same address of the RAM block, the rising edge of the write clock for port A must occur following the minimum write cycle time interval after the rising edge of the write clock for port B. Since data is written into the M4K blocks at the falling edge of the write clock, the rising edge of the write clock for port A should occur following half of the minimum write cycle time interval after the falling edge of the write clock for port B. If this timing is not met, the data stored in that particular address will be invalid. f For more information about the minimum synchronous write cycle time, refer to the Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook. Figure 7–7 shows true dual-port timing waveforms for a write operation at port A and a read operation at port B.

Altera Corporation 7–11 May 2008 Preliminary Using M4K Memory Figure 7–7. True Dual-Port Timing Waveforms Implementing Shift-Register Mode Embedded memory configurations can implement shift-register blocks for digital signal processing (DSP) applications, such as finite impulse response (FIR) filters, pseudo-random number generators, multi-channel filtering, and auto-correlation and cross-correlation functions. These and other DSP applications require local data storage, traditionally implemented with standard flip-flops that can quickly consume many logic cells for large shift registers. A more efficient alternative is to use embedded memory as a shift-register block, which saves logic cell and routing resources and provides a more efficient implementation. The size of a (w × m × n) shift register is determined by the input data width (w), the length of the taps (m), and the number of taps (n). The size of a (w × m × n) shift register must be less than or equal to the 4,608 bits. In addition, the size of (w × n) must be less than or equal to 36 bits. If a larger shift register is required, memory blocks can be cascaded together. Data is written into each address location at the falling edge of the clock and read from the address at the rising edge of the clock. The shift-register mode logic automatically controls the positive and negative edge clocking to shift the data in one clock cycle. Figure 7–8 shows the M4K memory block in shift-register mode. A_clk A_wren A_address A_data_in B_synch_data_out an-1 an a0 a1 a2 a3 a4 a5 din-1 din din4 din5 B_clk din6 B_asynch_data_out B_wren B_address bn b0 b1 b2 b3 doutn-2 doutn-1 doutn doutn-1 doutn dout0 A_synch_data_out A_asynch_data_out dout0 dout1 dout1 dout2 din-2 din-1 din dout0 dout1 dout2 dout3 din4 din-1 din dout0 dout1 dout2 dout3 din4 din5

7–12 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 7–8. M4K Shift-Register Memory Configuration Implementing ROM Mode M4K blocks can also be configured as ROM. ROM can be initialized in an M4K block by using a memory initialization file (.mif). Because all M4K memory configurations must have synchronous inputs, the address lines of the ROM are registered. ROM outputs can be registered or combinatorial. The read operation of the ROM is identical to the read operation of the single-port RAM configuration. Implementing FIFO Buffers FIFO buffer outputs are always combinatorial. Simultaneous read and write operations from an empty FIFO buffer are not supported. m-Bit Shift Register w w m-Bit Shift Register m-Bit Shift Register m-Bit Shift Register w w w w w w w × m × n Shift Register n Number of Taps

Altera Corporation 7–13 May 2008 Preliminary Clock Modes Clock Modes Depending on the M4K memory mode, independent, input/output, read/write, and/or single-port clock modes are available. Table 7–6 shows the clock modes supported by the M4K memory modes. Independent Clock Mode M4K memory blocks can implement independent clock mode for true dual-port memory. In this mode, a separate clock is available for each port (A and B). Clock A controls all registers on the port A side, while clock B controls all registers on the port B side. Each port also supports independent clock-enable signals and asynchronous clear signals for port A and B registers. Figure 7–9 shows an M4K memory block in independent clock mode. Table 7–6. M4K Memory Clock Modes Clocking Mode True-Dual Port Mode Simple Dual- Port Mode Single-Port Mode Independent v —— Input/output vv — Read/write — v — Single-port — — v

7–14 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 7–9. Independent Clock Mode Note (1) Note to Figure 7–9: (1) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. D ENA Q D ENA Q D ENA Q dataA[ ] addressA[ ] Memory Block 256 ´ 16 (2) 512 ´ 8 1,024 ´ 4 2,048 ´ 2 4,096 ´ 1 Data In Address A Write/Read Enable Data Out Data In Address B Write/Read Enable Data Out clkenA clockA D ENA Q wrenA

8 LAB Row Clocks

qA[ ] dataB[ ] addressB[ ] clkenB clockB wrenB qB[ ] ENA AB ENA DQ D ENA QbyteenaA[ ] Byte Enable A Byte Enable B byteenaB[ ] ENA DQ ENA DQ ENA DQ DQ Write Pulse Generator Write Pulse Generator

Altera Corporation 7–15 May 2008 Preliminary Clock Modes Input/Output Clock Mode M4K memory blocks can implement input/output clock mode for true and simple dual-port memory. On each of the two ports, A and B, one clock controls all registers for inputs (data input, wren, and address) into the memory block. The other clock controls the block's data output registers. Each memory block port also supports independent clock enables and asynchronous clear signals for input and output registers. Figures 7–10 and 7–11 show the memory block in input/output clock mode for true and simple dual-port modes, respectively.

7–16 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 7–10. Input/Output Clock Mode in True Dual-Port Mode Note (1) Note to Figure 7–10: (1) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. D ENA Q D ENA Q D ENA Q dataA[ ] addressA[ ] Memory Block 256 × 16 (2) 512 × 8 1,024 × 4 2,048 × 2 4,096 × 1 Data In Address A Write/Read Enable Data Out Data In Address B Write/Read Enable Data Out clkenA clockA D ENA Q wrenA qA[ ] dataB[ ] addressB[ ] clkenB clockB wrenB qB[ ] ENA AB ENA DQ ENA DQ ENA DQ DQ D ENA QbyteenaA[ ] Byte Enable A Byte Enable B byteenaB[ ] ENA DQ Write Pulse Generator Write Pulse Generator

Altera Corporation 7–17 May 2008 Preliminary Clock Modes Figure 7–11. Input/Output Clock Mode in Simple Dual-Port Mode Notes (1), (2) Notes to Figure 7–11: (1) For more information on the MultiTrack TM interconnect, refer to the Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook. (2) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. Read/Write Clock Mode M4K memory blocks can implement read/write clock mode for simple dual-port memory. This mode can use up to two clocks. The write clock controls the block's data inputs, wraddress, and wren. The read clock controls the data output, rdaddress, and rden. The memory blocks support independent clock enables for each clock and asynchronous clear signals for the read- and write-side registers. Figure 7–12 shows a memory block in read/write clock mode. D ENA Q D ENA Q D ENA Q D ENA Q D ENA Q data[ ] D ENA Qwraddress[ ] address[ ] Memory Block 256 ´ 16 512 ´ 8 1,024 ´ 4 2,048 ´ 2 4,096 ´ 1 Data In Read Address Write Address Write Enable Read Enable Data Out outclken inclken wrclock rdclock wren rden

8 LAB Row

D ENA Qbyteena[ ] Byte Enable Write Pulse Generator

7–18 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 7–12. Read/Write Clock Mode in Simple Dual-Port Mode Notes (1), (2) Notes to Figure 7–12: (1) For more information on the Mult iTrack interconnect, refer to the Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook. (2) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. Single-Port Mode The M4K memory blocks can implement single-port clock mode when simultaneous read and write operations are not required (see Figure 7–13). A single block in a memory block can support up to two single-port mode RAM blocks in M4K blocks. D ENA Q D ENA Q D ENA Q D ENA Q D ENA Q data[ ] D ENA Qwraddress[ ] address[ ] Memory Block 256 × 16 512 × 8 1,024 × 4 2,048 × 2 4,096 × 1 Data In Read Address Write Address Write Enable Read Enable Data Out outclken inclken wrclock rdclock wren rden D ENA Qbyteena[ ] Byte Enable Write Pulse Generator

Altera Corporation 7–19 May 2008 Preliminary Synchronous and Pseudo-Asynchronous Modes Figure 7–13. Single-Port Mode Notes (1), (2) Notes to Figure 7–13: (1) For more information about the Mu ltiTrack interconnect, refer to the Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook. (2) Violating the setup or hold time on the address register s could corrupt the memory contents. This applies to both read and write operations. Synchronous and Pseudo- Asynchronous Modes The M4K memory architecture implements synchronous, pipelined RAM by registering both the input and output signals to the RAM block. All M4K memory inputs are registered, providing synchronous write cycles. In synchronous operation, an M4K block generates its own self-timed strobe write enable (wren) signal derived from the global or regional clock. In contrast, a circuit using asynchronous RAM must generate the RAM wren signal while ensuring its data and address signals meet setup and hold time specifications relative to the wren signal. The output registers can be bypassed. In an asynchronous memory, neither the input nor the output is registered. While Cyclone devices do not support asynchronous memory, they do support a pseudo-asynchronous read operation where the output data is available during the same clock cycle as when the read address is driven into it. Pseudo-asynchronous reading is possible in the simple and D ENA Q D ENA Q D ENA Q D ENA Q data[ ] address[ ] RAM/ROM 256 × 16 512 × 8 1,024 × 4 2,048 × 2 4,096 × 1 Data In Address Write Enable Data Out outclken inclken inclock outclock Write Pulse Generator wren

7–20 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 true dual-port modes of the M4K blocks by clocking the read enable and read address registers on the negative clock edge and bypassing the output registers. The clear signal for both asynchronous and synchronous mode for the memory are treated similarly in Cyclone devices. All inputs to the memory must be synchronous, therefore, the time it takes a clear signal to reset the input or output registers is synchronous to the clock. f For more information, refer to AN 210: Converting Memory from Asynchronous to Synchronous for Stratix and Stratix GX Designs. Read-during- Write Operation at the Same Address The following two sections describe the functionality of the various M4K memory configurations when reading from an address during a write operation at that same address. There are two types of read-during-write operations: same-port and mixed-port. Figure 7–14 illustrates the difference in data flow between same-port and mixed-port read-during- write. Figure 7–14. Read-during-Write Data Flow Same-Port Read-during-Write Mode For read-during-write operation of a single-port RAM or the same port of a true dual-port RAM, the new data is available on the rising edge of the same clock cycle it was written on. See Figure 7–15 for a sample functional waveform. When using byte-enable signals in true dual-port RAM mode, the outputs for the masked bytes on the same port are unknown. (See Figure 7–1.) The non-masked bytes are read out as shown in Figure 7–15. Port A data in Port B data in Port B data out Port A data out Same-port data flow Mixed-port data flow

Altera Corporation 7–21 May 2008 Preliminary Read-during-Write Operation at the Same Address Figure 7–15. Same-Port Read-during-Write Functionality Note (1) Note to Figure 7–15: (1) Outputs are not registered. Mixed-Port Read-during-Write Mode This mode is used when a RAM in simple or true dual-port mode has one port reading and the other port writing to the same address location with the same clock. You can configure the M4K memory block to operate in this mode and modify the parameter shown below using the MegaWizard® Plug-In Manager included with the Quartus II software. The READ_DURING_WRITE_MODE_MIXED_PORTS parameter for M4K memory blocks determines whether or not to output the old data at the address. Setting this parameter to OLD_DATA outputs the old data at that address. Setting this parameter to DONT_CARE outputs an unknown value. During the instantiation of an ALTSYNCRAM or LPM_RAM_DP+ storage megafunction using the Quartus II software, the MegaWizard plug-in manager asks “How should the q output behave when reading a memory location that is being written from the other port?” Clicking “I don’t care” assigns the DONT_CARE value to the parameter, and clicking “Old memory contents appear” assigns the OLD_DATA value to the parameter.

1 Altera recommends using the MegaWizard Plug-In Manager to

create these memory megafunctions rather than directly creating instances. Once a storage megafunction is created using the MegaWizard Plug-In Manager, use the MegaWizard Plug-In Manager to make any necessary changes. See Figures 7–16 and 7–17 for sample functional waveforms showing mixed-port read-during-write mode operation. These figures assume that the outputs are not registered. inclock data_in wren data_out A BA Old

Altera Corporation 7–23 May 2008 Preliminary Referenced Documents Referenced Documents This chapter references the following documents: ■ AN 210: Converting Memory from Asynchronous to Synchronous for Stratix and Stratix GX Designs ■ Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook Document Table 7–7 shows the revision history for this chapter. Table 7–7. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.4 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.3 Added document revision history. — August 2005 v1.2 Minor updates. — February 2005 v1.1 Updated notes for Figures 7-9 through 7-13. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

7–24 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1

Altera Corporation Section IV–1 Preliminary Section IV. I/O Standards This section provides information on the Cyclone FPGA I/O capabilities. It also includes information on selecting I/O standards for Cyclone devices in the Quartus II software. This section contains the following chapters: ■ Chapter 8. Using Selectable I/O Standards in Cyclone Devices ■ Chapter 9. High-Speed Differential Signaling in Cyclone Devices Revision History Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the complete handbook.

Section IV–2 Altera Corporation Preliminary Revision History Cyclone Device Handbook, Volume 1

Altera Corporation 8–1 May 2008 Preliminary 8. Using Selectable I/O Standards in Cyclone Devices Introduction The proliferation of I/O standards and the need for improved I/O performance have made it critical that low-cost devices have flexible I/O capabilities. Selectable I/O capabilities such as SSTL-2, SSTL-3, and LVDS compatibility allow Cyclone® devices to connect to other devices on the same printed circuit board (PCB) that may require different operating and I/O voltages. With these aspects of implementation easily manipulated using the Altera Quartus ® II software, the Cyclone device family enables system designers to use low-cost FPGAs while keeping pace with increasing design complexity. This chapter is a guide to understanding the input/output capabilities of the Cyclone devices, including: ■ Supported I/O Standards ■ Cyclone I/O Banks ■ Programmable Current Drive Strength ■ Hot Socketing ■ I/O Termination ■ Pad Placement and DC Guidelines ■ Quartus II Software Support “Quartus II Software Support” on page 8–18 describes how to use the Quartus II software to specify device and pin options and assign pins to implement the above features of Cyclone devices. C51008-1.6

8–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Supported I/O Standards Cyclone devices support the I/O standards shown in Table 8–1. f For more details about the I/O standards discussed in this section, refer to the Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook. Table 8–1. I/O Standards Supported by Cyclone Devices Notes (1), (2) I/O Standard Type Input Voltage Level (V) Output Voltage Level (V) Input VREF (V) Output VCCIO (V) Termination VTT (V) 3.3-V LVTTL/LVCMOS Single-ended 3.3/2.5 3.3 N/A 3.3 N/A 2.5-V LVTTL/LVCMOS Single-ended 3.3/2.5 2.5 N/A 2.5 N/A 1.8-V LVTTL/LVCMOS PCI (3) Single-ended 3.3 3.3 N/A 3.3 N/A SSTL-3 Class I and II SSTL-2 Class I and II LVDS Compatibility Differential 0 to 2.4 VOD = 0.25 to 0.55 N/A 2.5 N/A RSDS Compatibility Differential 0.1 to 1.4 VOD = 0.1 to 0.6 N/A 2.5 N/A Differential SSTL - 2 Differential N/A (4) 2.5 1.25 2.5 1.25 Notes to Tab le 8– 1: (1) The EP1C3 device in the 100-pin thin quad flat pack (TQFP) package does not have support for a PLL LVDS input or an external clock output. (2) Cyclone devices have dual-purpose differential inputs. Outputs are balanced SSTL outputs requiring an external resistor divider. (3) EP1C3 devices support PCI by using the LVTTL 16-mA I/O standard and drive strength assignments in the Quartus II software. The device requires an external diode for PCI compliance. (4) This I/O standard is only available on output clock pins ( PLL_OUT pins).

Altera Corporation 8–3 May 2008 Preliminary Supported I/O Standards 3.3-V LVTTL (EIA/JEDEC Standard JESD8-B) The 3.3-V LVTTL I/O standard is a general-purpose, single-ended standard used for 3.3-V applications. The LVTTL standard defines the DC interface parameters for digital circuits operating from a 3.0-V/3.3-V power supply and driving or being driven by LVTTL-compatible devices. The LVTTL input standard specifies a wider input voltage range of – 0.3 V ≤VI ≤ 3.9 V . Altera recommends an input voltage range of – 0.5 V ≤ VI ≤ 4.1 V . The LVTTL standard does not require input reference voltages or board terminations. Cyclone devices support both input and output levels for 3.3-V LVTTL. 3.3-V LVCMOS (EIA/JEDEC Standard JESD8-B) The 3.3-V LVCMOS I/O standard is a general-purpose, single-ended standard used for 3.3-V applications. The LVCMOS standard defines the DC interface parameters for digital circuits operating from a 3.0-V or 3.3-V power supply and driving or being driven by LVCMOS-compatible devices. The LVCMOS standard specifies the same input voltage requirements as LVTTL (– 0.3 V ≤ V I ≤ 3.9 V). The output buffer drives to the rail to meet the minimum high-level output voltage requirements. The 3.3-V I/O Standard does not require input reference voltages or board terminations. Cyclone devices support both input and output levels specified by the 3.3-V LVCMOS I/O standard. 2.5-V LVTTL Normal and Wide Voltage Ranges (EIA/JEDEC Standard EIA/JESD8-5) The 2.5-V I/O standard is used for 2.5-V LVTTL applications. This standard defines the DC interface parameters for high-speed, low- voltage, non-terminated digital circuits driving or being driven by other 2.5-V devices. The input and output voltage requirements are: ■ The 2.5-V normal and wide range input standards specify an input voltage range of –0.3 V ≤ VI ≤ 3.0-V . ■ The normal range minimum high-level output voltage requirement (VOH) is 2.1-V . ■ The wide range minimum high-level output voltage requirement (VOH) is VCCIO – 0.2-V . The 2.5-V standard does not require input reference voltages or board terminations. Cyclone devices support input and output levels for both 2.5-V LVTTL ranges.

8–4 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 2.5-V LVCMOS Normal and Wide Voltage Ranges (EIA/JEDEC Standard EIA/JESD8-5) The 2.5-V I/O standard is used for 2.5-V LVCMOS applications. This standard defines the DC interface parameters for high-speed, low-voltage, non-terminated digital circuits driving or being driven by other 2.5-V parts. The input and output voltage ranges are: ■ The 2.5-V normal and wide range input standards specify an input voltage range of – 0.3-V ≤ V I ≤ 3.0-V . ■ The normal range minimum VOH requirement is 2.1 V . ■ The wide range minimum VOH requirement is VCCIO – 0.2 V . The 2.5-V standard does not require input reference voltages or board terminations. Cyclone devices support input and output levels for both 2.5-V LVCMOS ranges. 1.8-V LVTTL Normal and Wide Voltage Ranges (EIA/JEDEC Standard EIA/JESD8-7) The 1.8-V I/O standard is used for 1.8-V LVTTL applications. This standard defines the DC interface parameters for high-speed, low-voltage, non-terminated digital circuits driving or being driven by other 1.8-V parts. The input and output voltage ranges are: ■ The 1.8-V normal and wide range input standards specify an input voltage range of – 0.3 V ≤ V I ≤ 2.25 V . ■ The normal range minimum VOH requirement is VCCIO – 0.45 V . ■ The wide range minimum VOH requirement is VCCIO – 0.2 V . The 1.8-V standard does not require input reference voltages or board terminations. Cyclone devices support input and output levels for both normal and wide 1.8-V LVTTL ranges. 1.8-V LVCMOS Normal and Wide Voltage Ranges (EIA/JEDEC Standard EIA/JESD8-7) The 1.8-V I/O standard is used for 1.8-V LVCMOS applications. This standard defines the DC interface parameters for high-speed, low-voltage, non-terminated digital circuits driving or being driven by other 1.8-V devices. The input and output voltage ranges are: ■ The 1.8-V normal and wide range input standards specify an input voltage range of – 0.3 V ≤ V I ≤ 2.25 V . ■ The normal range minimum VOH requirement is VCCIO – 0.45 V . ■ The wide range minimum VOH requirement is VCCIO – 0.2 V .

Altera Corporation 8–5 May 2008 Preliminary Supported I/O Standards The 1.8-V standard does not require input reference voltages or board terminations. Cyclone devices support input and output levels for both normal and wide 1.8-V LVCMOS ranges. 1.5-V LVCMOS Normal and Wide Voltage Ranges (EIA/JEDEC Standard JESD8-11) The 1.5-V I/O standard is used for 1.5-V applications. This standard defines the DC interface parameters for high-speed, low-voltage, non- terminated digital circuits driving or being driven by other 1.5-V devices. The input and output voltage ranges are: ■ The 1.5-V normal and wide range input standards specify an input voltage range of – 0.3 V ≤ V I ≤ 1.9-V . ■ The normal range minimum VOH requirement is 1.05 V . ■ The wide range minimum VOH requirement is VCCIO – 0.2-V . The 1.5-V standard does not require input reference voltages or board terminations. Cyclone devices support input and output levels for both normal and wide 1.5-V LVCMOS ranges. 3.3-V (PCI Special Interest Group (SIG) PCI Local Bus Specification Revision 2.2) The PCI local bus specification is used for applications that interface to the PCI local bus, which provides a processor-independent data path between highly integrated peripheral controller components, peripheral add-in boards, and processor/memory systems. The conventional PCI specification revision 2.2 defines the PCI hardware environment including the protocol, electrical, mechanical, and configuration specifications for the PCI devices and expansion boards. This standard requires 3.3-V V CCIO. The 3.3-V PCI standard does not require input reference voltages or board terminations. The side I/O pins on all Cyclone devices (except the EP1C3 device) are fully compliant with the 3.3-V PCI Local Bus Specification Revision 2.2 and meet 32-bit/66-MHz operating frequency and timing requirements. The EP1C3 device supports the PCI I/O standard by using the LVTTL 16-mA setting and an external diode. The top and bottom I/O pins on all Cylcone devices support PCI by using the LVTTL 16-mA setting and an external diode. Cyclone devices support PCI input and output levels on I/O banks 1 and 3 only. See “Cyclone I/O Banks” for more details and the IP MegaStoreTM website.

8–6 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Table 8–2 lists the specific Cyclone devices that support 64- and 32-bit PCI at 66 MHz. Table 8–3 lists the specific Cyclone devices that support 64- and 32-bit PCI at 33 MHz. Table 8–2. Cyclone 66-MHz PCI Support Device Package -6 and -7 Speed Grades

64 Bit 32 Bit

EP1C4 324-pin FineLine BGA vv 400-pin FineLine BGA vv EP1C6 240-pin PQFP — v 256-pin FineLine BGA — v EP1C12 324-pin FineLine BGA vv EP1C20 324-pin FineLine BGA vv 400-pin FineLine BGA vv Table 8–3. Cyclone 33-MHz PCI Support Device Package -6, -7 and -8 Speed Grades EP1C4 324-pin FineLine BGA vv 400-pin FineLine BGA vv EP1C6 240-pin PQFP — v 256-pin FineLine BGA — v EP1C12 240-pin PQFP — v 256-pin FineLine BGA — v 324-pin FineLine BGA vv EP1C20 324-pin FineLine BGA vv 400-pin FineLine BGA vv

Altera Corporation 8–9 May 2008 Preliminary Cyclone I/O Banks flexible approach to LVDS support allows LVDS compatibility on every bank of the Cyclone device at speeds up to 640 Mbps. (Contact Altera Applications for the latest LVDS specification). Differential SSTL-2 - EIA/JEDEC Standard JESD8-9A The differential SSTL-2 I/O standard is a 2.5-V standard used for applications such as high-speed DDR SDRAM clock interfaces. This standard supports differential signals in systems using the SSTL-2 standard and supplements the SSTL-2 standard for differential clocks. The differential SSTL-2 standard specifies an input voltage range of –0 . 3V ≤ V I ≤ V CCIO + 0.3-V . The differential SSTL-2 standard does not require an input reference voltage differential. See Figure 8–5 for details on differential SSTL-2 termination. Cyclone devices support output clock levels for differential SSTL-2 class II operation. Figure 8–5. SSTL-2 Class II Differential Termination f For more details about the I/O standards discussed in this section, refer to the Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook. Cyclone I/O Banks The I/O pins on Cyclone devices are grouped together into I/O banks and each bank has a separate power bus. This permits designers to select the preferred I/O standard for a given bank enabling tremendous flexibility in the Cyclone device’s I/O support. Each Cyclone device supports four I/O banks regardless of density. Similarly, each device I/O pin is associated with one of these specific, numbered I/O banks. To accommodate voltage-referenced I/O Differential Transmitter Differential Receiver Z0 = 50 Ω 50 Ω 50 Ω Z0 = 50 Ω VTT = 1.25 V V TT = 1.25 V 50 Ω 50 Ω VTT = 1.25 V V TT = 1.25 V 25 Ω 25 Ω

Altera Corporation 8–11 May 2008 Preliminary Cyclone I/O Banks f For more information about acceptable input levels, refer to Using Cyclone Devices in Multiple-Voltage Systems chapter in the Cyclone Device Handbook. Any number of supported single-ended or differential standards can be simultaneously supported in a single I/O bank as long as they use compatible VCCIO levels for input and output pins. For example, an I/O bank with a 2.5-V VCCIO setting can support 2.5-V LVTTL inputs and outputs, 2.5-V LVDS-compatible inputs and outputs, and 3.3-V LVCMOS inputs only. Voltage-referenced standards can be supported in an I/O bank using any number of single-ended or differential standards as long as they use the same VREF and a compatible VCCIO value. For example, if you choose to implement both SSTL-3 and SSTL-2 in your Cyclone device, I/O pins using these standards—becaus e they require different VREF values—must be in different banks from each other. However, SSTL-3 and 3.3-V LVCMOS could be supported in the same bank with the VCCIO set to 3.3-V and the VREF set to 1.5-V . See “Pad Placement and DC Guidelines” on page 8–14 for more information. All four I/O banks support all of the I/O standards with the exception of PCI, which is only supported on banks 1 and 3 (see Figure 8–7). 1.5-V v(2) v(2) vv Notes to Tab le 8– 4: (1) For SSTL and LVDS I/O Standard , input buffers are powered by VCCINT and not VCCIO. Hence, input buffers can accept input levels of 3.3 V or 2.5 V regardless of VCCIO level for both SSTL and LVDS I/O Standard. (2) These input values overdrive the input buffer, so the pin leakage current is slightly higher than the default value. Check Allow voltage overdrive for LVTTL/LVCMOS input pins in Settings > Device > Device and Pin Options > Pin Placement tab to allow input pins with LVTTL or LVCMOS I/O standards to be placed by the Quartus II software inside an I/O bank with a lower VCCIO voltage than the voltage specified by the pins. Table 8–4. Acceptable Input Levels for LVTTL/LVCMOS Note (1) (Part 2 of 2) Bank VCCIO Acceptable Input Levels

8–12 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 8–7. I/O Standards Supported in Cyclone Devices Notes (1), (2) Notes to Figure 8–7 (1) EP1C3 devices support PCI by using the LVTTL 16-m A I/O standard and drive strength assignments in the Quartus II software. The device requires an external diode for PCI compliance. (2) The EP1C3 device in the 100-pin thin quad flat pack (TQFP) package does not have support for a PLL LVDS-compatible input or an external clock output. Programmable Current Drive Strength The Cyclone device I/O standards support various output current drive settings as shown in Table 8–5. These programmable drive-strength settings are a valuable tool in helping decrease the effects of simultaneously switching outputs (SSO) in conjunction with reducing system noise. The supported settings ensure that the device driver meets the specifications for I OH and IOL of the corresponding I/O standard. These drive-strength settings are programmable on a per-pin basis (for output and bidirectional pins only) using the Quartus II software. To modify the current strength of a particular pin, refer to “Programmable Drive Strength Settings”. I/O Bank 2 I/O Bank 1 I/O Bank 3 I/O Bank 4 All I/O Banks support ■ 3.3-V LVTTL/LVCMOS ■ 2.5-V LVTTL/LVCMOS ■ 1.8-V LVTTL/LVCMOS ■ 1.5-V LVCMOS ■ LVDS ■ RSDS ■ SSTL-2 Class I and II ■ SSTL-3 Class I and II I/O Bank 1 also supports the 3.3-V PCI I/O Standard I/O Bank 3 also supports the 3.3-V PCI I/O Standard

Altera Corporation 8–13 May 2008 Preliminary Hot Socketing Hot Socketing Cyclone devices support any power-up or power-down sequence (VCCIO and VCCINT) to facilitate hot socketing. You can drive signals into the device before or during power-up or power-down without damaging the device. Cyclone devices will not drive out until the device is configured and has attained proper operating conditions. You can power up or power down the VCCIO and VCCINT pins in any sequence. The power supply ramp rates can range from 100 ns to 100 ms. All VCC supplies must power down within 100 ms of each other to prevent I/O pins from driving out. Additionally, during power-up, the I/O pin capacitance is less than 15 pF and the clock pin capacitance is less than 20pF. ■ The hot socketing DC specification is | IIOPIN | < 300 µA. ■ The hot socketing AC specification is | IIOPIN | < 8 mA for 10 ns or less. I/O Termination The majority of the Cyclone I/O standards are single-ended, non-voltage- referenced I/O standards and, as such, the following I/O standards do not specify a recommended termination scheme: ■ 3.3-V LVTTL / LVCMOS ■ 2.5-V LVTTL / LVCMOS ■ 1.8-V LVTTL / LVCMOS ■ 1.5-V LVCMOS ■ 3.3-V PCI The Cyclone device family does not feature on-chip I/O termination resistors. Table 8–5. Programmable Drive Strength I/O Standard (1) IOH/IOL Current Strength Setting (2) 3.3-V LVTTL 24, 16, 12, 8, 4 mA 3.3-V LVCMOS 12, 8, 4, 2 mA 2.5-V LVTTL/LVCMOS 16, 12, 8, 2 mA 1.8-V LVTTL/LVCMOS 12, 8, 2 mA 1.5-V LVCMOS 8, 4, 2 mA Notes to Tab le 8 –5: (1) The Quartus II software default current setting is the maximum setting for each I/O standard. (2) SSTL 2 class I and II, SSTL 3 class I an d II, and PCI do not support programmable drive strength.

