BTM44X LSTD | Alldatasheet
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A Datasheet BTM44x Version 3.6
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REVISION HISTORY
Revision Date Description Approved By 1.0 9/10/2011 Initial Release Jonathan Kaye 1.1 04/2012 Up to Build 240 Jonathan Kaye 2.0 08/2012 General Formatting Jonathan Kaye 3.0 01/14/2013 Reformatting, Updates to FCC/IC Statements, Updates to Mechanical Specs Jonathan Kaye 3.1 09 Dec 2013 A. Dobbing’s signature added to DoC Jonathan Kaye 3.2 02 Feb 2014 Separated document into two docs: User Guide and Hardware Integration Guide Jonathan Kaye 3.3 06 Feb 2014 Updated Bluetooth SIG Qualification section Jonathan Kaye 3.4 18 Aug 2014 Updated shipping tray image and added module package dimension image. Jonathan Kaye 3.5 3 Sept 2014 Updated EU Declaration of Conformity for BTM441 / BTM443 Jonathan Kaye 3.6 18 Aug 2016 Changed from Hardware Integration Guide to Datasheet Sue White
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CONTENTS
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Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
1 PRODUCT DESCRIPTION
The BTM44x Bluetooth® modules from Laird Technologies have been designed to meet the needs of developers who wish to add robust, short range Bluetooth data connectivity to their products. They are based on the market leading Cambridge Silicon Radio BC04 chipset, providing exceptionally low power consumption with outstanding range. They support the latest Bluetooth® Version 2.1 Specification, providing the important advantage of Secure Simple Pairing, which improves security and enhances the ease of use for end customers. With physical sizes as small as 12.5 x 18.0mm and best of class, low-power operation, these modules are the ideal choice for applications where designers need both performance and minimum size. For maximum flexibility in systems integration, the modules are designed to support a separate power supply for I/O. To aid product development and integration, Laird Technologies has integrated a complete Bluetooth protocol stack within the modules, including support for multiple Bluetooth Profiles. The modules are fully qualified as Bluetooth End Products, allowing designers to integrate them within their own products with no further Bluetooth Qualification. They can then list and promote their products on the Bluetooth website free of charge. Support for Serial Port Profile (SPP), Human Interface Device (HID) profile and Health Device Profile (HDP) are included in the module. The support of the Bluetooth Sig’s Health Device Profile makes this the ideal module for development of Continua compliant medical and wellness devices. By default the Health Device Profile supports the ISO/IEEE 11073-10415 device specialization for weigh scales, but additional specializations for glucose and thermometer are available with more upon request. Communication is available to the module over a serial UART utilizing either a custom Multi-point Packet Protocol API or comprehensive AT commands. Combined with a low cost developer’s kit, this ensures that the choice of Laird Technologies modules guarantees the fastest route to market. Features and Benefits Bluetooth® v2.1+EDR Adaptive Frequency Hopping to cope with interference from other wireless devices Secure Simple Pairing support External or internal antenna options Comprehensive AT interface for simple programming Alternate Packet based interface for complex programming Bluetooth® END Product Qualified Compact size Class 2 output – 4dBm Low power operation UART interface
Applications
