BTS410-D2 SIEMENS | Alldatasheet

Document overview

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Technical content

Features

  • Overload protection
  • Current limitation
  • Short circuit protection
  • Thermal shutdown
  • Overvoltage protection (including load dump)
  • Fast demagnetization of inductive loads
  • Reverse battery protection1)
  • Undervoltage and overvoltage shutdown with auto-restart and hysteresis
  • CMOS diagnostic output
  • Open load detection in ON-state
  • CMOS compatible input
  • Loss of ground and loss of Vbb protection
  • Electrostatic discharge (ESD ) protection Application
  • µC compatible power switch with diagnostic feedback for 12 V and 24 V DC grounded loads
  • All types of resistive, inductive and capacitve loads
  • Replaces electromechanical relays, fuses and discrete circuits General Description N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection functions. + Vbb IN ST Signal GND ESD PROFET OUT GND Logic Voltage sensor Voltage source Open load detection Short circuit detection Charge pump Level shifter Temperature sensorRectifier Limit for unclamped ind. loads Gate protection Current limit Load GND Load V Logic Overvoltage protection 1) With external current limit (e.g. resistor RGND =150 Ω ) in GND connection, resistors in series with IN and ST connections, reverse load current limited by connected load. Product Summary Overvoltage protectionVbb(AZ ) 65 V Operating voltage Vbb(on) 4.7 ... 42 V On-state resistance R ON 220 m Ω Load current (ISO) IL(ISO) 1.8 A Current limitation IL(SCr) 5A TO-220AB/5 Standard Straight leads SMD

1 GND - Logic ground

2 IN I Input, activates the power switch in case of logical high signal

3V bb + Positive power supply voltage, the tab is shorted to this pin

4 ST S Diagnostic feedback, low on failure

5 OUT

(Load, L) O Output to the load Maximum Ratings at Tj = 25 °C unless otherwise specified Parameter Symbol Values Unit Supply voltage (overvoltage protection see page 3)Vbb 65 V Load dump protection2) VLoadDump = U A + Vs, U A = 13.5 V R I3)= 2 Ω , R L= 6.6 Ω , td= 400 ms, IN= low or high VLoad dump4) 100 V Load current (Short circuit current, see page 4)IL self-limited A Operating temperature range Storage temperature range Tj Tstg -40 ...+150 -55 ...+150 Power dissipation (DC), TC ≤ 25 °C Ptot 50 W Inductive load switch-off energy dissipation, single pulse Vbb = 12V, Tj,start = 150°C, TC = 150°C const. IL = 1.8 A, ZL = 2.3 H, 0 Ω : EAS 4.5 J Electrostatic discharge capability (ESD ) IN: (Human Bod y Model) all other pins: VESD 1 kV Input voltage (DC) VIN -0.5 ... +6 V Current through input pin (DC) Current through status pin (DC) see internal circuit diagrams page 6 IIN IST ±5.0 ±5.0 mA Thermal Characteristics Parameter and Conditions S ymbol Values Unit min typ max Thermal resistance chip - case: junction - ambient (free air): R thJC R thJA 2.5 K/W SMD version, device on PCB5):- - 3 5 - - 2) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a 150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for the protection of the input is integrated. 3) R I = internal resistance of the load dump test pulse generator 4) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 5) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb connection. PCB is vertical without blown air.

Electrical Characteristics

Parameter and Conditions Symbol Values Unit at Tj = 25 °C, Vbb = 12 V unless otherwise specified min typ max Load Switching Capabilities and Characteristics On-state resistance (pin 3 to 5) IL = 1.6 A Tj=25 °C: Tj=150 °C: R ON -- 190 390 220 440 m Ω Nominal load current, ISO Norm (pin 3 to 5) VON = 0.5 V, TC = 85 °C IL(ISO) 1.6 1.8 -- A Output current (pin 5) while GND disconnected or GND pulled up, Vbb=30 V, VIN= 0, see diagram page 7, Tj =-40...+150°C IL(GNDhigh) -- -- 1 mA Turn-on time IN to 90% VOUT : Turn-off time IN to 10% VOUT : ton toff 125 µs Slew rate on 10 to 30% VOUT , R L = 12 Ω , Tj =-40...+150°C dV /dton -- -- 3 V/ µs Slew rate off 70 to 40% VOUT , R L = 12 Ω , Tj =-40...+150°C -dV/dtoff -- -- 6 V/ µs Operating Parameters Operating voltage 6) Tj =-40...+150°C:Vbb(on) 4.7 -- 42 V Undervoltage shutdown Tj =25°C: Tj =-40...+150°C: Vbb(under) 2.9 2.7 4.5 4.7 V Undervoltage restart Tj =-40...+150°C:Vbb(u rst) -- -- 4.9 V Undervoltage restart of charge pump see diagram page 12 Vbb(ucp) -- 5.6 6.0 V Undervoltage hysteresis ΔVbb(under) = Vbb(u rst) - Vbb(under) ΔVbb(under) -- 0.1 -- V Overvoltage shutdown Tj =-40...+150°C:Vbb(over) 42 -- 52 V Overvoltage restart Tj =-40...+150°C:Vbb(o rst) 40 -- -- V Overvoltage hysteresis Tj =-40...+150°C:ΔVbb(over) -- 0.1 -- V Overvoltage protection7) Tj =-40...+150°C: Ibb=4 mA Vbb(AZ) 65 70 -- V Standby current (pin 3) Tj=-40...+25°C: VIN=0, IST ≤0, Tj= 150°C: Ibb(off) -- µA Leakage output current (included in Ibb(off)) VIN=0 IL(off) -- -- 20 µA Operating current (Pin 1)8), VIN=5 V, Tj =-40...+150°C IGND -- 1 2.1 mA 6) At supply voltage increase up to Vbb= 5.6 V typ without charge pump, VOUT ≈Vbb - 2 V 7) Meassured without load. See also VON(CL) in table of protection functions and circuit diagram page 7.

