BTC2030A3 CYSTEKEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 9

Technical content

Features

  • High breakdown voltage, BVCEO≥ 200V
  • Large continuous collector current capability
  • Low collector saturation voltage
  • Pb-free package Symbol Outline Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage V CBO 280 V Collector-Emitter V oltage V CEO 200 V Emitter-Base V oltage V EBO 6 V Collector Current I C 1 A Base Current I B 0.5 A Power Dissipation Pd 900 mW Junction Temperature Tj 150 °C Storage Temperature Tstg -55~+150 °C BTC2030A3 TO-92 B:Base C:Collector E:Emitter E C B

CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 2/9 BTC2030A3 CYStek Product Specification Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 280 - - V I C=10µA BVCEO 200 - - V I C=10mA BVEBO 6 - - V I E=10µA ICBO - - 100 nA V CB=250V IEBO - - 100 nA V EB=6V *VCE(sat) - 0.2 0.5 V I C=500mA, IB=50mA *VCE(sat) - - 1 V I C=1A, IB=50mA *VBE(sat) - - 0.9 V I C=500mA, IB=50mA *VBE(on) 0.45 - 0.75 V V CE=5V , IC=5mA *hFE 1 100 - - - V CE=5V , IC=50mA *hFE 2 100 - 320 - V CE=5V , IC=200mA *hFE 3 50 - - - V CE=5V , IC=1A fT 20 100 - MHz V CE=5V , IC=200mA Cob - - 20 pF V CB=10V , IE=0A,f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% Classification Of hFE 2 Rank O Y Range 100~200 160~320

Ordering Information

Device Package Shipping Marking BTC2030A3 TO-92 (Pb-free) 2000 pcs / Tape & Box C2030

CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 3/9 BTC2030A3 CYStek Product Specification Characteristic Curves Current Gain vs Collector Current 100 1000 1 10 100 1000 10000 Collector Current---IC(mA) Current Gain---HFE VCE=1V VCE=2V VCE=5V Saturation Voltage vs Collector Current 100 1000 1 10 100 1000 10000 Collector Current---IC(mA) Saturation Voltage---(mV) VCESAT IC=10IB IC=20IB IC=30IB IC=50IB Saturation Voltage vs Collector Current 100 1000 10000 1 10 100 1000 10000 Collector Current---IC(mA) Saturation Voltage---(V) VBESAT@IC=10IB Power Derating Curve 0.3 0.6 0.9 1.2 1.5 1.8 0 25 50 75 100 125 150 175 200 Ambient Temperature---TA(℃) Power Dissipation---PD(W)

CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 4/9 BTC2030A3 CYStek Product Specification Characteristic Curves(Cont.) Output Characteristics 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0123456 Collector-to-Emitter Voltage---VCE(V) Collector Current---IC(A) IB=0 IB=1mA IB=2mA IB=3mA IB=10mA IB=5mA IB=8m A Output Characteristics 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0123456 Collector-to-Emitter Voltage---VCE(V) Collector Current---IC(A) IB=0 IB=500uA IB=1mA IB=1.5m IB=2mA IB=10mA IB=2.5mA IB=3mA IB=4mA IB=6mA Output Capacitance vs Reverse Biased Voltage 100 11 0 1 0 0 Reverse Biased Voltage---VCB(V) Output Capacitance---Cob(pF) Safe Operating Area 0.001 0.01 0.1 1 10 100 1000 Forward Voltage---VCE(V) Forward Current---IC(A) PT=1s PT=10ms PT=1ms PT=100ms

CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 5/9 BTC2030A3 CYStek Product Specification Product Designation

CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 6/9 BTC2030A3 CYStek Product Specification Recommended IR reflow profile

CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 7/9 BTC2030A3 CYStek Product Specification Recommended temperature profile for wave soldering Recommendation: 1. Preheat temperature at solder side must be between 100 and 130 ℃ for 80 to 100 seconds. 2. Temperature ramp-up rate : 1~2 ℃/s 3. The temperature gradient between preheat and wave soldering must be smaller than +160℃. 4. Terminations must go through the wave simultaneously. 5. Travel through the wave from 255 to 260℃ for 2.5 to 3.5 seconds 6. Temperature ramp-down rate : 2~3 ℃/s

CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 8/9 BTC2030A3 CYStek Product Specification TO-92 Taping Outline Millimeters DIM Item Min. Max. A Component body height 4.33 4.83 D Tape Feed Diameter 3.80 4.20 D1 Lead Diameter 0.36 0.53 D2 Component Body Diameter 4.33 4.83 E 1.5 2.0 F1,F2 Component Lead Pitch 2.40 2.90 F1,F2 F1-F2 - ±0.3 H Height Of Seating Plane 15.50 16.50 H1 Feed Hole Location 8.50 9.50 H2 Front To Rear Deflection - 1 H2A Deflection Left Or Right - 1 H3 Component Height - 27 H4 Feed Hole To Bottom Of Component - 21 L Lead Length After Component Removal - 11 L1 Lead Wire Enclosure 2.50 - P Feed Hole Pitch 12.50 12.90 P1 Center Of Seating Plane Location 5.95 6.75 P2 4 Feed Hole Pitch 50.30 51.30 T Over All Tape Thickness - 0.55 T1 Total Taped Package Thickness - 1.42 T2 Carrier Tape Thickness 0.36 0.68 W Tape Width 17.50 19.00 W1 Adhesive Tape Width 5.00 7.00 - 20 pcs Pitch 253 255

CYStech Electronics Corp. Spec. No. : C316 Issued Date : 2005.12.21 Revised Date : 2006.04.03 Page No. : 9/9 BTC2030A3 CYStek Product Specification TO-92 Dimension *: Typical D 0.0142 0.0220 0.36 0.56 α 1 - *5° - *5° F 0.1323 0.1480 3.36 3.76 α 3 - *2° - *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: 42 Alloy ; solder plating
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Marking: A D B C I α 1 E F α 2 α 3 GH Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3 C2030 □ Product Name Date Code: Year+Month Year: 4→2004, 5→2005 HFE Rank