Embedded Devices Phone Devices Phone Accessories Security Devices Medical and Wellness Devices Automotive Applications Bluetooth® Profiles Supported Serial Port Profile (SPP) Human Interface Device (HID) Profile Host and device supported Health Device Profile (HDP): Agent supported IEEE Device Specialization 11073-10415 (Weight Scale) IEEE Device Specialization 11073 - 10408 (Thermometer) IEEE Device Specialization 11073 – 10417 (Glucose)
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2 HARDWARE SPECIFICATIONS
Table 1: Pin definitions Signal Description Voltage Specification
1 Unused
2 GND
3 UART_CTS Clear to Send I/P VUSB
4 UART_RXD Receive data I/P VUSB
5 UART_RTS Request to Send O/P VUSB
6 UART_TXD Transmit data O/P VUSB
7 GND
8 SPI_CSB SPI bus chip select I/P VIO
9 SPI_MISO SPI bus serial O/P VIO
10 SPI_MOSI SPI bus serial I/P VIO
11 SPI_CLK SPI bus clock I/P VIO
12 VDD_USB USB & UART supply voltage
13 VDD_IO I/O supply voltage
14 VDD_IN Main supply voltage
15 GND
16 PCM_IN PCM Data I/P VIO
17 PCM_SYNC PCM sync I/P VIO
18 PCM_CLK PCM clock I/P VIO
19 PCM_OUT PCM Data O/P VIO
20 RESET Module reset I/P See note 2
21 GPIO4 I/O for host- BT_Active BT_State VIO
22 GPIO2 / UART_DCD I/O for host VIO
23 GND
24 Unused
25 Unused See note 3
26 Unused See note 3
27 Unused See note 3
28 GND See note 3
29 ANT (BTM440 / 442 only) Antenna connection (50 ohm
matched) See note 3
30 GND See note 3
31 Unused See note 3
32 Unused See note 3
33 Unused See note 3
34 Unused See note 3
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Signal Description Voltage Specification
35 Unused See note 3
36 Unused See note 3
37 Unused See note 3
38 Unused
39 Unused
40 Unused
41 GND
42 GPIO1 / UART_RI I/O for host VIO
43 GPIO7 / UART_DTR I/O for host VIO
44 GPIO8 / UART_DSR I/O for host VIO
45 GND
46 D- Not used for AT module variants VUSB
47 D+ Not used for AT module variants VUSB
48 GPIO6 I/O for host- RF_Active VIO
49 GPIO5 I/O for host – WLAN_Active VIO
50 GPIO3 I/O for host – BT_Priority VIO
Notes: Unused pins may have internal connections and must not be connected. Reset input is active low. Input is pulled up to VDD_IN via 22k. Minimum reset pulse width is 5ms. Pins 25-37 should be left not connected on modules with integrated antenna (BTM441/3) Pins 8 – 11 (SPI related) are only for Laird internal production purposes.
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Physical Specifications Table 2: Physical Specifications Categories Feature Implementation Physical Dimensions 12.5mm x 18.0 x 3.4mm (BTM440 / 442) 12.5mm x 24.0mm x 3.4mm (BTM441/3) 12.5mm x 22.0 x 3.4mm (BTM441 / 443) Weight 3 grams Environmental Operating Temperature -40°C to +85°C Storage Temperature -40°C to +85°C Miscellaneous Lead free Lead-free and RoHS compliant Electrical Specifications Table 3: Electrical Specifications Categories Feature Implementation Wireless Specification Bluetooth® Version 2.1+EDR Transmit Class Class 2 Frequency 2.402 – 2.480 GHz Channels 79 channels Frequency Hopping Adaptive Frequency Hopping Max Transmit Power +4 dBm at antenna pad (BTM440/2) +4 dBmi from integrated antenna (BTM441/3) Min Transmit Power -27 dBm at antenna pad (BTM440/2) -27 dBmi from integrated antenna (BTM441/3) Receive Sensitivity -84 dBm Range 30 m Data Transfer Rate Up to 350 kbps Operational Specifications Table 4: Operational Specifiations Recommended Operating Conditions MIN MAX VDD_USB (USB compatibility not required) 1.7 3.6 VDD_USB (USB compatibility required) 3.1 3.6 VDD_IO 1.7 3.3 VDD_IN 3.0 3.3 Voltage Parameters Table 5: Voltage Parameters (VUSB) Logic Levels (VUSB) MIN TYP MAX INPUT VOLTAGE LEVELS Vih 0.7VDD_USB
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Logic Levels (VUSB) MIN TYP MAX Vil 2.7<VDD_USB<3.0 -0.4 +0.8 OUTPUT VOLTAGE LEVELS (1.7<VDD_USB<1.9) Voh (Iout = -4mA) VDD_USB – 0.4 Vol (Iout = 4mA) 0.4 OUTPUT VOLTAGE LEVELS (2.7<VDD_USB<3.0) Voh (Iout = -4mA) VDD_USB – 0.2 Vol (Iout = 4mA) 0.2 Note: VDD_USB must be connected to power the USB and UART interfaces. Table 6: Voltage Parameters (VIO) Logic Levels (VIO) MIN TYP MAX INPUT VOLTAGE LEVELS Vih 0.7VDD_IO Vil 2.7<VDD_IO<3.0 -0.4 +0.8 OUTPUT VOLTAGE LEVELS (1.7 < VDD_IO < 1.9) Voh (Iout = -4mA) VDD_IO – 0.4 Vol (Iout = 4mA) 0.4 OUTPUT VOLTAGE LEVELS (2.7 < VDD_IO < 3.0) Voh (Iout = -4mA) VDD_IO – 0.2 Vol (Iout = 4mA) 0.2
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 I/O Details Table 7: I/O Details Categories Feature Implementation Command Interface AT Instructions set Comprehensive control of connection and module operation S Registers for non-volatile storage of parameters UART Interface Baud Rate AT Mode Default Baud Rate: 9600 bps MP Mode Default Baud Rate: 115,200 bps Supply Voltage Supply 3.0V – 3.3V DC I/O 1.7V – 3.3V DC (independent of Supply) USB & UART 1.7V – 3.6V DC (independent of Supply) Coexistence / Compatibility WLAN (802.11) 2-wire and 3-wire hardware coexistence schemes supported Connections Interface Surface Mount Pads External Antenna (BTM440/2) Pad for 50 Ohm antenna Approvals Bluetooth Qualified as an END product FCC Limited Modular Approval (BTM440/2) Full Modular Approval (BTM441/3) Industry Canada (IC) Limited Modular Approval (BTM440/2) Full Modular Approval (BTM441/3) CE & R&TTE Meets CE and R&TTE requirements Miscellaneous Lead free Lead-free and RoHS compliant Warranty 1-Year Warranty Development Tools Development Kit Development board and software tools DVK-BTM440/2 Dev Kit with BTM440/2 module fitted DVK-BTM441/3 Dev Kit with BTM441/3 module fitted
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3 MECHANICAL CONSIDERATIONS
Mechanical Layout - BTM440/442 Mechanical Details Module Keep-Out Area:An area of 1.5mm around the module should be reserved as a keep-out area. No other components should be placed in this area. Note: Development Kit Schematics for this product can be accessed from the the BTM44x product page.
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Mechanical layout - BTM440/442 Mechanical Details Module Keep-Out Area:An area of 1.5mm around the module should be reserved as a keep-out area. No other components should be placed in this area. Note: Development Kit Schematics for this product can be accessed from the the BTM44x product page.
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Mechanical layout - BTM440/442 Mechanical Details WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to these test points, this will void the warranty. Laird does not recommend routing on the top layer underneath the module.
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Mechanical layout - BTM441/443 Mechanical Details Module Keep-Out Area:An area of 1.5mm around the module should be reserved as a keep-out area. No other components should be placed in this area. Note: Development Kit Schematics for this product can be accessed from the BTM44x product page.
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Mechanical layout - BTM441/443 Mechanical Details Module Keep-Out Area:An area of 1.5mm around the module should be reserved as a keep-out area. No other components should be placed in this area. Note: Development Kit Schematics for this product can be accessed from the following link: DVK Schematics – BTM44x
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Mechanical layout - BTM441/443 Mechanical Details
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Mechanical layout - BTM441/443 Mechanical Details WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to these test points, this will void the warranty. Laird does not recommend routing on the top layer underneath the module.
