BSP149

BSP149_05 INFINEON | Alldatasheet

Document overview

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Technical content

Features

• N-channel
• Depletion mode
• dv /dt rated
• Available with V GS(th) indicator on reel
• Pb-free lead plating; RoHS compliant Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Unit Continuous drain current I D T A=25 °C 0.66 A T A=70 °C 0.53 Pulsed drain current I D,pulse T A=25 °C 2.6 Reverse diode dv /dt dv /dt I D=0.66 A, V DS=160 V, di /dt =200 A/µs, T j,max=150 °C 6 kV/µs Gate source voltage V GS ±20 V ESD sensitivity (HBM) as per MIL-STD 883 Class 1 Power dissipation P tot T A=25 °C 1.8 W Operating and storage temperature T j, T stg -55 ... 150 °C IEC climatic category; DIN IEC 68-1 55/150/56 1) see table on next page and diagram 11 Value V DS 200 V R DS(on),max 3.5 Ω I DSS,min 0.14 A Product Summary PG-SOT-223 Type Package Tape and Reel Information Marking BSP149 PG-SOT-223 L6327: 1000 pcs/reel BSP149 BSP149 PG-SOT-223 L6906: 1000 pcs/reel sorted in V GS(th) bands1) BSP149 Rev. 1.2 page 1 2005-11-28

Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - soldering point (pin 4) R thJS - - 25 K/W SMD version, device on PCB R thJA minimal footprint - - 115 6 cm2 cooling area1) -- 7 0 Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=-3 V, I D=250 µA 200 - - V Gate threshold voltage V GS(th) V DS=3 V, I D=400 µA -2.1 -1.4 -1 Drain-source cutoff current I D(off) V DS=200 V, V GS=-3 V, T j=25 °C - - 0.1 µA V DS=200 V, V GS=-3 V, T j=125 °C --5 Gate-source leakage current I GSS V GS=20 V, V DS=0 V - - 10 nA On-state drain current I DSS V GS=0 V, V DS=10 V 140 - - mA Drain-source on-state resistance R DS(on) V GS=0 V, I D=70 mA - 1.7 3.5 Ω V GS=10 V, I D=660 mA - 1.0 1.8 Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=0.48 A 0.4 0.8 - S Threshold voltage V GS(th) sorted in bands3) J V GS(th) V DS=3 V, I D=108 µA -1.2 - -1 V K -1.35 - -1.15 L -1.5 - -1.3 M -1.65 - -1.45 N -1.8 - -1.6 drain connection. PCB is vertical in still air. 3) Each reel contains transistors out of one band whose identifying letter is printed on the reel label. A specific band cannot be ordered separately. Values 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (single layer, 70 µm thick) copper area for Rev. 1.2 page 2 2005-11-28

Parameter Symbol Conditions Unit min. typ. max. Dynamic characteristics Input capacitance C iss - 326 430 pF Output capacitance C oss -4 1 5 5 Reverse transfer capacitance Crss -1 7 2 5 Turn-on delay time t d(on) - 5.1 7.7 ns Rise time t r - 3.4 5.1 Turn-off delay time t d(off) -4 5 6 8 Fall time t f -2 1 3 1 Gate Charge Characteristics Gate to source charge Q gs - 0.74 1.0 nC Gate to drain charge Q gd - 5.6 8.4 Gate charge total Q g -1 1 1 4 Gate plateau voltage V plateau - 0.16 - V Reverse Diode Diode continous forward current I S - - 0.66 A Diode pulse current I S,pulse - - 2.6 Diode forward voltage V SD V GS=-3 V, I F=0.66 A, T j=25 °C - 0.9 1.2 V Reverse recovery time t rr -4 2 6 5 n s Reverse recovery charge Q rr -6 0 9 0 n C V R=100 V, I F=0.5 A, di F/dt =100 A/µs T A=25 °C Values V GS=-3 V, V DS=25 V, f =1 MHz V DD=100 V, V GS=-2…7 V, I D=0.50 A, R G=6 Ω V DD=160 V, I D=0.05 A, V GS=-3 to 5 V Rev. 1.2 page 3 2005-11-28

1 Power dissipation 2 Drain current

P tot=f(T A) I D=f(T A); V GS≥10 V 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T A=25 °C; D =0 Z thJA=f(t p) parameter: t p parameter: D =t p/T 10 µs 100 µs 1 ms 10 ms DC 103102101100 101 100 10-1 10-2 10-3 V DS [V] I D [A] limited by on-state resistance single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10210110010-110-210-310-4 102 101 100 t p [s] Z thJA [K/W] 0.5 1.5 0 40 80 120 160 T A [°C] P tot [W] 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 40 80 120 160 T A [°C] I D [A] Rev. 1.2 page 4 2005-11-28

5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C -0.2 V -0.1 V 0 V 0.1 V 0.2 V 0.5 V 1 V 10 V 0 0.2 0.4 0.6 0.8 1 I D [A] R DS(on) [Ω ] 0.4 0.8 1.2 1.6 -2 -1 0 1 2 3 V GS [V] I D [A] 0.2 0.4 0.6 0.8 1.2 I D [A] g fs [S] V 0.2- V 0.1- V 0 V 0.1 V 0.2 V 0.5 V 1V 10 0.2 0.4 0.6 0.8 02468 1 0 V DS [V] I D [A] Rev. 1.2 page 5 2005-11-28

9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=0.07 A; V GS=0 V V GS(th)=f(T j); V DS=3 V; I D=400 µA parameter: I D 11 Threshold voltage bands 12 Typ. capacitances I D=f(V GS); V DS=3 V; T j=25 °C C =f(V DS); V GS=-3 V; f =1 MHz 400 µA JKLMN 0.01 0.1 -2 -1.5 -1 -0.5 V GS [V] I D [mA] typ %98 -60 -20 20 60 100 140 180 T j [°C] R DS(on) [Ω ] typ %98 -2.5 -1.5 -0.5 -60 -20 20 60 100 140 180 T j [°C] V GS(th) [V] Ciss Coss Crss 100 1000 01 0 2 0 3 0 V DS [V] C [pF] Rev. 1.2 page 6 2005-11-28

13 Forward characteristics of reverse diode 15 Typ. gate charge I F=f(V SD) V GS=f(Q gate); I D=0.5 A pulsed parameter: T j parameter: V DD

16 Drain-source breakdown voltage

V BR(DSS)=f(T j); I D=250 µA 160 200 240 -60 -20 20 60 100 140 180 T j [°C] V BR(DSS) [V]

0.2 VDS(max)

0.5 VDS(max)

0.8 VDS(max)

Q gate [nC] V GS [V] 25 °C150 °C 25 °C, 98% 0.12 A 0.01 0.1 0 0.5 1 1.5 2 V SD [V] I F [A] 150 °C, 98% 25 °C, 98% Rev. 1.2 page 7 2005-11-28

Package Outline: Footprint: Packaging: Dimensions in mm Rev. 1.2 page 8 2005-11-28

St.-Martin-Straße 53 D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies office in Germany or our Infineon Technologies representatives worldwide (see address list). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.2 page 9 2005-11-28