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Technical content

23.01.2013 C365-2SR2 1 of 4

UV LED, Chip Die GaN C365-2SR2 is a 280x280 µm UV LED chip die , based on GaN material. On forward bias, it emits a radiation of typical 1.0-1.5 mW at a peak wavelength of 365 nm. Specifications (Unit: µm)

  • Structure: GaN based material
  • Substrate: Sapphire
  • Peak Wavelength: 365 nm
  • Optical Output Power: 1.0-1.5 mW
  • Bottom Area: 280x280 µm ±20 µm
  • Electrodes: Au alloy Electro-Optical Characteristics Item Symbol Condition Min. Typ. Max. Unit Forward Voltage VF IF = 20 mA 3.2 3.6 4.2 V Reverse Current IR VR = 5 V - - 10 µA Peak Wavelength *1 λP IF = 20 mA 363 - 370 nm Half Width Δλ IF = 20 mA - 15 - nm Total Radiated Power Po IF = 20 mA 1.0 - 1.5 mW *1 Measurement error: ±2 nm *² Radiated Power is measured as chip mounted in TO-18 header; measurement error: 10% *³ on request Note: The above specifications are for reference purpose only and subjected to change without prior notice.

23.01.2013 C365-2SR2 2 of 4

Typical Performance Curves Forward Current – Forward Voltage Forward Current – Relative Output Power Ambient Temperature – Relative Output Power Ambient Temperature – Forward Voltage Relative Spectral Emission Note: Typical performance curves are depending on packaging method. The above data are for SMD packaged LEDs.

23.01.2013 C365-2SR2 3 of 4

Dimensions Mechanical Specification (Unit: µm) Emission Area: 201x201 ±5 µm Bottom Area: 280x280 µm ±20 µm Chip Thickness: 120 µm ±10 µm N Bonding Pad Electrode: 90 µm ±5 µm P Bonding Pad Electrode: 90 µm ±5 µm (R=45) Electrodes Spacing: 128 µm ±5 µm Cross Section Diagram Material Substrate: Sapphire Epitaxial Layer: GaN Based Material N Bonding Pad Electrode: Au alloy P Bonding Pad Electrode: Au alloy Package Chips are attached on an arranging sheet. Arranging sheet: Tecni tape T4, TECNISCO Sheet size: 200x200 mm Adhesive side: the back of chips Arranging pitch: 0.43 mm Inspection

  • All chips will be inspected on each item of the electrical and optical characteristics (VF, IR, PO, λP, Δλ).
  • Verification of quantity: Calculated quantity of chips on an arranging sheet without shortage.

23.01.2013 C365-2SR2 4 of 4

  1. Cautions
  • DO NOT look directly into the emitting area of the LED during operation!
  • The LED is emitting UV radiation, which may harm your eyes. To prevent inadequate exposure of UV radiation, wear UV protective glasses.
  • Please handle with care when taking out the chips on sheet.
  • A UV light resistance paste for chip mounting is recommended. 2. Static Electricity
  • The LEDs are very sen sitive to Static Electricity and surge voltage. So it is recommended that a wrist band and/or an anti - electrostatic glove be used when handling the LEDs.
  • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs.