BTS130 SIEMENS | Alldatasheet

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Technical content

Features

  • N channel
  • Enhancement mode
  • Temperature sensor with thyristor characteristic
  • The drain pin is electrically shorted to the tab Pin 1 2 3 GDS Type V DS ID R DS(on) Package Ordering Code BTS 130 50 V 27 A 0.05 Ω TO-220AB C67078-A5001-A3 Maximum Ratings Parameter Symbol Values Unit Drain-source voltage VDS 50 V Drain-gate voltage,RGS = 20 kΩ VDGR 50 Gate-source peak voltage, aperiodic Vgs ± 20 Continuous drain current,TC = 25°C ID 27 A ISO drain current TC = 85°C, VGS = 10 V,VDS = 0.5 V ID-ISO 7.5 Pulsed drain current,TC = 25° C ID puls 108 Short circuit current,Tj = – 55 ... + 150° C ISC 80 Short circuit dissipation,Tj = – 55 ... + 150°C PSCmax 1200 W Power dissipation Ptot 75 Operating and storage temperature range Tj,Tstg – 55 ... + 150 °C DIN humidity category, DIN 40 040 – E – IEC climatic category, DIN IEC 68-1 – 55/150/56 Thermal resistance Chip-case Chip-ambient Rth JC Rth JA ≤ 1.67 ≤ 75 K/W

Electrical Characteristics

at Tj = 25°C, unless otherwise specified. Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain-source breakdown voltage VGS = 0, ID = 0.25 mA V(BR)DSS 50 – – V Gate threshold voltage VGS =VDS , ID = 1 mA VGS(th) 2.5 3.0 3.5 Zero gate voltage drain current VGS = 0 V,VDS = 50 V Tj = 25°C Tj = 125°C IDSS 100 300 µA Gate-source leakage current VGS = 20 V,VDS = 0 Tj = 25°C Tj = 150°C IGSS 100 nA µA Drain-source on-state resistance VGS = 10 V, ID =17 A RDS(on) – 0.04 0.05 Ω Dynamic Characteristics Forward transconductance VDS ≥ 2× ID × RDS(on)max,ID = 17 A gfs 8.0 13.0 18.0 S Input capacitance VGS = 0, VDS = 25 V,f = 1 MHz C iss 700 940 1250 pF Output capacitance VGS = 0, VDS = 25 V,f = 1 MHz C oss – 500 750 Reverse transfer capacitance VGS = 0, VDS = 25 V,f = 1 MHz C rss – 180 270 Turn-on timeton, (ton =td(on) +tr) VCC = 30 V,VGS = 10 V,ID = 3 A,RGS = 50Ω td(on) –2 5 4 0 n s tr –6 0 9 0 Turn-off timetoff, (toff =td(off) +tf) VCC = 30 V,VGS = 10 V,ID = 3 A,RGS = 50Ω td(off) – 100 130 t f –7 5 9 5 BTS 130

Electrical Characteristics (cont’d) at Tj = 25°C, unless otherwise specified. Parameter Symbol Values Unit min. typ. max. Reverse Diode Continuous source current IS – – 27 A Pulsed source current ISM – – 108 Diode forward on-voltage IF = 54 A,VGS = 0 VSD – 1.5 2.0 V Reverse recovery time IF = IS, diF/dt = 100 A/µs,VR = 30 V t rr – 150 – ns Reverse recovery charge IF = IS, diF/dt = 100 A/µs,VR = 30 V Q rr – 1.0 – µC Temperature Sensor Forward voltage ITS(on) = 10 mA,Tj = – 55 ... + 150° C Sensor override,tp ≤ 100µs VTS(on) 1.4 1.5 V Forward current Sensor override,tp ≤ 100µs ITS(on) 600 mA Holding current,VTS(off) = 5 V, Tj = 25°C Tj = 150°C IH 0.05 0.05 0.1 0.2 0.5 0.3 Switching temperature VTS = 5 V TTS(on) 150 – – Turn-off time VTS = 5 V,ITS(on) = 2 mA toff 0.5 – 2.5 µs BTS 130

Examples for short-circuit protection atTj = – 55 ... + 150°C, unless otherwise specified. Parameter Symbol Examples Unit 12 – Drain-source voltage VDS 15 30 – V Gate-source voltage VGS 8.1 5.9 – Short-circuit current ISC ≤ 80 ≤ 37 – A Short-circuit dissipation PSC 1200 1100 – W Response time Tj = 25° C, before short circuit tSC(off) 25 25 – ms BTS 130 Short-circuit protectionISC =f (VDS ) Parameter:V GS Diagram to determineISC forTj= – 55 ... + 150°C Max. gate voltageVGS(SC) =f (VDS ) Parameter:Tj= – 55 ... + 150°C

Max. power dissipationPtot =f (TC ) Typical output characteristicsID =f (VDS ) Parameter:tp =8 0µs Typ. drain-source on-state resistance RDS(on) =f (ID ) Parameter:V GS Safe operating areaID =f (VDS ) Parameter:D = 0.01,TC =2 5°C BTS 130

Drain-source on-state resistance RDS(on) =f (Tj) Parameter:ID = 17 A,VGS = 10 V (spread) Typ. transfer characteristic ID =f (VGS ) Parameter:tp = 80µs,VDS = 25 V Gate threshold voltageVGS(th) =f (Tj) Parameter:V DS =VGS ,ID = 1 mA Typ. transconductancegfs =f (ID ) Parameter:tp = 80µs,VDS = 25 V BTS 130

Continuous drain currentID = f (TC ) Parameter:VGS ≥ 10 V Typ. gate-source leakage current IGSS = f (TC ) Parameter:VGS = 20 V,VDS = 0 Forward characteristics of reverse diode IF =f (VSD ) Parameter:T j,tp = 80µs (spread) Typ. capacitancesC =f (VDS ) Parameter:VGS = 0,f= 1 MHz BTS 130

Transient thermal impedanceZ thJC =f (tp) Parameter:D =tp/T BTS 130

SMD version E3045 C67078-A5001-A9 3.79.5 9.9 4.6 0.75 1.05 2.542.54 17.5 2.8 12.8 0.5 2.4 13.5 9.2 15.6 1.3 4.4 GPT05155 3) max. 14.5 by dip tinning press burr max. 0.05 2) dip tinning 1) punch direction, burr max. 0.04 2) 1