Parameter and Conditions Symbol Values Unit at Tj = 25 °C, Vbb = 12 V unless otherwise specified min typ max Semiconductor Group 4 Protection Functions Initial peak short circuit current limit (pin 3 to 5)9), ( max 450 µs if VON > VON(SC) ) IL(SCp) Tj =-40°C: Tj =25°C: Tj =+150°C: A Overload shutdown current limit IL(SCr) VON = 8 V, Tj = Tjt (see timing diagrams, page 10) -- 5 -- A Short circuit shutdown delay after input pos. slope VON > VON(SC) , Tj =-40..+150°C: min value valid only, if input "low" time exceeds 60 µs td(SC) -- -- 450 µs Output clamp (inductive load switch off) at VOUT = Vbb - VON(CL) IL= 40 mA, Tj =-40..+150°C:VON(CL) 61 68 73 V Short circuit shutdown detection voltage (pin 3 to 5) VON(SC) -- 8.5 -- V Thermal overload trip temperature Tjt 150 -- -- °C Thermal hysteresis ΔTjt -- 10 -- K Reverse battery (pin 3 to 1) 10) -Vbb -- -- 32 V Diagnostic Characteristics Open load detection current (on-condition) Tj=-40 ..150°C: IL (OL) 2 -- 150 mA 8) Add IST , if IST > 0, add IIN, if VIN>5.5 V 9) Short circuit current limit for max. duration of td(SC) max=450 µs, prior to shutdown 10) Requires 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature protection is not active during reverse current operation! Input and Status currents have to be limited (see max. ratings page 2 and circuit page 7).

Parameter and Conditions Symbol Values Unit at Tj = 25 °C, Vbb = 12 V unless otherwise specified min typ max Semiconductor Group 5 Input and Status Feedback11) Input turn-on threshold voltage Tj =-40..+150°C:VIN(T+) 1.5 -- 2.4 V Input turn-off threshold voltage Tj =-40..+150°C:VIN(T-) 1.0 -- -- V Input threshold hysteresis Δ VIN(T) -- 0.5 -- V Off state input current (pin 2), VIN = 0.4 V IIN(off) 1- - 3 0 µA On state input current (pin 2), VIN = 5 V IIN(on) 10 25 70 µA Status invalid after positive input slope (short circuit) Tj=-40 ... +150°C: td(ST SC) -- -- 450 µs Status invalid after positive input slope (open load) Tj=-40 ... +150°C: td(ST) 300 -- 1400 µs Status output (CMOS ) Tj =-40...+150°C, IST = - 50 µA: Tj =-40...+150°C, IST = +1.6 mA: Max. status current for current source (out): valid status output, current sink (in) : Tj =-40...+150°C VST(high)12) VST(low) -IST +IST 13) 4.4 5.1 6.5 0.4 0.25 1.6 V mA 11) If a ground resistor RGND is used, add the voltage drop across this resistor. 12) VSt high ≈ Vbb during undervoltage shutdown 13) No current sink capability during undervoltage shutdown

L H L H H H H H H H H H H H Open load L H 14) H L H H L H L H L L H Short circuit to GND L H L L H L H L H L H H H L Short circuit to V bb L H H H L H H H (L15)) H H (L15)) H H (L15)) L H Overtem- perature L H L L L L L L L L L L L L Under- voltage L H L L L 16) L16) L16) L16) H H H H H H Overvoltage L H L L L L L L H H H H H H L = "Low" Level X = don't care Z = high impedance, potential depends on external circuit H = "High" Level Status signal after the time delay shown in the diagrams (see fig 5. page 11...12) 14) Power Transistor off, high impedance, versions BTS 410H, BTS 412B: internal pull up current source for open load detection. 15) Low resistance short Vbb to output may be detected in ON-state by the no-load-detection 16) No current sink capability during undervoltage shutdown Terms PROFET V IN ST OUT GND bb VSTV IN IST IIN Vbb Ibb IL VOUTIGND VON R GND Input circuit (ESD protection) IN GND IR ZD ZD III1 I2 ESD- ZD I1 6 V typ., ESD zener diodes are not to be used as voltage clamp at DC conditions. Operation in this mode may result in a drift of the zener voltage (increase of up to 1 V). Status output ST VLogic GND ESD- ZD Zener diode: 6 V typ., max 5.0 mA, VLogic 5 V typ, ESD zener diodes are not to be used as voltage clamp at DC conditions. Operation in this mode may result in a drift of the zener voltage (increase of up to 1 V).

