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Technical content

08.11.2012 C355-2SR1 1 of 3

UV LED chip die, 355nm Drawing Thickness: 120 µm ± 10 µm All dimensions in µm Storage Conditions Item Value Storage time 3 Months Storage Temperature 5 … +35 °C Storage Humidity 45 …85 % Specifications (If=20mA, Ta=25°C) Item Symbol Min. Typ. Max. Unit Electrical Specification Forward Voltage *1 UF 3.2 3.6 4.2 V Reverse Current IR 10.0 µA Optical Specification Optical Power PO 0.5 - 1.0 mW Peak Wavelength *2 λP 353 - 360 nm Spectral Half Width (FWHM) Δλ 15 nm * measurement tolerance is ± 0.2 V, ± 2 nm Device Materials Item Material Wafer material GaN based on Sapphire Substrate Electrodes n-contact Au p-contact Au XSL-355-5E is RoHS compliant

08.11.2012 C355-2SR1 2 of 3

Typical Performance Curves forward voltage vs. forward current: forward voltage vs. relative output power: ambient temperature vs. relative output power: ambient temperature vs. forward voltage: ambient temp. vs. maximum forward current: spectrum: *above measurements derive from chip die packaged into resin mold LED package

08.11.2012 C355-2SR1 3 of 3

Chips are arranged on 200x200 mm adhesive sheet at 0,43mm pitch Precaution for Use 1. Static Electricity

  • The LED chip dies are ver y sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band or an anti -electrostatic glove be used when handling the chips.
  • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the chips. 2. Heat Generation
  • Thermal design of the end product is of paramount importance. Please consider the heat generation of the chip when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of chip placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in the specification.
  • The operating current should be dec ided after considering the ambient maximum temperature of the chip dies.