BSP372 SIEMENS | Alldatasheet

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Semiconductor Group 1 Sep-12-1996 BSP 372 SIPMOS ® Small-Signal Transistor

  • N channel
  • Enhancement mode
  • Logic Level
  • Avalanche rated Pin 1 Pin 2 Pin 3 Pin 4 G D S D Type VDS ID R DS(on) Package Marking BSP 372 100 V 1.7 A 0.31 Ω SOT-223 BSP 372 Type Ordering Code Tape and Reel Information BSP 372 Q 67000-S300 E6327 Maximum Ratings Parameter Symbol Values Unit Continuous drain current TA = 28 °C ID 1.7 A DC drain current, pulsed TA = 25 °C IDpuls 6.8 Avalanche energy, single pulse ID = 1.7 A, VDD = 25 V, R GS = 25 Ω L = 23.3 mH, Tj = 25 °C EAS mJ Gate source voltage VGS ± 14 V Gate-source peak voltage,aperiodic Vgs ± 20 Power dissipation TA = 25 °C Ptot 1.8 W

Semiconductor Group 2 Sep-12-1996 BSP 372 Maximum Ratings Parameter Symbol Values Unit Chip or operating temperature Tj -55 ... + 150°C Storage temperature Tstg -55 ... + 150 Thermal resistance, chip to ambient air R thJA ≤ 70 K/W Therminal resistance, junction-soldering point 1) R thJS ≤ 10 DIN humidity category, DIN 40 040 E IEC climatic category, DIN IEC 68-1 55 / 150 / 56 1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain- source breakdown voltage VGS = 0 V, ID = 0.25 mA, Tj = 0 °C V(BR)DSS 100 - - V Gate threshold voltage VGS =VDS, ID = 1 mA VGS(th) 0.8 1.4 2 Zero gate voltage drain current VDS = 100 V, VGS = 0 V, Tj = 25 °C VDS = 100 V, VGS = 0 V, Tj = 125 °C IDSS 0.1 100 µA Gate-source leakage current VGS = 20 V, VDS = 0 V IGSS - 10 100 nA Drain-Source on-state resistance VGS = 5 V, ID = 1.7 A R DS(on) - 0.17 0.31 Ω

Semiconductor Group 3 Sep-12-1996 BSP 372 Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Dynamic Characteristics Transconductance VDS ≥ 2 * ID * RDS(on)max, ID = 1.7 A gfs 2 4- S Input capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz C iss - 470 625 pF Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz C oss - 125 190 Reverse transfer capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz C rss - 70 105 Turn-on delay time VDD = 30 V, VGS = 5 V, ID = 0.3 A R GS = 50 Ω td(on) - 12 18 ns Rise time VDD = 30 V, VGS = 5 V, ID = 0.3 A R GS = 50 Ω tr - 40 60 Turn-off delay time VDD = 30 V, VGS = 5 V, ID = 0.3 A R GS = 50 Ω td(off) - 140 190 Fall time VDD = 30 V, VGS = 5 V, ID = 0.3 A R GS = 50 Ω tf - 65 90

Semiconductor Group 4 Sep-12-1996 BSP 372 Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Reverse Diode Inverse diode continuous forward current TA = 25 °C IS - - 1.7 A Inverse diode direct current,pulsed TA = 25 °C ISM - - 6.8 Inverse diode forward voltage VGS = 0 V, IF = 1.7 A, Tj = 25 °C VSD - 0.8 1.1 V Reverse recovery time VR = 30 V, IF=lS, diF/dt = 100 A/µs trr - - - ns Reverse recovery charge VR = 30 V, IF=lS, diF/dt = 100 A/µs Q rr - - - µC

Semiconductor Group 5 Sep-12-1996 BSP 372 Power dissipation Ptot = ƒ(TA) 0 20 40 60 80 100 120 °C 160 TA 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 W 2.0 Ptot Drain current ID = ƒ(TA) parameter: VGS ≥ 5 V 0 20 40 60 80 100 120 °C 160 TA 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 A 1.8 ID Safe operating area ID =f(VDS ) parameter : D = 0, TC =25°C Transient thermal impedance Zth JA = ƒ(tp) parameter: D = tp / T -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 K/W ZthJC 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 s tp single pulse 0.01 0.02 0.05 0.10 0.20 D = 0.50

Semiconductor Group 6 Sep-12-1996 BSP 372 Typ. output characteristics ID = ƒ(VDS ) parameter: tp = 80 µs , Tj = 25 °C VDS 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 A 3.8 ID VGS [V] a a 2.0 b b 2.5 c c 3.0 d d 3.5 e e 4.0 f f 4.5 g g 5.0 h h 6.0 i i 7.0 j j 8.0 k k 9.0 l P tot = 2W l 10.0 Typ. drain-source on-resistance R DS (on) = ƒ(ID ) parameter: tp = 80 µs, Tj = 25 °C ID 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Ω 1.0 R DS (on) VGS [V] = a 2.0 VGS [V] = a a 2.5 b b 3.0 c c 3.5 d d 4.0 e e 4.5 f f 5.0 g g 6.0 h h 7.0 i i 8.0 j j 9.0 k k 10.0 Typ. transfer characteristics ID = f(VGS ) parameter: tp = 80 µs 0 1 2 3 4 5 6 7 8 V 10 V GS 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 A 6.5 ID Typ. forward transconductance gfs = f (ID ) parameter: tp = 80 µs, ID 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 S 6.5 gfs

7 Sep-12-1996Semiconductor Group

Drain-source on-resistance R DS (on) = ƒ(Tj) parameter: ID = 1.7 A, VGS = 5 V -60 -20 20 60 100 °C 160 Tj 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 Ω 0.75 R DS (on) typ 98% Gate threshold voltage VGS (th) = ƒ(Tj) parameter: VGS = VDS , ID = 1 mA 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 V 4.6 V GS(th) -60 -20 20 60 100 °C 160 Tj typ 98% Typ. capacitances C = f (VDS ) parameter:VGS =0V, f = 1 MHz 0 5 10 15 20 25 30 V 40 V DS -2 10 -1 10 0 10 1 10 nF C C rss C oss C iss Forward characteristics of reverse diode IF = ƒ(VSD ) parameter: Tj, tp = 80 µs -2 10 -1 10 0 10 1 10 A IF VSD Tj = 25 °C typ Tj = 25 °C (98%) Tj = 150 °C typ Tj = 150 °C (98%)

Semiconductor Group 8 Sep-12-1996 BSP 372 Avalanche energy EAS = ƒ(Tj) parameter: ID = 1.7 A, VDD = 25 V R GS = 25 Ω , L = 23.3 mH 20 40 60 80 100 120 °C 160 Tj mJ E AS Drain-source breakdown voltage V(BR)DSS = ƒ(Tj) -60 -20 20 60 100 °C 160 Tj 100 102 104 106 108 110 112 114 116 V 120 V (BR)DSS Safe operating area ID =f(VDS ) parameter : D = 0.01, TC =25°C

Semiconductor Group 9 Sep-12-1996 BSP 372 Package outlines SOT-223 Dimensions in mm