8–14 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Voltage-Referenced I/O Standard Termination Voltage-referenced I/O standards require both an input reference voltage, VREF, and a termination voltage, VTT. An external pull up to VTT must be provided to the Cyclone device as the device does not have VTT pins. The reference voltage of the receiving device tracks the termination voltage of the transmitting device. For more information on termination for voltage-referenced I/O standards, refer to “Supported I/O Standards”. Differential I/O Standard Termination Differential I/O standards typically require a termination resistor between the two signals at the receiver. The termination resistor must match the differential load impedance of the bus. LVDS and RSDS are the only differential I/O standards supported by Cyclone devices. For information on LVDS termination and RSDS termination, refer to the LVDS Receiver and Transmitter Termination and RSDS I/O Standard Support in Cyclone Devices sections, respectively, in the High-Speed Differential Signaling in Cyclone Devices chapter in the Cyclone Device Handbook. Pad Placement and DC Guidelines This section provides pad placement guidelines for the programmable I/O standards supported by Cyclone devices and includes essential information for designing systems using the devices’ selectable I/O capabilities. This section also discusses the DC limitations and guidelines. Differential Pad Placement Guidelines In order to maintain an acceptable noise level on the VCCIO supply, there are restrictions on placement of single-ended I/O pads in relation to differential pads. Use the following guidelines for placing single-ended pads with respect to differential pads in Cyclone devices. ■ Single-ended inputs may be only be placed four or more pads away from a differential pad. ■ Single-ended outputs and bidirectional pads may only be placed five or more pads away from a differential pad.

1 The Quartus II software generates an error message for illegally

placed pads.

Altera Corporation 8–15 May 2008 Preliminary Pad Placement and DC Guidelines VREF Pad Placement Guidelines In order to maintain an acceptable noise level on the VCCIO supply and to prevent output switching noise from shifting the VREF rail, there are restrictions on the placement of single-ended voltage referenced I/Os with respect to VREF pads and VCCIO/GND pairs. Please use the following guidelines for placing single-ended pads in Cyclone devices. Input Pads Each VREF pad supports a maximum of 40 input pads with up to 20 on each side of the VREF pad. This is irrespective of VCCIO/GND pairs. Output Pads When a voltage referenced input or bidirectional pad does not exist in a bank, there is no limit to the number of output pads that can be implemented in that bank. When a voltage referenced input exists, each VCCIO/GND pair supports 9 outputs for Fineline BGA® packages or 4 outputs for quad flat pack (QFP) packages. Any output pads must be placed greater than 1 pad away from your VREF pad to maintain acceptable noise levels. Bidirectional Pads Bidirectional pads must satisfy input and output guidelines simultaneously. If the bidirectional pads are all controlled by the same OE and there are no other outputs or voltage referenced inputs in the bank, then there is no case where there is a voltage referenced input active at the same time as an output. Therefore, the output limitation does not apply. However, since the bidirectional pads are linked to the same OE, the bidirectional pads will all act as inputs at the same time. Therefore, the input limitation of 40 input pads (20 on each side of your VREF pad) will apply.

8–16 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 If the bidirectional pads are all controlled by different output enables (OE) and there are no other outputs or voltage referenced inputs in the bank, then there may be a case where one group of bidirectional pads is acting as inputs while another group is acting as outputs. In such cases, apply the formulas shown in Table 8–6. Consider an FineLine BGA package with 4 bidirectional pads controlled by OE1, 4 bidirectional pads controlled by OE2, and 2 bidirectional pads controlled by OE3. If OE1 and OE2 are active and OE3 is inactive, there are 10 bidirectional pads, but it is safely allowable because there would be 8 or fewer outputs per VCCIO/GND pair. When at least one additional voltage referenced input and no other outputs exist in the same VREF bank, the bidirectional pad limitation applies in addition to the input and output limitations. See the following equation. (Total number of bidirectional pads) + (Total number of input pads) ≤ 40 (20 on each side of your VREF pad)

1 The bidirectional pad limitation applies to both Fineline BGA

packages and QFP packages. After applying the equation above, apply one of the equations in Table 8–7, depending on package type. Table 8–6. Input-Only Bidirectional Pad Limitation Formulas Package Type Formula FineLine BGA (Total number of bidirectional pads) - (Total number of pads from the smallest group of pads controlled by an OE) ≤ 9 (per VCCIO/GND pair) QFP (Total number of bidirecti onal pads) - (Total number of pads from the smallest group of pads controlled by an OE) ≤ 4 (per VCCIO/GND pair). Table 8–7. Bidirectional Pad Limitation Formulas (Where VREF Inputs Exist) Package Type Formula FineLine BGA (Total number of bidirectional pads) ≤ 9 (per VCCIO/GND pair) QFP (Total number of bidirectional pads) ≤ 4 (per VCCIO/GND pair)

Altera Corporation 8–17 May 2008 Preliminary Pad Placement and DC Guidelines When at least one additional output exists but no voltage referenced inputs exist, apply the appropriate formula from Table 8–8. When additional voltage referenced inputs and other outputs exist in the same VREF bank, then the bidirectional pad limitation must again simultaneously adhere to the input and output limitations. As such, the following rules apply: Total number of bidirectional pads + Total number of input pads ≤ 40 (20 on each side of your VREF pad). packages and QFP packages. After applying the equation above apply one of the equations in Table 8–9, depending on package type. Each I/O bank can only be set to a single VCCIO voltage level and a single VREF voltage level at a given time. Pins of different I/O standards can share the bank if they have compatible VCCIO values (see Table 8–4 for more details). In all cases listed above, the Quartus II software generates an error message for illegally placed pads. Table 8–8. Bidirectional Pad Limitation Formulas (Where VREF Outputs Exist) Package Type Formula FineLine BGA (Total number of bidirect ional pads) + (Total number of additional output pads) - (Total number of pads from the smallest group of pads controlled by an OE) ≤ 9 (per VCCIO/GND pair) QFP (Total number of bidirectional pads) + (Total number of additional output pads) - (Total number of pads from the smallest group of pads controlled by an OE) = 4 (per VCCIO/GND pair) Table 8–9. Bidirectional Pad Limitation Formulas (Multiple VREF Inputs and Outputs) Package Type Formula FineLine BGA (Total number of bidirectional pads) + (Total number of output pads) ≤ 9 (per VCCIO/GND pair) QFP (Total number of bidirectional pads) + (Total number of output pads) ≤ 4 (per VCCIO/GND pair)

8–18 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 DC Guidelines There is a current limit of 320 mA per 16 consecutive output pins, as shown by the following equation: Table 8–10 shows the current allowed per pin by select I/O standards as measured under the standard's defined loading conditions. PCI, LVTTL, LVCMOS, and other supported I/O standards not shown in the table do not have standardized loading conditions. As such, the current allowed per pin in a series-loaded condition for these standards is considered negligible. Quartus II Software Support Use the Quartus II software to specify which programmable I/O standards to use for Cyclone devices. This section describes Quartus II implementation, placement, and assignment guidelines, including: ■ Settings ■ Device and pin options ■ Assigning pins ■ Programmable drive strength settings ■ I/O banks in the floorplan view ■ Auto placement and verification Settings The Settings dialog box (Assignments menu) includes options allowing you to set a default I/O standard, optimize for I/O placement, assign I/O pins, and numerous other I/O-related options. The most pertinent user features are described in detail below. Table 8–10. I/O Standard DC Specification Pin I/O Standard I Pin (mA) 3.3-V V CCIO 2.5-V VCCIO SSTL-3 Class I 8 N/A SSTL-3 Class II 16 N/A SSTL-2 Class I N/A 8.1 SSTL-2 Class II N/A 16.4 LVDS N/A Σ pin + 15 pin Ipin < 320 mA

Altera Corporation 8–19 May 2008 Preliminary Quartus II Software Support Device and Pin Options To access Device and Pin Options, choose Settings from Assignments menu. From Settings dialog box, click Device and Pin Options. There are numerous categories in the Device and Pin Options dialog box, including General, Configuration, Programming Files, Unused Pins, Dual-Purpose Pins, and Voltage. Similarly, each of these categories contains settings vital to the device operation such as the default I/O standard applied to the device (Voltage tab), how to reserve all unused pins (Unused Pins tab), specify the capacitive load (in picofarads (pF)) on output pins for each I/O standards (Capacitive Loading tab), and whether or not the device should enable a device-wide reset (General tab). Assigning Pins Assuming a specific device has been chosen in the available devices list in the Device Settings dialog box (Assignments menu), clicking Pin Planner provides the device's pin settings and pin assignments (see Figure 8–8). You can view, add, remove and update pin settings in the Pin Planner window. The information for each pin includes: ■ Node Name ■ Direction ■ Location ■ I/O Bank ■ Vref Group ■ I/O Standard ■ Reserved ■ Group

8–20 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 8–8. Assign Pins

1 You can use Filter in the Pin Planner window to list assigned,

unassigned, input, output, bidirectional or all pins. When you assign an I/O standard that requires a reference voltage to an I/O pin, the Quartus II software automatically assigns VREF pins. Refer to Quartus II Help for instructions on how to use an I/O standard for a pin. Programmable Drive Strength Settings To specify programmable drive strength settings, perform the following steps: 1. Choose Assignment Editor (Assignments menu). 2. Under To field in the Assignment Editor box, right-click on a new row. Select Node Finder. Click List in the Node Finder window. Then select the output or bidirectional pin for which you will specify the current strength. 3. Set the Assignment Name field to Current Strength (accepts wildcards/groups), then enter the desired value in the Value field. 4. Select Yes under Enabled field to enable the selected current strength.

Altera Corporation 8–21 May 2008 Preliminary Quartus II Software Support The Quartus II software displays the entire range of drive strength choices. While the Quartus II software does not prohibit you from specifying any of these for your I/O pin, not every setting is supported by every I/O standard. See Table 8–5 for supported combinations. I/O Banks in the Floorplan View View the arrangement of the device I/O banks by choosing Timing Closure Floorplan (Assignments View menu) with the Floorplan View displayed (see Figure 8–9). Pins that belong to the same I/O bank must use the same VCCIO voltage. You can assign multiple I/O standards to the I/O pins in any given I/O bank as long as the VCCIO voltage of the desired I/O standards is the same. A given bank can have up to three VREF signals, and each signal can support one voltage-referenced I/O standard. Each device I/O pin belongs to a specific, numbered I/O bank. By default, the Show I/O Banks option is enabled, allowing the I/O banks to be displayed as color coded (See Figure 8–9). Figure 8–9. Floorplan View Window

8–22 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Auto Placement and Verification of Selectable I/O Standards The Quartus II software automatically verifies the placement for all I/O and VREF pins and performs the following actions: ■ Automatically places I/O pins of different VREF standards without pin assignments in separate I/O banks and enables the VREF pins of these I/O banks. ■ Verifies that voltage-referenced I/O pins requiring different VREF levels are not placed in the same bank. ■ Reports an error message if the current limit is exceeded for a Cyclone power bank (See “DC Guidelines”). ■ Automatically assigns VREF pins and I/O pins such that the current requirements are met and I/O standards are placed properly. Conclusion Cyclone device I/O capabilities enable system designers to keep pace with increasing design complexity utilizing a low-cost FPGA device family. Support for I/O standards including SSTL and LVDS compatibility allow Cyclone devices to fit into a wide variety of applications. The Quartus II software makes it easy to use these I/O standards in Cyclone device designs. After design compilation, the software also provides clear, visual representations of pads and pins and the selected I/O standards. Taking advantage of the support of these I/O standards in Cyclone devices will allow you to lower your design costs without compromising design flexibility or complexity. More Information For more information about Cyclone devices refer to the following resources: ■ Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook ■ Using Cyclone Devices in Multiple-Voltage Systems chapter in the Cyclone Device Handbook ■ AN 75: High-Speed Board Designs References For more information on the I/O standards referred to in this document, see the following sources: ■ Stub Series Terminated Logic for 2.5-V (SSTL-2), JESD8-9A, Electronic Industries Association, December 2000. ■ 1.5-V +/- 0.1-V (Normal Range) and 0.9-V - 1.6-V (Wide Range) Power Supply Voltage and Interface Standard for Non-terminated Digital Integrated Circuits, JESD8-11, Electronic Industries Association, October 2000.

Altera Corporation 8–23 May 2008 Preliminary Referenced Documents ■ 1.8-V +/- 0.15-V (Normal Range) and 1.2-V - 1.95-V (Wide Range) Power Supply Voltage and Interface Standard for Non-terminated Digital Integrated Circuits, JESD8-7, Electronic Industries Association, February 1997. ■ 2.5-V +/- 0.2-V (Normal Range) and 1.8-V to 2.7-V (Wide Range) Power Supply Voltage and Interface Standard for Non-terminated Digital Integrated Circuits, JESD8-5, Electronic Industries Association, October 1995. ■ Interface Standard for Nominal 3-V/ 3.3-V Supply Digital Integrated Circuits, JESD8-B, Electronic Industries Association, September 1999. ■ PCI Local Bus Specification, Revision 2.2, PCI Special Interest Group, December 1998. ■ Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, ANSI/TIA/EIA-644, American National Standards Institute/Telecommunications Industry/Electronic Industries Association, October 1995. Referenced Documents This chapter references the following documents: ■ AN 75: High-Speed Board Designs ■ Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook ■ High-Speed Differential Signaling in Cyclone Devices chapter in the Cyclone Device Handbook ■ Using Cyclone Devices in Multiple-Voltage Systems chapter in the Cyclone Device Handbook Document Table 8–11 shows the revision history for this chapter. Table 8–11. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.6 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.5

• Added document revision history.
• Removed references to “compiler” settings and updated information in “Quartus II Software Support” section.
• Updated Figure 8–8 and the following handpara note.
• Updated procedure in “Programmable Drive Strength Settings” section.
• Minor update in “I/O Banks in the Floorplan View”.

8–24 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 August 2005 v1.4 Minor updates. — February 2005 v1.3

• Updated information concerning hot socketing AC specifications.
• Updated the notes to Figures 8-13 through 8-20.
• Updated text in the Output Pads section. Changed 2 pads away to 1. October 2003 v1.2 Updated the 3.3-V (PCI Special Interest Group (SIG) PCI Local Bus Specification Revision 2.2) section. September 2003 v1.1 Updated LVDS data rates to 640 Mbps from 311 Mbps. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

Altera Corporation 9–1 May 2008 Preliminary 9. High-Speed Differential Signaling in Cyclone Devices Introduction From high-speed backplane applications to high-end switch boxes, low-voltage differential signaling (LVDS) is the technology of choice. LVDS is a low-voltage differential signaling standard, allowing higher noise immunity than single-ended I/O technologies. Its low-voltage swing allows for high-speed data transfers, low power consumption, and less electromagnetic interference (EMI). LVDS I/O signaling is a data interface standard defined in the TIA/EIA-644 and IEEE Std. 1596.3 specifications. The reduced swing differential signaling (RSDS) standard is a derivative of the LVDS standard. The RSDS I/O standard is similar in electrical characteristics to LVDS, but has a smaller voltage swing and therefore provides further power benefits and reduced EMI. National Semiconductor Corporation introduced the RSDS specification and now many vendors use it for flat panel display (FPD) links between the controller and the drivers that drive the display column drivers. Cyclone devices support the RSDS I/O standard at speeds up to 311 megabits per second (Mbps). Altera® Cyclone devices allow you to transmit and receive data through LVDS signals at a data rate up to 640 Mbps. For the LVDS transmitter and receiver, the Cyclone device’s input and output pins support serialization and deserialization through internal logic. This chapter describes how to use Cyclone I/O pins for LVDS and RSDS signaling and contains the following topics: ■ Cyclone I/O Banks ■ Cyclone High-Speed I/O Interface ■ LVDS Receiver and Transmitter ■ RSDS I/O Standard Support in Cyclone Devices ■ Cyclone Receiver and Transmitter Termination ■ Implementing Cyclone LVDS and RSDS I/O Pins in the Quartus® II Software ■ Design Guidelines C51009-1.6

9–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Cyclone High- Speed I/O Banks Cyclone devices offer four I/O banks, as shown in Figure 9–1. A subset of pins in each of the four I/O banks (on both rows and columns) support the high-speed I/O interface. Cyclone pin tables list the pins that support the high-speed I/O interface. The EP1C3 device in the 100-pin thin quad flat pack (TQFP) package does not support the high-speed I/O interface. Figure 9–1. Cyclone I/O Banks Table 9–1 shows the total number of supported high-speed I/O channels in each Cyclone device. You can use each channel as a receiver or transmitter. Cyclone devices support different modes (× 1, × 2, × 4, × 7, × 8, and × 10) of operation with a maximum internal clock frequency of 405 MHz (-6 speed grade), 320 MHz (-7 speed grade), or 275 MHz (-8 speed grade), and a maximum data rate of 640 Mbps (-6 speed grade). I/O Bank 2 I/O Bank 3 I/O Bank 4 I/O Bank 1 All I/O Banks Support ■ 3.3-V LVTTL/LVCMOS ■ 2.5-V LVTTL/LVCMOS ■ 1.8-V LVTTL/LVCMOS ■ 1.5-V LVCMOS ■ LVDS ■ RSDS ■ SSTL-2 Class I and II ■ SSTL-3 Class I and II I/O Bank 3 Also Supports the 3.3-V PCI I/O Standard I/O Bank 1 Also Supports the 3.3-V PCI I/O Standard Individual Power Bus

Altera Corporation 9–3 May 2008 Preliminary Cyclone High-Speed I/O Interface f For more information about I/O standards supported by Cyclone devices, refer to the Using Selectable I/O Standards in Cyclone Devices chapter in the Cyclone Device Handbook. Cyclone High- Speed I/O Interface You can use the I/O pins and internal logic to implement an high-speed I/O receiver and transmitter in Cyclone devices. Cyclone devices do not contain dedicated serialization or deserialization circuitry; therefore, shift registers, internal global phase-locked loops (PLLs), and I/O cells are used to perform serial-to-parallel conversions on incoming data and parallel-to-serial conversion on outgoing data. Clock Domains Cyclone devices provide a global clock network and two PLLs (the EP1C3 device only contains one PLL). The global clock network consists of eight global clock lines that drive through the entire device (see Figure 9–2). There are four dedicated clock pins that feed the PLL inputs (two dedicated clocks for each PLL). PLL pins can also act as LVDS input pins. Cyclone PLLs provide general-purpose clocking with clock multiplication and phase shifting as well as external outputs for high- speed differential I/O support. Altera recommends that designers use a data channel for the high-speed clock output for better balanced skew on the transmitter data pins with respect to the output clock. Table 9–1. Number of High-Speed I/O Channels Per Cyclone Device Device Pin Count Total Number of High- Speed I/O Channels EP1C3 144 34 EP1C4 324 103 400 129 EP1C6 144 29 240 72 256 72 EP1C12 240 66 256 72 324 103 EP1C20 324 95 400 129

9–6 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 9–5. Transmitter Output Waveform for Differential I/O Standard Table 9–2 lists the LVDS I/O specifications. VOS Ground Positive Channel (p) Negative Channel (n) Single-Ended Waveform Differential Waveform +VOD VOD p n = 0 V VOD Table 9–2. LVDS I/O Specifications (Part 1 of 2) Symbol Parameter Conditions Min Typ Max Unit VCCINT Supply Voltage — 1.425 1.5 1.575 V VCCIO I/O Supply Voltage — 2.375 2.5 2.625 V VOD Differential Output Voltage R L = 100 Ω 250 350 550 mV Δ VOD Change in VOD between H and L RL = 100 Ω ——5 0 m V VOS Output Offset Voltage RL = 100 Ω 1.125 1.25 1.375 V Δ VOS Change in VOS between H and L RL = 100 Ω ——5 0 m V VID Input differential voltage swing (single-ended)

0.1 V ≤ VCM ≤

2.0 V 100 — 650 mV VIN Receiver input voltage range —0 — 2 . 4 V

Altera Corporation 9–7 May 2008 Preliminary RSDS I/O Standard Support in Cyclone Devices RSDS I/O Standard Support in Cyclone Devices The RSDS specification defines its use in chip-to-chip applications between the timing controller and the column drivers on display panels. The Cyclone characterization and simulations were performed to meet the National Semiconductor Corp. RSDS Interface Specification. Table 9–3 shows the RSDS electrical characteristics for Cyclone devices. Figures 9–6 and 9–7 show the RSDS receiver and transmitter signal waveforms. VCM Receiver input common mode voltage 100 mV ≤ V ID ≤ 650 mV 100 — 2,000 mV RL Receiver Differential Input Resistor — 90 100 110 W Table 9–2. LVDS I/O Specifications (Part 2 of 2) Symbol Parameter Conditions Min Typ Max Unit Table 9–3. RSDS Electrical Characteristics for Cyclone Devices Symbol Parameter Min Typ Max Unit VCCIO I/O supply voltage 2.375 2.5 2.625 V VOD Differential output voltage 100 200 600 mV VOS Output offset voltage 0.5 1.2 1.5 V VTH Differential threshold — — ±100 mV VCM Input common mode voltage 0.3 — 1.5 V

Altera Corporation 9–9 May 2008 Preliminary RSDS I/O Standard Support in Cyclone Devices Cyclone FPGA devices support all three bus configuration types as defined by the RSDS specification: ■ Multi-drop bus with double termination ■ Multi-drop bus with single end termination ■ Double multi-drop bus with single termination Designing with RSDS Cyclone devices support the RSDS standard using the LVDS I/O buffer types. For receivers, the LVDS input buffer can be used without any changes. For transmitters, the LVDS output buffer can be used with the external resistor network shown in Figure 9–8. Figure 9–8. RSDS Resistor Network Table 9–4 shows the resistor values recommended for each RSDS bus configuration type. f For more information about RSDS bus configuration types, refer to the RSDS specification from the National Semiconductor website (www.national.com). RS RS RP RL = 100 Ω 50 Ω 50 Ω Resistor Network Cyclone Device RSDS ReceiverLVDS Transmitter ≤1 inch Table 9–4. Recommended Resistor Values Bus Configuration Type RS (Ω)R P (Ω) Multi-drop bus with double termination 160 145 Multi-drop bus with single end termination 226 124 Double multi-drop bus with single termination 226 124

9–10 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 A resistor network is required to attenuate the LVDS output voltage swing to meet the RSDS specifications. The resistor network values can be modified to reduce power or improve the noise margin. The resistor values chosen should satisfy the following equation: For example, in the multi-drop bus with single end termination or double multi-drop bus with single termination bus configuration, the resistor values can be modified to RS = 200 Ω and RP = 130 Ω to increase the VOD or voltage swing of the signal. Additional simulations using the IBIS models should be performed to validate that custom resistor values meet the RSDS requirements. RSDS Software Support When designing for the RSDS I/O standard, assign the LVDS I/O standard to the I/O pins intended for RSDS in the Quartus II software. Contact Altera Applications for reference designs. RS × RP RS + RP = 50 Ω

Altera Corporation 9–11 May 2008 Preliminary High-Speed I/O Timing in Cyclone Devices High-Speed I/O Timing in Cyclone Devices Since LVDS and RSDS data communication is source synchronous, timing analysis is different than other I/O standards. You must understand how to analyze timing for the high-speed I/O signal, which is based on skew between the data and the clock signal. You should also consider board skew, cable skew, and clock jitter in your calculation. This section provides details on high-speed I/O standards timing parameters in Cyclone devices. Table 9–5 defines the parameters of the timing diagram shown in Figure 9–9. Table 9–5. High-Speed I/O TIming Definitions Note (1) Parameter Symbol Description High-speed clock frequency f HSCLK High-speed receiver/transmitter input clock frequency. High-speed I/O data rate HSIODR High-speed receiv er/transmitter input and output data rate. High-speed external output clock fHSCLKOUT High-speed transmitter external output clock frequency using an LVDS data channel. Channel-to-channel skew TCCS The timing diffe rence between the fastest and slowest output edges, including tCO variation and clock skew. The clock is included in the TCCS measurement. Sampling window SW The period of time during which the data must be valid in order for you to capture it correctly. The setup and hold times determine the ideal strobe position within the sampling window. SW = tSW (max) – tSW (min). Receiver input skew margin RSKM RSKM is defined by the total margin left after accounting for the sampling window and TCCS. The RSKM equation is: RSKM = (TUI – SW – TCCS) / 2 Input jitter tolerance (peak-to- peak) Allowed input jitter on the input clock to the PLL that is tolerable while maintaining PLL lock. Output jitter (peak-to-peak) Peak-to-peak output jitter from the PLL. Rise time t RISE Low-to-high transmission time. Fall time t FALL High-to-low transmission time. Duty cycle t DUTY Duty cycle on LVDS transmitter output clock. PLL lock time t LOCK Lock time for the PLL Note to Table 9–5: (1) The TCCS specification applies to the whole bank of LVDS as long as the SERDES logic is placed within the LAB adjacent to the output pins.

Altera Corporation 9–13 May 2008 Preliminary High-Speed I/O Timing in Cyclone Devices HSIODR ×10 156.25 NA 311 156.25 NA 311 156.25 NA 311 Mbps ×8 125 NA 311 125 NA 311 125 NA 311 Mbps ×7 125 NA 311 125 NA 311 125 NA 311 Mbps ×4 62.5 NA 311 62.5 NA 311 62.5 NA 311 Mbps ×2 31.25 NA 311 31.25 NA 311 31.25 NA 311 Mbps ×1 (1) 15.625 NA 275 15.625 NA 275 15.625 NA 275 Mbps fHSCLKOUT — 15.625 NA 275 15.625 NA 275 15.625 NA 275 MHz TCCS — NA NA ±150 NA NA ±150 NA NA ±150 ps SW — NA NA 500 NA NA 550 NA NA 550 ps Input jitter tolerance (peak-to- peak) — NA NA 400 NA NA 400 NA NA 400 ps Output jitter (peak- to-peak) — NA NA 400 NA NA 400 NA NA 400 ps t RISE — 150 200 250 150 200 250 150 200 250 ps tFALL — 150 200 250 150 200 250 150 200 250 ps tDUTY — 4 55 05 5 4 55 05 5 4 55 05 5 % tLOCK — NA NA 100 NA NA 100 NA NA 100 μs Note to Table 9–6: (1) The PLL must divide down the input clock frequency to have the internal clock frequency meet the specification shown in the DC and Switching Characteristics chapter in the Cyclone Device Handbook. Table 9–6. RSDS Timing Specification for Cyclone Devices (Part 2 of 2) Symbol Conditions -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Typ Max Min Typ Max Min Typ Max

9–14 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Table 9–7 shows the LVDS timing budget for Cyclone devices at 640 Mbps. Table 9–7. LVDS Timing Specification for Cyclone Devices Symbol Conditions -6 Speed Grade -7 Speed Grade -8 Speed Grade Unit Min Typ Max Min Typ Max Min Typ Max fHSCLK ×10 15.625 NA 64 15.625 NA 64 15.625 NA 55 MHz ×8 15.625 NA 80 15.625 NA 80 15.625 NA 68.75 MHz ×4 15.625 NA 160 15.625 NA 160 15.625 NA 137.5 MHz ×2 15.625 NA 320 15.625 NA 320 15.625 NA 275 MHz ×1 (1) 15.625 NA 567 15.625 NA 549 15.625 NA 531 MHz HSIODR ×10 156.25 NA 640 156.25 NA 640 156.25 NA 550 Mbps ×8 125 NA 640 125 NA 640 125 NA 550 Mbps ×7 125 NA 640 125 NA 640 125 NA 550 Mbps ×4 62.5 NA 640 62.5 NA 640 62.5 NA 550 Mbps ×2 31.25 NA 640 31.25 NA 640 31.25 NA 550 Mbps ×1 (1) 15.625 NA 320 15.625 NA 320 15.625 NA 275 Mbps f HSCLKOUT 15.625 NA 320 15.625 NA 320 15.625 NA 275 MHz TCCS NA NA ±150 NA NA ±150 NA NA ±150 ps SW NA NA 500 NA NA 500 NA NA 550 ps Input jitter tolerance (peak-to- peak) NA NA 400 NA NA 400 NA NA 400 ps Output jitter (peak- to-peak) NA NA 400 NA NA 400 NA NA 400 ps t RISE 150 200 250 150 200 250 150 200 250 ps tFALL 150 200 250 150 200 250 150 200 250 ps tDUTY 45 50 55 45 50 55 45 50 55 % tLOCK NA NA 100 NA NA 100 NA NA 100 μs Note to Table 9–7: (1) The PLL must divide down the input clock frequency to have the internal clock frequency meet the specification shown in the DC and Switching Characteristics chapter in the Cyclone Device Handbook.

