500-0110 LSTD | Alldatasheet
Document overview
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Technical content
global solutions: local support TM Innovative Technology for a Connected World Tflex TM
500 Series
CoMplianT 2.8 W/mK TherMally ConduCTive Gap Filler Tflex™ 500 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts. Tflex™ 500’s unique silicone and filler combination has extremely low silicone extractables compared to many other silicone interface products. Tflex™ 500 meets NASA outgassing specification. Tflex™ 500 is naturally tacky, no adhesive coating is required. Tflex™ 500 is electrically insulating, stable from -50ºC to 200ºC and is certified to UL 94V0 flammability rating. FeaTureS and BeneFiTS
- Thermal conductivity 2.8 W/mK
- Highly compliant and cost effective
- Low thermal resistance even at low pressure
- Available in thicknesses from 0.020-inch (0.25mm) through 0.200-inch (5.0mm) in 0.010-inch increments
- Naturally tacky for easy assembly
- Low silicone extractables
appliCaTionS
- Cooling components to chassis
- Telecommunication hardware
- Thermal module for notebook computer
- LED solid state lighting
- Power electronics
- Computer servers
- Graphics cards
- Gaming systems
- LCD and PDP flat panel displays
- Industrial automation equipment
- Wireless infrastructure
- Fragile ASIC components
- Automotive engine control
- IT devices
- Military electronics Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice@lairdtech.com www.lairdtech.com/thermal
Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies domestic terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request.damages of any kind. All Laird Technologies’ products are sold pursuant to the Laird Technologies’ domestic terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request. Document A15958-00 Rev B, 11/2009. © 2010 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc. STandard ThiCKneSSeS opTionS Proprietary DC1 option available to eliminate tack from top side to aid in handling. MaTerial naMe and ThiCKneSS Tflex™ indicates Laird Technologies’ brand thermally conductive elastomeric gap filler product. 5xxx indicates ‘500 series’ 2.8 W/mK material, and xxx indicates thickness in -mil (0.001-inches); -DC1 designates proprietary tack eliminating option Examples: Tflex™ 5120 = 0.120-inch thick material Tflex™ 5120-DC1 = 0.0120-inch thick material with proprietary DC1 option TflexTM 500 Preliminary TEST METHOD Construction Filled silicone elastomer NA Color Light Blue Visual Thermal Conductivity 2.8 W/mK ASTM D5470 Hardness (Shore 00) 40 (at 3 second delay) ASTM D2240 Density 3.0 g/cc Helium Pycnometer Standard Thickness Range 0.020" - 0.200" (0.5 - 5.1mm) Thickness Tolerance ±10% UL Flammability Rating 94 V0 UL Temperature Range -50ºC to 200ºC NA Volume Resistivity 10^13 ohm-cm ASTM D257 Outgassing TML 0.29% ASTM E595 Outgassing CVCM 0.04% ASTM E595 Coefficient Thermal Expansion (CTE) 37.4 ppm/ºC 70ºC-130ºC IPC-TM-650 2.4.24 TflexTM 500 TypiCal properTieS Thermal Gap Filler Preliminary 0.0 0.5 1.0 1.5 2.0 0 10 20 30 40 50 60 70 80 Thermal Resistance (°C-in2/W) Pressure (psi, 1 psi = 6.9 KPa) Tflex 500 Thermal Resistance verse Pressure 5200 5160 5120 5100 580 560 540 520 5200 5160 5120 5100 580 560 540 520 10% 20% 30% 40% 50% 60% 70% 80% 0 10 20 30 40 50 60 70 80 90 100 1 10 % Deflection Pressure (psi, 1 psi = 6.9 KPa) Tflex 500 Defection verse Pressure (ASTM D575)