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
4 FCC REGULATORY STATEMENTS
FCC and Industry Canada Statements The OEM’s final equipment user manual must show the following statement: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
4.1.1 Considerations for OEM Integration
Changes or modifications not expressly approved by Laird Technologies could void the user’s authority to operate the equipment. Designers should note the distinction that the FCC makes regarding portable and mobile devices. Mobile devices are defined as products that are not used closer than 20cm to the human body, whereas portable devices can be used closer that 20cm to the body. A device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold for an uncontrolled environment ≤ 60/f(GHz) i.e. 25mW for a 2.4Ghz device. The Maximum Power Exposure for the BTM44x has been evaluated and found to comply with the low power threshold for an uncontrolled environment. Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment authorization policies for mobile and portable devices. The BTM44x comply with the FCC RF radiation exposure limits set forth for an uncontrolled environment. This device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. These procedures could require RF exposure evaluation to be re-evaluated on the complete product. The installer of this module into host equipment must ensure his equipment complies with the FCC RF Exposure requirements set forth in 47 CFR 2.1091 or 2.1093 The BTM44x comply with the RSS-102RF radiation exposure limits set forth for an uncontrolled environment. If this device and its antenna is co-located or operating in conjunction with any other antenna or transmitter RF exposure evaluation should be re-evaluated on the complete product by a qualified test house. The installer of this module into host equipment must ensure his equipment complies with the Industry Canada RSS-102 RF Exposure requirements. BTM440 / BTM442 These modules hold a limited modular approval. Approval with any other antenna configuration or layout other than that approved will necessitate additional radiated emission testing to be performed. The modules were approved with the following antenna: RF Solutions: ANT-24G-WHJ-SMA 0dBi
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4.1.3 FCC Labeling requirement
4.1.3.1 BTM440 / BTM442
If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: PI4410B” or “Contains FCC ID: PI4410B”. Any similar wording that expresses the same meaning may be used.
4.1.3.2 BTM441 / BTM443
If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: PI4411B” or “Contains FCC ID: PI4411B.” Any similar wording that expresses the same meaning may be used.
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5 DECLARATIONS OF COMPLIANCE
EU Declaration of Conformity – BTM440 / BTM442 Manufacturer: Laird Technologies Product: BTM440/2 EU Directive: RTTE 1995/5/EC Conformity Assessment: Annex IV
5.1.1 Reference standards used for presumption of conformity:
Article Number: Requirement Reference standard(s): 3.1a Health and Safety EN 60950-1:2006 3.1b Protection requirements with respect to electromagnetic Compatibility EN 301 489-1 V1.8.1 EN 301 489-17 2.1.1 Emissions: EN55022:2006/A1:2000/A2:2006(ClassB) Immunity: EN61000-4-2:1995/A1:1998/A2:2001 EN61000-4-3:2002/A1:2002
3.2 Means of the efficient use of
EN 300 328 V1.7.1 (2006-10)
5.1.2 Declaration:
We, Ezurio Ltd, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose. Place of Issue: Ezurio Ltd dba Laird Technologies Saturn House, Mercury Park Wooburn Green HP100HH, United Kingdom tel: +44 (0)1628 858 940 fax: +44 (0)1628 528 382 Date of Issue: October 2009 Name of Authorised Person: Andrew Dobbing, Engineering Manager Signature:
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 EU Declaration of Conformity – BTM441 / BTM443 Manufacturer: Laird Product: BTM410 / BTM411 / BTM420 / BTM421 / BTM430 / BTM431 / BTM441 / BTM443 / BTM461 EU Directive: RTTE 1995/5/EC Conformity Assessment: Annex IV
5.2.1 Reference Standards used for Presumption of Conformity
Article Number Requirement Reference standard(s) 3.1a Health and Safety EN 60950-1:2005 (2nd Ed); +Am1:2009 +Am2:2013 EN 60950- 1:2006+A11+a1:2010+A12:2011+A2:2013 3.1a RF Exposure EN 62479:2010 3.1b Protection requirements with respect to electromagnetic compatibility EN 301 489-1 V1.9.2 (2011-09) EN 301 489-17 V2.2.1 (2012-09) Emissions: EN55022:2010 /AC:2011 (ClassB) Immunity: EN61000-4-2:2009 EN61000-4-3:2006 /A1:2008 /A2:2010
3.2 Means of the efficient use
EN 300 328 V1.8.1 (2012-06)
5.2.2 Declaration:
We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose. Place of Issue: Laird 11160 Thompson Ave. Lenexa, KS 66219 Date of Issue: October 2009 Name of Authorized Person: Daniel Waters / Certifications Specialist Signature:
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
6 BLUETOOTH APPROVALS
This application note covers the procedure for generating a new Declaration ID for a Subsystem combination on the Bluetooth SIG website. In the instance of subsystems, a member can combine two or more subsystems to create a complete Bluetooth End Product solution. Subsystem listings referenced as an example: Design Name Owner Declaration ID Link to listing on the SIG website BTM44x Laird B016072 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=16072 Interface Express subsystem Cambridge Consultants Ltd B017578 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17578 Assumptions This procedure assumes that the member is simply combining two subsystems to create a new design, without any modification to the existing, qualified subsystems. This is achieved by using the Listing interface on the Bluetooth SIG website. Figure 1 shows the basic subsystem combination of a controller and host subsystem. The Controller provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP and any other specific protocols and profiles existing in the Host subsystem listing. The design may also include a Profile Subsystem. Figure 1: Basic subsystem combination of a controller and host subsystem The Qualification Process requires each company to registered as a member of the Bluetooth SIG – www.bluetooth.org The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/ For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID depend on your
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 membership status, please refer to the following webpage: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document: https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486 To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm In step 1, select Reference a Qualified Design and enter the Declaration IDs of each subsystem used in the End Product design. You can then select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a credit card, it will not be possible to proceed until the SIG invoice is paid. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document. Your new Design will be listed on the SIG website and you can print your Certificate and DoC. For further information please refer to the following training material: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates Additional Assistance Please contact your local sales representative or our support team for further assistance: Laird Technologies Connectivity Products Business Unit Support Centre: http://ews-support.lairdtech.com Email: wireless.support@lairdtech.com Phone: Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web: http://www.lairdtech.com/bluetooth
7 ORDERING INFORMATION
BTM440 Bluetooth MP Data Module (external antenna) BTM441 Bluetooth MP Data Module (with integrated antenna) BTM442 Bluetooth AT Data Module (external antenna) BTM443 Bluetooth AT Data Module (with integrated antenna) DVK – BTM440 Development board with BTM440 module soldered in place DVK – BTM442 Development board with BTM442 module soldered in place
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8 APPLICATION NOTE FOR SURFACE MOUNT MODULES
Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the User Manual. This Application Note is considered a living document and will be updated as new information is presented. The modules are designed to meet the needs of several commercial and industrial applications. The modules are designed to be easily manufactured and conform to current automated manufacturing processes. Shipping Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick and place machines. Layouts of the trays are provided in Figures 8 and 9. Figure 8: BTM44x Shipping Tray Details Reflow Parameters Laird Technologies surface mount modules are designed to be easily manufactured including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird Technologies’ surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Figure 10: Recommended Reflow Temperature Temperatures should not exceed the minimums or maximums presented in Table 21. Table 8: Recommended Maximum and minimum temperatures Recommended Max & Min's Specification Value Unit Temperature Inc./Dec. Rate (max) 3 °C / Sec Temperature Decrease rate (goal) 2-3 °C / Sec Soak Temp Increase rate (goal) .5 - 1 °C / Sec Flux Soak Period (Min) 60 Sec Flux Soak Period (Max) 90 Sec Flux Soak Temp (Min) 150 °C Flux Soak Temp (max) 190 °C Time Above Liquidous (max) 60 Sec Time Above Liquidous (min) 20 Sec Time In Target Reflow Range (goal) 30 Sec Time At Absolute Peak (max) 30 Sec Liquidous Temperature (SAC305) 217 °C Lower Target Reflow Temperature 225 °C Upper Target Reflow Temperature 250 °C Absolute Peak Temperature 260 °C IMPORTANT: During reflow, modules should not be above 260°C and not for more than 30 seconds.