9–16 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Implementing Cyclone LVDS and RSDS I/O Pins in the Quartus II Software For differential signaling, the receiver must deserialize the incoming data and send it to the internal logic as a parallel signal. Accordingly, the transmitter must serialize the parallel data coming from the internal logic to send it off-chip (see Figure 9–13). Figure 9–13. Deserialization and Serialization at Receiver and Transmitter Although Cyclone devices do not incorporate a dedicated serializer/ deserializer (SERDES), you can incorporate these functions in your design using the Quartus II software. The device implements the SERDES in logic elements (LEs) and requires a PLL. LVDS in Cyclone devices is implememented using megafunctions in Quartus II software. The altlvds_rx megafunction implements a deserialization receiver. The altlvds_tx megafunction implements a serialization transmitter. The placement of the LE registers is handled by the LVDS MegaWizard in the Quartus II software. The Cyclone device DDIO logic placer in the Quartus II software only places the DDIO output registers according to Altera’s recommendation and does not check if it meets the TCCS specification. There is no timing analysis done in the Quartus II software to report the TCCS. Verify timing anaysis by running the Timing Analyzer in the Quartus II software. Refer to the Quartus II software documenation and the Quartus II Help for more information on these megafunctions. Follow the recommendations in Tables 9–8 and 9–9 for PLL phase shift settings. The operation of these settings are guaranteed by operation. Cyclone Device Deserializer Serializer rxin + rxin - txout + txout - Serial DataSerial Data Receiver Transmitter

Altera Corporation 9–17 May 2008 Preliminary Implementing Cyclone LVDS and RSDS I/O Pins in the Quartus II Software The required receiver PLL phase settings for top and bottom I/O banks (I/O banks 2 and 4) based on high-speed I/O data rate and operating mode are shown in Table 9–8. The required receiver PLL phase settings for right and left I/O banks (I/O Bank 1 and 3) based on high-speed I/O data rate and operating mode are shown in Table 9–9. Table 9–8. Receiver PLL Phase Settings for Top and Bottom I/O Banks Device Phase Shift (Degree) Unit 0 22.5 45 EP1C3 — — 300 to 640 Mbps EP1C4 — 601 to 640 300 to 600 Mbps EP1C6 — 601 to 640 300 to 600 Mbps EP1C12 — 451 to 640 300 to 450 Mbps EP1C20 551 to 640 300 to 550 — Mbps Table 9–9. Receiver PLL Phase Settingsfor Right and Left I/O Banks Device Phase Shift (Degree) Unit –22.5 0 22.5 45 EP1C3 — — 451 to 640 300 to 450 Mbps EP1C4 — 551 to 640 300 to 550 — Mbps EP1C6 — — 451 to 640 300 to 450 Mbps EP1C12 601 to 640 451 to 600 300 to 450 — Mbps EP1C20 501 to 640 300 to 500 — — Mbps

9–18 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Design Guidelines To implement LVDS in Cyclone devices, adhere to the following design guidelines in the Quartus II software. ■ Route LVDS CLKOUT to pins through regular user LVDS pins. This routing provides better TCCS margin. ■ To meet the tSU and tCO timing requirement between serial and parallel registers, use the I/O registers of the input and output pins. ■ fMAX is limited by the delay between the IOE and the next logic element (LE) register. To achieve an fMAX of 320 MHz, the delay between the IOE and the next LE register at the receiver and transmitter side must not be more than 3.125 ns. ■ The best location to implement the shift registers is within the LAB adjacent to the input or output pin. ■ LVDS data and clock should be aligned at the output pin. If these signals are not aligned, use a phase shift to align them. Differential Pad Placement Guidelines To maintain an acceptable noise level on the VCCIO supply, there are restrictions on placement of single-ended I/O pins in relation to differential pads. f For placing single-ended pads with respect to differential pads in Cyclone devices, refer to the guidelines in the Using Selectable I/O Standards in Cyclone Devices chapter in the Cyclone Device Handbook. Board Design Considerations This section explains how to get the optimal performance from the Cyclone I/O block and ensure first-time success in implementing a functional design with optimal signal quality. The critical issues of controlled impedance of traces and connectors, differential routing, and termination techniques must all be considered to get the best performance from the integrated circuit (IC). Use this chapter together with the Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook. The Cyclone device generates signals that travel over the media at frequencies as high as 640 Mbps. Use the following general guidelines: ■ Base board designs on controlled differential impedance. Calculate and compare all parameters such as trace width, trace thickness, and the distance between two differential traces. ■ Maintain equal distance between traces in LVDS pairs, as much as possible. Routing the pair of traces close to each other will maximize the common-mode rejection ratio (CMRR)

Altera Corporation 9–19 May 2008 Preliminary Conclusion ■ Longer traces have more inductance and capacitance. These traces should be as short as possible to limit signal integrity issues. ■ Place termination resistors as close to receiver input pins as possible. ■ Use surface mount components. ■ Avoid 90° or 45° corners. ■ Use high-performance connectors. ■ Design backplane and card traces so that trace impedance matches the connector’s and/or the termination’s impedance. ■ Keep equal number of vias for both signal traces. ■ Create equal trace lengths to avoid skew between signals. Unequal trace lengths result in misplaced crossing points and decrease system margins as the TCCS value increases. ■ Limit vias because they cause discontinuities. ■ Use the common bypass capacitor values such as 0.001 μF, 0.01 μF, and 0.1 μF to decouple the high-speed PLL power and ground planes. ■ Keep switching TTL signals away from differential signals to avoid possible noise coupling. ■ Do not route TTL clock signals to areas under or above the differential signals. ■ Analyze system-level signals. Conclusion Cyclone LVDS I/O capabilities enable you to keep pace with increasing design complexity while offering the lowest-cost FPGA on the market. Support for I/O standards including LVDS allows Cyclone devices to fit into a wide variety of applications. Taking advantage of these I/O standards and Cyclone pricing allows you to lower your design costs while remaining on the cutting edge of technology. Referenced Documents This chapter references the following documents: ■ AN 224: High-Speed Board Layout Guidelines ■ Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook ■ DC and Switching Characteristics chapter in the Cyclone Device Handbook ■ Using Selectable I/O Standards in Cyclone Devices chapter in the Cyclone Device Handbook

9–20 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Document Table 9–10 shows the revision history for this chapter. Table 9–10. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.6 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.5 Added document revision history. — August 2005 v1.4 Updated minimum LVDS LOD value listed in Table 9-2. — February 2005 v1.3 Minor updates. — October 2003 v1.2

• Added RSDS information.
• Removed VSS from Figure 9–5.
• Added RSDS and LVDS timing information in Tables 9–6 and 9–7, respectively.
• Updated Implementing Cyclone LVDS and RSDS I/O Pins in the Quartus II Software section, including addition of the PLL Circuit section. September 2003 v1.1 Updated LVDS data rates to 640 Mbps from 311 Mbps. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

Altera Corporation Section V–1 Preliminary Section V. Design Considerations This section provides documentation on design considerations when utilizing Cyclone devices. In addition to these design considerations, refer to the Intellectual Property section of the Altera web site for a complete offering of IP cores for Cyclone devices. This section contains the following chapters: ■ Chapter 10, Implementing Double Data Rate I/O Signaling in Cyclone Devices ■ Chapter 11. Using Cyclone Devices in Multiple-Voltage Systems ■ Chapter 12. Designing with 1.5-V Devices Revision History Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the complete handbook.

Section V–2 Altera Corporation Preliminary Revision History Cyclone Device Handbook, Volume 1

Altera Corporation 10–1 May 2008 Preliminary 10. Implementing Double Data Rate I/O Signaling in Cyclone Devices Introduction Double data rate (DDR) transmission is used in many applications where fast data transmission is needed, such as memory access and first-in first-out (FIFO) memory structures. DDR uses both edges of a clock to transmit data, which facilitates data transmission at twice the rate of a single data rate (SDR) architecture using the same clock speed. This method also reduces the number of I/O pins required to transmit data. This chapter shows implementations of a double data rate I/O interface using Cyclone® devices. Cyclone devices support DDR input, DDR output, and bidirectional DDR signaling. For more information on using Cyclone devices in applications with DDR SDRAM and FCRAM memory devices, refer to “DDR Memory Support” on page 10–4. Double Data Rate Input The DDR input implementation shown in Figure 10–1 uses four internal logic element (LE) registers located in the logic array block (LAB) adjacent to the DDR input pin. The DDR data is fed to the first two of four registers. One register captures the DDR data present during the rising edge of the clock. The second register captures the DDR data present during the falling edge of the clock. Figure 10–1. Double Data Rate Input Implementation n_edge_reg PRN DQ PRN DQ PRN DQ PRN DQ p_edge_reg ddr_l_sync_reg ddr_h_sync_reg ddr clk ddr_out_l ddr_out_h NOT DFF DFF DFF DFF C51010-1.2

Altera Corporation 10–5 May 2008 Preliminary Document Revision History Document Table 10–1 shows the revision history for this chapter. Table 10–1. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.2 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.1 Added document revision history. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

10–6 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1

Altera Corporation 11–1 May 2008 Preliminary 11. Using Cyclone Devices in Multiple-Voltage Systems Introduction To meet the demand for higher system speed in data communications, semiconductor vendors use increasingly advanced processing technologies requiring lower operating voltages. As a result, printed circuit boards (PCBs) often incorporate devices conforming to one of A mixture of components with various voltage level I/O standards on a single PCB is inevitable. In order to accommodate this mixture of devices on a single PCB, a device that can act as a bridge or interface between these devices is needed. The Cyclone ® device family’s MultiVolt™ I/O operation capability meets the increasing demand for compatibility with devices of different voltages. MultiVolt I/O operation separates the power supply voltage from the output voltage, enabling Cyclone devices to interoperate with other devices using different voltage levels on the same PCB. In addition to MultiVolt I/O operation, this chapter discusses several other features that allow you to use Cyclone devices in multiple-voltage systems without damaging the device or the system, including: ■ Hot-Socketing—add and remove Cy clone devices to and from a powered-up system without affecting the device or system operation ■ Power-Up Sequence flexibility—Cyclone devices can accommodate any possible power-up sequence ■ Power-On Reset—Cyclone devices maintain a reset state until voltage is within operating range I/O Standards The I/O buffer of a Cyclone device is programmable and supports a wide range of I/O voltage standards. Each I/O bank in a Cyclone device can be programmed to comply with a different I/O standard. All I/O banks can be configured with the following I/O standards: ■ 3.3-V LVTTL/LVCMOS ■ 2.5-V LVTTL/LVCMOS ■ 1.8-V LVTTL/LVCMOS ■ 1.5-V LVCMOS ■ LVDS ■ SSTL-2 Class I and II ■ SSTL-3 Class I and II C51011-1.2

11–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 I/O banks 1 and 3 also include 3.3-V PCI I/O standard interface capability. See Figure 11–1. Figure 11–1. I/O Standards Supported by Cyclone Devices Notes (1), (2), (3) Notes to Figure 11–1 (1) Figure 1 is a top view of the silicon die. (2) Figure 1 is a graphical representation only. Refer to the pin list and the Quartus ® II software for exact pin locations. (3) The EP1C3 device in the 100-pin thin quad flat pack (TQFP) package does not have support for a PLL LVDS input or an external clock output. MultiVolt I/O Operation Cyclone devices include MultiVolt I/O operation capability, allowing the core and I/O blocks of the device to be powered-up with separate supply voltages. The VCCINT pins supply power to the device core and the VCCIO pins supply power the device’s I/O buffers. I/O Bank 1 I/O Bank 2 I/O Bank 3 I/O Bank 4 I/O Bank 1 also supports the 3.3-V PCI I/O Standard I/O Bank 3 also supports the 3.3-V PCI I/O Standard All I/O Banks support ■ 3.3-V LVTTL/LVCMOS ■ 2.5-V LVTTL/LVCMOS ■ 1.8-V LVTTL/LVCMOS ■ 1.5-V LVCMOS ■ LVDS ■ SSTL-2 Class I and II ■ SSTL-3 Class I and II Individual Power Bus

Altera Corporation 11–3 May 2008 Preliminary 5.0-V Device Compatibility

1 Supply all device VCCIO pins that have MultiVolt I/O capability

Figure 11–2. Figure 11–2. Implementing a Multiple-Voltage System with a Cyclone Device 5.0-V Device Compatibility A Cyclone device may not correctly interoperate with a 5.0-V device if the output of the Cyclone device is connected directly to the input of the 5.0-V device. If VOUT of the Cyclone device is greater than VCCIO, the PMOS pull-up transistor still conducts if the pin is driving high, preventing an external pull-up resistor from pulling the signal to 5.0-V . A Cyclone device can drive a 5.0-V LVTTL device by connecting the VCCIO pins of the Cyclone device to 3.3 V . This is because the output high voltage (VOH) of a 3.3-V interface meets the minimum high-level voltage of 2.4-V of a 5.0-V LVTTL device. (A Cyclone device cannot drive a 5.0-V LVCMOS device.) Because the Cyclone devices are 3.3-V , 64- and 32-bit, 66- and 33-MHz PCI compliant the input circuitry accepts a maximum high-level input voltage (VIH) of 4.1-V . To drive a Cyclone device with a 5.0-V device, you must connect a resistor (R2) between the Cyclone device and the 5.0-V device. See Figure 11–3. Cyclone Device 3.3-V Device 2.5-V Device 5.0-V Device

Altera Corporation 11–5 May 2008 Preliminary 5.0-V Device Compatibility Figure 11–4. Output Drive Characteristics of a 5.0-V Device As shown above, R1 = 5.0-V/135 mA.

1 The values usually shown in data sheets reflect typical operating

conditions. Subtract 20% from the data sheet value for guard band. This subtraction applied to the above example gives R1 a value of 30 Ω. R2 should be selected to not violate the driving device’s IOH specification. For example, if the above device has a maximum IOH of 8 mA, given the PCI clamping diode, VIN =V CCIO + 0.7-V = 3.7-V . Given that the maximum supply load of a 5.0-V device (VCC) will be 5.25-V , the value of R2 can be calculated as follows: This analysis assumes worst-case conditions. If your system will not see a wide variation in voltage-supply levels, you can adjust these calculations accordingly. 1 Because 5.0-V device tolerance in Cyclone devices requires use of the PCI clamp (not available on EP1C3 devices), and this clamp is activated during configuration, 5.0-V signals may not be driven into the device until it is configured. 150 54321 120 135 VO Output Voltage (V) Typical Output Current (mA) IO IOH IOL VCCINT = 5.0V VCCIO = 5.0V

11–6 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Hot-Socketing Hot-socketing, also known as hot-swapping, refers to inserting or removing a board or device into or out of a system board while system power is on. For a system to support hot-socketing, plug-in or removal of the subsystem or device must not damage the system or interrupt system operation. All devices in the Cyclone family are designed to support hot-socketing without special design requirements. The following features have been implemented in Cyclone devices to facilitate hot-socketing: ■ Devices can be driven before power-up with no damage to the device. ■ I/O pins remain tri-stated during power-up. ■ Signal pins do not drive the VCCIO or VCCINT power supplies. 1 Because 5.0-V tolerance in Cyclone devices require the use of the PCI clamping diode, and the clamping diode is only available after configuration has finished, be careful not to connect 5.0-V signals to the device. Devices Can Be Driven before Power-Up The device I/O pins, dedicated input pins, and dedicated clock pins of Cyclone devices can be driven before or during power-up without damaging the devices. I/O Pins Remain Tri-Stated during Power-Up A device that does not support hot-socketing may interrupt system operation or cause contention by driving out before or during power-up. For Cyclone devices, I/O pins are tri-stated before and during power-up and configuration, and will not drive out. Signal Pins Do Not Drive the VCCIO or VCCINT Power Supplies A device that does not support hot-socketing will short power supplies together when powered-up through its signal pins. This irregular power-up can damage both the driving and driven devices and can disrupt card power-up. In Cyclone devices, there is no current path from I/O pins, dedicated input pins, or dedicated clock pins to the VCCIO or VCCINT pins before or during power-up. A Cyclone device may be inserted into (or removed from) a powered-up system board without damaging or interfering with system-board operation. When hot-socketing, Cyclone devices have a minimal effect on the signal integrity of the backplane.

Altera Corporation 11–7 May 2008 Preliminary Power-Up Sequence

1 The maximum DC current when hot-socketing Cyclone devices

is less than 300 µA, whereas the maximum AC current during hot-socketing is less than 8 mA for a period of 10ns or less. During hot-socketing, the signal pins of a device may be connected and driven by the active system before the power supply can provide current to the device VCC and ground planes. Known as latch-up, this condition can cause parasitic diodes to turn on within the device, causing the device to consume a large amount of current, and possibly causing electrical damage. This operation can also cause parasitic diodes to turn on inside of the driven device. Cyclone devices are immune to latch-up when hot- socketing. Power-Up Sequence Because Cyclone devices can be used in a multi-voltage environment, they are designed to tolerate any possible power-up sequence. Either VCCINT or VCCIO can initially supply power to the device, and 3.3-V , 2.5-V , 1.8-V , or 1.5-V input signals can drive the devices without special precautions before VCCINT or VCCIO is applied. Cyclone devices can operate with a VCCIO voltage level that is higher than the VCCINT level. You can also change the VCCIO supply voltage while the board is powered-up. However, you must ensure that the VCCINT and VCCIO power supplies stay within the correct device operating conditions. When VCCIO and VCCINT are supplied from different power sources to a Cyclone device, a delay between VCCIO and VCCINT may occur. Normal operation does not occur until both power supplies are in their recommended operating range. When VCCINT is powered-up, the IEEE Std. 1149.1 Joint Test Action Group (JTAG) circuitry is active. If TMS and TCK are connected to VCCIO and VCCIO is not powered-up, the JTAG signals are left floating. Thus, any transition on TCK can cause the state machine to transition to an unknown JTAG state, leading to incorrect operation when VCCIO is finally powered-up. To disable the JTAG state during the power-up sequence, TCK should be pulled low to ensure that an inadvertent rising edge does not occur on TCK. Power-On Reset When designing a circuit, it is important to consider system state at power-up. Cyclone devices maintain a reset state during power-up. When power is applied to a Cyclone device, a power-on-reset event occurs if VCC reaches the recommended operating range within a certain period of time (specified as a maximum VCC rise time). A POR event does not occur if these conditions are not met because slower rise times can cause incorrect device initialization and functional failure. The VCCIO level of the I/O banks that contains configuration pins must also reach an acceptable level to trigger POR event.

11–8 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1

1 If VCCINT does not remain in the specified operating range,

operation is not assured until VCCINT re-enters the range. The Cyclone device family’s MultiVolt I/O operation capability allows you to incorporate newer-generation devices with devices of varying voltage levels. This capability also enables the device core to run at its core voltage, VCCINT, while maintaining I/O pin compatibility with other logic levels. Altera has taken further steps to make system design easier by designing devices that allow VCCINT and VCCIO to power-up in any sequence and by incorporating support for hot-socketing. Document Table 11–1 shows the revision history for this chapter. Table 11–1. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.3 Minor textual and style changes. — January 2007 v1.2 Updated “Power-On Reset” section. — October 2003 v1.1 Added 64-bit PCI support information. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

Altera Corporation 12–1 May 2008 Preliminary 12. Designing with 1.5-V Devices Introduction The Cyclone® FPGA family provides the best solution for high-volume, cost-sensitive applications. A Cyclone device is fabricated on a leading-edge 1.5-V, 0.13-µm, all-layer copper SRAM process. Using a 1.5-V operating voltage provides the following advantages: ■ Lower power consumption compared to 2.5-V or 3.3-V devices. ■ Lower operating temperature. ■ Less need for fans and other temperature-control elements. Since many existing designs are based on 5.0-V, 3.3-V and 2.5-V power supplies, a voltage regulator may be required to lower the voltage supply level to 1.5-V. This document provides guidelines for designing with Cyclone devices in mixed-voltage and single-voltage systems and provides examples using voltage regulators. This document also includes information about: ■ “Power Sequencing and Hot Socketing” on page 12–1 ■ “Using MultiVolt I/O Pins” on page 12–2 ■ “Voltage Regulators” on page 12–3 ■ “1.5-V Regulator Application Examples” on page 12–19 ■ “Board Layout” on page 12–21 ■ “Power Sequencing and Hot Socketing” on page 12–1 Power Sequencing and Hot Socketing Because 1.5-V Cyclone FPGAs can be used in a mixed-voltage environment, they have been designed specifically to tolerate any possible power-up sequence. Therefore, the VCCIO and VCCINT power supplies may be powered in any order. You can drive signals into Cyclone FPGAs before and during power up without damaging the device. In addition, Cyclone FPGAs do not drive out during power up since they are tri-stated during power up. Once the device reaches operating conditions and is configured, Cyclone FPGAs operate as specified by the user. f For more information, refer to the Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook. C51012-1.4

12–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Using MultiVolt I/O Pins I/O supply voltage level (VCCIO). All pins, including dedicated inputs, clock, I/O, and JTAG pins, are 3.3-V tolerant before and after VCCINT and VCCIO are powered. When VCCIO is connected to 1.5-V, the output is compatible with 1.5-V logic levels. The output pins can be made 1.8-V, 2.5-V, or 3.3-V compatible by using open-drain outputs pulled up with external resistors. You can use external resistors to pull open-drain outputs up with a 1.8-V, 2.5-V, or 3.3-V VCCIO. Table 12–1 summarizes Cyclone MultiVolt I/O support. Figure 12–1 shows how Cyclone FPGAs interface with 3.3--V and 2.5-V devices while operating with a 1.5-V VCCINT to increase performance and save power. Table 12–1. Cyclone MultiVolt I/O Support Note (1) VCCIO (V) Input Signal Output Signal 1.8-V vvvv — v (3) v ——— Notes to Table 12–1: (1) The PCI clamping diode must be disabled to drive an input with voltages higher than VCCIO. (2) When V CCIO = 1.5-V and a 2.5-V or 3.3-V input signal feeds an input pin, higher pin leakage current is expected. (3) When V CCIO = 1.8-V, a Cyclone device can drive a 1.5-V device with 1.8-V tolerant inputs. (4) When V CCIO = 3.3-V and a 2.5-V input signal feeds an input pin, or when VCCIO = 1.8-V and a 1.5-V input signal feeds an input pin, the VCCIO supply current is slightly larger than expected. The reason for this increase is that the input signal level does not drive to the VCCIO rail, which causes the input buffer to not completely shut off. (6) Cyclone devices can be 5.0-V tolerant with the use of an external resistor and the internal PCI clamp diode. (8) When V CCIO = 3.3-V, a Cyclone device can drive a device with 5.0-V LVTTL inputs but not 5.0-V LVCMOS inputs.

Altera Corporation 12–3 May 2008 Preliminary Voltage Regulators Figure 12–1. Cyclone FPGAs Interface with 3.3-V and 2.5-V Devices Voltage Regulators This section explains how to generate a 1.5-V supply from another system supply. Supplying power to the 1.5-V logic array and/or I/O pins requires a 5.0-V- or 3.3-V-to-1.5-V voltage regulator. A linear regulator is ideal for low-power applications because it minimizes device count and has acceptable efficiency for most applications. A switching voltage regulator provides optimal efficiency. Switching regulators are ideal for high-power applications because of their high efficiency. This section will help you decide which regulator to use in your system, and how to implement the regulator in your design. There are several companies that provide voltage regulators for low-voltage devices, such as Linear Technology Corporation, Maxim Integrated Products, Intersil Corporation (Elantec), and National Semiconductor Corporation. Table 12–2 shows the terminology and specifications commonly encountered with voltage regulators. Symbols are shown in parentheses. If the symbols are different for linear and switching regulators, the linear regulator symbol is listed first. 3.3 V 2.5 V 1.5 V 3.3-V TTL 3.3-V CMOS 3.3-V Device 2.5-V Device Cyclone Device 2.5-V TTL 2.5-V CMOS VCCINT = 1.5 V VCCIO1 = 2.5 V VCCIO2 = 3.3 V Table 12–2. Voltage Regulator Specifications and Terminology (Part 1 of 2) Specification/Terminology Description Input voltage range (VIN,VCC) Minimum and maximum input voltages define the input voltage range, which is determined by the regulator process voltage capabilities. Line regulation (line regulation, VOUT) Line regulation is the variation of the output voltage (VOUT) with changes in the input voltage (VIN). Error amplifier gain, pass transistor gain, and output impedance all influence line regulation. Higher gain results in better regulation. Board layout and regulator pin-outs are also important because stray resistance can introduce errors.

12–4 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Linear Voltage Regulators Linear voltage regulators generate a regulated output from a larger input voltage using current pass elements in a linear mode. There are two types of linear regulators available: one using a series pass element and another using a shunt element (e.g., a zener diode). Altera recommends using series linear regulators because shunt regulators are less efficient. Load regulation (load regulation, VOUT) Load regulation is a variation in the output voltage caused by changes in the input supply current. Linear Technology regulators are designed to minimize load regulation, which is affected by error amplifier gain, pass transistor gain, and output impedance. Output voltage selection Output voltage selection is adjustable by resistor voltage divider networks, connected to the error amplifier input, that control the output voltage. There supplies. Quiescent current Quiescent current is the suppl y current during no-load or quiescent state. This current is sometimes used as a general term for a supply current used by the regulator. Dropout voltage Dropout voltage is the difference between the input and output voltages when the input is low enough to cause the output to drop out of regulation. The dropout voltage should be as low as possible for better efficiency. Current limiting Voltage regulator s are designed to limit the amount of output current in the event of a failing load. A short in the load causes the output current and voltage to decrease. This event cuts power dissipation in the regulator during a short circuit. Thermal overload protection This feature limits power dissipation if the regulator overheats. When a specified temperature is reached, the regulator turns off the output drive transistors, allowing the regulator to cool. Normal operation resumes once the regulator reaches a normal operating temperature. Reverse current protection If the input power supply fail s, large output capacitors can cause a substantial reverse current to flow backward through the regulator, potentially causing damage. To prevent damage, protection diodes in the regulator create a path for the current to flow from V OUT to VIN. Stability The dominant pole placed by the output capacitor influences stability. Voltage regulator vendors can assist you in output capacitor selection for regulator designs that differ from what is offered. Minimum load requirements A mini mum load from the voltage divider network is required for good regulation, which also serves as the ground for the regulator’s current path. Efficiency Efficiency is the division of the output power by the input power. Each regulator model has a specific efficiency value. The higher the efficiency value, the better the regulator. Table 12–2. Voltage Regulator Specifications and Terminology (Part 2 of 2) Specification/Terminology Description

Altera Corporation 12–5 May 2008 Preliminary Voltage Regulators Series linear regulators use a series pass element (i.e., a bipolar transistor or MOSFET) controlled by a feedback error amplifier (see Figure 12–2) to regulate the output voltage by comparing the output to a reference voltage. The error amplifier drives the transistor further on or off continuously to control the flow of current needed to sustain a steady voltage level across the load. Figure 12–2. Series Linear Regulator Table 12–3 shows the advantages and disadvantages of linear regulators compared to switching regulators. You can minimize the difference between the input and output voltages to improve the efficiency of linear regulators. The dropout voltage is the minimum allowable difference between the regulator’s input and output voltage. Table 12–3. Linear Regulator Advantages and Disadvantages Advantages Disadvantages Requires few supporting components Low cost Requires less board space Quick transient response Better noise and drift characteristics No electromagnetic interference (EMI) radiation from the switching components Tighter regulation Less efficient (typically 60%) Higher power dissipation Larger heat sink requirements Reference Error Amplifier VOUTVIN

12–6 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Linear regulators are available with fixed, variable, single, or multiple outputs. Multiple-output regulators can generate multiple outputs (e.g., 1.5- and 3.3-V outputs). If the board only has a 5.0-V power voltage supply, you should use multiple-output regulators. The logic array requires a 1.5-V power supply, and a 3.3-V power supply is required to interface with 3.3- and 5.0-V devices. However, fixed-output regulators have fewer supporting components, reducing board space and cost. Figure 12–3 shows an example of a three-terminal, fixed-output linear regulator. Figure 12–3. Three-Terminal, Fixed-Output Linear Regulator Adjustable-output regulators contain a voltage divider network that controls the regulator’s output. Figure 12–4 shows how you can also use a three-terminal linear regulator in an adjustable-output configuration. Figure 12–4. Adjustable-Output Linear Regulator Switching Voltage Regulators Step-down switching regulators can provide 3.3-V-to-1.5-V conversion with up to 95% efficiencies. This high efficiency comes from minimizing quiescent current, using a low-resistance power MOSFET switch, and, in higher-current applications, using a synchronous switch to reduce diode losses. Linear Regulator IN OUT ADJ

1.5 VVIN

VOUT = [VREF × (1 + )] + (IADJ × R1)

Altera Corporation 12–7 May 2008 Preliminary Voltage Regulators Switching regulators supply power by pulsing the output voltage and current to the load. Table 12–4 shows the advantages and disadvantages of switching regulators compared to linear regulators. f For more information about switching regulators, refer to Linear Technology’s application note, AN35: Step Down Switching Regulators, at www.linear.com/designtools/app_notes.jsp. There are two types of switching regulators, asynchronous and synchronous. Asynchronous switching regulators have one field effect transistor (FET) and a diode to provide the current path while the FET is off (see Figure 12–5). Figure 12–5. Asynchronous Switching Regulator Synchronous switching regulators have a voltage- or current-controlled oscillator that controls the on and off time of the two MOSFET devices that supply the current to the circuit (see Figure 12–6). Table 12–4. Switching Regulator Advantages and Disadvantages Advantages Disadvantages Highly efficient (typically >80%) Reduced power dissipation Smaller heat sink requirements Wider input voltage range High power density Generates EMI Complex to design Requires 15 or more supporting components Higher cost Requires more board space High-Frequency Circulating Path LOAD Switch NodeMOSFET VOUTVIN

12–8 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 12–6. Voltage-Controlled Synchronous Switching Regulator Maximum Output Current Select an external MOSFET switching transistor (optional) based on the maximum output current that it can supply. Use a MOSFET with a low on-resistance and a voltage rating high enough to avoid avalanche breakdown. For gate-drive voltages less than 9-V, use a logic-level MOSFET. A logic-level MOSFET is only required for topologies with a controller IC and an external MOSFET. Selecting Voltage Regulators Your design requirements determine which voltage regulator you need. The key to selecting a voltage regulator is understanding the regulator parameters and how they relate to the design. The following checklist can help you select the proper regulator for your design: ■ Do you require a 3.3-V, 2.5-V, and 1.5-V output (VOUT)? ■ What precision is required on the regulated 1.5-V supplies (line and load regulation)? ■ What supply voltages (VIN or VCC) are available on the board? ■ What voltage variance (input voltage range) is expected on VIN or VCC? ■ What is the maximum ICC (IOUT) required by your Altera® device? ■ What is the maximum current surge (IOUT(MAX)) that the regulator will need to supply instantaneously? VIN VOUTVoltage-Controlled Oscillator (VCO)

Altera Corporation 12–9 May 2008 Preliminary Voltage Regulators Choose a Regulator Type If required, select either a linear, asynchronous switching, or synchronous switching regulator based on your output current, regulator efficiency, cost, and board-space requirements. DC-to-DC converters have output current capabilities from 1 to 8 A. You can use a controller with an external MOSFET rated for higher current for higher-output- current applications. Calculate the Maximum Input Current Use the following equation to estimate the maximum input current based on the output power requirements at the maximum input voltage: Where η is nominal effici ency: typically 90% for switching regulators, 60% for linear 2.5-V-to-1.5-V conversion, 45% for linear 3.3-V-to-1.5-V conversion, and 30% for linear 5.0-V-to-1.5-V conversion. Once you identify the design requirements, select the voltage regulator that is best for your design. Tables 12–5 and 12–6 list a few Linear Technology and Elantec regulators available at the time this document was published. There may be more regulators to choose from depending on your design specification. Contact a regulator manufacturer for availability. IIN,DC(MAX) = VOUT × IOUT(MAX) η × VIN(MAX) Table 12–5. Linear Technology 1.5-V Output Voltage Regulators Voltage Regulator Regulator Type Total Number of Components VIN (V) I OUT (A) Special Features LT1573 Linear 10 2.5 or 3.3 (1) 6— LT1083 Linear 5 5.0 7.5 — LT1084 Linear 5 5.0 5 — LT1085 Linear 5 5.0 3 Inexpensive solution LTC1649 Switching 22 3.3 15 Selectable output LTC1775 Switching 17 5.0 5 — Note to Table 12–5: (1) A 3.3-V V IN requires a 3.3-V supply to the regulator’s input and 2.5-V supply to bias the transistors.

