BM1117D-2.5

BM1117 BOOKLY | Alldatasheet

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BOOKLY MICRO ELECTRONIC LIMITED CORP. GENERAL DESCRIPTION The BM1117 series of adjustable and fixed voltage regulators are designed to provide 1A output current and to operate down to 1V input-to-output differential. The dropout voltage of the device is guaranteed maximum 1.3V at maximu m output current, decreasing at lower load currents. On-chip trimming adjusts the reference voltage to within 1% accuray. Current limit is also trimmed, minimizing the stress under overload conditions on both the regulator and power source circuitry. The BM1117 devices are pin compatible with other three-terminal SCSI regulators and are offered in the low profile surface mount SOT-223 package and in the TO252-2 small plastic package. F E A T U R E S A P P L I C A T I O N S Three Terminal Adjustable or Fixed Voltages* High Efficiency Linear Regulators Output Current of 1A  5V to 3.3V Linear Regulator Up to +18V input max.  Power Management for Notebook Line Regulation: 0.2% Max.  Battery Chargers Load Regulation: 0.4% Max.  Battery Powered Instrumentation SOT-223 and TO-252-2 package ava  Active SCSI Terminators

ORDERING INFORMATION

BM1117D-ADJ BM1117-ADJ 0 to 125° C BM1117D-1.5 BM1117-1.5 0 to 125° C BM1117D-1.8 BM1117-1.8 0 to 125° C BM1117D-2.5 BM1117-2.5 0 to 125° C BM1117D-2.85 BM1117-2.85 0 to 125° C BM1117D-3.3 BM1117-3.3 0 to 125° C BM1117D--5.0 BM1117-5.0 0 to 125° C *For additional available fixed voltages contact factory. PIN DESCRIPTIONS FIXED VERSION 1- Ground 2- V OUT 3- VIN ADJUSTABLE VERSION 1- Adjust 2- V OUT 3- VIN SOT-223 Top View 123 TO-252-2 FRONT VIEW

S P E C I F I C A T I O N B M 1 1 1 7 BOOKLY MICRO ELECTRONICS LIMITED CORP. ABSOLUT MAXIMUM RATINGS(Note 1) Power Dissipation Input Voltage Operating Junction Temperature Control Section Power Transistor Storage temperature Internally limited 20V 0°C to 125°CS 0°C to 150°C - 65°C to +150°C Soldering information Lead Temperature (10 sec) 300°C Thermal Resistance TO-252 package φ JA= 60°C/W SOT-223 package φ JA= 90°C/W* * With package soldering to copper area over backside ground plane or internal power plane φJA can vary from 46°C/W to >90°C/W depending on mounting technique and the size of the copper area.

ELECTRICAL CHARACTERISTICS

Electrical Characteristics at IOUT = 0 mA, and TJ = +25°C unless otherwise specified. Parameter Device Conditions Min Typ Max Units Reference Voltage (Note 2) BM1117 I OUT = 10 mA 10mA ≤IOUT ≤1A, 1.5V≤ (VIN - VOUT) ≤12V 1.238 1.225 1.250 1.250 1.262 1.270 V V Output Voltage (Note 2) BM1117-1.5 0≤I OUT ≤1A ,3.0V≤VIN ≤12V 1.485 1.476 1.500 1.500 1.515 1.524 V V BM1117-1.8 0 ≤IOUT ≤1A , 3.3V≤VIN ≤12V 1.782 1.773 1.800 1.800 1.818 1.827 V V BM1117-2.5 0 ≤IOUT≤1A ,4.0V≤VIN ≤12V 2.475 2.460 2.500 2.500 2.525 2.560 V V BM1117-2.85 0 ≤IOUT ≤1A ,4.35V≤VIN ≤12V 2.82 2.79 2.850 2.850 2.88 2.91 V V BM1117-3.3 0 ≤IOUT ≤1A ,4.75V ≤VIN ≤12V 3.267 3.235 3.300 3.300 3.333 3.365 V V BM1117-5.0 0 ≤IOUT ≤1A , 6.5V ≤VIN ≤12V 4.950 4.900 5.000 5.000 5.050 5.100 V V Line Regulation BM1117 IOUT = 10 mA , 1.5V≤ (VIN - VOUT) ≤12V 0.015 0.035 0.2 0.2 BM1117-1.5 3.0V≤VIN ≤12V 0.3 0.6 mV mV BM1117-1.8 3.3V≤VIN ≤12V 0.3 0.6 mV mV BM1117-2.5 4.0V≤VIN ≤12V 0.3 0.6 mV mV BM1117-2.85 4.35V≤VIN ≤12V 0.3 0.6 mV mV BM1117-3.3 4.75V≤VIN ≤12V 0.5 1.0 mV mV BM1117-5.0 6.5V≤VIN ≤12V 0.5 1.0 mV mV