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9 REFERENCES
[1] “Bluetooth Specification Version 2.1 + EDR [vol3]”, 26 July 2007 http://www.bluetooth.com/Bluetooth/Technology/Building/Specifications/ (click on “Core Specification v2.1 + EDR”) [2] “Serial Port Profile“ Specification http://www.bluetooth.com/Bluetooth/Technology/Works/SPP.htm (link at the bottom of page “Need more? View the Serial Port Profile (SPP)”) [3] “Bluetooth Assigned Numbers” http://www.bluetooth.com/Bluetooth/Technology/Building/Specifications/ select “Items per page: ALL”, go to end of page, there click on “Assigned Numbers – Baseband”, for a complete list of Profile UUIDs: click on “Assigned Numbers – Service Discovery” [4] Class of Device Generator: this link might be helpful for creating a particular CoD http://bluetooth-pentest.narod.ru/software/bluetooth_class_of_device-service_generator.html Caution: this tool allows selection of more than one minor device classes, so make sure that only one minor device class is select and verify the result with [3] anyway. [5] “Bluecore 4 External” Data Sheet, Cambridge Silicon Radio (CSR) http://www.csrsupport.com (log in or new account required) [6] “Winbond 681360 Codec Board User Guide”, Ezurio Application Note [7] “BTM44x AppNote: Getting Started” [8] “BTM44x AppNote: Firmware Upgrade” [9] “BTM44x AppNote: Throughput Analysis” [10] “BTM44x AppNote: Health Device Profile” [11] “BTM44x AppNote: Latency Optimization” [12] “BTM44x AppNote: RF Testing”
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
10 GLOSSARY OF TERMS
A2DP : Advanced Audio Distribution Profile ACL : Asynchronous Connection-Oriented Link ADC : Analogue to Digital Converter AGHFP : Audio Gateway Hands-Free Profile AT : Command prefix, ‘Attention’ AVRCP : Audio/Video Remote Control Profile BISM : Bluetooth Intelligent Serial Module CoD : Class Of Device (also referred to as “device class”) Codec : Device capable of encoding / decoding an analogue / digital signal DAC : Digital to Analogue Converter DSP : Digital Signal Processor DUN : Dial-Up Network Profile EIR : Extended Inquiry Response eSCO : Enhanced Synchronous Connection Oriented Link (used for Audio) FTP : File Transfer Profile GOEP : Generic Object Access Exchange Profile GPIO : General Purpose Input Output HF : Hands-free Role of Hands-free Profile (“Hands-free Unit”) HFG : Audio Gateway Role of Hands-free Profile (“Hands-free Gateway”) HFP : Hands Free Profile HID : Human Interface Device Profile HS : Headset Role of Headset Profile (“Headset”) HSG : Audio Gateway Role of Headset Profile (“Headset Gateway”) HSP : Headset Profile I/O (IO) : Input/Output Mic : Microphone MITM : Man In The Middle OPP : Object Push Profile PBAP : Phone Book Access Profile PT : PASS THROUGH Command PWM : Pulse Width Modulation SBC : Sub Band Codec SCO : Synchronous Connection Oriented Link (used for Audio) SLC : Service Level Connection SPP : Serial Port Profile SSO : Serial Stream Oriented SSP : Secure Simple Pairing SUI : SUBUNIT INFO Command Sxxx : S-Register No. xxx TDL : Trusted Device List UART : Universal Asynchronous Receiver / Transmitter UI : UNIT INFO Command
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/wireless © Copyright 2015 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
11 RELATED DOCUMENTS AND FILES
The following additional BTM44x technical documents are also available from the Laird BTM44x product page under the Documentation tab: Product Brief User Manual Firmware Release Notes Development Kit Schematics Application Notes Getting Started Firmware Upgrade Throughput Analysis Health Device Profile Latency Optimization RF Testing