12–10 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Voltage Divider Network Design a voltage divider network if you are using an adjustable output regulator. Follow the controller or converter IC’s instructions to adjust the output voltage. 1.5-V Regulator Circuits This section contains the circuit diagrams for the voltage regulators discussed in this chapter. You can use the voltage regulators in this section to generate a 1.5-V power supply. Refer to the voltage regulator data sheet to find detailed specifications. If you require further information that is not shown in the data sheet, contact the regulator’s vendor. Figures 12–7 through 12–12 show the circuit diagrams of Linear Technology voltage regulators listed in Table 12–5. The LT1573 linear voltage regulator converts 2.5-V to 1.5-V with an output current of 6A (see Figure 12–7). Table 12–6. Elantec 1.5-V Output Voltage Regulators Voltage Regulator Regulator Type Total Number of Components VIN (V) I OUT (A) Special Features EL7551C Switching 11 5.0 1 — EL7564CM Switching 13 5.0 4 — EL7556BC Switching 21 5.0 6 — EL7562CM Switching 17 3.3 or 5.5 2 — EL7563CM Switching 19 3.3 4 —

Altera Corporation 12–15 May 2008 Preliminary Voltage Regulators Figures 12–13 through 12–17 show the circuit diagrams of Elantec voltage regulators listed in Table 12–6. Figures 12–13 through 12–15 show the switching regulator that converts 5.0-V to 1.5-V with different output current. Figure 12–13. EL7551C: 5.0-V-to-1.5-V/1-A Synchronous Switching Regulator 0.1 μF 0.1 μF 0.1 μF 10 μF Ceramic 270 pF 47 μF 1.5 V 1 A VIN 5.0 V 10 μH 539 Ω 39 kΩ 1 kΩ PGND PGND FB LX LX VREF VDRV VHI SGND EN VDD PGND VIN COSC PGND VIN EL7551C

12–16 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 12–14. EL7564CM: 5.0-V-to-1.5-V/4-A Synchronous Switching Regulator 0.22 μF 0.1 μF 390 pF 2.2 nF 330 μF 330 μF 1.5 V 4 A VIN 5.0 V 4.7 μH 22 Ω 1 kΩ 539 Ω C10 100 pF 0.22 μF PGND LX PGND PGND VIN STP STN FB VDRV VHI EN PG LX PGND SGND VDD VTJ VREF COSC PGND EL7564CM

Altera Corporation 12–17 May 2008 Preliminary Voltage Regulators Figure 12–15. EL7556BC: 5.0-V-to-1.5-V/6-A Synchronous Switching Regulator Notes to Figures 12–13 − 12–15: (1) These capacitors are ceramic capacitors. (2) These capacitors are ceramic or tantalum capacitor. (3) These are BAT54S fast diodes. (4) D4 is only required for EL7556ACM. (5) This is a Sprague 293D337X96R3 2X330 μF capacitor. (6) This is a Sprague 293D337X96R3 3X330 μF capacitor. C11 (2) 0.22 μF C10 (6) 1.0 mF C5 (2) 1 μF C4 (1) 0.1 μF C6 (1) 0.1 μF C8 (1) 220 pF C7 (1) 39 pF C12 1.0 μF C9 (5) 660 μF VIN TEST PWRGD OT FB1 OUTEN CSLOPE VDD VSSP VSSP VSSP VSSP VSSP VCC2DET VIN VIN CREF COSC FB2 C2V VHI LX LX VSSP VSSP LX LX CP VSS EL7556BC 5.1 Ω 100 Ω 2.5 μH 39.2 Ω 20 Ω Optional (3), (4) VOUT = 1.5 V × (1 + ) 50 Ω VIN D3 (3) D2 (3) D1 (3)

12–18 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figures 12–16 and 12–17 show the switching regulator that converts 3.3 V to 1.5 V with different output currents. Figure 12–16. EL7562CM: 3.3-V to 1.5-V/2-A Synchronous Switching Regulator Figure 12–17. EL7563CM: 3.3-V to 1.5-V/4-A Synchronous Switching Regulator VOUT 1.5 V 2 A VIN 3.3 V SGND VDD PGND VIN VIN EN COSC PGND PGND FB LX VHI LX PGND VREF VDRV EL7562CM 39 Ω 0.1 μF 0.1 μF 0.1 μFC2 0.1 μF 0.1 μF 270 pF 100 μF 0.1 μF 100 μF 2.5 μH 539 Ω 1 kΩ D2 D3 D4 VOUT 1.5 V

4 AVIN

3.3 V VREF COSC VTJ PGND PGND VIN SGND VDD EN PG VHI LX LX PGND FB VDRV EL7563CM PGND PGND STP STN 22 Ω 330 μF 2.5 μH 513 Ω 1 kΩ 0.22 μF 0.22 μF C10 2.2 nF 330 μF 0.1 μF 0.22 μF 2.2 nF 390 pF 0.1 μF D2 D4

Altera Corporation 12–19 May 2008 Preliminary 1.5-V Regulator Application Examples 1.5-V Regulator Application Examples The following sections show the process used to select a voltage regulator for three sample designs. The regulator selection is based on the amount of power that the Cyclone device consumes. There are 14 variables to consider when selecting a voltage regulator. The following variables apply to Cyclone device power consumption: ■ fMAX ■ Output and bidirectional pins ■ Average toggle rate for I/O pins (togIO) ■ Average toggle rate for logic elements (LEs) (togLC) ■ User-mode ICC consumption ■ Maximum power-up ICCINT requirement ■ Utilization ■ VCCIO supply level ■ VCCINT supply level The following variables apply to the voltage regulator: ■ Output voltage precision requirement ■ Supply voltage on the board ■ Voltage supply output current ■ Variance of board supply ■ Efficiency Different designs have different power consumptions based on the variables listed. Once you calculate the Cyclone device’s power consumption, you must consider how much current the Cyclone device needs. You can use the Cyclone power calculator (available at www.altera.com) or the PowerGauge TM tool in the Quartus II software to determine the current needs. Also check the maximum power-up current requirement listed in the Power Consumption section of the Cyclone FPGA Family Data Sheet because the power-up current requirement may exceed the user-mode current consumption for a specific design. Once you determine the minimum current the Cyclone device requires, you must select a voltage regulator that can generate the desired output current with the voltage and current supply that is available on the board using the variables listed in this section. An example is shown to illustrate the voltage regulator selection process.

12–20 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Synchronous Switching Regulator Example This example shows a worst-case scenario for power consumption where the design uses all the LEs and RAM. Table 12–7 shows the design requirements for 1.5-V design using a Cyclone EP1C12 FPGA. Table 12–8 uses the checklist on page 12–8 to help select the appropriate voltage regulator. Table 12–7. Design Requirements for the Example EP1C12F324C Design Requirement Value Output voltage precision requirement ±5% Supply voltages available on the board 3.3 V Voltage supply output current available for this section (IIN, DC(MAX) ) 2 A Variance of board supply (VIN) ±5% fMAX 150 MHz Average togIO 12.5% Average togLC 12.5% Utilization 100 % Output and bidirectional pins 125 VCCIO supply level 3.3 V VCCINT supply level 1.5 V Efficiency ≥90% Table 12–8. Voltage Regulator Selection Process for EP1C12F324C Design (Part 1 of 2) Output voltage requirements V OUT = 1.5 V Supply voltages V IN OR VCC = 3.3 V Supply variance from Linear Technology data sheet Supply variance = ±5 % Estimated ICCINT Use Cyclone Power Calculator ICCINT = 620 mA Estimated ICCIO if regulator powers VCCIO Use Cyclone Power Calculator (not applicable in this example because VCCIO = 3.3 V) ICCIO = N/A Total user-mode current consumption ICC = ICCINT + ICCIO ICC = 620 mA

Altera Corporation 12–21 May 2008 Preliminary Board Layout Board Layout Laying out a printed circuit board (PCB) properly is extremely important in high-frequency (≥100 kHz) switching regulator designs. A poor PCB layout results in increased EMI and ground bounce, which affects the reliability of the voltage regulator by obscuring important voltage and current feedback signals. Altera recommends using Gerber files ⎯pre- designed layout files⎯supplied by the regulator vendor for your board layout. If you cannot use the supplied layout files, contact the voltage regulator vendor for help on re-designing the board to fit your design requirements while maintaining the proper functionality. EP1C12 maximum power-up current requirement See Power Consumption section of the Cyclone FPGA Family Data Sheet for other densities IPUC(MAX) = 900 mA Maximum output current required Compare ICC with IPUC(MAX) IOUT(MAX) = 900 mA Voltage regulator selection See Linear Technology LTC 1649 data sheet See Intersil (Elantec) EL7562C data sheet LTC1649 IOUT(MAX) = EL7562C IOUT(MAX) = 15 A 2 A LTC1649 Nominal efficiency (η) Nominal efficiency ( η) = > 90 % Line and load regulation Line regulation + load regulation = (0.17 mV + 7 mV)/ 1.5 V × 100% Line and Load Regulation = 0.478 % < 5% Minimum input voltage (VIN(MIN)) (VIN(MIN)) = VIN(1 – ΔVIN) = 3.3V(1 – 0.05) (VIN(MIN)) = 3.135 V Maximum input current IIN, DC(MAX) = (VOUT × IOUT(MAX))/(η × VIN(MIN)) IIN, DC(MAX) = 478 mA < 2 A EL7562C Nominal efficiency (η) Nominal efficiency ( η) = > 95 % Line and load regulation Line regulation + load regulation = (0.17 mV + 7 mV)/ 1.5 V × 100% Line and Load Regulation = 0.5 % < 5% Minimum input voltage (VIN(MIN)) (VIN(MIN)) = VIN(1 – ΔVIN) = 3.3V(1 – 0.05) (VIN(MIN)) = 3.135 V Maximum input current IIN, DC(MAX) = (VOUT × IOUT(MAX))/(η × VIN(MIN)) IIN, DC(MAX) = 453 mA < 2 A Table 12–8. Voltage Regulator Selection Process for EP1C12F324C Design (Part 2 of 2)

Altera Corporation 12–23 May 2008 Preliminary Board Layout Figure 12–19. Single Regulator Solution for Systems that Require 5.0-V, 2.5-V and 1.5-V Supply Levels Split-Plane Method The split-plane design method reduces the number of planes required by placing two power supply planes in one plane (see Figure 12–20). For example, the layout for this method can be structured as follows: ■ One 2.5-V plane, covering the entire board ■ One plane split between 5.0-V and 1.5-V This technique assumes that the majority of devices are 2.5-V. To support MultiVolt I/O, Altera devices must have access to 1.5-V and 2.5-V planes. Regulator 2.5-V Device 1.5-V Device Altera Cyclone FPGA 1.5 V 5.0 V 2.5 V PCB

12–24 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Figure 12–20. Split Board Layout for 2.5-V Systems With 5.0-V and 1.5-V Devices Conclusion With the proliferation of multiple voltage levels in systems, it is important to design a voltage system that can support a low-power device like Cyclone devices. Designers must consider key elements of the PCB, such as power supplies, regulators, power consumption, and board layout when successfully designing a system that incorporates the low- voltage Cyclone family of devices. References Linear Technology Corporation. Application Note 35 (Step-Down Switching Regulators). Milpitas: Linear Technology Corporation, 1989. Linear Technology Corporation. LT1573 Data Sheet (Low Dropout Regulator Driver). Milpitas: Linear Technology Corporation, 1997. Linear Technology Corporation. LT1083/LT1084/LT1085 Data Sheet (7.5 A, 5 A, 3 A Low Dropout Positive Adjustable Regulators). Milpitas: Linear Technology Corporation, 1994. Linear Technology Corporation. LTC1649 Data Sheet (3.3V Input High Power Step-Down Switching Regulator Controller). Milpitas: Linear Technology Corporation, 1998. 2.5-V Device 2.5-V Device 2.5-V Device 5.0-V Device 5.0-V Device 1.5-V Device 1.5-V Device 2.5-V Device Altera Cyclone FPGA (1.5 V) 1.5 VPCB 5.0 V Regulator

Altera Corporation 12–25 May 2008 Preliminary Referenced Documents Linear Technology Corporation. LTC1775 Data Sheet (High Power No Rsense Current Mode Synchronous Step-Down Switching Regulator). Milpitas: Linear Technology Corporation, 1999. Intersil Corporation. EL7551C Data Sheet (Monolithic 1 Amp DC:DC Step- Down Regulator). Milpitas: Intersil Corporation, 2002. Intersil Corporation. EL7564C Data Sheet (Monolithic 4 Amp DC:DC Step- Down Regulator). Milpitas: Intersil Corporation, 2002. Intersil Corporation. EL7556BC Data Sheet (Integrated Adjustable 6 Amp Synchronous Switcher). Milpitas: Intersil Corporation, 2001. Intersil Corporation. EL7562C Data Sheet (Monolithic 2 Amp DC:DC Step- Down Regulator). Milpitas: Intersil Corporation, 2002. Intersil Corporation. EL7563C Data Sheet (Monolithic 4 Amp DC:DC Step- Down Regulator). Milpitas: Intersil Corporation, 2002. Referenced Documents This chapter references the following document: ■ Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook Document Table 12–9 shows the revision history for this chapter. Table 12–9. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.4 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.3

• Added document revision history.
• Removed references to Stratix in “Introduction” and “Power Sequencing and Hot Socketing” sections. August 2005 v1.1 Minor updates. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

12–26 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1

Altera Corporation Section VI–1 Preliminary Section VI. Configuration This section provides information for all of the supported configuration schemes for Cyclone devices. The last chapter provides information on EPCS1 and EPCS4 serial configuration devices. This section contains the following chapters: ■ Chapter 13. Configuring Cyclone FPGAs ■ Chapter 14. Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Revision History Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the complete handbook.

Section VI–2 Altera Corporation Preliminary Revision History Cyclone Device Handbook, Volume 1

Altera Corporation 13–1 May 2008 13. Configuring Cyclone FPGAs Introduction You can configure Cyclone® FPGAs using one of several configuration schemes, including the active serial (AS) configuration scheme. This scheme is used with the low cost serial configuration devices. Passive serial (PS) and Joint Test Action Group (JTAG)-based configuration schemes are also supported by Cyclone FPGAs. Additionally, Cyclone FPGAs can receive a compressed configuration bit stream and decompress this data in real-time, reducing storage requirements and configuration time. This chapter describes how to configure Cyclone devices using each of the three supported configuration schemes. f For more information about setting device configuration options or generating configuration files, refer to the Software Settings section in volume 2 of the Configuration Handbook. Device Configuration Overview Cyclone FPGAs use SRAM cells to store configuration data. Since SRAM memory is volatile, configuration data must be downloaded to Cyclone FPGAs each time the device powers up. You can download configuration data to Cyclone FPGAs using the AS, PS, or JTAG interfaces (see Table 13–1). Table 13–1. Cyclone FPGA Configuration Schemes Configuration Scheme Description Active serial (AS) configuration Configuration using:

• Serial configuration devices (EPCS1, EPCS4, and EPCS16) Passive serial (PS) configuration Configuration using:
• Enhanced configuration devices (EPC4, EPC8, and EPC16)
• EPC2, EPC1 configuration devices
• Intelligent host (microprocessor)
• Download cable JTAG-based configuration Configur ation via JTAG pins using:
• Download cable
• Intelligent host (microprocessor)
• JamTM Standard Test and Programming Language (STAPL)
• Ability to use SignalTap® II Embedded Logic Analyzer. C51013-1.8

13–2 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Device Configuration Overview You can select a Cyclone FPGA configuration scheme by driving its MSEL1 and MSEL0 pins either high (1) or low (0), as shown in Table 13–2. If your application only requires a single configuration mode, the MSEL pins can be connected to VCC (the I/O bank’s VCCIO voltage where the MSEL pin resides) or to ground. If your application requires more than one configuration mode, the MSEL pins can be switched after the FPGA has been configured successfully. Toggling these pins during user mode does not affect the device operation. However, the MSEL pins must be valid before initiating reconfiguration. After configuration, Cyclone FPGAs will initialize registers and I/O pins, then enter user mode and function as per the user design. Figure 13–1 shows an AS configuration waveform. Figure 13–1. AS Configuration Waveform Table 13–2. Selecting Cyclone Configuration Schemes MSEL1 MSEL0 Configuration Scheme 00 AS 01 PS

01 JTAG-based (1)

Note to T able 13–2: (1) JTAG-based configuration takes preced ence over other schemes, which means that MSEL pin settings are ignored. Read Address

136 Cycles

CONF_DONE nCSO DCLK ASDO DATA0 INIT_DONE User I/O User Mode Tri-stated with internal pull-up resistor. bit N − 1bit N bit 1 bit 0

Altera Corporation 13–3 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs You can configure Cyclone FPGAs using the 3.3-, 2.5-, 1.8-, or 1.5-V LVTTL I/O standard on configuration and JTAG input pins. These devices do not feature a VCCSEL pin; therefore, you should connect the VCCIO pins of the I/O banks containing configuration or JTAG pins according to the I/O standard specifications. Table 13–3 summarizes the approximate uncompressed configuration file size for each Cyclone FPGA. To calculate the amount of storage space required for multi-device configurations, add the file size of each device together. You should only use the numbers in Table 13–3 to estimate the configuration file size before design compilation. Different file formats, such as .hex or .ttf files, have different file sizes. For any specific version of the Quartus® II software, any design targeted for the same device has the same uncompressed configuration file size. If compression is used, the file size can vary after each compilation. Data Compression Cyclone FPGAs are the first FPGAs to support decompression of configuration data. This feature allows you to store compressed configuration data in configuration devices or other memory, and transmit this compressed bit stream to Cyclone FPGAs. During configuration, the Cyclone FPGA decompresses the bit stream in real time and programs its SRAM cells. Cyclone FPGAs support compression in the AS and PS configuration schemes. Compression is not supported for JTAG-based configuration.

1 Preliminary data indicates that compression reduces

configuration bit stream size by 35 to 60%. Table 13–3. Cyclone Raw Binary File (.rbf) Sizes Device Data Size (Bits) Data Size (Bytes) EP1C3 627,376 78,422 EP1C4 924,512 115,564 EP1C6 1,167,216 145,902 EP1C12 2,323,240 290,405 EP1C20 3,559,608 435,000

13–4 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Data Compression When you enable compression, the Quartus II software generates configuration files with compressed configuration data. This compression reduces the storage requirements in the configuration device or flash, and decreases the time needed to transmit the bit stream to the Cyclone FPGA. There are two methods to enable compression for Cyclone bitstreams: before design compilation (in the Compiler Settings menu) and after design compilation (in the Convert Programming Files window). To enable compression in the project's compiler settings, select Device under the Assignments menu to bring up the settings window. After selecting your Cyclone device open the Device and Pin Options window, and in the General settings tab enable the check box for Generate compressed bitstreams (as shown in Figure 13–2).

Altera Corporation 13–5 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Figure 13–2. Enabling Compression for Cyclone Bitstreams in Compiler Settings

13–6 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Data Compression Compression can also be enabled when creating programming files from the Convert Programming Files window. See Figure 13–3. 1. Click Convert Programming Files (File menu). 2. Select the programming file type (POF, SRAM HEXOUT, RBF, or TTF). 3. For POF output files, select a configuration device. 4. Select Add File and add a Cyclone SOF file(s). 5. Select the name of the file you added to the SOF Data area and click Properties. 6. Turn on Compression. Figure 13–3. Enabling Compression for Cyclone Bitstreams in Convert Programming Files

Altera Corporation 13–7 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs When multiple Cyclone devices are cascaded, the compression feature can be selectively enabled for each device in the chain. Figure 13–4 depicts a chain of two Cyclone FPGAs. The first Cyclone FPGA has the compression feature enabled and therefore receives a compressed bit stream from the configuration device. The second Cyclone FPGA has the compression feature disabled and receives uncompressed data. Figure 13–4. Compressed and Uncompressed Configuration Data in the Same Programming File Note (1) Note to Figure 13–4: (1) The first device in the chain should be set up in AS configuration mode (MSEL[1..0]="00"). The remaining devices in the chain must be set up in PS configuration mode (MSEL[1..0]="01"). You can generate programming files for this setup from the Convert Programming Files window (File menu) in the Quartus II software. The decompression feature supported by Cyclone FPGAs is separate from the decompression feature in enhanced configuration devices (EPC16, EPC8, and EPC4 devices). The data compression feature in the enhanced configuration devices allows them to store compressed data and decompress the bit stream before transmitting to the target devices. When using Cyclone FPGAs with enhanced configuration devices, Altera recommends using compression on one of the devices, not both (preferably the Cyclone FPGA since transmitting compressed data reduces configuration time). nCE GND nCEO Decompression Controller Cyclone FPGA nCE nCEO N.C. Decompression Controller Cyclone FPGA Serial or Enhanced Configuration Device Serial Data Compressed U ncompressed

13–8 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes Configuration Schemes This section describes the various configuration schemes you can use to configure Cyclone FPGAs. Descriptions include an overview of the protocol, pin connections, and timing information. The schemes discussed are: ■ AS configuration (serial configuration devices) ■ PS configuration ■ JTAG-based configuration Active Serial Configuration (Serial Configuration Devices) In the AS configuration scheme, Cyclone FPGAs are configured using the new serial configuration devices. These configuration devices are low cost devices with non-volatile memory that feature a simple four-pin interface and a small form factor. These features make serial configuration devices an ideal solution for configuring the low-cost Cyclone FPGAs. f For more information on programming serial configuration devices, refer to the Cyclone Literature web page at www.altera.com and the Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet. Serial configuration devices provide a serial interface to access configuration data. During device configuration, Cyclone FPGAs read configuration data via the serial interface, decompress data if necessary, and configure their SRAM cells. This scheme is referred to as an AS configuration scheme because the FPGA controls the configuration interface. This scheme is in contrast to the PS configuration scheme where the configuration device controls the interface. Serial configuration devices have a four-pin interface: serial clock input (DCLK), serial data output (DATA), AS data input (ASDI), and an active-low chip select (nCS). This four-pin interface connects to Cyclone FPGA pins as shown in Figure 13–5.

Altera Corporation 13–9 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Figure 13–5. AS Configuration of a Single Cyclone FPGA Notes to Figure 13–5: (1) Connect the pull-up re sistors to a 3.3-V supply. (2) Cyclone FPGAs use the ASDO to ASDI path to control the configuration device. Connecting the MSEL[1..0] pins to 00 selects the AS configuration scheme. The Cyclone chip enable signal, nCE, must also be connected to ground or driven low for successful configuration. During system power up, both the Cyclone FPGA and serial configuration device enter a power-on reset (POR) period. As soon as the Cyclone FPGA enters POR, it drives nSTATUS low to indicate it is busy and drives CONF_DONE low to indicate that it has not been configured. After POR, which typically lasts 100 ms, the Cyclone FPGA releases nSTATUS and enters configuration mode when this signal is pulled high by the external 10-kΩ resistor. Once the FPGA successfully exits POR, all user I/O pins are tri-stated. Cyclone devices have weak pull-up resistors on the user I/O pins which are on before and during configuration. f The value of the weak pull-up resistors on the I/O pins that are on before and during configuration can be found in the DC and Switching Characteristics chapter in the Cyclone Device Handbook. The serial clock (DCLK) generated by the Cyclone FPGA controls the entire configuration cycle (see Figure 13–1 on page 13–2) and this clock signal provides the timing for the serial interface. Cyclone FPGAs use an GND N.C. DATA DCLK nCS ASDI DATA0 DCLK nCSO ASDO Serial Configuration Device Cyclone FPGA 10 kΩ10 kΩ VCC 10 kΩ VCC VCC GND nCEO nCE nSTATUS nCONFIG CONF_DONE (2) MSEL1 MSEL0 (1) (1) (1)

13–10 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes internal oscillator to generate DCLK. After configuration, this internal oscillator is turned off. Table 13–4 shows the active serial DCLK output frequencies. The serial configuration device latches input/control signals on the rising edge of DCLK and drives out configuration data on the falling edge. Cyclone FPGAs drive out control signals on the falling edge of DCLK and latch configuration data on the falling edge of DCLK. In configuration mode, the Cyclone FPGA enables the serial configuration device by driving its nCSO output pin low that is connected to the chip select (nCS) pin of the configuration device. The Cyclone FPGA’s serial clock (DCLK) and serial data output (ASDO) pins send operation commands and read-address signals to the serial configuration device. The configuration device provides data on its serial data output (DATA) pin that is connected to the DATA0 input on Cyclone FPGAs. After the Cyclone FPGA receives all configuration bits, it releases the open-drain CONF_DONE pin allowing the external 10-kΩ resistor to pull this signal to a high level. Initialization begins only after the CONF_DONE line reaches a high level. The CONF_DONE pin must have an external 10-kΩ pull-up resistor in order for the device to initialize. You can select the clock used for initialization by using the User Supplied Start-Up Clock option in the Quartus II software. The Quartus II software uses the 10-MHz (typical) internal oscillator (separate from the AS internal oscillator) by default to initialize the Cyclone FPGA. After initialization, the internal oscillator is turned off. When you enable the User Supplied Start-Up Clock option, the software uses the CLKUSR pin as the initialization clock. Supplying a clock on the CLKUSR pin does not affect the configuration process. After all configuration data is accepted and the CONF_DONE signal goes high, Cyclone devices require 136 clock cycles to initialize properly. An optional INIT_DONE pin is available. This pin signals the end of initialization and the start of user mode with a low-to-high transition. The Enable INIT_DONE output option is available in the Quartus II software. If the INIT_DONE pin is used, it is high due to an external 10-kΩ pull-up resistor when nCONFIG is low and during the beginning of configuration. Once the option bit to enable INIT_DONE is programmed into the device (during the first frame of configuration data), the Table 13–4. Active Serial DCLK Output Frequency Minimum Typical Maximum Units 14 17 20 MHz

Altera Corporation 13–11 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs INIT_DONE pin goes low. When initialization is complete, the INIT_DONE pin is released and pulled high. This low-to-high transition signals that the FPGA has entered user mode. In user mode, the user I/O pins do not have weak pull-ups and functions as assigned in your design. If an error occurs during configuration, the Cyclone FPGA asserts the nSTATUS signal low indicating a data frame error, and the CONF_DONE signal stays low. With the Auto-Restart Configuration on Frame Error option enabled in the Quartus II software, the Cyclone FPGA resets the configuration device by pulsing nCSO, releases nSTATUS after a reset time-out period (about 30 μs), and retries configuration. If this option is turned off, the system must monitor nSTATUS for errors and then pulse nCONFIG low for at least 40 μs to restart configuration. After successful configuration, the CONF_DONE signal is tri-stated by the target device and then pulled high by the pull-up resistor. All AS configuration pins, DATA0, DCLK, nCSO, and ASDO, have weak internal pull-up resistors. These pull-up resistors are always active. When the Cyclone FPGA is in user mode, you can initiate reconfiguration by pulling the nCONFIG pin low. The nCONFIG pin should be low for at least 40 μs. When nCONFIG is pulled low, the FPGA also pulls nSTATUS and CONF_DONE low and all I/O pins are tri-stated. Once nCONFIG returns to a logic high level and nSTATUS is released by the Cyclone FPGA, reconfiguration begins. Configuring Multiple Devices (Cascading) You can configure multiple Cyclone FPGAs using a single serial configuration device. You can cascade multiple Cyclone FPGAs using the chip-enable (nCE) and chip-enable-out (nCEO) pins. The first device in the chain must have its nCE pin connected to ground. You must connect its nCEO pin to the nCE pin of the next device in the chain. When the first device captures all of its configuration data from the bit stream, it drives the nCEO pin low enabling the next device in the chain. You must leave the nCEO pin of the last device unconnected. The nCONFIG, nSTATUS, CONF_DONE, DCLK, and DATA0 pins of each device in the chain are connected (see Figure 13–6). This first Cyclone FPGA in the chain is the configuration master and controls configuration of the entire chain. You must connect its MSEL pins to select the AS configuration scheme. The remaining Cyclone FPGAs are configuration slaves and you must connect their MSEL pins to select the PS configuration scheme. Figure 13–6 shows the pin connections for this setup.

13–12 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes Figure 13–6. Configuring Multiple Devices Using a Serial Configuration Device (AS) Note to Figure 13–6: (1) Connect the pull-up resistors to a 3.3-V supply. As shown in Figure 13–6, the nSTATUS and CONF_DONE pins on all target FPGAs are connected together with external pull-up resistors. These pins are open-drain bidirectional pins on the FPGAs. When the first device asserts nCEO (after receiving all of its configuration data), it releases its CONF_DONE pin. But the subsequent devices in the chain keep this shared CONF_DONE line low until they have received their configuration data. When all target FPGAs in the chain have received their configuration data and have released CONF_DONE, the pull-up resistor drives a high level on this line and all devices simultaneously enter initialization mode. If an error occurs at any point during configuration, the nSTATUS line is driven low by the failing FPGA. If you enable the Auto Restart Configuration on Frame Error option, reconfiguration of the entire chain begins after a reset time-out period (a maximum of 40 μs). If the option is turned off, the external system must monitor nSTATUS for errors and then pulse nCONFIG low to restart configuration. The external system can pulse nCONFIG if it is under system control rather than tied to VCC.