S P E C I F I C A T I O N B M 1 1 1 7 BOOKLY MICRO ELECTRONICS LIMITED CORP. Parameter Device Conditions Min Typ Max Units Load Regulation (Notes 2, 3) BM1117 (VIN - VOUT) =3V, 10mA≤IOUT ≤1A 0.1 0.2 0.3 0.4 BM1117-1.5 VIN=5V, 0≤IOUT ≤1A mV mV BM1117-1.8 VIN=5V, 0≤IOUT≤1A mV mV BM1117-2.5 VIN=5V, 0≤IOUT ≤1A mV mV BM1117-2.85 VIN=5V, 0 ≤IOUT≤1A mV mV BM1117-3.3 VIN=5V, 0 ≤IOUT≤1A mV mV BM1117-5.0 VIN=8V, 0≤IOUT ≤1A mV mV Dropout Voltage IN - VOUT) BM1117 85/-3.3/-5.0 OUT , ∆VREF = 1%, IOUT = 1A (Note 4) 1.0 1.3 V Current Limit BM1117 85/-3.3/-5.0 IN - VOUT) = 5V 900 1,100 1,500 mA Minimum Load Current BM1117 (V IN - VOUT) = 12V (Note 5) 5 10 mA Quiescent Current BM1117 85/-3.3/-5.0 V IN ≤12V 5 10 mA Ripple Rejection BM1117 f =120Hz , COUT = 22µF Tantalum, IOUT = 1A, (VIN-VOUT ) = 3V, CADJ =10µF 60 75 dB BM1117-1.5/-1.8/ -2.5/- 2.85 f =120Hz , COUT = 22µF Tantalum, IOUT = 1A, VIN = 6V 60 72 dB BM1117-3.3 f =120Hz , COUT = 22µF Tantalum, IOUT= 1A, VIN = 6.3V 60 72 dB BM1117-5.0 f =120Hz , COUT = 22µF Tantalum, IOUT = 1A, VIN = 8V 60 68 dB Thermal Regulation BM1117 TA = 25°C, 30ms pulse 0.008 0.04 %W Adjust Pin Current BM1117 10mA ≤IOUT ≤1A, 1.5V≤ (VIN - VOUT) ≤12V 120 µA µA Adjust Pin Current Change BM1117 10mA ≤I OUT ≤1A, 1.5V≤ (VIN- VOUT) ≤12V 0.2 5 µA Temperature Stability 0.5 %

S P E C I F I C A T I O N B M 1 1 1 7 BOOKLY MICRO ELECTRONICS LIMITED CORP. Parameter Device Conditions Min Typ Max Units Long Term Stability TA =125°C, 1000Hrs 0.3 1 % RMS Output Noise (% of VOUT ) TA=25°C, 10Hz ≤f ≤10kHz 0.003 % Thermal Resistance Junction-to-Case 15 °C/W Parameters identified with boldface type apply over the full operating temperature range. Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Note 2: Line and Load regulation are guaranteed up to t he maximum power dissipation of 1.2 W. Power dissipation is determined by the input/output differ ential and the output curren t. Guaranteed maximum power dissipation will not be available over the full input/output range. Note 3: See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction temperature by low duty cycle pulse testing. Load regulation is measured at the output lead ~1/8” from the package. Note 4: Dropout voltage is specified over the full output current range of the device. Note 5: Minimum load current is defined as the minimum output current required to maintain regulation. When 1.5V≤ (VIN - VOUT) ≤12V the device is guaranteed to regulate if the output current is greater than 10mA. APPLICATION HINTS The BM1117 series of adjustable and fixed regulators are easy to use and are protected against short circuit and thermal overloads. Thermal prot ection circuitry will s hut-down the regulator should the junction temperature exceed 165°C at the sense point. Pin compatible with older three terminal adj ustable regulators, these devices offer the advantage of a lower dropout voltage, more precise reference tolerance and improved reference stability with temperature. Stability The circuit design used in the BM1117 series requires the use of an output capacitor as frequenc y compensation. The addition of 22µF solid tantalum or 150uF aluminum on the output will ensure stability for all operating conditions. When adjustment terminal is bypassed with a capacitor to improve ripple rejection, the requirement for output capacitor increase. The value of 22µF tantalum or 150uF aluminum covers all cases of bypassing the adjustment terminal. Without bypassing the adjustment terminal smaller capacitors can be used with equally good results. To ensure good transient response with heavy load current changes capacitor values on the order of 100mF are used in the output of many r egulators. To further improve stability and transient response of these devices lar ger values of output capacitor can be used. Protection Diodes Unlike older regulators, the BM1117 family does not need any protection diodes between the ad justment pin and the output and from the output to the input to prevent over-stressing the die. Internal resistors are limiting the internal