Fault Condition: VON > 8.5 V typ.; IN high Short circuit detection Logic unit + Vbb OUT V ON Inductive and overvoltage output clamp + Vbb OUT GND PROFET V Z VON VON clamped to 68 V typ. Overvolt. and reverse batt. protection + Vbb IN ST STR INR GND GNDR Signal GND Logic PROFET V Z2 V Z1 VZ1 = 6.2 V typ., VZ2 = 70 V typ., R GND = 150 Ω , RIN, R ST = 15 kΩ Open-load detection ON-state diagnostic condition: VON < R ON * IL(OL); IN high Open load detection Logic unit + Vbb OUT ON VON GND disconnect PROFET V IN ST OUT GND bb Vbb 1 VIN VST VGND Any kind of load. In case of Input=high is VOUT ≈ VIN - VIN(T+) . Due to VGND >0, no VST = low signal available. GND disconnect with GND pull up PROFET V IN ST OUT GND bb Vbb VGND V IN VST Any kind of load. If VGND > VIN - VIN(T+) device stays off Due to VGND >0, no VST = low signal available.

Vbb disconnect with energized inductive load PROFET V IN ST OUT GND bb Vbb high Normal load current can be handled by the PROFET itself. Vbb disconnect with charged external inductive load PROFET V IN ST OUT GND bb Vbb high S D If other external inductive loads L are connected to the PROFET, additional elements like D are necessary. Inductive Load switch-off energy dissipation PROFET V IN ST OUT GND bb E E E E AS bb L R ELoad L R L{Z L Energy stored in load inductance: EL = 1/2·L·I2 L While demagnetizing load inductance, the energy dissipated in PROFET is EAS = Ebb + EL - ER = ∫ VON(CL)·iL(t) dt, with an approximate solution for RL > 0 Ω : EAS = IL· L 2·R L

  • (Vbb + |VOUT(CL) |)· ln (1+ IL·R L |VOUT(CL) | ) Maximum allowable load inductance for a single switch off L = f (IL ); Tj,start = 150°C,TC = 150°C const., Vbb = 12 V, R L = 0 Ω L [mH] 100 1000 10000 123456 IL [A] Typ. transient thermal impedance chip case ZthJC = f(tp, D), D=tp/T ZthJC [K/W] 0.01 0.1 1E-5 1E-4 1E-3 1E-2 1E-1 1E0 1E1 0.01 0.02 0.05 0.1 0.2 0.5 tp [s]

all versions: High-side switch, Input protection, ESD protection, load dump and reverse battery protection with 150 Ω in GND connection, protection against loss of ground Type BTS 412 B2 410D2 410E2 410F2 410G2 410H2 307 308 Logic version B D EFGH Overtemperature protection with hysteresis Tj >150 °C, latch function17)18) Tj >150 °C, with auto-restart on cooling X X X X X X X X Short circuit to GND protection switches off when VON >3.5 V typ. and Vbb> 7 V typ17) (when first turned on after approx. 150 µs) XX switches off when VON >8.5 V typ.17) (when first turned on after approx. 150 µs) Achieved through overtemperature protection X X XX X X Open load detection in OFF-state with sensing current 30 µA typ. in ON-state with sensing voltage drop across power transistor X X XXX XXX Undervoltage shutdown with auto restartX X XXXXXX Overvoltage shutdown with auto restart19) X X XXXX - X Status feedback for overtemperature short circuit to GND short to V bb open load undervoltage overvoltage X X X X X X X X 20) X X X X X 20) X X X 20) X X 20) X X X X X X X X X X X X X X Status output type CMOS Open drain X X XXXXXX Output negative voltage transient limit (fast inductive load switch off) to Vbb - VON(CL) X X XXXXXX Load current limit high level (can handle loads with high inrush currents) low level (better protection of application) X X X XXXXX Protection against loss of GND X X XXXXXX 17) Latch except when Vbb -VOUT < VON(SC) after shutdown. In most cases VOUT = 0 V after shutdown (VOUT ≠ 0 V only if forced externally). So the device remains latched unless Vbb < VON(SC) (see page 4). No latch between turn on and td(SC). 18) With latch function. Reseted by a) Input low, b) Undervoltage 19) No auto restart after overvoltage in case of short circuit 20) Low resistance short Vbb to output may be detected in ON-state by the no-load-detection

Figure 9a: Overvoltage at short circuit shutdown: IN V OUT t V bb ST IL V bb(o rst) Output short to GND short circuit shutdown Overvoltage due to power line inductance. No overvoltage auto- restart of PROFET after short circuit shutdown.

Standard TO-220AB/5 Ordering code BTS 410 D2 Q67060-S6101-A2 TO-220AB/5, Option E3043 Ordering code BTS 410 D2 E3043 Q67060-S6101-A3 SMD TO-220AB/5, Opt. E3062 Ordering code BTS410D2 E3062A T&R: Q67060-S6101-A4