1 While you can cascade Cyclone FPGAs, serial configuration

devices cannot be cascaded or chained together. DATA DCLK nCS ASDI DATA0 DCLK nCSO ASDO Serial Configuration Device Cyclone FPGA Master 10 kΩ10 kΩ VCC VCC GND nCEOnCE nSTATUS CONF_DONE DATA0 DCLK Cyclone FPGA Slave nCEO nCE nSTATUS CONF_DONE 10 kΩ VCC nCONFIG nCONFIG MSEL1 MSEL0 GND VCC N.C. MSEL1 MSEL0 GND (1) (1) (1)

Altera Corporation 13–13 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs If the configuration bit stream size exceeds the capacity of a serial configuration device, you must select a larger configuration device and/or enable the compression feature. While configuring multiple devices, the size of the bit stream is the sum of the individual devices’ configuration bit streams. Configuring Multiple Devices with the Same Data Certain applications require the configuration of multiple Cyclone devices with the same design through a configuration bit stream or SOF file. This can actually be done by two methods and they are shown below. For both methods, the serial configuration devices cannot be cascaded or chained together. Method 1 For method 1, the serial configuration device stores two copies of the SOF file. The first copy configures the master Cyclone device, and the second copy configures all the remaining slave devices concurrently. The setup is similar to Figure 13–7 where the master is setup in AS mode (MSEL=00) and the slave devices are setup in PS mode (MSEL01). To configure four identical Cyclone devices with the same SOF file, you could setup the chain similar to the example shown in Figure 13–6, except connect the three slave devices for concurrent configuration. The nCEO pin from the master device drives the nCE input pins on all three slave devices, and the DATA and DCLK pins connect in parallel to all four devices. During the first configuration cycle, the master device reads its configuration data from the serial configuration device while holding nCEO high. After completing its configuration cycle, the master drives nCE low and transmits the second copy of the configuration data to all three slave devices, configuring them simultaneously. The advantage of using the setup in Figure 13–7 is you can have a different SOF file for the Cyclone master device. However, all the Cyclone slave devices must be configured with the same SOF file.

Altera Corporation 13–15 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs the slave devices are set up in PS mode (MSEL=01). You could set up one or more slave devices in the chain and all the slave devices are set up in the same way as the design shown in Figure 13–8. Figure 13–8. Configuring Multiple Devices with the Same Design Using a Serial Configuration Device In this setup, all the Cyclone devices in the chain are connected for concurrent configuration. This reduces the active serial configuration time because all the Cyclone devices are configured in only one configuration cycle. To achieve this, the nCE input pins on all the Cyclone devices are connected to ground and the nCEO output pins on all the Cyclone devices are left unconnected. The DATA and DCLK pins connect in parallel to all the Cyclone devices. It is recommended to add a buffer before the DATA and DCLK output from the master Cyclone to avoid signal strength and signal integrity issues. The buffer should not significantly change the DATA-to-DCLK relationships or delay them with respect to other ASMI signals, which are nSTATUS CONF_DONE nCONFIG nCE Data0 DCLK nCS0 MSEL0 MSEL1 EPCS4 Device Data DCLK nCS ASDI ASDO GND 10 kΩ 10 kΩ 10 kΩ VCC Buffer GND Master Cyclone Device GND nSTATUS CONF_DONE nCONFIG nCE Data0 DCLK nCS0 MSEL0 MSEL1 ASDO GND VCC Slave Cyclone Device

13–16 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes ASDI and nCS signals. Also, the buffer should only drive the slave Cyclone devices, so that the timing between the master Cyclone device and serial configuration device is unaffected. This setup can support both compressed and uncompressed SOFs. Therefore, if the configuration bit stream size exceeds the capacity of a serial configuration device, you can enable the compression feature on the SOF used or you can select a larger serial configuration device. Estimating Active Serial Configuration Time Active serial configuration time is dominated by the time it takes to transfer data from the serial configuration device to the Cyclone FPGA. This serial interface is clocked by the Cyclone DCLK output (generated from an internal oscillator). As listed in Table 13–4, the DCLK minimum frequency is 14 MHz (71 ns). Therefore, the maximum configuration time estimate for an EP1C3 device (0.628 MBits of uncompressed data) is: (0.628 MBits × 71 ns) = 47 ms. The typical configuration time is 33 ms. Enabling compression reduces the amount of configuration data that is transmitted to the Cyclone device, reducing configuration time. On average, compression reduces configuration time by 50%. Programming Serial Configuration Devices Serial configuration devices are non-volatile, flash-memory-based devices. You can program these devices in-system using the ByteBlasterTM II download cable. Alternatively, you can program them using the Altera Programming Unit (APU) or supported third-party programmers. You can perform in-system programming of serial configuration devices via the AS programming interface. During in-system programming, the download cable disables FPGA access to the AS interface by driving the nCE pin high. Cyclone FPGAs are also held in reset by a low level on nCONFIG. After programming is complete, the download cable releases nCE and nCONFIG, allowing the pull-down and pull-up resistor to drive GND and VCC, respectively. Figure 13–9 shows the download cable connections to the serial configuration device. f For more information about the ByteBlaster II cable, refer to the ByteBlaster II Download Cable User Guide.

Altera Corporation 13–17 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs The serial configuration devices can be programmed in-system by an external microprocessor using SRunner. SRunner is a software driver developed for embedded serial configuration device programming that can be customized to fit in different embedded systems. The SRunner can read a Raw Programming Data file (.rpd) and write to the serial configuration devices. The programming time is comparable to the Quartus II software programming time. f For more information about SRunner, refer tothe AN 418: SRunner: An Embedded Solution for Serial Configuration Device Programming and the source code on the Altera website (www.altera.com). Figure 13–9. In-System Programming of Serial Configuration Devices Notes to Figure 13–9: (1) Connect these pull-up resistors to 3.3-V supply. (2) The nCEO pin is left unconnected. (3) Power up the ByteBlaster II cable’s V CC with a 3.3-V supply. DATA DCLK nCS ASDI DATA0 DCLK nCSO nCE nCONFIG nSTATUS nCEO CONF_DONE ASDO VCC VCC VCC VCC 10 kΩ 10 kΩ 10 kΩ 10 kΩ Cyclone FPGA Serial Configuration Device Pin 1 MSEL1 MSEL0 GND ByteBlaser II 10-Pin Male Header (2)N.C. (1) (1) (1) (3)

13–18 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes You can program serial configuration devices by using the Quartus II software with the APU and the appropriate configuration device programming adapter. All serial configuration devices are offered in an eight-pin small outline integrated circuit (SOIC) package and can be programmed using the PLMSEPC-8 adapter. In production environments, serial configuration devices can be programmed using multiple methods. Altera programming hardware (APU) or other third-party programming hardware can be used to program blank serial configuration devices before they are mounted onto PCBs. Alternatively, you can use an on-board microprocessor to program the serial configuration device in-system using C-based software drivers provided by Altera. f For more information on programming serial configuration devices, refer to the Cyclone Literature web page at www.altera.com and the Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet. f Device configuration options and how to create configuration files are discussed further in the Software Settings section in volume 2 of the Configuration Handbook. Passive Serial Configuration Cyclone FPGAs also feature the PS configuration scheme supported by all Altera FPGAs. In the PS scheme, an external host (configuration device, embedded processor, or host PC) controls configuration. Configuration data is clocked into the target Cyclone FPGAs via the DATA0 pin at each rising edge of DCLK. The configuration waveforms for this scheme are shown in Figure 13–10.

Altera Corporation 13–19 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Figure 13–10. PS Configuration Cycle Waveform Notes to Figure 13–10: (1) During initial power up and configuration, CONF_DONE is low. After configuration, CONF_DONE goes high to indicate successful configuration. If the device is reconfigured, CONF_DONE goes low after nCONFIG is driven low. (2) User I/O pins are tri-stated during co nfiguration. Cyclone FPGAs also have a weak pull-up resistor on I/O pins during configuration. After initialization, the user I/O pins perform the function assigned in the user’s design. (3) When used, the optional INIT_DONE signal is high when nCONFIG is low before configuration and during the first 136 clock cycles of configuration. (4) In user mode, DCLK should be driven high or low when using the PS configuration scheme. When using the AS configuration scheme, DCLK is a Cyclone output pin and should not be driven externally. (5) In user mode, DATA0 should be driven high or low. PS Configuration Using Configuration Device In the PS configuration device scheme, nCONFIG is usually tied to VCC (when using EPC16, EPC8, EPC4, or EPC2 devices, you can connect nCONFIG to nINIT_CONF). Upon device power-up, the target Cyclone FPGA senses the low-to-high transition on nCONFIG and initiates configuration. The target device then drives the open-drain CONF_DONE pin low, which in-turn drives the configuration device’s nCS pin low. When exiting POR, both the target and configuration device release the open-drain nSTATUS pin (typically Cyclone POR lasts 100 ms). Before configuration begins, the configuration device goes through a POR delay of up to 100 ms (maximum) to allow the power supply to stabilize. You must power the Cyclone FPGA before or during the POR time of the enhanced configuration device. During POR, the configuration device drives its OE pin low. This low signal delays configuration because the OE pin is connected to the target device’s nSTATUS pin. When the target and configuration devices complete POR, they both release the nSTATUS to OE line, which is then pulled high by a pull-up resistor. High-Z nCONFIG nSTATUS CONF_DONE (1) DCLK DATA User I/O Pins (2) INIT_DONE (3) MODE High-Z D0 D1 D2 D3 D(N – 1) DN Configuration Initialization User User I/O Configuration (4) (5) Tri-stated with internal pull-up resistor

13–20 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes When configuring multiple devices, configuration does not begin until all devices release their OE or nSTATUS pins. When all devices are ready, the configuration device clocks out DATA and DCLK to the target devices using an internal oscillator. After successful configuration, the Cyclone FPGA starts initialization using the 10-MHz internal oscillator as the reference clock. After initialization, this internal oscillator is turned off. The CONF_DONE pin is released by the target device and then pulled high by a pull-up resistor. When initialization is complete, the target Cyclone FPGA enters user mode. The CONF_DONE pin must have an external 10-kΩ pull-up resistor in order for the device to initialize. If an error occurs during configuration, the target device drives its nSTATUS pin low, resetting itself internally and resetting the configuration device. If you turn on the Auto-Restart Configuration on Frame Error option, the device reconfigures automatically if an error occurs. To set this option, select Compiler Settings (Processing menu), and click on the Chips & Devices tab. Select Device and Pin Options, and click on the Configuration tab. If the Auto-Restart Configuration on Frame Error option is turned off, the external system (configuration device or microprocessor) must monitor nSTATUS for errors and then pulse nCONFIG low to restart configuration. The external system can pulse nCONFIG if it is under system control rather than tied to VCC. When configuration is complete, the target device releases CONF_DONE, which disables the configuration device by driving nCS high. The configuration device drives DCLK low before and after configuration. In addition, if the configuration device sends all of its data and then detects that CONF_DONE has not gone high, it recognizes that the target device has not configured successfully. (For CONF_DONE to reach a high state, enhanced configuration devices wait for 64 DCLK cycles after the last configuration bit. EPC2 devices wait for 16 DCLK cycles.) In this case, the configuration device pulses its OE pin low for a few microseconds, driving the target device’s nSTATUS pin low. If the Auto-Restart Configuration on Frame Error option is set in the Quartus II software, the target device resets and then releases its nSTATUS pin after a reset time- out period. When nSTATUS returns high, the configuration device reconfigures the target device. You should not pull CONF_DONE low to delay initialization. Instead, use the Quartus II software’s User-Supplied Start-Up Clock option to synchronize the initialization of multiple devices that are not in the same configuration chain. Devices in the same configuration chain initialize together since their CONF_DONE pins are tied together.

Altera Corporation 13–21 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs CONF_DONE goes high during the first few clock cycles of initialization. Hence, when using the CLKUSR feature you would not see the CONF_DONE signal high until you start clocking CLKUSR. However, the device does retain configuration data and waits for these initialization clocks to release CONF_DONE and go into user mode. Figure 13–11 shows how to configure one Cyclone FPGA with one configuration device. Figure 13–11. Single Device Configuration Circuit Notes to Figure 13–11: (1) The pull-up resistor sh ould be connected to the same supply voltage as the configuration device. This pull-up resistor is 10 kΩ. The EPC16, EPC8, EPC4, and EPC2 devices’ OE and nCS pins have internal, user-configurable pull-up resistors. If you use internal pull-up resistors, do not use external pull-up resistors on these pins. (2) The nINIT_CONF pin is available on EPC16, EPC8, EPC4, and EPC2 devices and has an internal pull-up resistor that is always active. If nINIT_CONF is not used, nCONFIG can be pulled to VCC directly or through a resistor. (3) The nCEO pin is left unconnected for the last device in the chain. (4) Connect MSEL0 to the VCC supply voltage of the I/O bank it resides in. Configuring Multiple Cyclone FPGAs You can use a single configuration device to configure multiple Cyclone FPGAs. In this setup, the nCEO pin of the first device is connected to the nCE pin of the second device in the chain. If there are additional devices, connect the nCE pin of the next device to the nCEO pin of the previous device. You should leave the nCEO pin on the last device in the chain unconnected. To configure properly, all of the target device CONF_DONE and nSTATUS pins must be tied together. Figure 13–12 shows an example of configuring multiple Cyclone FPGAs using a single configuration device. Cyclone FPGA DCLK DATA OE nCS nINIT_CONF (2) MSEL0 MSEL1 DCLK DATA0 nSTATUS CONF_DONE nCONFIG VCC VCC GND (1) (1) nCE nCEO N.C. (3) Configuration Device10 kΩ 10 kΩ10 kΩ VCC VCC (1) GND (4)

13–22 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes Figure 13–12. Configuring Multiple Cyclone FPGAs with a Single Configuration Device Notes to Figure 13–12: (1) The pull-up resistor should be conn ected to the same supply voltage as the configuration device. The EPC16, EPC8, EPC4, and EPC2 devices’ OE and nCS pins have internal, user-configurable pull-up resistors. If you use internal pull-up resistors, do not use external pull-up resistors on these pins. (2) EPC16, EPC8, and EPC4 configuration devices cannot be cascaded. (3) The nCEO pin is left unconnected for the last device in the chain. (4) The nINIT_CONF pin is available on EPC16, EPC8, EPC4, and EPC2 devices. If nINIT_CONF is not used, nCONFIG must be pulled to VCC directly or through a resistor. (5) The nINIT_CONF pin has an internal pull-up resistor that is always active in EPC16, EPC8, EPC4, and EPC2 devices. These devices do not need an external pull-up resistor on the nINIT_CONF pin. (6) Connect MSEL0 to the VCC supply voltage of the I/O bank it resides in. When performing multi-device PS configuration, you must generate the configuration device programming file (.sof) from each project. Then you must combine multiple .sof files using the Quartus II software through the Convert Programming Files dialog box. After the first Cyclone FPGA completes configuration during multi- device configuration, its nCEO pin activates the second device’s nCE pin, prompting the second device to begin configuration. Because all device CONF_DONE pins are tied together, all devices initialize and enter user mode at the same time. In addition, all nSTATUS pins are tied together; therefore, if any device (including the configuration device) detects an error, configuration stops for the entire chain. Also, if the configuration device does not detect CONF_DONE going high at the end of configuration, it resets the chain by Configuration Device (2) DCLK DATA OE nCS nINIT_CONF (4), (5) DCLK DATA0 nSTATUS CONF_DONE nCONFIG VCC VCC GND nCE VCC DCLK DATA0 nSTATUS CONF_DONE nCONFIG GND nCE MSEL1 nCEO nCASC (1) (1) (1) nCEO (3)N.C. Cyclone FPGA 2 Cyclone FPGA 1 MSEL0 VCC GND MSEL1 MSEL0 VCC 10 kΩ 10 kΩ 10 kΩ (6)(6)

Altera Corporation 13–23 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs pulsing its OE pin low for a few microseconds. For CONF_DONE to reach a high state, enhanced configuration devices wait for 64 DCLK cycles after the last configuration bit. EPC2 devices wait for 16 DCLK cycles. If the Auto-Restart Configuration on Frame Error option is turned on in the Quartus II software, the Cyclone FPGA releases its nSTATUS pins after a reset time-out period (about 30 μs). When the nSTATUS pins are released and pulled high, the configuration device reconfigures the chain. If the Auto-Restart Configuration on Frame Error option is not turned on, the devices drive nSTATUS low until they are reset with a low pulse on nCONFIG. You can also cascade several EPC2 or EPC1 configuration devices to configure multiple Cyclone FPGAs. When all data from the first configuration device is sent, it drives nCASC low, which in turn drives nCS on the subsequent EPC2 or EPC1 device. Because a configuration device requires less than one clock cycle to activate a subsequent configuration device, the data stream is uninterrupted. You cannot cascade EPC16, EPC8, and EPC4 configuration devices. Figure 13–13 shows how to configure multiple devices using cascaded EPC2 or EPC1 devices.

13–24 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes Figure 13–13. Multi-Device PS Configuration Using Cascaded EPC2 or EPC1 Devices Notes to Figure 13–13: (1) The pull-up resistor should be connected to the same supply voltage as the configuration device. (2) The nINIT_CONF pin (available on enhanced configuration devices and EPC2 devices only) has an internal pull-up resistor that is always active, meaning an external pull-up resistor should not be used on the nINIT_CONF- nCONFIG line. The nINIT_CONF pin does not need to be connected if its function is not used. If nINIT_CONF is not used or not available (such as on EPC1 devices), nCONFIG must be pulled to VCC either directly or through a resistor. (3) The enhanced configuration devices' and EPC2 devices’ OE and nCS pins have internal programmable pull-up resistors. External 10-kΩ pull-up resistors should be used. To turn off the internal pull-up resistors, check the Disable nCS and OE pull-ups on configuration device option when generating programming files. PS Configuration Using a Download Cable Using a download cable in PS configuration, an intelligent host (for example, your PC) transfers data from a storage device (for example, your hard drive) to the Cyclone FPGA through a USB Blaster, ByteBlaster II, MasterBlaster, or ByteBlasterMV cable. To initiate configuration in this scheme, the download cable generates a low-to-high transition on the nCONFIG pin. The programming hardware then sends the configuration data one bit at a time on the device’s DATA0 pin. The data is clocked into the target device using DCLK until the CONF_DONE goes high. When using programming hardware for the Cyclone FPGA, turning on the Auto-Restart Configuration on Frame Error option does not affect the configuration cycle because the Quartus II software must restart configuration when an error occurs. Figure 13–14 shows the PS configuration setup for the Cyclone FPGA using a USB Blaster, ByteBlaster II, MasterBlaster, or ByteBlasterMV cable. VCC VCC EPC2 or EPC1 Device 1 DCLK DATA OE nCS nINIT_CONF (2) DCLK DATA0 nSTATUS CONF_DONE nCONFIG VCC GND nCE VCC DCLK DATA nCS OE DCLK DATA0 nSTATUS CONF_DONE nCONFIG nCE nCEO (2) nCASC Cyclone Device 1 (1) (1) (1) (3) nCEO nINIT_CONF Cyclone Device 2 (3) N.C. EPC2 or EPC1 Device 2 10 kΩ10 kΩ10 kΩ (3) (3)MSEL1 MSEL0 GND MSEL1 MSEL0 GND VCC

Altera Corporation 13–25 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Figure 13–14. PS Configuration Circuit with a Download Cable Notes to Figure 13–14: (1) You should connect the pull-u p resistor to the same supply voltage as the MasterBlaster (VIO pin) or ByteBlasterMV cable. (2) Pin 6 of the header is a V IO reference voltage for the MasterBlaster output driver. VIO should match the device’s VCCIO. This pin is a no-connect pin for the ByteBlasterMV header. (3) The pull-up resistors on DATA0 and DCLK are only needed if the download cable is the only configuration scheme used on your board. This is to ensure that DATA0 and DCLK are not left floating after configuration. For example, if you are also using a configuration device, the pull-up resistors on DATA0 and DCLK are not needed. (4) Connect MSEL0 to the VCC supply voltage of the I/O bank it resides in. You can use the download cable to configure multiple Cyclone FPGAs by connecting each device’s nCEO pin to the subsequent device’s nCE pin. All other configuration pins are connected to each device in the chain. Because all CONF_DONE pins are tied together, all devices in the chain initialize and enter user mode at the same time. In addition, because the nSTATUS pins are tied together, the entire chain halts configuration if any device detects an error. In this situation, the Quartus II software must restart configuration; the Auto-Restart Configuration on Frame Error option does not affect the configuration cycle. Figure 13–15 shows how to configure multiple Cyclone FPGAs with a ByteBlaster II, MasterBlaster, or ByteBlasterMV cable. 10-Pin Male Header VCC (1)VCC (1) VCC VCC (1) Cyclone Device DCLK nCONFIG CONF_DONE Shield GND MSEL1 MSEL0 10 kΩ10 kΩ 10 kΩ nSTATUS DATA0 Pin 1 nCE GND GND VIO (2) VCC VCC (1) 10 kΩ (3) VCC (1) 10 kΩ(3) (4) (PS Mode) nCEO N.C.

13–26 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes Figure 13–15. Multi-Device PS Configuration with a Download Cable Notes to Figure 13–15: (1) You should connect the pull-u p resistor to the same supply voltage as the MasterBlaster (VIO pin) or ByteBlasterMV cable. (2) V IO is a reference voltage for the MasterBlaster output driver. VIO should match the device’s VCCIO. Refer to the MasterBlaster Serial/USB Communications Cable User Guide for this value. (3) The pull-up resistors on DATA0 and DCLK are only needed if the download cable is the only configuration scheme used on your board. This is to ensure that DATA0 and DCLK are not left floating after configuration. For example, if you are also using a configuration device, the pull-up resistors on DATA0 and DCLK are not needed. (4) Connect MSEL0 to the VCC supply voltage of the I/O bank it resides in. If you are using a ByteBlaster II, MasterBlaster, or ByteBlasterMV cable to configure device(s) on a board that also is populated with configuration devices, you should electrically isolate the configuration devices from the target device(s) and cable. One way to isolate the configuration devices is to add logic, such as a multiplexer, that can select between the configuration devices and the cable. The multiplexer allows bidirectional transfers on the nSTATUS and CONF_DONE signals. Another option is to add switches to the five common signals (CONF_DONE, nSTATUS, DCLK, Cyclone FPGA 1 Cyclone FPGA 2 MSEL0 nCE nCONFIG CONF_DONE DCLK nCE nCEO nCONFIG CONF_DONE DCLK nCEO GND (PS Mode) VCC VCC (1) GND VCC (1) VCC (1) nSTATUS nSTATUS DATA0 DATA0 MSEL1 MSEL0 MSEL1 10 kΩ 10 kΩ 10 kΩ Pin 1 10-Pin Male Header N.C. VIO (2) GND VCC GND VCC VCC (1) 10 kΩ (3) (4) VCC (1) 10 kΩ (3)

Altera Corporation 13–27 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs nCONFIG, and DATA0) between the cable and the configuration devices. The last option is to remove the configuration devices from the board when configuring with the cable. Figure 13–16 shows a combination of a configuration device and a ByteBlaster II, MasterBlaster, or ByteBlasterMV cable to configure a Cyclone FPGA. Figure 13–16. Configuring with a Combined PS and Configuration Device Scheme Notes to Figure 13–16: (1) You should connect the pull-up resistor to th e same supply voltage as the configuration device. (2) Pin 6 of the header is a V IO reference voltage for the MasterBlaster output driver. VIO should match the target device’s VCCIO. This is a no-connect pin for the ByteBlasterMV header. (3) You should not attempt configuration with a ByteBla ster II, MasterBlaster, or ByteBlasterMV cable while a configuration device is connected to a Cyclone FPGA. Instead, you should either remove the configuration device from its socket when using the download cable or place a switch on the five common signals between the download cable and the configuration device. Remove the ByteBlaster II, MasterBlaster, or ByteBlasterMV cable when configuring with a configuration device. (4) If nINIT_CONF is not used, nCONFIG must be pulled to VCC either directly or through a resistor. (5) The pull-up resistors on DATA0 and DCLK are only needed if the download cable is the only configuration scheme used on your board. This is to ensure that DATA0 and DCLK are not left floating after configuration. For example, if you are also using a configuration device, the pull-up resistors on DATA0 and DCLK are not needed. (6) Connect MSEL0 to the VCC supply voltage of the I/O bank it resides in. f For more information on how to use the ByteBlaster II, MasterBlaster, or ByteBlasterMV cables, see the following documents: ■ ByteBlaster II Download Cable User Guide ■ ByteBlasterMV Download Cable User Guide ■ MasterBlaster Serial/USB Communications Cable User Guide Cyclone FPGA MSEL0 nCE nCONFIG CONF_DONE DCLK nCEO GND Download Cable 10-Pin Male Header (PS Mode) VCC nSTATUS DATA0 MSEL1 10 kΩ 10 kΩ 10 kΩ Pin 1 DCLK DATA OE nCS nINIT_CONF (4) (3) (3) (3) (3) (3) GNDVIO (2)N.C. GND VCC (1) 10 kΩ (5) 10 kΩ (5) VCC (1) VCC (1) VCC (1) VCC (1)VCC (6) Configuration Device

13–28 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes PS Configuration from a Microprocessor In PS configuration with a microprocessor, a microprocessor transfers data from a storage device to the target Cyclone FPGA. To initiate configuration in this scheme, the microprocessor must generate a low-to- high transition on the nCONFIG pin and the target device must release nSTATUS. The microprocessor then places the configuration data one bit at a time on the DATA0 pin of the Cyclone FPGA. The least significant bit (LSB) of each data byte must be presented first. Data is clocked continuously into the target device using DCLK until the CONF_DONE signal goes high. The Cyclone FPGA starts initialization using the internal oscillator after all configuration data is transferred. After initialization, this internal oscillator is turned off. The device’s CONF_DONE pin goes high to show successful configuration and the start of initialization. During configuration and initialization and before the device enters user ode the microprocessor must not drive CONF_DONE low. Driving DCLK to the device after configuration does not affect device operation. Since the PS configuration scheme is a synchronous scheme, the configuration clock speed must be below the specified maximum frequency to ensure successful configuration. Maximum DCLK frequency supported by Cyclone FPGAs is 100 MHz (see Table 13–5 on page 13–30). No maximum DCLK period (i.e., minimum DCLK frequency) exists. You can pause configuration by halting DCLK for an indefinite amount of time. If the target device detects an error during configuration, it drives its nSTATUS pin low to alert the microprocessor. The microprocessor can then pulse nCONFIG low to restart the configuration process. Alternatively, if the Auto-Restart Configuration on Frame Error option is turned on in the Quartus II software, the target device releases nSTATUS after a reset time-out period. After nSTATUS is released, the microprocessor can reconfigure the target device without needing to pulse nCONFIG low. The microprocessor can also monitor the CONF_DONE and INIT_DONE pins to ensure successful configuration and initialization. If the microprocessor sends all data, but CONF_DONE and INIT_DONE has not gone high, it must reconfigure the target device. Figure 13–17 shows the circuit for PS configuration with a microprocessor.

Altera Corporation 13–29 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Figure 13–17. PS Configuration Circuit with a Microprocessor Notes to Figure 13–17: (1) The nCEO pin is left unconnected. (2) Connect MSEL0 to the VCC supply voltage of the I/O bank it resides in. Configuring Cyclone FPGAs with the MicroBlaster Software The MicroBlasterTM software driver allows you to configure Altera FPGAs, including Cyclone FPGAs, through the ByteBlaster II or ByteBlasterMV cable in PS mode. The MicroBlaster software driver supports a Raw Binary File (.rbf) programming input file and is targeted for embedded PS configuration. The source code is developed for the Windows NT operating system, although you can customize it to run on other operating systems. f For more information about the MicroBlaster software driver, refer to the AN 423: Configuring the MicroBlaster Passive Serial Software Driver and source files on the Altera website at www.altera.com. Passive Serial Timing For successful configuration using the PS scheme, several timing parameters such as setup, hold, and maximum clock frequency must be satisfied. The enhanced configuration and EPC2 devices are designed to meet these interface timing specifications. If you use a microprocessor or another intelligent host to control the PS interface, ensure that you meet these timing requirements. Microprocessor CONF_DONE nSTATUS nCE DATA0 nCONFIG Cyclone Device Memory ADDR DATA0 GND MSEL1 VCCVCC 10 kΩ 10 kΩ GND DCLK nCEO N.C. (1) MSEL0 VCC (2)

Altera Corporation 13–31 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs f Device configuration options and how to create configuration files are discussed further in the Software Settings section in volume 2 of the Configuration Handbook. JTAG-Based Configuration JTAG has developed a specification for boundary-scan testing. This boundary-scan test (BST) architecture offers the capability to efficiently test components on printed circuit boards (PCBs) with tight lead spacing. The BST architecture can test pin connections without using physical test probes and capture functional data while a device is operating normally. You can also use the JTAG circuitry to shift configuration data into Cyclone FPGAs. The Quartus II software automatically generates .sof files that can be used for JTAG configuration. f For more information about JTAG boundary-scan testing, refer to AN 39: IEEE 1149.1 (JTAG) Boundary-Scan Testing in Altera Devices. To use the SignalTap II Embedded Logic Analyzer, you need to connect the JTAG pins of your Cyclone device to a download cableheader on your PCB. f For more information about SignalTap II, refer to the Design Debugging Using the SignalTap II Embedded Logic Analyzer chapter in volume 3 of the Quartus II Handbook. Cyclone devices are designed such that JTAG instructions have precedence over any device operating modes. So JTAG configuration can take place without waiting for other configuration to complete (e.g., tCL DCLK low time 7n s tCLK DCLK period 15 ns fMAX DCLK maximum frequency 66 MHz tCD2UM CONF_DONE high to user mode (3) 62 0 µ s Notes to T able 13–5: (1) This information is preliminary. (2) This value applies only if the internal oscillator is selected as the clock source for device initialization. If the clock source is CLKUSR, multiply the clock period by 270 to obtain this value. CLKUSR must be running during this period to reset the device. (3) The minimum and maximum numbers apply on ly if the internal oscillator is chosen as the clock source for device initialization. If the clock source is CLKUSR, multiply the clock period by 140 to obtain this value. (4) You can obtain this value if you do not delay configuration by extending the nSTATUS low-pulse width. Table 13–5. PS Timing Parameters for Cyclone Devices Note (1) (Part 2 of 2) Symbol Parameter Min Max Units

13–32 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes configuration with serial or enhanced configuration devices). If you attempt JTAG configuration in Cyclone FPGAs during non-JTAG configuration, non-JTAG configuration is terminated and JTAG configuration is initiated.