S P E C I F I C A T I O N B M 1 1 1 7 BOOKLY MICRO ELECTRONICS LIMITED CORP. SOT223 Table 1. COPPER AREA TOP SIDE* BACK SIDE BOARD AREA THERMAL RESISTANCE (JUNCTION-TO-AMBIENT) 2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W 1000 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W 225 Sq. mm 2500 Sq. mm 2500 Sq. mm 53°C/W 100 Sq. mm 2500 Sq. mm 2500 Sq. mm 59°C/W 1000 Sq. mm 1000 Sq. mm 1000 Sq. mm 52°C/W 1000 Sq. mm 0 1000 Sq. mm 55°C/W Connected as shown above , RP is not multiplied by the divider ratio In the case of fixed voltage devices the top of R1 is connected Kelvin internally, and the ground pin can be used for negative side sensing. Thermal Considerations The BM1117 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings of 125°C should not be exceeded under continuous normal load conditions. Careful consideration must be given to all sources of thermal resistance from junction to ambient. For the surface mount package SOT-223 additional heat sources mounted near the device must be considered. The heat dissipation capabilit y of the PC board and its copper traces is used as a heat sink for the device. The thermal resistance from the junction to the tab for the BM1117 is 15°C/W. Thermal resistance from tab to ambient can be as low as 30°C/W. The total thermal resistance from junction to ambient can be as low as 45°C/W. This requires a reasonable sized PC board with at least on layer of copper to spread the heat across the board and couple it into the surrounding air. Experiments have shown that the heat spreading copper layer does not need to be electrically connected to the tab of the device. The PC material can be very effective at transmitting heat between the pad area, attached to the pad of the device, and a ground plane layer either inside or on the opposite side of the b oard. Although the actual thermal resistanc e of the PC material is high, the Length/Area ratio of the thermal resistance between layers is small. The data in Table 1, was taken using1/16” FR-4 board with 1 oz. copper foil, and it can be used as a rough guideline for estimating thermal resistance. For each application the thermal resistance will be affected by thermal interactions with other components on the board. To determine the actual value some experimentation will be necessary. The power dissipation of the BM1117 is equal to: P D = ( VIN - VOUT )( IOUT ) Maximum junction temperature will be equal to: T J = TA(MAX) + PD PD :Thermal esistance (junction-to-ambient) Maximum junction temperature must not exceed 125°C.

S P E C I F I C A T I O N B M 1 1 1 7 BOOKLY MICRO ELECTRONICS LIMITED CORP. Ripple Rejection The ripple rejection values are measured with the adjustment pin bypassed. The impedance of the adjust pin capacitor at t he ripple frequency should be less t han the value of R1 (normally 100Ωto 200Ω) for a proper bypassing and ripple reject ion approaching the va lues shown. The size of the required adjust pin capacitor is a function of the input ripple frequency. If R1=100Ω at 120Hz the adjust pin capacitor should be >13mF. At 10kHz only 0.16mF is needed. The ripple rejection will be a f unction of output voltage, in circuits without an adjust pin bypass capacitor. The output ripple will increase directly as a ratio of the output voltage to the reference voltage (VOUT / VREF ).

S P E C I F I C A T I O N B M 1 1 1 7 BOOKLY MICRO ELECTRONICS LIMITED CORP. TYPICAL CHARACTERISTICS Minimum Operating Current (Adjustable Device) Short-Circuit Current Load Regulation Ripple Rejection vs. Current Temperature Stability Adjust Pin Current

S P E C I F I C A T I O N B M 1 1 1 7 ƽ TO252-2 ƽ SOT223-3