1 The Cyclone configuration data decompression feature is not

supported in JTAG-based configuration. A device operating in JTAG mode uses four required pins: TDI, TDO, TMS, and TCK. Cyclone FPGAs do not support the optional TRST pin. The three JTAG input pins, TCK, TDI, and TMS, have weak internal pull-up resistors, whose values are approximately 20 to 40 kΩ. All user I/O pins are tri-stated during JTAG configuration. Table 13–6 shows each JTAG pin’s function. JTAG Configuration Using a Download Cable During JTAG configuration, data is downloaded to the device on the board through a USB Blaster, ByteBlaster II, ByteBlasterMV , or MasterBlaster download cable. Configuring devices through a cable is similar to programming devices in-system. See Figure 13–19 for pin connection information. Table 13–6. JTAG Pin Descriptions Pin Description Function TDI Test data input Serial input pin for instructions as well as test and programming data. Data is shifted in on the rising edge of TCK. If the JTAG interface is not required on the board, the JTAG circuitry can be disabled by connecting this pin to VCC. TDO Test data output Serial data output pin for instructions as well as test and programming data. Data is shifted out on the falling edge of TCK. The pin is tri-stated if data is not being shifted out of the device. If the JTAG interface is not required on the board, the JTAG circuitry can be disabled by leaving this pin unconnected. TMS Test mode select Input pin that provides the contro l signal to determine the transitions of the Test Access Port (TAP) controller state machine. Transitions within the state machine occur on the rising edge of TCK. Therefore, TMS must be set up before the rising edge of TCK. TMS is evaluated on the rising edge of TCK. If the JTAG interface is not required on the board, the JTAG circuitry can be disabled by connecting this pin to VCC. TCK Test clock input The clock input to the BST circuitry. Some operations occur at the rising edge, while others occur at the falling edge. If the JTAG interface is not required on the board, the JTAG circuitry can be disabled, by connecting this pin to GND.

Altera Corporation 13–33 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Figure 13–19. JTAG Configuration of Single Cyclone FPGA Notes to Figure 13–19: (1) You should connect the pull-up resistor to the same supply voltage as the download cable. (2) You should connect the nCONFIG, MSEL0, and MSEL1 pins to support a non-JTAG configuration scheme. If you only use JTAG configuration, connect nCONFIG and MSEL0 to VCC, and MSEL1 to ground. Pull DATA0 and DCLK to high or low. (3) V IO is a reference voltage for the MasterBlaster output driver. VIO should match the device’s VCCIO. Refer to the MasterBlaster Serial/USB Communications Cable User Guide for this value. In the ByteBlaster MV , this pin is a no connect. In the USB Blaster and ByteBlaster II, this pin is connected to nCE when it is used for Active Serial programming; otherwise it is a no connect. (4) nCE must be connected to GND or driven low for successful configuration. To configure a single device in a JTAG chain, the programming software places all other devices in bypass mode. In bypass mode, devices pass programming data from the TDI pin to the TDO pin through a single bypass register without being affected internally. This scheme enables the programming software to program or verify the target device. Configuration data driven into the device appears on the TDO pin one clock cycle later. The Quartus II software verifies successful JTAG configuration upon completion. The software checks the state of CONF_DONE through the JTAG port. If CONF_DONE is not high, the Quartus II software indicates that configuration has failed. If CONF_DONE is high, the software indicates that configuration was successful. After the configuration bit stream is transmitted serially via the JTAG TDI port, the TCK port is clocked an additional 134 cycles to perform device initialization. nCE MSEL0 MSEL1 nCONFIG CONF_DONE VCC (1) GND VCC GND VCC (2) (2) (2) 10 kΩ 10 kΩ nSTATUS ByteBlaster II, MasterBlaster, or ByteBlasterMV 10-Pin Male Header (Top View) TCK TDO TMS TDI GND VIO (3) Cyclone Device DATA0 DCLK (2) (2) Pin 1 VCC 10 kΩ VCC 10 kΩ 1 kΩ GND

13–34 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes 1 If VCCIO is tied to 3.3-V , both the I/O pins and the JTAG TDO port drive at 3.3-V levels. Cyclone FPGAs have dedicated JTAG pins. Not only can you perform JTAG testing on Cyclone FPGAs before and after, but also during configuration. While other device families do not support JTAG testing during configuration, Cyclone FPGAs support the BYPASS, IDCODE, and SAMPLE instructions during configuration without interrupting configuration. All other JTAG instructions may only be issued by first interrupting configuration and reprogramming I/O pins using the CONFIG_IO instruction. The CONFIG_IO instruction allows I/O buffers to be configured via the JTAG port, and when issued, interrupts configuration. This instruction allows you to perform board-level testing prior to configuring the Cyclone FPGA or waiting for a configuration device to complete configuration. Once configuration has been interrupted and JTAG testing is complete, the part must be reconfigured via JTAG (PULSE_CONFIG instruction) or by pulsing nCONFIG low. The chip-wide reset and output enable pins on Cyclone FPGAs do not affect JTAG boundary-scan or programming operations. Toggling these pins does not affect JTAG operations (other than the usual boundary-scan operation).

Altera Corporation 13–35 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs When designing a board for JTAG configuration of Cyclone FPGAs, you should consider the dedicated configuration pins. Table 13–7 shows how you should connect these pins during JTAG configuration. JTAG Configuration of Multiple Devices When programming a JTAG device chain, one JTAG-compatible header, such as the ByteBlaster II header, is connected to several devices. The number of devices in the JTAG chain is limited only by the drive capacity of the download cable. However, when four or more devices are connected in a JTAG chain, Altera recommends buffering the TCK, TDI, and TMS pins with an on-board buffer. JTAG-chain device configuration is ideal when the system contains multiple devices, or when testing your system using JTAG BST circuitry. Figure 13–20 shows multi-device JTAG configuration. Table 13–7. Dedicated Configuration Pin Connections During JTAG Configuration Signal Description nCE Drive all Cyclone devices in the chain low by connecting nCE to ground, pulling it down via a resistor, or driving it low by some control circuitry. For devices in a multi-device PS and AS configuration chains, connect the nCE pins to ground during JTAG configuration or configure them via JTAG in the same order as the configuration chain. nCEO For all Cyclone devices in a chain, the nCEO pin can be left floating or connected to the nCE pin of the next device. See nCE description above. nSTATUS Pulled to VCC through a 10-kΩ resistor. When configuring multiple devices in the same JTAG chain, pull up each nSTATUS pin to VCC individually. CONF_DONE Pulled to VCC through a 10-kΩ resistor. When configuring multiple devices in the same JTAG chain, pull up each CONF_DONE pin to VCC individually. The CONF_DONE pin must have an external 10-kΩ pull-up resistor in order for the device to initialize. nCONFIG Driven high by connecting to VCC, pulling up through a resistor, or driving it high by some control circuitry. MSEL0, MSEL1 Do not leave these pins floating. These pins support whichever non-JTAG configuration is used in production. If only JTAG configuration is used, you should tie these pins to ground. DCLK Do not leave these pins floating. Drive low or high, whichever is more convenient. DATA0 Do not leave these pins floating. Drive low or high, whichever is more convenient.

Altera Corporation 13–37 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Figure 13–21. JTAG Configuration of Cyclone FPGAs with a Microprocessor Notes to Figure 13–21: (1) Connect the nCONFIG, MSEL1, and MSEL0 pins to support a non-JTAG configuration scheme. If your design only uses JTAG configuration, connect the nCONFIG pin to VCC and the MSEL1 and MSEL0 pins to ground. (2) Pull DATA0 and DCLK to either high or low. (3) nCE must be connected to GND or driver low for succesful JTAG configuration. f For more information about JTAG programming in an embedded environment, refer to AN 122: Using JamSTAPL for ISP &ICR via an Embedded Processor. Configuring Cyclone FPGAs with JRunner JRunner is a software driver that allows you to configure Altera FPGAs, including Cyclone FPGAs, through the ByteBlaster II or ByteBlasterMV cables in JTAG mode. The programming input file supported is in .rbf format. JRunner also requires a Chain Description File (.cdf) generated by the Quartus II software. JRunner is targeted for embedded JTAG configuration. The source code has been developed for the Windows NT operating system (OS). You can customize the code to make it run on other platforms. For more information on the JRunner software driver, see JRunner Software Driver: An Embedded Solution to the JTAG Configuration and the source files on the Altera website. Jam STAPL Jam STAPL, JEDEC standard JESD-71, is a standard file format for in- system programmability (ISP) purposes. Jam STAPL supports programming or configuration of programmable devices and testing of electronic systems, using the IEEE 1149.1 JTAG interface. Jam STAPL is a freely licensed open standard. nCONFIG DATA0 DCLK TDI TCK TMS Microprocessor Memory ADDR DATA TDO Cyclone FPGA nSTATUS CONF_DONE VCC VCC 10 kΩ 10 kΩ (2) (1) (2) (1) (1) MSEL1 MSEL0 nCE (3) nCEO N.C.

13–38 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes

1 Both JTAG connection methods should include space for the

MasterBlaster or ByteBlasterMV header connection. The header is useful during prototyping because it allows you to verify or modify the Cyclone FPGA’s contents. During production, you can remove the header to save cost. Program Flow The Jam Player provides an interface for manipulating the IEEE Std. 1149.1 JTAG TAP state machine. The TAP controller is a 16-state, state machine that is clocked on the rising edge of TCK, and uses the TMS pin to control JTAG operation in a device. Figure 13–22 shows the flow of an IEEE Std. 1149.1 TAP controller state machine.

Altera Corporation 13–39 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Figure 13–22. JTAG TAP Controller State Machine While the Jam Player provides a driver that manipulates the TAP controller, the Jam Byte-Code File (.jbc) provides the high-level intelligence needed to program a given device. All Jam instructions that SELECT_DR_SCAN CAPTURE_DR SHIFT_DR EXIT1_DR PAUSE_DR EXIT2_DR UPDATE_DR SHIFT_IR EXIT1_IR PAUSE_IR EXIT2_IR UPDATE_IR TMS = 0 TMS = 0 TMS = 0 TMS = 1 TMS = 0 TMS = 1 TMS = 1 TMS = 0 TMS = 1 TMS = 0 TMS = 1 TMS = 1 TMS = 0TMS = 0 TMS = 1 TMS = 1 TMS = 0 TMS = 1 TMS = 0 TMS = 0 TMS = 1 TMS = 0 TMS = 0 TMS = 1 TMS = 0 RUN_TEST/ IDLETMS = 0 TEST_LOGIC/ RESETTMS = 1 TMS = 0 TMS = 1 TMS = 1 TMS = 1 TMS = 1 CAPTURE_IR SELECT_IR_SCAN

13–40 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes send JTAG data to the device involve moving the TAP controller through either the data register leg or the instruction register leg of the state machine. For example, loading a JTAG instruction involves moving the TAP controller to the SHIFT_IR state and shifting the instruction into the instruction register through the TDI pin. Next, the TAP controller is moved to the RUN_TEST/IDLE state where a delay is implemented to allow the instruction time to be latched. This process is identical for data register scans, except that the data register leg of the state machine is traversed. The high-level Jam instructions are the DRSCAN instruction for scanning the JTAG data register, the IRSCAN instruction for scanning the instruction register, and the WAIT command that causes the state machine to sit idle for a specified period of time. Each leg of the TAP controller is scanned repeatedly, according to instructions in the .jbc file, until all of the target devices are programmed. Figure 13–23 shows the functional behavior of the Jam Player when it parses the .jbc file. When the Jam Player encounters a DRSCAN, IRSCAN, or WAIT instruction, it generates the proper data on TCK, TMS, and TDI to complete the instruction. The flow diagram shows branches for the DRSCAN, IRSCAN, and WAIT instructions. Although the Jam Player supports other instructions, they are omitted from the flow diagram for simplicity.

Altera Corporation 13–41 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Figure 13–23. Jam Player Flow Diagram (Part 1 of 2) Set TMS to 1 and Pulse TCK Twice Set TMS to 0 and Pulse TCK Twice Switch Case[] EOF Start Switch End EOF? Test-Logic-Reset Run-Test/Idle Set TMS to 1 and Pulse TCK Five Times Set TMS to 0 and Pulse TCK Read Instruction from the Jam File Set TMS to 1 and Pulse TCK Three Times F T Test-Logic-Reset Parse Argument IRSCAN DRSCAN Switch Set TMS to 0 and Pulse TCK Delay WAIT Run-Test/Idle Select-IR-Scan Shift-IR Set TMS to 0 and Pulse TCK and Write TDI Set TMS to 0 and Pulse TCK and Write TDI Set TMS to 1 and Pulse TCK Set TMS to 0 and Pulse TCK Set TMS to 1 and Pulse TCK Twice Set TMS to 0 and Pulse TCK Shift-IR Exit1-IR Pause-IR Update-IR Run-Test/Idle Shift-DR Set TMS to 0 and Pulse TCK and Write TDI Set TMS to 0 and Pulse TCK Twice Set TMS to 1 and Pulse TCK Parse Argument Shift-DR Select-DR-Scan Continued on Part 2 of Flow Diagram F T Shift-IR

13–42 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes Figure 13–24. Jam Player Flow Diagram (Part 2 of 2) Execution of a Jam program starts at the beginning of the program. The program flow is controlled using GOTO, CALL/RETURN, and FOR/NEXT structures. The GOTO and CALL statements refer to labels that are symbolic names for program statements located elsewhere in the Jam program. The language itself enforces almost no constraints on the organizational structure or control flow of a program.

1 The Jam language does not support linking multiple Jam

programs together or including the contents of another file into a Jam program. Switch Update-IR Run-Test/Idle Set TMS to 1 and Pulse TCK Set TMS to 0 and Pulse TCK Switch Update-IR Run-Test/Idle Set TMS to 1 and Pulse TCK Set TMS to 0 and Pulse TCK Set TMS to 1 and Pulse TCK and Store TDO Set TMS to 0 and Pulse TCK, Write TDI, and Store TDO Shift-DR Exit1-DR F F T Report Error DefaultCase[] Loop< DR Length Set TMS to 1 and Pulse TCK and Store TDO Set TMS to 0 and Pulse TCK, Write TDI, and Store TDO Compare Capture Exit1-DR Switch Update-IR Run-Test/Idle Set TMS to 1 and Pulse TCK Set TMS to 0 and Pulse TCK Loop< DR Length Set TMS to 1 and Pulse TCK and Store TDO Set TMS to 0 and Pulse TCK and Write TDI Exit1-DR Continued from Part 1 of Flow Diagram Correct TDO Value T F F T T Loop< DR Length

Altera Corporation 13–43 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Jam Instructions Each Jam statement begins with one of the instruction names listed in Table 13–8. The instruction names, including the names of the optional instructions, are reserved keywords that you cannot use as variable or label identifiers in a Jam program. Table 13–9 shows the state names that are reserved keywords in the Jam language. These keywords correspond to the state names specified in the IEEE Std. 1149.1 JTAG specification. Table 13–8. Instruction Names BOOLEAN INTEGER PREIR CALL IRSCAN PRINT CRC IRSTOP PUSH DRSCAN LET RETURN DRSTOP NEXT STATE EXIT NOTE WAIT EXPORT POP VECTOR (1) FOR POSTDR VMAP (1) GOTO POSTIR — IF PREDR — Note to T able 13–8: (1) This instruction name is an optional language extension. Table 13–9. Reserved Keywords (Part 1 of 2) IEEE Std. 1149.1 JTAG State Names Jam Reserved State Names Test-Logic-Reset RESET Run-Test-Idle IDLE Select-DR-Scan DRSELECT Capture-DR DRCAPTURE Shift-DR DRSHIFT Exit1-DR DREXIT1 Pause-DR DRPAUSE Exit2-DR DREXIT2 Update-DR DRUPDATE Select-IR-Scan IRSELECT Capture-IR IRCAPTURE

13–44 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Configuration Schemes Example Jam File that Reads the IDCODE The following illustrates the flexibility and utility of the Jam STAPL. The example code reads the IDCODE out of a single device in a JTAG chain.

1 The array variable, I_IDCODE, is initialized with the IDCODE

instruction bits ordered the LSB first (on the left) to most significant bit (MSB) (on the right). This order is important because the array field in the IRSCAN instruction is always interpreted and sent, MSB to LSB. Example Jam File Reading IDCODE BOOLEAN read_data[32]; BOOLEAN I_IDCODE[10] = BIN 1001101000; ‘assumed BOOLEAN ONES_DATA[32] = HEX FFFFFFFF; INTEGER i; ‘Set up stop state for IRSCAN IRSTOP IRPAUSE; ‘Initialize device STATE RESET; IRSCAN 10, I_IDCODE[0..9]; ‘LOAD IDCODE INSTRUCTION STATE IDLE; WAIT 5 USEC, 3 CYCLES; DRSCAN 32, ONES_DATA[0..31], CAPTURE read_data[0..31]; ‘CAPTURE IDCODE PRINT “IDCODE:”; FOR i=0 to 31; PRINT read_data[i]; NEXT i; EXIT 0; Shift-IR IRSHIFT Exit1-IR IREXIT1 Pause-IR IRPAUSE Exit2-IR IREXIT2 Update-IR IRUPDATE Table 13–9. Reserved Keywords (Part 2 of 2) IEEE Std. 1149.1 JTAG State Names Jam Reserved State Names

13–46 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Device Configuration Pins Device Configuration Pins Tables 13–10 through 13–12 describe the connections and functionality of all the configuration related pins on the Cyclone device. Table 13–10 describes the dedicated configuration pins. These pins are required to be connected properly on your board for successful configuration. Some of these pins may not be required for your configuration schemes. Table 13–10. Dedicated Cyclone Device Configuration Pins (Part 1 of 3) Pin Name User Mode Configuration Scheme Pin Type Description MSEL1 MSEL0 – All Input Two-bit configuration input that set the Cyclone device configuration scheme (see Table 13–2). Use these pins to select the Cyclone configuration schemes for the appropriate connections. These pins must remain at a valid state during power-up before nCONFIG is pulled low to initiate a reconfiguration and during configuration. This pin uses Schmitt trigger input buffers. nCONFIG – All Input Configuration control i nput. Pulling this pin low during user-mode causes the FPGA to lose its configuration data, enter a reset state, and tri-state all I/O pins. Returning this pin to a logic high initiates a reconfiguration. If the configuration scheme uses an enhanced configuration device or EPC2 device, the nCONFIG pin can be tied directly to VCC or to the configuration device's nINIT_CONF pin. This pin uses Schmitt trigger input buffers

Altera Corporation 13–47 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs nSTATUS – All Bidirectional open-drain The device drives nSTATUS low immediately after power-up and releases it within 5 µs. (When using a configuration device, the configuration device holds nSTATUS low for up to 200 ms.) Status output. If an error occurs during configuration, nSTATUS is pulled low by the target device. Status input. If an external source drives the nSTATUS pin low during configuration or initialization, the target device enters an error state. Driving nSTATUS low after configuration and initialization does not affect the configured device. If the design uses a configuration device, driving nSTATUS low causes the configuration device to attempt to configure the FPGA, but since the FPGA ignores transitions on nSTATUS in user-mode, the FPGA does not reconfigure. To initiate a reconfiguration, nCONFIG must be pulled low. The OE and nCS pins in the enhanced configuration devices and EPC2 devices have optional internal programmable pull-up resistors. If the design uses internal pull-up resistors, do not use external 10-kΩ pull-up resistors on these pins. This pin uses Schmitt trigger input buffers CONF_DONE – All Bidirectional open-drain Status output. The target device drives the CONF_DONE pin low before and during configuration. Once all configuration data is received without error and the initialization clock cycle starts, the target device releases CONF_DONE. Status input. After all data is received and CONF_DONE goes high, the target device initializes and enters user mode. Driving CONF_DONE low after configuration and initialization does not affect the configured device. The OE and nCS pins in the enhanced configuration devices and EPC2 devices have optional internal programmable pull-up resistors. If the design uses internal pull-up resistors, do not use external 10-kΩ pull-up resistors on these pins. This pin uses Schmitt trigger input buffers Table 13–10. Dedicated Cyclone Device Configuration Pins (Part 2 of 3) Pin Name User Mode Configuration Scheme Pin Type Description

13–48 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Device Configuration Pins DCLK –P S AS Input (PS) Output (AS) In PS configuration, the clock input clocks data from an external source into the target device. Data is latched into the FPGA on the rising edge of DCLK. In AS configuration, DCLK is an output from the Cyclone FPGA that provides timing for the configuration interface. After configuration, the logic levels on this pin do not affect the Cyclone FPGA. This pin uses Schmitt trigger input buffers ASDO I/O in PS mode, N/A in AS mode AS Output Control signal from the Cyclone FPGA to the serial configuration device in AS mode used to read out configuration data. nCSO I/O in PS mode, N/A in AS mode AS Output Output control signal from the Cyclone FPGA to the serial configuration device in AS mode that enables the configuration device. nCE – All Input Active-low chip enable. The nCE pin activates the device with a low signal to allow configuration. The nCE pin must be held low during configuration, initialization, and user mode. In single device configuration, tie the nCE pin low. In multi-device configuration, the first device’s nCE pin is tied low while its nCEO pin is connected to nCE of the next device in the chain. Hold the nCE pin low for programming the FPGA via JTAG. This pin uses Schmitt trigger input buffers nCEO – All Output Output that drives low when device configuration is complete. In single device configuration, this pin is left floating. In multi-device configuration, this pin feeds the next device's nCE pin. The nCEO of the last device in the chain is left floating. DATA0 – All Input Data input. In serial configuration mode, bit-wide configuration data is presented to the target device on the DATA0 pin. Toggling DATA0 after configuration does not affect the configured device. This pin uses Schmitt trigger input buffers Table 13–10. Dedicated Cyclone Device Configuration Pins (Part 3 of 3) Pin Name User Mode Configuration Scheme Pin Type Description

Altera Corporation 13–49 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Table 13–11 describes the optional configuration pins. If these optional configuration pins are not enabled in the Quartus II software, they are available as general-purpose user I/O pins. Therefore during configuration, these pins function as user I/O pins and are tri-stated with weak pull-ups. Table 13–11. Optional Cyclone Device Configuration Pins Pin Name User Mode Pi n Type Description CLKUSR N/A if option is on, I/O if option is off Input Optional user-supplied cl ock input. Synchronizes the initialization of one or more devices. This pin is enabled by turning on the Enable user-supplied start-up clock (CLKUSR) option in the Quartus II software. INIT_DONE N/A if option is on, I/O if option is off Output open-drain Status pin. Can be used to indicate when the device has initialized and is in user mode. The INIT_DONE pin must be pulled to VCC with a 10-kΩ resistor. The INIT_DONE pin drives low during configuration. Before and after configuration, the INIT_DONE pin is released and is pulled to VCC by an external pull-up resistor. Because INIT_DONE is tri-stated before configuration, it is pulled high by the external pull-up resistor. Thus, the monitoring circuitry must be able to detect a low-to- high transition. This pin is enabled by turning on the Enable INIT_DONE output option in the Quartus II software. DEV_OE N/A if the option is on, I/O if the option is off. Input Optional pin that allows the user to override all tri-states on the device. When this pin is driven low, all I/O pins are tri-stated; when this pin is driven high, all I/O pins behave as programmed. This pin is enabled by turning on the Enable device-wide output enable (DEV_OE) option in the Quartus II software. DEV_CLRn N/A if the option is on, I/O if the option is off. Input Optional pin that allows you to override all clears on all device registers. When this pin is driven low, all registers are cleared; when this pin is driven high, all registers behave as programmed. This pin is enabled by turning on the Enable device-wide reset (DEV_CLRn) option in the Quartus II software.

13–50 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Referenced Documents Table 13–12 describes the dedicated JTAG pins. JTAG pins must be kept stable before and during configuration to prevent accidental loading of JTAG instructions. Referenced Documents This chapter references the following documents: ■ AN 39: IEEE 1149.1 (JTAG) Boundary-Scan Testing in Altera Devices ■ AN 418: SRunner: An Embedded Solution for Serial Configuration Device Programming ■ AN 423: Configuring the MicroBlaster Passive Serial Software Driver ■ ByteBlaster II Download Cable User Guide ■ ByteBlasterMV Download Cable User Guide ■ Cyclone FPGA Family Data Sheet section of the Cyclone Device Handbook ■ DC and Switching Characteristics chapter in the Cyclone Device Handbook ■ Design Debugging Using the SignalTap II Embedded Logic Analyzer chapter in volume 3 of the Quartus II Handbook ■ MasterBlaster Serial/USB Communications Cable User Guide ■ Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet ■ Software Settings section in volume 2 of the Configuration Handbook Table 13–12. Dedicated JTAG Pins Pin Name User Mode Pin Type Description TDI N/A Input Serial input pin for instructions as well as test and programming data. Data is shifted in on the rising edge of TCK. If the JTAG interface is not required on the board, the JTAG circuitry can be disabled by connecting this pin to VCC . This pin uses Schmitt trigger input buffers TDO N/A Output Serial data output pin for instructions as well as test and programming data. Data is shifted out on the falling edge of TCK. The pin is tri-stated if data is not being shifted out of the device. If the JTAG interface is not required on the board, the JTAG circuitry can be disabled by leaving this pin unconnected. TMS N/A Input Input pin that provides the control si gnal to determine the transitions of the TAP controller state machine. Transitions within the state machine occur on the rising edge of TCK. Therefore, TMS must be set up before the rising edge of TCK. TMS is evaluated on the rising edge of TCK. If the JTAG interface is not required on the board, the JTAG circuitry can be disabled by connecting this pin to VCC . This pin uses Schmitt trigger input buffers TCK N/A Input The clock input to the BST circuitr y. Some operations occur at the rising edge, while others occur at the falling edge. If the JTAG interface is not required on the board, the JTAG circuitry can be disabled by connecting this pin to ground. This pin uses Schmitt trigger input buffers

Altera Corporation 13–51 May 2008 Cyclone Device Handbook, Volume 1 Configuring Cyclone FPGAs Document Table 13–13 shows the revision history for this chapter. Table 13–13. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.8 Minor textual and style changes. Added “Referenced Documents” section. January 2007 v1.7

• Added document revision history.
• Removed a note from Table 13–2.
• Updated Figure 13–1.
• Updated Table 13–3.
• Updated feetpara note in “Active Serial Configuration (Serial Configuration Devices)” section.
• Updated feetpara note on page 13–18.
• Updated Note (2) in Figure 13–11.
• Updated Note (4) in Figure 13–12.
• Updated Note (2) in Figure 13–19. July 2006 v1.6 Updated Figure 13–19.— August 2005 v1.5
• Updated tables.
• Minor text updates. March 2005 v1.4
• Updated Figure 13–1.
• Updated Figure 13–10. February 2005 v1.3 Updated Figure 13–13.— August 2004 v1.2
• Deleted sections: Programming Configuration Devices, Connecting the JTAG Chain, Passive Serial and JTAG, Device Options, Device Configuration Files, Configuration Reliability, and Board Layout Tips.
• Deleted figures: Embedded System Block Diagram, Combining PS & JTAG Configuration, Configuration Options Dialog Box.
• Deleted table: Cyclone Configuration Option Bits.
• Added: USB Blaster to cable list; new Figure 13–13; text on pages 13-14, 13-29, and 13-30, and information to Table 13–6.
• Changes to Figures 13–14 to 13–16, 13–19, 13–20, 13–25; numbers changed in EP1C4 row of Table 13–3.
• Added extensive descriptions of configuration methods under the “Configuring Multiple Devices with the Same Data” section. July 2003 v1.1 Updated .rbf sizes. Minor updates throughout the document. — May 2003 v1.0 Added document to Cyclone Device Handbook. —

13–52 Altera Corporation Cyclone Device Handbook, Volume 1 May 2008 Document Revision History

Altera Corporation 14–1 May 2008 14. Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Introduction The serial configuration devices provide the following features: ■ 1-, 4-, 16-, 64-, and 128-Mbit flash memory devices that serially configure Stratix® III, Stratix II GX, and Stratix II FPGAs, Arria™ GX FPGAs, and the Cyclone® series FPGAs using the active serial (AS) configuration scheme ■ Easy-to-use four-pin interface ■ Low cost, low-pin count, and non-volatile memory ■ Low current during configuration and near-zero standby mode current ■ 3.3-V operation ■ Available in 8-pin and 16-pin small outline integrated circuit (SOIC) package ■ Enables the Nios® processor to access unused flash memory through AS memory interface ■ Re-programmable memory with more than 100,000 erase/program cycles ■ Write protection support for memory sectors using status register bits ■ In-system programming support with SRunner software driver ■ In-system programming support with USB Blaster™, EthernetBlaster™, or ByteBl aster™ II download cables ■ Additional programming support with the Altera® Programming Unit (APU) and programming hardware from BP Microsystems, System General, and other vendors ■ Software design support with the Altera Quartus® II development system for Windows-based PCs as well as Sun SPARC station and HP 9000 Series 700/800 ■ Delivered with the memory array erased (all the bits set to 1)

1 The term “serial configuration devices” used in this document

refers to Altera EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128. C51014-3.1

14–2 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Functional Description Functional With SRAM-based devices that support active serial configuration, configuration data must be reloaded each time the device powers up, the system reconfigures, or when new configuration data is required. Serial configuration devices are flash memory devices with a serial interface that can store configuration data for FPGA devices that support active serial configuration and reload the data to the device upon power-up or reconfiguration. Table 14–1 lists the serial configuration devices. For an 8-pin SOIC package, you can migrate vertically from the EPCS1 to the EPCS4 or EPCS16 since the EPCS devices are offered in the same device package. Similarly, for a 16-pin SOIC package, you can migrate vertically from the EPCS16 to the EPCS64 or EPCS128. 1 EPCS16 is available in 8-pin and 16-pin SOIC packages. Table 14–2 lists the serial configuration device used with each Stratix III FPGA and the configuration file size. Stratix III devices can be used with EPCS16, EPCS64, or EPCS128. Table 14–1. Serial Configuration Devices (3.3-V Operation) Device Memory Size (Bits) EPCS1 1,048,576 EPCS4 4,194,304 EPCS16 16,777,216 EPCS64 67,108,864 EPCS128 134,217,728 Table 14–2. Serial Configuration Device Support for Stratix III Devices (Part 1 of 2) Stratix III Device Raw Binary File Size (Bits) (1) Serial Configuration Device EPCS1 EPCS4 EPCS16 EPCS64 EPCS128 EP3SL50 22,178,792 — — v (2) vv EP3SL70 22,178,792 — — v (2) vv EP3SL110 47,413,312 — — — vv EP3SL150 47,413,312 — — — vv EP3SL200 93,324,656 — — — v (2) v EP3SL340 117,384,664 ———— v EP3SE50 25,891,968 — — — vv EP3SE80 48,225,392 — — — vv

Altera Corporation 14–3 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Table 14–3 lists the serial configuration device used with each Stratix II GX FPGA and the configuration file size. Stratix II GX devices can be used with EPCS16, EPCS64, or EPCS128. EP3SE110 48,225,392 — — — vv EP3SE260 93,324,656 — — — v (2) v Notes to T able 14–2: (1) These are uncompressed file sizes. (2) This is with the Stratix III compression feature enabled. Table 14–2. Serial Configuration Device Support for Stratix III Devices (Part 2 of 2) Stratix III Device Raw Binary File Size (Bits) (1) Serial Configuration Device EPCS1 EPCS4 EPCS16 EPCS64 EPCS128 Table 14–3. Serial Configuration Device Support for Stratix II GX Devices Stratix II GX Device Raw Binary File Size (Bits) (1) Serial Configuration Device EPCS1 EPCS4 EPCS16 EPCS64 EPCS128 EP2SGX30C EP2SGX30D 9,640,672 —— vvv EP2SGX60C EP2SGX60D EP2SGX60E 16,951,824 v (2) vv EP2SGX90E EP2SGX90F 25,699,104 ——— vv EP2SGX130G 37,325,760 — — — vv Notes to T able 14–3: (1) These are uncompressed file sizes. (2) This is with the Stratix II GX compression feature enabled.

14–4 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Functional Description Table 14–4 lists the serial configuration device used with each Stratix II FPGA and the configuration file size. Stratix II devices can be used with EPCS4, EPCS16, EPCS64, or EPCS128. Table 14–5 lists the serial configuration device used with each Arria GX FPGA and the configuration file size. Arria GX devices can be used with EPCS16, EPCS64, or EPCS128. Table 14–4. Serial Configuration Device Support for Stratix II Devices Stratix II Device Raw Binary File Size (Bits) (1) Serial Configuration Device EPCS4 EPCS16 EPCS64 EPCS128 EP2S15 4,721,544 v (2) vvv EP2S30 9,640,672 — vvv EP2S60 16,951,824 — v (2) vv EP2S90 25,699,104 — v (2) vv EP2S130 37,325,760 — — vv EP2S180 49,814,760 — — vv Notes to T able 14–4: (1) These are uncompressed file sizes. (2) This is with the Stratix II compression feature enabled. Table 14–5. Serial Configuration Device Support for Arria GX Devices Arria GX Device Raw Binary File Size (Bits) (1) Serial Configuration Device EPCS1 EPCS4 EPCS16 EPCS64 EPCS128 EP1AGX20C 9,640,672 —— vvv EP1AGX35C EP1AGX35D 9,640,672 —— vvv EP1AGX50C EP1AGX50D 16,951,824 —— v (2) vv EP1AGX60C EP1AGX60D EP1AGX60E 16,951,824 v (2) vv EP1AGX90E 25,699,104 — — — vv Notes to T able 14–5: (1) These are uncompressed file sizes. (2) This is with the Arria GX compression feature enabled.

Altera Corporation 14–5 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Table 14–6 lists the serial configuration device used with each Cyclone III FPGA and the configuration file size. Cyclone III devices can be used with EPCS4, EPCS16, EPCS64, or EPCS128. Table 14–7 lists the serial configuration device used with each Cyclone II FPGA and the configuration file size. Cyclone II devices can be used with EPCS1, EPCS4, EPCS16, EPCS64, or EPCS128. Table 14–6. Serial Configuration Device for Cyclone III Devices Cyclone III Device Raw Binary File Size (Bits) (1) Serial Configuration Device EPCS1 EPCS4 EPCS16 EPCS64 EPCS128 EP3C5 2,944,088 — vvvv EP3C10 2,944,088 — vvvv EP3C16 4,086,848 — vvvv EP3C25 5,748,552 — — vvv EP3C40 9,534,304 — — vvv EP3C55 14,889,560 — — vvv EP3C80 19,965,752 — — v(2) vv EP3C120 28,571,696 — — — vv Notes to T able 14–6: (1) These are uncompressed file sizes. (2) This is with the Cyclone III compression feature enabled. Table 14–7. Serial Configuration Device for Cyclone II Devices Cyclone II Device Raw Binary File Size (Bits) (1) Serial Configuration Device EPCS1 EPCS4 EPCS16 EPCS64 EPCS128 EP2C5 1,265,792 v (2) vvvv EP2C8 1,983,536 — vvvv EP2C20 3,892,496 — vvvv EP2C35 6,848,608 — — vvv EP2C50 9,951,104 — — vvv EP2C70 14,319,216 — — vvv Notes to T able 14–7: (1) These are uncompressed file sizes. (2) This is with the Cyclone II compression feature enabled.

14–6 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Functional Description Table 14–8 lists the serial configuration device used with each Cyclone FPGA and the configuration file size. Cyclone devices can be used with EPCS1, EPCS4, EPCS16, EPCS64, or EPCS128. With the new data-decompression feature in the Stratix III, Stratix II GX, and Stratix II FPGAs, Arria GX FPGAs, and Cyclone FPGA families, you can use smaller serial configuration devices to configure larger FPGAs. 1 Serial configuration devices cannot be cascaded. f For more information about the FPGA decompression feature, refer to the configuration chapter in the appropriate device handbook. The serial configuration devices are designed to configure Stratix III, Stratix II GX, and Stratix II FPGAs and the Cyclone series FPGAs and cannot configure other existing Altera FPGA device families. Table 14–8. Serial Configuration Device Support for Cyclone Devices Cyclone Device Raw Binary File Size (Bits) (1) Serial Configuration Device EPCS1 EPCS4 EPCS16 EPCS64 EPCS128 EP1C3 627,376 vvvvv EP1C4 924,512 vvvvv EP1C6 1,167,216 v (2) vvvv EP1C12 2,323,240 — vvvv EP1C20 3,559,608 — vvvv Notes to T able 14–8: (1) These are uncompressed file sizes. (2) This is with the Cyclone compression feature enabled.

14–8 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Active Serial FPGA Configuration Active Serial FPGA Configuration The following Altera FPGAs support Active Serial (AS) configuration scheme with serial configuration devices: ■ Stratix III ■ Stratix II GX ■ Stratix II ■ Arria GX ■ Cyclone series FPGAs

1 This section is only relevant for FPGAs that support the AS

configuration scheme. There are four signals on the serial configuration device that interface directly with the FPGA’s control signals. The serial configuration device signals DATA, DCLK, ASDI, and nCS interface with DATA0, DCLK, ASDO, and nCSO control signals on the FPGA, respectively. Figure 14–2 shows a serial configuration device programmed via a download cable, which configures an FPGA in AS mode. Figure 14–3 shows a serial configuration device programmed using the APU or a third-party programmer configuring an FPGA in AS configuration mode.

Altera Corporation 14–9 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Figure 14–2. Cyclone FPGA Configuration in AS Mode (Serial Configuration Device Programmed Using Download Cable) Note (4) Notes to Figure 14–2: (1) V CC = 3.3 V . (2) Serial configuration devices cannot be cascaded. (3) Connect the FPGA MSEL[] input pins to select the AS configuration mode. For details, refer to the appropriate FPGA family chapter in the Configuration Handbook. (4) For more information about configuration pin I/O requir ements in an AS scheme for a Cyclone III FPGA, refer to the Configuring Cyclone III Devices chapter in volume 1 of the Cyclone III Device Handbook. DATA DCLK nCS ASDI DATA0 DCLK nCSO nCE nCONFIG nSTATUS MSEL[1..0] nCEO CONF_DONE ASDO VCC (1) VCC (1) VCC (1) VCC (1) 10 k/K57 10 k/K57 10 k/K57 10 k/K57 (3)00 Cyclone FPGA Serial Configuration Device (2) Pin 1 N.C.

14–10 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Active Serial FPGA Configuration Figure 14–3. Cyclone FPGA Configuration in AS Mode (Serial Configuration Device Programmed by APU or Third-Party Programmer) Note (4) Notes to Figure 14–3: (1) V CC = 3.3 V . (2) Serial configuration devices cannot be cascaded. (3) Connect the FPGA MSEL[] input pins to select the AS configuration mode. For details, refer to the appropriate FPGA family chapter in the Configuration Handbook. (4) For more information about configuration pin I/O requir ements in an AS scheme for a Cyclone III FPGA, refer to the Configuring Cyclone III Devices chapter in volume 1 of the Cyclone III Device Handbook. The FPGA acts as the configuration master in the configuration flow and provides the clock to the serial configuration device. The FPGA enables the serial configuration device by pulling the nCS signal low via the nCSO signal (refer to Figures 14–2 and 14–3). Subsequently, the FPGA sends the instructions and addresses to the serial configuration device via the ASDO signal. The serial configuration device responds to the instructions by sending the configuration data to the FPGA’s DATA0 pin on the falling edge of DCLK. The data is latched into the FPGA on the DCLK signal’s falling edge. The FPGA controls the nSTATUS and CONF_DONE pins during configuration in AS mode. If the CONF_DONE signal does not go high at the end of configuration or if the signal goes high too early, the FPGA will pulse its nSTATUS pin low to start reconfiguration. Upon successful configuration, the FPGA releases the CONF_DONE pin, allowing the external 10-kΩ resistor to pull this signal high. Initialization begins after the CONF_DONE goes high. After initialization, the FPGA enters user mode. DATA DCLK nCS ASDI DATA0 DCLK nCSO nCE nCONFIG nSTATUS MSEL[1..0] nCEO CONF_DONE ASDO VCC (1) VCC (1) VCC (1) 10 k/K57 10 k/K57 10 k/K57 (3)00 Cyclone FPGA Serial Configuration Device (2) N.C.

Altera Corporation 14–11 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet f Refer to the configuration chapter in the appropriate device handbook for more information about configuring the FPGAs in AS mode or other configuration modes. Multiple devices can be configured by a single EPCS device. However, serial configuration devices cannot be cascaded. Refer to Table 14–1 to ensure the programming file size of the cascaded FPGAs does not exceed the capacity of a serial configuration device. Figure 14–4 shows the AS configuration scheme with multiple FPGAs in the chain. The first FPGA is the configuration master and has its MSEL[] pins set to AS mode. The following FPGAs are configuration slave devices and have their MSEL[] pins set to PS mode. Figure 14–4. Multiple Devices in AS Mode Note (5) Notes to Figure 14–4: (1) V CC = 3.3 V . (2) Serial configuration devices cannot be cascaded. (3) Connect the FPGA MSEL[] input pins to select the AS configuration mode. For details, refer to the appropriate FPGA family chapter in the Configuration Handbook. (4) Connect the FPGA MSEL[] input pins to select the PS configuration mode. For details, refer to the appropriate FPGA family chapter in the Configuration Handbook. (5) For more information about configuration pin I/O requir ements in an AS scheme for a Cyclone III FPGA, refer to the Configuring Cyclone III Devices chapter in volume 1 of the Cyclone III Device Handbook. DATA DCLK nCS ASDI DATA0 DCLK nCSO nCE nCONFIG nSTATUS MSEL[1..0] nCEO CONF_DONE ASDO VCC (1) 10 k/K57 VCC (1) 10 k/K57 VCC (1) 10 k/K57 (3)00 Cyclone FPGA (Master) DATA0 DCLK nCE nCONFIG nSTATUS MSEL[1..0] nCEO CONF_DONE (4)01 Cyclone FPGA (Slave) Serial Configuration Device (2) N.C.

14–12 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access Serial Configuration Device Memory Access This section describes the serial configuration device’s memory array organization and operation codes. Timing specifications for the memory are provided in the “Timing Information” section. Memory Array Organization Table 14–9 provides details about the memory array organization in EPCS128, EPCS64, EPCS16, EPCS4, and EPCS1. Tables 14–10 through 14–14 show the address range for each sector in EPCS128, EPCS64, EPCS16, EPCS4, and EPCS1. Table 14–9. Memory Array Organization in Serial Configuration Devices Details EPCS128 EPCS64 EPCS16 EPCS4 EPCS1 Bytes (bits) 16,777,216 bytes (128 Mbits) 8,388,608 bytes (64 Mbits) 2,097,152 bytes (16 Mbits) 524,288 bytes (4 Mbits) 131,072 bytes (1 Mbit) Number of sectors 64 128 32 8 4 Bytes (bits) per sector 262,144 (2 Mbits) 65,536 bytes (512 Kbits) 65,536 bytes (512 Kbits) 65,536 bytes (512 Kbits) 32,768 bytes (256 Kbits) Pages per sector 1,024 256 256 256 128 Total number of pages 65,536 32,768 8,192 2,048 512 Bytes per page 256 bytes 256 bytes 256 bytes 256 bytes 256 bytesTable 14–10. Address Range for Sectors in EPCS128 (Part 1 of 3) Sector Address Range (Byte Addresses in HEX) Start End

63 H'FC0000 H'FFFFFF

62 H'F80000 H'FBFFFF

61 H'F40000 H'F7FFFF

60 H'F00000 H'F3FFFF

59 H'EC0000 H'EFFFFF

58 H'E80000 H'EBFFFF

57 H'E40000 H'E7FFFF

56 H'E00000 H'E3FFFF

55 H'DC0000 H'DFFFFF

54 H'D80000 H'DBFFFF

Altera Corporation 14–13 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet

53 H'D40000 H'D7FFFF

52 H'D00000 H'D3FFFF

51 H'CC0000 H'CFFFFF

50 H'C80000 H'CBFFFF

49 H'C40000 H'C7FFFF

48 H'C00000 H'C3FFFF

47 H'BC0000 H'BFFFFF

46 H'B80000 H'BBFFFF

45 H'B40000 H'B7FFFF

44 H'B00000 H'B3FFFF

43 H'AC0000 H'AFFFFF

42 H'A80000 H'ABFFFF

41 H'A40000 H'A7FFFF

40 H'A00000 H'A3FFFF

39 H'9C0000 H'9FFFFF

38 H'980000 H'9BFFFF

37 H'940000 H'97FFFF

36 H'900000 H'93FFFF

35 H'8C0000 H'8FFFFF

34 H'880000 H'8BFFFF

33 H'840000 H'87FFFF

32 H'800000 H'83FFFF

31 H'7C0000 H'7FFFFF

30 H'780000 H'7BFFFF

29 H'740000 H'77FFFF

28 H'700000 H'73FFFF

27 H'6C0000 H'6FFFFF

26 H'680000 H'6BFFFF

25 H'640000 H'67FFFF

24 H'600000 H'63FFFF

23 H'5C0000 H'5FFFFF

22 H'580000 H'5BFFFF

Table 14–10. Address Range for Sectors in EPCS128 (Part 2 of 3) Sector Address Range (Byte Addresses in HEX) Start End

14–14 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access

21 H'540000 H'57FFFF

20 H'500000 H'53FFFF

19 H'4C0000 H'4FFFFF

18 H'480000 H'4BFFFF

17 H'440000 H'47FFFF

16 H'400000 H'43FFFF

15 H'3C0000 H'3FFFFF

14 H'380000 H'3BFFFF

13 H'340000 H'37FFFF

12 H'300000 H'33FFFF

11 H'2C0000 H'2FFFFF

10 H'280000 H'2BFFFF

9 H'240000 H'27FFFF

8 H'200000 H'23FFFF

7 H'1C0000 H'1FFFFF

6 H'180000 H'1BFFFF

5 H'140000 H'17FFFF

4 H'100000 H'13FFFF

3 H'0C0000 H'0FFFFF

2 H'080000 H'0BFFFF

1 H'040000 H'07FFFF

0 H'000000 H'03FFFF

Table 14–11. Address Range for Sectors in EPCS64 (Part 1 of 5) Sector Address Range (Byte Addresses in HEX) Start End

127 H'7F0000 H'7FFFFF

126 H'7E0000 H'7EFFFF

125 H'7D0000 H'7DFFFF

124 H'7C0000 H'7CFFFF

123 H'7B0000 H'7BFFFF

Table 14–10. Address Range for Sectors in EPCS128 (Part 3 of 3) Sector Address Range (Byte Addresses in HEX) Start End

Altera Corporation 14–15 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet

122 H'7A0000 H'7AFFFF

121 H'790000 H'79FFFF

120 H'780000 H'78FFFF

119 H'770000 H'77FFFF

118 H'760000 H'76FFFF

117 H'750000 H'75FFFF

116 H'740000 H'74FFFF

115 H'730000 H'73FFFF

114 H'720000 H'72FFFF

113 H'710000 H'71FFFF

112 H'700000 H'70FFFF

111 H'6F0000 H'6FFFFF

110 H'6E0000 H'6EFFFF

109 H'6D0000 H'6DFFFF

108 H'6C0000 H'6CFFFF

107 H'6B0000 H'6BFFFF

106 H'6A0000 H'6AFFFF

105 H'690000 H'69FFFF

104 H'680000 H'68FFFF

103 H'670000 H'67FFFF

102 H'660000 H'66FFFF

101 H'650000 H'65FFFF

100 H'640000 H'64FFFF

99 H'630000 H'63FFFF

98 H'620000 H'62FFFF

97 H'610000 H'61FFFF

96 H'600000 H'60FFFF

95 H'5F0000 H'5FFFFF

94 H'5E0000 H'5EFFFF

93 H'5D0000 H'5DFFFF

92 H'5C0000 H'5CFFFF

91 H'5B0000 H'5BFFFF

Table 14–11. Address Range for Sectors in EPCS64 (Part 2 of 5) Sector Address Range (Byte Addresses in HEX) Start End

14–16 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access

90 H'5A0000 H'5AFFFF

89 H'590000 H'59FFFF

88 H'580000 H'58FFFF

87 H'570000 H'57FFFF

86 H'560000 H'56FFFF

85 H'550000 H'55FFFF

84 H'540000 H'54FFFF

83 H'530000 H'53FFFF

82 H'520000 H'52FFFF

81 H'510000 H'51FFFF

80 H'500000 H'50FFFF

79 H'4F0000 H'4FFFFF

78 H'4E0000 H'4EFFFF

77 H'4D0000 H'4DFFFF

76 H'4C0000 H'4CFFFF

75 H'4B0000 H'4BFFFF

74 H'4A0000 H'4AFFFF

73 H'490000 H'49FFFF

72 H'480000 H'48FFFF

71 H'470000 H'47FFFF

70 H'460000 H'46FFFF

69 H'450000 H'45FFFF

68 H'440000 H'44FFFF

67 H'430000 H'43FFFF

66 H'420000 H'42FFFF

65 H'410000 H'41FFFF

64 H'400000 H'40FFFF

63 H'3F0000 H'3FFFFF

62 H'3E0000 H'3EFFFF

61 H'3D0000 H'3DFFFF

60 H'3C0000 H'3CFFFF

59 H'3B0000 H'3BFFFF

Table 14–11. Address Range for Sectors in EPCS64 (Part 3 of 5) Sector Address Range (Byte Addresses in HEX) Start End

Altera Corporation 14–17 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet

58 H'3A0000 H'3AFFFF

57 H'390000 H'39FFFF

56 H'380000 H'38FFFF

55 H'370000 H'37FFFF

54 H'360000 H'36FFFF

53 H'350000 H'35FFFF

52 H'340000 H'34FFFF

51 H'330000 H'33FFFF

50 H'320000 H'32FFFF

49 H'310000 H'31FFFF

48 H'300000 H'30FFFF

47 H'2F0000 H'2FFFFF

46 H'2E0000 H'2EFFFF

45 H'2D0000 H'2DFFFF

44 H'2C0000 H'2CFFFF

43 H'2B0000 H'2BFFFF

42 H'2A0000 H'2AFFFF

41 H'290000 H'29FFFF

40 H'280000 H'28FFFF

39 H'270000 H'27FFFF

38 H'260000 H'26FFFF

37 H'250000 H'25FFFF

36 H'240000 H'24FFFF

35 H'230000 H'23FFFF

34 H'220000 H'22FFFF

33 H'210000 H'21FFFF

32 H'200000 H'20FFFF

31 H'1F0000 H'1FFFFF

30 H'1E0000 H'1EFFFF

29 H'1D0000 H'1DFFFF

28 H'1C0000 H'1CFFFF

27 H'1B0000 H'1BFFFF

Table 14–11. Address Range for Sectors in EPCS64 (Part 4 of 5) Sector Address Range (Byte Addresses in HEX) Start End

14–18 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access

26 H'1A0000 H'1AFFFF

25 H'190000 H'19FFFF

24 H'180000 H'18FFFF

23 H'170000 H'17FFFF

22 H'160000 H'16FFFF

21 H'150000 H'15FFFF

20 H'140000 H'14FFFF

19 H'130000 H'13FFFF

18 H'120000 H'12FFFF

17 H'110000 H'11FFFF

16 H'100000 H'10FFFF

15 H'0F0000 H'0FFFFF

14 H'0E0000 H'0EFFFF

13 H'0D0000 H'0DFFFF

12 H'0C0000 H'0CFFFF

11 H'0B0000 H'0BFFFF

10 H'0A0000 H'0AFFFF

9 H'090000 H'09FFFF

8 H'080000 H'08FFFF

7 H'070000 H'07FFFF

6 H'060000 H'06FFFF

5 H'050000 H'05FFFF

4 H'040000 H'04FFFF

3 H'030000 H'03FFFF

2 H'020000 H'02FFFF

1 H'010000 H'01FFFF

0 H'000000 H'00FFFF

Table 14–11. Address Range for Sectors in EPCS64 (Part 5 of 5) Sector Address Range (Byte Addresses in HEX) Start End

Altera Corporation 14–19 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Table 14–12. Address Range for Sectors in EPCS16 Sector Address Range (Byte Addresses in HEX) Start End

14–20 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access Operation Codes This section describes the operations that can be used to access the memory in serial configuration devices. The DATA, DCLK, ASDI, and nCS signals access the memory in serial configuration devices. All serial configuration device operation codes, addresses and data are shifted in and out of the device serially, with the most significant bit (MSB) first. The device samples the active serial data input on the first rising edge of the DCLK after the active low chip select (nCS) input signal is driven low. Shift the operation code (MSB first) serially into the serial configuration device through the active serial data input pin. Each operation code bit is latched into the serial configuration device on the rising edge of the DCLK. Different operations require a different sequence of inputs. While executing an operation, you must shift in the desired operation code, followed by the address bytes, data bytes, both, or neither. The device Table 14–13. Address Range for Sectors in EPCS4 Sector Address Range (Byte Addresses in HEX) Start End

7 H'70000 H'7FFFF

6 H'60000 H'6FFFF

5 H'50000 H'5FFFF

4 H'40000 H'4FFFF

3 H'30000 H'3FFFF

2 H'20000 H'2FFFF

1 H'10000 H'1FFFF

0 H'00000 H'0FFFF

Table 14–14. Address Range for Sectors in EPCS1 Sector Address Range (Byte Addresses in HEX) Start End

3 H'18000 H'1FFFF

2 H'10000 H'17FFF

1 H'08000 H'0FFFF

0 H'00000 H'07FFF

Altera Corporation 14–21 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet must drive nCS high after the last bit of the operation sequence is shifted in. Table 14–15 shows the operation sequence for every operation supported by the serial configuration devices. For the read byte, read status, and read silicon ID operations, the shifted-in operation sequence is followed by data shifted out on the DATApin. You can drive the nCS pin high after any bit of the data-out sequence is shifted out. For the write byte, erase bulk, erase sector, write enable, write disable, and write status operations, drive the nCS pin high exactly at a byte boundary (drive the nCS pin high a multiple of eight clock pulses after the nCS pin is driven low); otherwise, the operation is rejected and is not executed. All attempts to access the memory contents while a write or erase cycle is in progress will not be granted, and the write or erase cycle will continue unaffected. Table 14–15. Operation Codes for Serial Configuration Devices Operation Operation Code (1) Address Bytes Dummy Bytes Data Bytes DCLK f MAX (MHz) Write enable 0000 0110 00 0 2 5 Write disable 0000 0100 00 0 2 5 Read status 0000 0101 0 0 1 to infinite (2) 25 Read bytes 0000 0011 3 0 1 to infinite (2) 20 Read silicon ID (4) 1010 1011 0 3 1 to infinite (2) 25 Write status 0000 0001 00 1 2 5 Write bytes 0000 0010 3 0 1 to 256 (3) 25 Erase bulk 1100 0111 00 0 2 5 Erase sector 1101 1000 30 0 2 5 Read Device Identification (5) 1001 1111 0 2 1 to infinite (2) 25 Notes to T able 14–15: (1) The MSB is listed first and the leas t significant bit (LSB) is listed last. (2) The status register, data or silicon ID are read out at least once on the DATA pin and will continuously be read out until nCS is driven high. (3) Write bytes operation requires at least one data byte on the DATA pin. If more than 256 bytes are sent to the device, only the last 256 bytes are written to the memory. (4) Read silicon ID operation is available on ly for EPCS1, EPCS4, EPCS16, and EPCS64. (5) Read Device Identification operation is available only for EPCS128.

14–24 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access Setting the write in progress bit to 1 indicates that the serial configuration device is busy with a write or erase cycle. Resetting the write in progress bit to 0 means no write or erase cycle is in progress. Resetting the write enable latch bit to 0 indicates that no write or erase cycle will be accepted. Set the write enable latch bit to 1 before every write bytes, write status, erase bulk, and erase sector operation. The non-volatile block protect bits determine the area of the memory protected from being written or erased unintentionally. Table 14–16 through Table 14–20 show the protected area in the serial configuration devices with reference to the block protect bits. The erase bulk operation is only available when all the block protect bits are 0. When any of the block protect bits are set to 1, the relevant area is protected from being written by write bytes operations or erased by erase sector operations. Table 14–16. Block Protection Bits in EPCS1 Status Register Content Memory Content BP1 Bit BP0 Bit Protected Area Unprotected Area

00 None All four sectors: 0 to 3

01 Sector 3 Three sectors: 0 to 2

10 Two sectors: 2 and 3 Two sectors: 0 and 1

11 All sectors None

Table 14–17. Block Protection Bits in EPCS4 Status Register Content Memory Content BP2 Bit BP1 Bit BP0 Bit Protected Area Unprotected Area

000 None All eight sectors: 0 to 7

001 Sector 7 Seven sectors: 0 to 6

010 Sectors 6 and 7 Six sectors: 0 to 5

011 Four sectors: 4 to 7 Four sectors: 0 to 3

100 All sectors None

101 All sectors None

110 All sectors None

111 All sectors None

Altera Corporation 14–25 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Table 14–18. Block Protection Bits in EPCS16 Status Register Content Memory Content BP2 Bit BP1 Bit BP0 Bit Protected Area Unprotected Area

000 None All sectors (32 sectors 0 to 31)

001 Upper 32nd (Sector 31) Lower 31/32nds (31 sectors: 0 to 30)

010 Upper sixteenth (two sectors: 30 and 31) Lower 15/16ths (30 sectors: 0 to 29)

011 Upper eighth (four sectors: 28 to 31) Lower seven-eighths (28 sectors: 0 to 27)

100 Upper quarter (eight sectors: 24 to 31) Lower three-quarters (24 sectors: 0 to 23)

101 Upper half (sixteen sectors: 16 to 31) Lower half (16 sectors: 0 to 15)

110 All sectors (32 sectors: 0 to 31) None

111 All sectors (32 sectors: 0 to 31) None

Table 14–19. Block Protection Bits in EPCS64 Status Register Content Memory Content BP2 Bit BP1 Bit BP0 Bit Protected Area Unprotected Area

000 None All sectors (128 sectors: 0 to 127)

001 Upper 64th (2 sectors: 126 and 127) Lower 63/64ths (126 sectors: 0 to 125)

010 Upper 32nd (4 sectors: 124 to 127) Lower 31/32nds (124 sectors: 0 to 123)

011 Upper sixteenth (8 sectors: 120 to 127) Lower 15/16ths (120 sectors: 0 to 119)

100 Upper eighth (16 sectors: 112 to 127) Lower seven-eighths (112 sectors: 0 to 111)

101 Upper quarter (32 sectors: 96 to 127) Lower three-quarters (96 sectors: 0 to 95)

110 Upper half (64 sectors: 64 to 127) Lower half (64 sectors: 0 to 63)

111 All sectors (128 sectors: 0 to 127) None

14–26 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access You can read the status register at any time, even while a write or erase cycle is in progress. When one of these cycles is in progress, you can check the write in progress bit (bit 0 of the status register) before sending a new operation to the device. The device can also read the status register continuously, as shown in Figure 14–9. Figure 14–9. Read Status Operation Timing Diagram Write Status Operation The write status operation code is b'0000 0001, with the MSB listed first. Use the write status operation to set the status register block protection bits. The write status operation has no effect on the other bits. Therefore, you can implement this operation to protect certain memory sectors, as defined in Table 14–16 through Table 14–20. After setting the block protect bits, the protected memory sectors are treated as read-only Table 14–20. Block Protection Bits in EPCS128 Status Register Content Memory Content BP2 Bit BP1 Bit BP0 Bit Protected Area Unprotected Area

000 None All sectors (64 sectors: 0 to 63)

001 Upper 64th (1 sector: 63) Lower 63/64ths (63 sectors: 0 to 62)

010 Upper 32nd (2 sectors: 62 to 63) Lower 31/32nds (62 sectors: 0 to 61)

011 Upper 16th (4 sectors: 60 to 63) Lower 15/16ths (60 sectors: 0 to 59)

100 Upper 8th (8 sectors: 56 to 63) Lower seven-eighths (56 sectors: 0 to 55)

101 Upper quarter (16 sectors: 48 to 63) Lower three-quarters (48 sectors: 0 to 47)

110 Upper half (32 sectors: 32 to 63) Lower half (32 sectors: 0 to 31)

111 All sectors (64 sectors: 0 to 63) None

01234567 8 9 1 01 11 21 31 41 5 765432107 2107 6543 Operation Code MSB MSB Status Register Out Stat us Register Out High Impedance

Altera Corporation 14–27 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet memory. You must execute the write enable operation before the write status operation so the device sets the status register’s write enable latch bit to 1. The write status operation is implemented by driving nCS low, followed by shifting in the write status operation code and one data byte for the status register on the ASDI pin. Figure 14–10 shows the timing diagram for the write status operation. nCS must be driven high after the eighth bit of the data byte has been latched in, otherwise, the write status operation is not executed. Immediately after nCS drives high, the device initiates the self-timed write status cycle. The self-timed write status cycle usually takes 5 ms for all serial configuration devices and is guaranteed to be less than 15 ms (refer to tWS in Table 14–23). You must account for this delay to ensure that the status register is written with desired block protect bits. Alternatively, you can check the write in progress bit in the status register by executing the read status operation while the self-timed write status cycle is in progress. The write in progress bit is 1 during the self-timed write status cycle, and 0 when it is complete. Figure 14–10. Write Status Operation Timing Diagram Read Bytes Operation The read bytes operation code is b'0000 0011, with the MSB listed first. To read the memory contents of the serial configuration device, the device is first selected by driving nCS low. Then, the read bytes operation code is shifted in followed by a 3-byte address (A[23..0]). Each address bit must be latched in on the rising edge of the DCLK. After the address is latched in, the memory contents of the specified address are shifted out serially on the DATA pin, beginning with the MSB. For reading Raw Programming Data files (.rpd), the content is shifted out serially beginning with the LSB. Each data bit is shifted out on the falling edge of nCS DCLK ASDI DATA 01234567 8 9 1 01 11 21 31 41 5 Operation Code Status Register 7 6 543210 MSB High Impedance

14–28 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access DCLK. The maximum DCLK frequency during the read bytes operation is 20 MHz. Figure 14–11 shows the timing diagram for the read bytes operation. The first byte address can be at any location. The device automatically increments the address to the next higher address after shifting out each byte of data. Therefore, the device can read the whole memory with a single read bytes operation. When the device reaches the highest address, the address counter restarts at 0x000000, allowing the memory contents to be read out indefinitely until the read bytes operation is terminated by driving nCS high. The device can drive nCS high any time after data is shifted out. If the read bytes operation is shifted in while a write or erase cycle is in progress, the operation is not executed and has no effect on the write or erase cycle in progress. Figure 14–11. Read Bytes Operation Timing Diagram Notes to Figure 14–11: (1) Address bit A[23] is a don't-care bit in EPCS64. Address bits A[23..21] are don't-care bits in EPCS16. Address (2) For RPD files, the read sequence shifts out the LSB of the data byte first. Read Silicon ID Operation The read silicon ID operation code is b'1010 1011, with the MSB listed first. Only EPCS1, EPCS4, EPCS16, and EPCS64 support this operation. It reads the serial configuration device’s 8-bit silicon ID from the DATA output pin. If this operation is shifted in during an erase or write cycle, it is ignored and has no effect on the cycle that is in progress. nCS DCLK ASDI DATA 01234567 8 91 0 2 8 29 30 31 32 33 34 35 36 37 3 8 39 Operation Code 24-Bit Address (1) 23 22 21 3 2 1 0 77 6543210 MSB MSB (2) High Impedance DATA Out 1 DATA O ut 2

Altera Corporation 14–29 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Table 14–21 shows the serial configuration device silicon IDs. The device implements the read silicon ID operation by driving nCS low then shifting in the read silicon ID operation code followed by three dummy bytes on ASDI. The serial configuration device’s 8-bit silicon ID is then shifted out on the DATA pin on the falling edge of DCLK, as shown in Figure 14–12. The device can terminate the read silicon ID operation by driving nCS high after the silicon ID has been read at least once. Sending additional clock cycles on DCLK while nCS is driven low can cause the silicon ID to be shifted out repeatedly. Figure 14–12. Read Silicon ID Operation Timing Diagram Note (1) Note to Figure 14–12: (1) Only EPCS1, EPCS4, EPCS16, and EPCS64 support Read Silicon ID operation. Read Device Identification Operation The read device identification operation code is b’1001 1111, with the MSB listed first. Only EPCS128 supports this operation. It reads the serial configuration device’s 8-bit device identification from the DATA output pin. If this operation is shifted in during an erase or write cycle, it is ignored and has no effect on the cycle that is in progress. Table 14–22 shows the serial configuration device identification. Table 14–21. Serial Configuration Device Silicon ID Serial Configuration Device Silicon ID (Binary Value) EPCS1 b'0001 0000 EPCS4 b'0001 0010 EPCS16 b'0001 0100 EPCS64 b'0001 0110 nCS DCLK ASDI DATA 01234567 8 91 0 2 8 29 30 31 32 33 34 35 36 37 3 8 39 Operation Code Three Dummy Bytes 23 22 21 3 2 1 0 76543210 MSB MSB High Impedance Silicon ID

14–30 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access The device implements the read device identification operation by driving nCS low then shifting in the read device identification operation code followed by one dummy byte on ASDI. The serial configuration device’s 16-bit device identification is then shifted out on the DATA pin on the falling edge of DCLK, as shown in Figure 14–13. The device can terminate the read device identification operation by driving nCS high after reading the device identification at least once. Figure 14–13. Read Device Identification Operation Timing Diagram Note (1) Note to Figure 14–13: (1) Only EPCS128 supports read de vice identification operation. Write Bytes Operation The write bytes operation code is b'0000 0010, with the MSB listed first. The write bytes operation allows bytes to be written to the memory. The write enable operation must be executed prior to the write bytes operation to set the write enable latch bit in the status register to 1. The write bytes operation is implemented by driving nCS low, followed by the write bytes operation code, three address bytes and a minimum one data byte on ASDI. If the eight least significant address bits (A[7..0]) are not all 0, all sent data that goes beyond the end of the current page is not written into the next page. Instead, this data is written at the start address of the same page (from the address whose eight LSBs are all 0). Drive nCS low during the entire write bytes operation sequence, as shown in Figure 14–14. Table 14–22. Serial Configuration Device Identification Serial Configuration Device Silicon ID (Binary Value) EPCS128 b'0001 1000 nCS DCLK ASDI DATA 0 1234567 8 91 0 11 12 13 14 15 16 17 1 8 19 20 21 22 Operation Code 765 43 210 MSBMSB High Impedance Dummy Byte 1 765 43 210 765 43 210 Silicon ID MSB 23 24 25 26 27 2 8 29 30 31 Dummy Byte 2

Altera Corporation 14–31 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet If more than 256 data bytes are shifted into the serial configuration device with a write bytes operation, the previously latched data is discarded and the last 256 bytes are written to the page. However, if less than 256 data bytes are shifted into the serial configuration device, they are guaranteed to be written at the specified addresses and the other bytes of the same page are unaffected. If the design must write more than 256 data bytes to the memory, it needs more than one page of memory. Send the write enable and write bytes operation codes followed by three new targeted address bytes and 256 data bytes before a new page is written. nCS must be driven high after the eighth bit of the last data byte has been latched in. Otherwise, the device will not execute the write bytes operation. The write enable latch bit in the status register is reset to 0 before the completion of each write bytes operation. Therefore, the write enable operation must be carried out before the next write bytes operation. The device initiates the self-timed write cycle immediately after nCS is driven high. Refer to tWB in Table 14–23 for the self-timed write cycle time for the respective EPCS devices. Therefore, you must account for this amount of delay before another page of memory is written. Alternatively, you can check the status register’s write in progress bit by executing the read status operation while the self-timed write cycle is in progress. The write in progress bit is set to 1 during the self-timed write cycle, and 0 when it is complete. Figure 14–14. Write Bytes Operation Timing Diagram Notes to Figure 14–14: (1) Address bit A[23] is a don't-care bit in EPCS64. Address bits A[23..21] are don't-care bits in EPCS16. Address (2) For RPD files, write the LSB of the data byte first. Erase Bulk Operation The erase bulk operation code is b'1100 0111, with the MSB listed first. The erase bulk operation sets all memory bits to 1 or 0xFF. Similar to the write bytes operation, the write enable operation must be executed prior to the erase bulk operation so that the write enable latch bit in the status register is set to 1. nCS DCLK ASDI 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 2072 2073 2074 2075 2076 2077 2078 2079 Operation Code 24-Bit Address (1) 23 22 21 3 2 1 0 7654 MSB MSB (2) MSB (2) MSB (2) Data Byte 1 Data Byte 2 Data Byte 256 3210 7654 7654 3210 3210

14–32 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Serial Configuration Device Memory Access You can implement the erase bulk operation by driving nCS low and then shifting in the erase bulk operation code on the ASDI pin. nCS must be driven high after the eighth bit of the erase bulk operation code has been latched in. Figure 14–15 shows the timing diagram. The device initiates the self-timed erase bulk cycle immediately after nCS is driven high. Refer to tEB in Table 14–23 for the self-timed erase bulk cycle time for the respective EPCS devices. You must account for this delay before accessing the memory contents. Alternatively, you can check the write in progress bit in the status register by executing the read status operation while the self-timed erase cycle is in progress. The write in progress bit is 1 during the self-timed erase cycle and 0 when it is complete. The write enable latch bit in the status register is reset to 0 before the erase cycle is complete. Figure 14–15. Erase Bulk Operation Timing Diagram Erase Sector Operation The erase sector operation code is b'1101 1000, with the MSB listed first. The erase sector operation allows the user to erase a certain sector in the serial configuration device by setting all bits inside the sector to 1 or 0xFF. This operation is useful for users who access the unused sectors as general purpose memory in their applications. The write enable operation must be executed prior to the erase sector operation so that the write enable latch bit in the status register is set to 1. The erase sector operation is implemented by first driving nCS low, then shifting in the erase sector operation code and the three address bytes of the chosen sector on the ASDI pin. The three address bytes for the erase sector operation can be any address inside the specified sector. (Refer to Tables 14–10 through 14–14 for sector address range information.) Drive nCS high after the eighth bit of the erase sector operation code has been latched in. Figure 14–16 shows the timing diagram. nCS DCLK ASDI 01234567 Operation Code

Altera Corporation 14–33 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Immediately after the device drives nCS high, the self-timed erase sector cycle is initiated. Refer to tES in Table 14–23 for the self-timed erase sector cycle time for the respective EPCS devices. You must account for this amount of delay before the memory contents can be accessed. Alternatively, you can check the write in progress bit in the status register by executing the read status operation while the erase cycle is in progress. The write in progress bit is 1 during the self-timed erase cycle and 0 when it is complete. The write enable latch bit in the status register resets to 0 before the erase cycle is complete. Figure 14–16. Erase Sector Operation Timing Diagram Note to Figure 14–16: (1) Address bit A[23] is a don't-care bit in EPCS64. Address bits A[23..21] are don't-care bits in EPCS16. Address Power and Operation This section describes the power modes, power-on reset (POR) delay, error detection, and initial programming state of serial configuration devices. Power Mode Serial configuration devices support active power and standby power modes. When nCS is low, the device is enabled and is in active power mode. The FPGA is configured while in active power mode. When nCS is high, the device is disabled but could remain in active power mode until all internal cycles have completed (such as write or erase operations). The serial configuration device then goes into stand-by power mode. The ICC1 parameter specifies the VCC supply current when the device is in active power mode and the ICC0 parameter specifies the current when the device is in stand-by power mode (refer to Table 14–29). nCS DCLK ASDI 0123456789 2 8 2 9 3 0 3 1 Operation Code 24-Bit Address (1) 23 22 3 2 1 0 MSB

14–34 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Power and Operation Power-On Reset During initial power-up, a POR delay occurs to ensure the system voltage levels have stabilized. During AS configuration, the FPGA controls the configuration and has a longer POR delay than the serial configuration device. f For the POR delay time, refer to the configuration chapter in the appropriate device handbook. Error Detection During AS configuration with the serial configuration device, the FPGA monitors the configuration status through the nSTATUS and CONF_DONE pins. If an error condition occurs (nSTATUS drives low) or if the CONF_DONE pin does not go high, the FPGA will initiate reconfiguration by pulsing the nSTATUS and nCSO signals, which controls the chip select pin on the serial configuration device (nCS). After an error, configuration automatically restarts if the Auto-Restart Upon Frame Error option is turned on in the Quartus II software. If the option is turned off, the system must monitor the nSTATUS signal for errors and then pulse the nCONFIG signal low to restart configuration.

Altera Corporation 14–37 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Figure 14–19 shows the timing waveform for FPGA AS configuration scheme using a serial configuration device. Figure 14–19. AS Configuration Timing tODIS Output disable time after read — 15 ns tnCLK2D Clock falling edge to data — 15 ns Table 14–24. Read Operation Parameters (Part 2 of 2) Symbol Parameter Min Max Unit Read Address bit N − 1bit N bit 1 bit 0 CONF_DONE nCSO DCLK ASDO DATA0 INIT_DONE User I/O User Mode tCF2ST1 tH tSU tCH tCL Tri-stated with internal pull-up resistor

14–38 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Programming and Configuration File Support Table 14–25 shows the timing parameters for AS configuration mode. Programming and Configuration File Support The Quartus II design software provides programming support for serial configuration devices. After selecting the serial configuration device, the Quartus II software automatically generates the Programmer Object File (.pof) to program the device. The software allows users to select the appropriate serial configuration device density that most efficiently stores the configuration data for a selected FPGA. The serial configuration device can be programmed in-system by an external microprocessor using SRunner. SRunner is a software driver developed for embedded serial configuration device programming that designers can customize to fit in different embedded systems. The SRunner can read RPD file and write to the serial configuration devices. The programming time is comparable to the Quartus II software programming time. Note that writing and reading the RPD file to the EPCS is different from other data and address bytes. The LSB of RPD bytes must be shifted out first during the read bytes instruction and the LSB of RPD bytes must be shifted in first during the write bytes instruction. This is because the FPGA reads the LSB of the RPD data first during the configuration process. f For more information about SRunner, refer to the AN 418: SRunner: An Embedded Solution for Serial Configuration Device Programming User Guide and the source code on the Altera website (www.altera.com). Table 14–25. Timing Parameters for AS Configuration Symbol Parameter Min Typ Max Unit fCLK DCLK frequency from Cyclone FPGA 14 17 20 MHz DCLK frequency from Stratix II or Cyclone II FPGA (40 MHz) (1) 20 26 40 MHz DCLK frequency from Stratix II or Cyclone II FPGA (20 MHz) 10 13 20 MHz DCLK frequency from Cyclone III FPGA (1) 20 30 40 MHz DCLK frequency from Stratix III FPGA (1) 15 25 40 MHz tH Data hold time after rising edge on DCLK 0— — n s tSU Data set up time before rising edge on DCLK 5— — n s Note to Table 14–25: (1) Existing batches of EPCS1 and EPCS4 manufactured on 0.15 µm process geometry supports AS configuration up to 40 MHz. However, batches of EPCS1 and EPCS4 manufactured on 0.18 µm process geometry support only up to 20 MHz. EPCS16, EPCS64, and EPCS128 are not affected. For information about product traceability and transition date to differentiate between 0.15 µm process geometry and 0.18 µm process geometry EPCS1 and EPCS4, refer to PCN 0514 Manufacturing Changes on EPCS Family process change notification on the Altera website at www.altera.com.

Altera Corporation 14–39 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Serial configuration devices can be programmed using the APU with the appropriate programming adapter (PLMSEPC-8) via the Quartus II software, USB Blaster, EthernetBlaster, or the ByteBlaster II download cable via the Quartus II software. In addition, many third-party programmers, such as BP Microsystems and System General, offer programming hardware that supports serial configuration devices. During in-system programming of a serial configuration device via the USB Blaster, EthernetBlaster, or ByteBlaster II download cable, the cable pulls nCONFIG low to reset the FPGA and overrides the 10-kΩ pull-down resistor on the FPGA’s nCE pin (refer to Figure 14–2). The download cable then uses the four interface pins (DATA, nCS, ASDI, and DCLK) to program the serial configuration device. Once the programming is complete, the download cable releases the serial configuration device’s four interface pins and the FPGA’s nCE pin, and pulses nCONFIG to start configuration. The FPGA can program the serial configuration device in-system using the JTAG interface with the Serial FlashLoader. This solution allows you to indirectly program the serial configuration device using the same JTAG interface that is used to configure the FPGA. f For more information about the Serial FlashLoader, refer to AN 370: Using the Serial FlashLoader with the Quartus II Software. f For more information on programming and configuration support, refer to the following documents: ■ Altera Programming Hardware Data Sheet ■ Programming Hardware Manufacturers ■ USB-Blaster Download Cable User Guide ■ ByteBlaster II Download Cable User Guide ■ EthernetBlaster Communications Cable User Guide Operating Conditions Tables 14–26 through 14–30 provide information on absolute maximum ratings, recommended operating conditions, DC operating conditions, and capacitance for serial configuration devices. Table 14–26. Absolute Maximum Ratings Note (1) (Part 1 of 2) Symbol Parameter Condition Min Max Unit VCC Supply voltage for EPCS1, EPCS4, and EPCS16 With respect to ground –0.6 4.0 V Supply voltage for EPCS64 and EPCS128 With respect to ground –0.2 4.0 V

14–40 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Operating Conditions VI DC input voltage for EPCS1, EPCS4, and EPCS16 With respect to ground –0.6 4.0 V DC input voltage for EPCS64 and EPCS128 With respect to ground –0.5 4.0 V IMAX DC VCC or GND current — — 15 mA IOUT DC output current per pin — –25 25 mA PD Power dissipation — — 54 mW TSTG Storage temperature No bias –65 150 ° C TAMB Ambient temperature Under bias –65 135 ° C TJ Junction temperature Under bias — 135 ° C Table 14–27. Recommended Operating Conditions Symbol Parameter Conditions Min Max Unit VCC Supply voltage (2) 2.7 3.6 V VI Input voltage Respect to GND –0.3 0.3 + VCC V VO Output voltage — 0 V CC V TA Operating temperature For commercial use 0 70 ° C For industrial use –40 85 ° C tR Input rise time — — 5 ns tF Input fall time — — 5 ns Table 14–28. DC Operating Conditions Symbol Parameter Conditions Min Max Unit VIH High-level input voltage for EPCS1, EPCS4, and EPCS16 —0 . 6 × VCC VCC + 0.4 V High-level input voltage for EPCS64 and EPCS128 —0 . 6 × V CC VCC + 0.2 V VIL Low-level input voltage — –0.5 0.3 × VCC V VOH High-level output voltage IOH = –100 μA (3) VCC – 0.2 —V VOL Low-level output voltage I OL = 1.6 mA (3) —0 . 4 V II Input leakage current V I = VCC or GND –10 10 μA IOZ Tri-state output off-state current V O = VCC or GND –10 10 μA Table 14–26. Absolute Maximum Ratings Note (1) (Part 2 of 2) Symbol Parameter Condition Min Max Unit

Altera Corporation 14–41 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Pin Information As shown in Figures 14–20 and 14–21, the serial configuration device is an 8-pin or 16-pin device. The control pins on the serial configuration device are: serial data output (DATA), active serial data input (ASDI), serial clock (DCLK), and chip select (nCS). Table 14–31 shows the serial configuration device's pin descriptions. Figure 14–20 shows the Altera serial configuration device 8-pin SOIC package and its pin-out diagram. Table 14–29. ICC Supply Current Symbol Parameter Conditions Min Max Unit ICC0 VCC supply current (standby) for EPCS1, EPCS4, and EPCS16 —— 5 0 μA VCC supply current (standby) for EPCS64 and EPCS128 —— 1 0 0 μA ICC1 VCC supply current (during active power mode) for EPCS1, EPCS4, and EPCS16 —5 1 5 m A VCC supply current (during active power mode) for EPCS64 and EPCS128 —5 2 0 m A Table 14–30. Capacitance Note (4) Symbol Parameter Conditions Min Max Unit CIN Input pin capacitance V IN = 0 V — 6 pF COUT Output pin capacitance V OUT = 0 V — 8 pF Notes to T able 14–26 through 14–30: (1) Refer to the Operating Requirements for Altera Devices Data Sheet. (2) Maximum V CC rise time is 100 ms. (3) The I OH parameter refers to high-level TTL or CMOS output current; the I OL parameter refers to low-level TTL or CMOS output current. (4) Capacitance is sample-tested only at T A = 25 ° C and at a 20-MHz frequency.

Altera Corporation 14–43 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Package All serial configuration devices are available in 8-pin or 16-pin plastic SOIC package. f For more information on Altera device packaging including mechanical drawing and specifications for this package, refer to the Altera Device Package Information Data Sheet. Table 14–31. Serial Configuration Device Pin Description Pin Name Pin Number in 8-Pin SOIC Package Pin Number in 16-Pin SOIC Package Pin Type Description DATA 2 8 Output The DATA output signal transfers data serially out of the serial configuration device to the FPGA during read/configuration operation. During a read/configuration operations, the serial configuration device is enabled by pulling nCS low. The DATA signal transitions on the falling edge of DCLK. ASDI 5 15 Input The AS data input signal is used to transfer data serially into the serial configuration device. It receives the data that should be programmed into the serial configuration device. Data is latched on the rising edge of DCLK. nCS 1 7 Input The active low chip select input signal toggles at the beginning and end of a valid instruction. When this signal is high, the device is deselected and the DATA pin is tri-stated. When this signal is low, it enables the device and puts the device in an active mode. After power up, the serial configuration device requires a falling edge on the nCS signal before beginning any operation. DCLK 6 16 Input DCLK is provided by the FPGA. This signal provides the timing of the serial interface. The data presented on ASDI is latched to the serial configuration device on the falling edge of DCLK. Data on the DATA pin changes after the falling edge of DCLK and is latched into the FPGA on the falling edge. VCC 3, 7, 8 1, 2, 9 Power Power pins connect to 3.3 V. GND 4 10 Ground Ground pin.

14–44 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Ordering Code Ordering Code Table 14–32 shows the ordering codes for serial configuration devices. Referenced Documents This chapter references the following documents: ■ Active Serial Memory Interface Data Sheet ■ Altera Device Package Information Data Sheet ■ Altera Programming Hardware Data Sheet ■ AN 370: Using the Serial FlashLoader with the Quartus II Software ■ AN 418: SRunner: An Embedded Solution for Serial Configuration Device Programming User Guide ■ ByteBlaster II Download Cable User Guide ■ Configuring Cyclone III Devices chapter in volume 1 of the Cyclone III Device Handbook ■ EthernetBlaster Communications Cable User Guide ■ Operating Requirements for Altera Devices Data Sheet ■ Programming Hardware Manufacturers ■ USB-Blaster Download Cable User Guide Document Table 14–33 shows the revision history for this chapter. Table 14–32. Serial Configuration Device Ordering Codes Device Ordering Code (1) EPCS1 EPCS1SI8 EPCS1SI8N EPCS4 EPCS4SI8 EPCS4SI8N EPCS16 EPCS16SI16N EPCS16SI8N EPCS64 EPCS64SI16N EPCS128 EPCS128SI16N Note to T able 14–32: (1) N: Lead free.

Altera Corporation 14–45 May 2008 Cyclone Handbook, Volume 1 Serial Configuration Devices (EPCS1, EPCS4, EPCS16, EPCS64, and EPCS128) Data Sheet Table 14–33. Document Revision History (Part 1 of 2) Date and Document Version Changes Made Summary of Changes May 2008 v3.1

• Updated Tables 14–2, 14–5, 14–6, 14–27, and 14–28.
• Deleted Note 5 to Table 14–30.
• Added “Referenced Documents” section. August 2007 v3.0
• Updated “Introduction” section.
• Updated “Functional Description” section.
• Updated Tables 14–1 through 14–3 and Tables 14–6 through 14–8 to with EPCS128 information.
• Added Table 14–5 on Arria GX.
• Added Note (4) to Figure 14–3.
• Added Note (5) to Figure 14–4.
• Updated Table 14–9 with EPCS128 information.
• Added new Table 14–10 on address range for sectors in EPCS128.
• Updated Table 14–15 with information on “Read Device Identification” and added Note (5).
• Added new Table 14–20 on block protection bits in EPCS128.
• Added Note (1) to Figure 14–12.
• Added new section “Read Device Identification Operation” with Table 14–22 and Figure 14–13.
• Updated “Write Bytes Operation”, “Erase Bulk Operation” and “Erase Sector Operation” sections.
• Updated Table 14–23 to include EPCS128 information.
• Updated Note (1) to Table 14–25.
• Updated VCC and VI information to include EPCS128 in Table 14–26.
• Updated VIH information to include EPCS128 in Table 14–28.
• Updated ICC0 and ICC1 information to include EPCS128 in Table 14–29.
• Updated Figure 14–21 and Table 14–32 with EPCS128 information.
• Updated document to include EPCS128.
• Updated document to include Arria GX. April 2007 v2.0
• Updated “Introduction” section.
• Updated “Functional Description” section and added handpara note.
• Added Tables 14–3, 14–5, and 14–6.
• Updated “Active Serial FPGA Configuration” section and its handpara note.
• Added Note (4) to Figure 14–2.
• Updated Table 14–25 and added Note (1).
• Updated Figure 14–20.
• Updated Table 14–32.
• Updated chapter to include Stratix II GX, Stratix III, and Cyclone III support for EPCS devices.
• Added information about EPCS16SI8N. January 2007 v1.7
• Removed reference to PLMSEPC-16 in “Programming and Configuration File Support”.
• Updated DCLK pin information in Table 14–31.

14–46 Altera Corporation Cyclone Handbook, Volume 1 May 2008 Document Revision History October 2006 v1.6

• Updated Figure 14–19.
• Updated Table 14–29 and Table 14–31. August 2005 v1.5 Updated table 4-4 to include EPCS64 support for Cyclone devices. August 2005 v1.4
• Updated tables.
• Minor text updates. February 2005 v1.3 Updated hot socketing AC specifications. — October 2003 v1.2
• Added Serial Configuration Device Memory Access section.
• Updated timing information in Tables 4–10 and 4–11.section.
• Updated timing information in Tables 4-16 and 4-17. July 2003 v1.1 Minor updates. — May 2003 v1.0 Added document to the Cyclone Device Handbook. — Table 14–33. Document Revision History (Part 2 of 2) Date and Document Version Changes Made Summary of Changes

Altera Corporation Section VII–1 Preliminary Section VII. Cyclone Device

Package Information

This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications. This section includes the following chapter: ■ Chapter 15. Package Information for Cyclone Devices Revision History Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the complete handbook.

Section VII–2 Altera Corporation Preliminary

Altera Corporation 15–1 May 2008 Preliminary 15. Package Information for Cyclone Devices Introduction This data sheet provides package information for Altera® devices. It includes the following sections: ■ “Device and Package Cross Reference” on page 15–1 ■ “Thermal Resistance” on page 15–2 ■ “Package Outlines” on page 15–2 In this data sheet, packages are listed in the order of ascending pin count. Device and Package Cross Reference Table 15–1 shows which Altera Cyclone® devices are available in FineLine BGA packages. Table 15–1. Cyclone Devices in FineLine BGA Packages Device Package Pins EP1C4 Non-Thermally Enhanced FineLine BGA 324 Non-Thermally Enhanced FineLine BGA 400 EP1C6 Non-Thermally Enhanced FineLine BGA 256 EP1C12 Non-Thermally Enhanced FineLine BGA 256 Non-Thermally Enhanced FineLine BGA 324 EP1C20 Non-Thermally Enhanced FineLine BGA 324 Non-Thermally Enhanced FineLine BGA 400 C52006-1.3

15–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 2 Thermal Resistance Table 15–2 provides θJA (junction-to-ambient thermal resistance) and θJC (junction-to-case thermal resistance) values for Altera Cyclone devices. Package Outlines The package outlines on the following pages are listed in order of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. Table 15–2. Thermal Resistance of Cyclone Devices Notes (1), (2) Device Pin Count Package θJC (° C/W) θJA (° C/W) Still Air θJA (° C/W) 100 ft./min. θJA (° C/W) 200 ft./min. θJA (° C/W) 400 ft./min. EP1C4 324 FineLine BGA

400 FineLine

256 FineLine

324 FineLine

Notes to T able 15–2: (1) TQFP: thin quad flat pack (2) PQFP: plastic quad flat pack

Altera Corporation 15–3 May 2008 Preliminary Document Revision History Document Table 15–3 shows the revision history for this chapter. Table 15–3. Document Revision History Date and Document Version Changes Made Summary of Changes May 2008 v1.3 Minor changes to format. — January 2007 v1.2 Added document revision history. —